DE68920469D1 - Elektronische Packung. - Google Patents
Elektronische Packung.Info
- Publication number
- DE68920469D1 DE68920469D1 DE68920469T DE68920469T DE68920469D1 DE 68920469 D1 DE68920469 D1 DE 68920469D1 DE 68920469 T DE68920469 T DE 68920469T DE 68920469 T DE68920469 T DE 68920469T DE 68920469 D1 DE68920469 D1 DE 68920469D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic pack
- pack
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/182,639 US4962416A (en) | 1988-04-18 | 1988-04-18 | Electronic package with a device positioned above a substrate by suction force between the device and heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68920469D1 true DE68920469D1 (de) | 1995-02-23 |
DE68920469T2 DE68920469T2 (de) | 1995-07-20 |
Family
ID=22669383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68920469T Expired - Fee Related DE68920469T2 (de) | 1988-04-18 | 1989-03-16 | Elektronische Packung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4962416A (de) |
EP (1) | EP0338249B1 (de) |
JP (1) | JPH01270253A (de) |
DE (1) | DE68920469T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
DE4019091A1 (de) * | 1990-06-15 | 1991-12-19 | Battelle Institut E V | Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung |
US5252850A (en) * | 1992-01-27 | 1993-10-12 | Photometrics Ltd. | Apparatus for contouring a semiconductor, light responsive array with a prescribed physical profile |
TW258829B (de) * | 1994-01-28 | 1995-10-01 | Ibm | |
US5923538A (en) * | 1994-10-17 | 1999-07-13 | Lsi Logic Corporation | Support member for mounting a microelectronic circuit package |
US5614763A (en) * | 1995-03-13 | 1997-03-25 | Zetetic Institute | Methods for improving performance and temperature robustness of optical coupling between solid state light sensors and optical systems |
US5706171A (en) * | 1995-11-20 | 1998-01-06 | International Business Machines Corporation | Flat plate cooling using a thermal paste retainer |
US5825087A (en) * | 1996-12-03 | 1998-10-20 | International Business Machines Corporation | Integral mesh flat plate cooling module |
DE69822158T2 (de) * | 1997-04-04 | 2005-02-17 | Unisys Corp. | Methode und Vorrichtung zum wärmeleitenden Verbinden einer elektronischen Schaltung mit einem Wärmetauscher |
US5909056A (en) * | 1997-06-03 | 1999-06-01 | Lsi Logic Corporation | High performance heat spreader for flip chip packages |
US6037658A (en) * | 1997-10-07 | 2000-03-14 | International Business Machines Corporation | Electronic package with heat transfer means |
FR2771890B1 (fr) * | 1997-11-28 | 2000-02-18 | Thomson Csf | Procede de montage en surface d'un boitier hyperfrequence sur un circuit imprime et boitier et circuit imprime pour la mise en oeuvre du procede |
DE10035175C1 (de) * | 2000-07-19 | 2002-01-03 | Fraunhofer Ges Forschung | Verfahren zur Herstellung einer elektrischen und/oder mechanischen Verbindung von flexiblen Dünnfilmsubstraten |
US7044212B1 (en) * | 2000-08-25 | 2006-05-16 | Net Nanofiltertechnik Gmbh | Refrigeration device and a method for producing the same |
US6942025B2 (en) * | 2000-09-20 | 2005-09-13 | Degree Controls, Inc. | Uniform heat dissipating and cooling heat sink |
US6474074B2 (en) * | 2000-11-30 | 2002-11-05 | International Business Machines Corporation | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
DE10352705A1 (de) * | 2003-11-12 | 2005-06-23 | Diehl Bgt Defence Gmbh & Co. Kg | Schaltungsanordnung |
JP4413649B2 (ja) * | 2004-03-03 | 2010-02-10 | 日産自動車株式会社 | 放熱構造体及びその製造方法 |
JP2006269639A (ja) * | 2005-03-23 | 2006-10-05 | Denso Corp | 放熱装置および車載電子機器 |
US7513035B2 (en) | 2006-06-07 | 2009-04-07 | Advanced Micro Devices, Inc. | Method of integrated circuit packaging |
US20080106868A1 (en) * | 2006-11-03 | 2008-05-08 | Dell Products L.P. | Thermal interface material volume between thermal conducting members |
US8269340B2 (en) | 2007-09-19 | 2012-09-18 | International Business Machines Corporation | Curvilinear heat spreader/lid with improved heat dissipation |
US20090152713A1 (en) * | 2007-12-18 | 2009-06-18 | Ioan Sauciuc | Integrated circuit assembly including thermal interface material comprised of oil or wax |
US7961469B2 (en) * | 2009-03-31 | 2011-06-14 | Apple Inc. | Method and apparatus for distributing a thermal interface material |
US8268389B2 (en) * | 2010-01-08 | 2012-09-18 | International Business Machines Corporation | Precast thermal interface adhesive for easy and repeated, separation and remating |
JP6398708B2 (ja) * | 2014-12-26 | 2018-10-03 | 株式会社デンソー | 電子装置、及びそれを用いた駆動装置 |
JP6101728B2 (ja) * | 2015-03-30 | 2017-03-22 | 株式会社フジクラ | ベーパーチャンバー |
US11335621B2 (en) * | 2016-07-19 | 2022-05-17 | International Business Machines Corporation | Composite thermal interface objects |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3492535A (en) * | 1968-01-08 | 1970-01-27 | Ncr Co | Ceramic circuit card |
NL159818B (nl) * | 1972-04-06 | 1979-03-15 | Philips Nv | Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. |
US4069498A (en) * | 1976-11-03 | 1978-01-17 | International Business Machines Corporation | Studded heat exchanger for integrated circuit package |
US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
US4233645A (en) * | 1978-10-02 | 1980-11-11 | International Business Machines Corporation | Semiconductor package with improved conduction cooling structure |
US4231154A (en) * | 1979-01-10 | 1980-11-04 | International Business Machines Corporation | Electronic package assembly method |
US4323914A (en) * | 1979-02-01 | 1982-04-06 | International Business Machines Corporation | Heat transfer structure for integrated circuit package |
US4442450A (en) * | 1981-03-30 | 1984-04-10 | International Business Machines Corporation | Cooling element for solder bonded semiconductor devices |
US4415025A (en) * | 1981-08-10 | 1983-11-15 | International Business Machines Corporation | Thermal conduction element for semiconductor devices |
US4386116A (en) * | 1981-12-24 | 1983-05-31 | International Business Machines Corporation | Process for making multilayer integrated circuit substrate |
US4517051A (en) * | 1982-12-27 | 1985-05-14 | Ibm Corporation | Multi-layer flexible film module |
US4563725A (en) * | 1983-01-06 | 1986-01-07 | Welwyn Electronics Limited | Electrical assembly |
US4567505A (en) * | 1983-10-27 | 1986-01-28 | The Board Of Trustees Of The Leland Stanford Junior University | Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
US4546410A (en) * | 1983-10-31 | 1985-10-08 | Kaufman Lance R | Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink |
US4681654A (en) * | 1986-05-21 | 1987-07-21 | International Business Machines Corporation | Flexible film semiconductor chip carrier |
-
1988
- 1988-04-18 US US07/182,639 patent/US4962416A/en not_active Expired - Fee Related
-
1989
- 1989-02-16 JP JP1035205A patent/JPH01270253A/ja active Granted
- 1989-03-16 EP EP89104682A patent/EP0338249B1/de not_active Expired - Lifetime
- 1989-03-16 DE DE68920469T patent/DE68920469T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0338249B1 (de) | 1995-01-11 |
EP0338249A2 (de) | 1989-10-25 |
DE68920469T2 (de) | 1995-07-20 |
EP0338249A3 (en) | 1990-06-13 |
JPH01270253A (ja) | 1989-10-27 |
US4962416A (en) | 1990-10-09 |
JPH0586068B2 (de) | 1993-12-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |