CN1744306A - 半导体装置及其制造方法 - Google Patents
半导体装置及其制造方法 Download PDFInfo
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- CN1744306A CN1744306A CNA2005100978335A CN200510097833A CN1744306A CN 1744306 A CN1744306 A CN 1744306A CN A2005100978335 A CNA2005100978335 A CN A2005100978335A CN 200510097833 A CN200510097833 A CN 200510097833A CN 1744306 A CN1744306 A CN 1744306A
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
Claims (7)
Applications Claiming Priority (2)
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JP2004250453 | 2004-08-30 | ||
JP2004250453A JP4050732B2 (ja) | 2004-08-30 | 2004-08-30 | 半導体装置およびその製造方法 |
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CN1744306A true CN1744306A (zh) | 2006-03-08 |
CN100437995C CN100437995C (zh) | 2008-11-26 |
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CNB2005100978335A Expired - Fee Related CN100437995C (zh) | 2004-08-30 | 2005-08-30 | 半导体装置及其制造方法 |
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US (2) | US7268430B2 (zh) |
JP (1) | JP4050732B2 (zh) |
KR (2) | KR20060050794A (zh) |
CN (1) | CN100437995C (zh) |
TW (1) | TWI297185B (zh) |
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US10784221B2 (en) * | 2011-12-06 | 2020-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of processing solder bump by vacuum annealing |
US9512863B2 (en) * | 2012-04-26 | 2016-12-06 | California Institute Of Technology | Silicon alignment pins: an easy way to realize a wafer-to-wafer alignment |
JP2013251405A (ja) * | 2012-05-31 | 2013-12-12 | Tadatomo Suga | 金属領域を有する基板の接合方法 |
JP6032667B2 (ja) * | 2012-08-31 | 2016-11-30 | 国立研究開発法人産業技術総合研究所 | 接合方法 |
KR20140038735A (ko) * | 2012-09-21 | 2014-03-31 | (주)호전에이블 | 패키지 모듈 및 그 제조 방법 |
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-
2004
- 2004-08-30 JP JP2004250453A patent/JP4050732B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-30 US US11/213,882 patent/US7268430B2/en active Active
- 2005-08-30 CN CNB2005100978335A patent/CN100437995C/zh not_active Expired - Fee Related
- 2005-08-30 KR KR1020050079848A patent/KR20060050794A/ko not_active Application Discontinuation
- 2005-08-30 TW TW094129599A patent/TWI297185B/zh not_active IP Right Cessation
-
2006
- 2006-11-28 KR KR1020060118387A patent/KR100821574B1/ko not_active IP Right Cessation
-
2007
- 2007-08-09 US US11/889,100 patent/US7776735B2/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105472216A (zh) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | 具有缓冲结构的电气支架及摄像模组 |
CN108054490A (zh) * | 2017-12-08 | 2018-05-18 | 中国电子科技集团公司第五十四研究所 | 一种多层柔性基板局部微弹簧低应力组装结构 |
CN110557903A (zh) * | 2019-09-05 | 2019-12-10 | 深圳市星河电路股份有限公司 | 一种pcb超高金线邦定值加工方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100821574B1 (ko) | 2008-04-15 |
KR20060050794A (ko) | 2006-05-19 |
TW200616128A (en) | 2006-05-16 |
JP4050732B2 (ja) | 2008-02-20 |
US20080254610A1 (en) | 2008-10-16 |
JP2006066809A (ja) | 2006-03-09 |
US7776735B2 (en) | 2010-08-17 |
TWI297185B (en) | 2008-05-21 |
US7268430B2 (en) | 2007-09-11 |
CN100437995C (zh) | 2008-11-26 |
KR20070008473A (ko) | 2007-01-17 |
US20060043552A1 (en) | 2006-03-02 |
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