CN101517734A - 弹性触头和使用它的金属端子之间的接合方法 - Google Patents

弹性触头和使用它的金属端子之间的接合方法 Download PDF

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Publication number
CN101517734A
CN101517734A CNA2007800355721A CN200780035572A CN101517734A CN 101517734 A CN101517734 A CN 101517734A CN A2007800355721 A CNA2007800355721 A CN A2007800355721A CN 200780035572 A CN200780035572 A CN 200780035572A CN 101517734 A CN101517734 A CN 101517734A
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China
Prior art keywords
spring contact
contact
spring
electronic unit
splicing ear
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CNA2007800355721A
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长野真一
吉田信
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Publication of CN101517734A publication Critical patent/CN101517734A/zh
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Abstract

本发明提供一种提高与IC封装等电子部件的连接电极之间的接合强度的弹性触头和金属端子之间的接合方法。由焊锡形成的电子部件侧的连接电极(42)和弹性触头(20)的前端部(22b)用接触部(O)接触。弹性触头(20)在前端部(22b)形成电阻层，前端部(22b)配置在感应线圈(50)的间隙(51)内。如果在所述感应线圈(50)上流过给定的高频电流，所述电阻部就通过电磁感应发热，连接电极(42)的焊锡熔化，流入所述弹性触头(20)的前端部(22b)，所以用所述接触部(O)的一点能牢固地接合弹性触头(20)的前端部(22b)和连接电极(42)之间。

Description

弹性触头和使用它的金属端子之间的接合方法
技术领域
本发明涉及例如与设置在电子部件中的连接端子弹性地接触、连接的弹性触头和使用它的金属端子之间的接合方法。
背景技术
在以下的专利文献1中记载了涉及通过金属间接合，使螺旋状触头和设置在电子部件中的连接端子之间相接的金属间接合方法的发明。
专利文献1的金属间接合的相接的条件是按压连接端子的力为0.05～1N，温度为20～250℃，按压时间为1～3分钟。此外，在把温度设定为低的常温20℃，按压的力也低的时候，按压时间为48小时左右。
专利文献1：特开2006-147890号公报
可是，在专利文献1中记载的金属间接合法中，例如在其段落(0027)中记载为“···如果向旁边挪动，就偏离”那样，连接端子和螺旋状触头之间的接合强度容易变得不充分，具有作为螺旋状触头的可靠性容易下降的问题。
即在专利文献1中记载的接合方法中，通过使用多棱锥状的连接端子和螺旋状触头，所述连接端子和螺旋状触头之间不是一点，是在多处接合的结构。在这样的结构中，由于一处的接触压力容易变得不充分，所以各接合部分的接合强度降低，作为全体的接合强度难以提高。
因此，在专利文献1记载的内容中，进行通过一起使用热硬化性的环氧树脂，增强所述连接端子和所述螺旋状触头之间的接合状态的对策。
发明内容
本发明解决所述以往的课题，其目的在于，提供能确实提高与连接端子之间的接合强度的弹性触头。
此外，本发明的目的在于，提供一种金属端子之间的接合方法，通过在一点使连接端子和弹性触头相接，提高接合强度。
本发明是一种弹性触头，具有弹性变形部，其特征在于：在所述弹性变形部的前端局部设置由比除了所述前端的其它弹性变形部电阻率大的金属材料形成的电阻层。
在本发明中，因为在所述弹性变形部的前端具有电阻层，所以能使前端部的发热量比弹性变形部的前端以外的发热量大。
所述弹性变形部具有弹性层和导电层，在所述弹性变形部的前端，设置电阻层代替所述导电层，或者设置电阻层覆盖所述导电层的表面，例如所述电阻层由钯(Pd)形成。
在所述方法中，能只使电阻层局部地发热。
在所述电阻层的表面形成由金(Au)或镀金(Au)构成的表面层。
在所述方法中，能防止钯(Pd)的氧化。
此外，在所述中，所述导电层由铜或铜合金形成。
在所述方法中，能降低弹性变形部的前端部以外的电阻率。因此，能降低弹性变形部的前端以外的发热量。
此外，所述导电层由镍(Ni)或镍合金形成。
在所述方法中，为能发挥高的机械强度和高的弯曲弹性系数的弹性变形部。
例如，所述弹性变形部形成为螺旋状，所述弹性变形部立体成形。
在所述方法中，能在一点与电子部件侧的连接端子接合，能提高接合强度。
此外，本发明是一种金属端子之间的接合方法，分别接合设置在电子部件上的多个连接端子和与所述连接端子对应配置的多个弹性触头，其特征在于，具有：
(a)在所述多个弹性触头之上装填设置了所述多个连接端子的电子部件的底面，使所述连接端子与所述弹性触头接触的工序；
(b)对所述连接端子和所述弹性触头的接触部进行加热，使两者接合的工序。
或者，一种金属端子之间的接合方法，分别接合任意所述的弹性触头和设置在电子部件上的多个连接端子，其特征在于，具有：
(c)在所述多个弹性触头之上装填设置了所述多个连接端子的电子部件的底面，使所述连接端子与所述弹性触头局部地接触的工序；
(d)局部加热所述连接端子和所述弹性触头接触的接触部，使所述接触部局部熔化的工序；
(e)通过熔化后的所述接触部，使所述连接端子和所述弹性触头接合的工序。
在本发明中，使接触部局部发热，接合所述连接端子和所述弹性触头之间，用焊锡形成所述连接端子的时候，能把所述焊锡熔化，所以能确实地接合两者之间。
在所述中，在所述工序(a)或(c)之前，具有以下工序：在所述多个连接端子和多个弹性触头的至少一方涂敷焊膏，作为接触部工序。
在所述方法中，电子部件侧的连接端子由焊锡以外的导电性金属形成时，也能把所述连接端子和弹性触头接合。
在所述中，所述工序(b)或者(d)中，由对所述接触部提供电流时产生的焦耳热进行加热，例如所述焦耳热是基于来自外部的电磁感应引起的磁力线产生的涡电流和所述接触部具有的电阻成分而产生的，或者所述焦耳热是基于从外部直接对所述接触部提供的电流和所述接触部具有的电阻成分而产生的。
在所述方法中，能确实地只使所述电阻部发热，减小其它部分的发热。
或者，所述工序(b)或者(d)中，至少所述电子部件和所述基板的一方由在两者相对的板厚方向振动时产生的摩擦热进行加热。
在所述方法中，能在各接触部产生摩擦热，通过该摩擦热，能把焊锡熔化，进行接合。
在所述工序(b)或者(e)之后，在所述电子部件的底面的连接端子和所述弹性触头之间注入非导电性的粘合剂，进行固定。
在所述方法中，能更牢固地把连接端子和弹性触头之间连接。
在本发明中，为能与电子部件的连接端子在一点接触，确实地提高与所述连接端子之间的接合强度的弹性触头。
此外，在本发明中，能提供在一点使连接端子和弹性触头相接，从而能提高接合强度的金属端子之间的接合方法。
附图说明
图1是具有本发明的实施方式的弹性触头的连接装置的局部剖视图。
图2是表示本发明实施方式的弹性触头的平面图。
图3是弹性触头的局部剖视图。
图4是表示接触连接电极(焊锡球)，并压缩弹性触头的状态的与图3同样的局部剖视图。
图5是弹性触头的放大剖视图，A是图2的A-A线的前端部的剖视图，B是图2的B-B线的前端部以外的剖视图，C是表示B的其它结构例的前端部以外的剖视图。
图中：1-连接装置，10-基台，12-支撑面，16-基体材料板，20-弹性触头，21-支撑部，22-弹性变形部(弹性臂)，22a-基部，22b-前端部，31-导电层，32-弹性层，33-电阻层，40-电子部件，42-连接电极，50-感应线圈，51-间隙，O-接触部。
具体实施方式
图1是具有本发明的实施方式的弹性触头的连接装置的局部剖视图，图2是表示本发明实施方式的弹性触头的平面图，图3是图2的弹性触头的局部剖视图，图4是表示接触连接电极(焊锡球)，并压缩弹性触头的状态的与图3同样的局部剖视图，图5是弹性触头的放大剖视图，A是图2的A-A线的前端部的剖视图，B是图2的B-B线的前端部以外的剖视图，C是表示B的其它结构例的前端部以外的剖视图。
图1所示的连接装置1具有基台10。基台10的平面形状是四边形，在基台10的4边分别形成几乎垂直上升的侧壁部10a。由4边的侧壁部10a包围的区域是凹部11，其底部10b的上面是支撑面12。在所述支撑面12之上设置连接板15。连接板15在弹性的基体材料板16的表面设置多个弹性触头20。
如图3所示，在所述基体材料板16形成多个通孔16a，在各通孔16a的内周面形成多个通孔16a，在各通孔16a的内周面用电镀等方法形成导电层17。在基体材料板16的表面形成与所述导电层17导通的表面一侧的连接区域17a，在基体材料板16的背面形成与所述导电层17导通的背面一侧的连接区域17b。
所述弹性触头20是冲压薄的导电性金属板、再进行电镀处理而形成的触头，把各弹性触头20用导电性粘合剂等接合在所述连接区域17a的表面上。或者，使用铜或镍(Ni)等导电性材料，用电镀工序形成弹性触头20。例如，在与基体材料板16不同的板的表面，用电镀工序形成多个弹性触头20，所述板重合在基体材料板16上，各弹性触头20用导电性粘合剂等接合在所述连接区域17a上。
各弹性触头20设置在基体材料板16上之后，提供外力，形成立体形状。这时，用加热处理除去内部的残留应力，弹性触头20用立体形状能发挥弹力。
如图3所示，在基体材料板16的背面一侧，形成在所述连接区域17b分别连接的导电性材料的凸部(bump)电极18。如图1所示，如果连接板15设置在基台10的底部10b的表面即支撑面上，所述凸部电极18就与设置在所述支撑面12上的导电部连接。
所述支撑面12上的弹性触头20的排列间隔例如是2mm以下，或者1mm以下。弹性触头20的外形尺寸的最大值也是2mm以下，或者1mm以下。
如图1所示，在连接装置1设置电子部件40。电子部件40是IC封装等，在主体部41内密封IC裸芯片等各种电子元件。在主体部41的底面41a设置多个连接电极42，各连接电极42与主体部41内的电路导通。本实施方式的电子部件40的所述连接电极42是球状。可是，连接电极42也能是截头圆锥形状。或者也能是平面焊盘等。
所述连接电极42由包含锡(Sn)的导电性的合金即不包含铅的焊锡形成，理想的是由锡铋合金、锡银合金形成。可是，所述连接电极42并不局限于由焊锡形成的结构，也能使用金、银、铜或者包含它们的合金等形成。
如图2和图3所示，支撑部21和弹性变形部(弹性臂)22一体地连续形成弹性触头20。弹性变形部22形成螺旋形状，弹性变形部22的卷绕开始端即基部22a与支撑部21一体化。弹性变形部22的卷绕结束端即前端部22b位于螺旋的中心部。如图2所示，构成弹性触头20的支撑部21连接在所述连接区域17a上，弹性变形部22的前端部22b离开连接区域17a而立体成形。
如图5A中用剖视图所示，弹性触头20由设置在表面一侧的导电层31和设置在其内部的弹性层32形成。
导电层31是铜或包含铜的合金的单层。铜合金理想的是使用具有高的电导电度和高的机械强度的具有Cu、Si、Ni的铜镍硅合金(Corsonalloy)。铜镍硅合金使用例如Cu-Ni-Si-Mg，Cu为96.2质量％，Ni为3.0质量％，Si为0.65质量％，Mg为0.15质量％的合金。
弹性层32理想的是比导电层31电阻率大，并且发挥高的机械强度和高的弯曲弹性系数的金属材料，例如Ni层或包含Ni的合金层。Ni合金使用Ni-X合金(但是，X是P、W、Mn、Ti、Be中的任意一种以上)。在导电层31的周围进行电解电镀或非电解电镀，形成弹性层32。弹性层32理想的是由非电解电镀形成的Ni-P合金。在Ni-P合金中，通过把磷(P)的浓度变为10at％以上且30at％以下，至少一部分成为非晶体，能取得高的弹性系数和高的拉伸强度。或者，弹性层32由Ni-W合金形成。这时，通过把钨(W)的浓度变为10at％以上且30at％以下，至少一部分成为非晶体，能取得高的弹性系数和高的拉伸强度。此外，在图5A的剖视图中，弹性变形部22的厚度尺寸和宽度尺寸都是1μm以上且100μm以下。
如图5B所示，在弹性变形部22的前端部22b的中心具有所述同样的弹性层32。可是，不同点在于，其周围代替所述导电层31，形成比导电层31电阻率大很多的电阻层33。或者，如图5C所示，也能是电阻层33覆盖所述导电层31的周围的结构。
作为电阻层33，能使用具有比形成弹性层32的金属材料大的电阻率的金属材料，例如电阻率为10.8×10-8Ωm的钯(Pd)等，但是如果是电阻率大的金属材料，就不局限于所述钯(Pd)，也能是其它金属。例如，也能是含有镍(Ni)和铬(Cr)的合金即镍铬合金(注册商标)等(107.3×10-8Ωm)。
另外，在电阻层33使用钯(Pd)时，为了防止钯(Pd)的氧化，也能是在所述弹性层32的表面把金(Au)作为表面层(未图示)设置的结构。但是，如果金与焊锡接合的话，接合部分容易变脆。因此，作为表面层，设置金(Au)的时候，理想的是所述表面层不变厚地在钯(Pd)的表面，通过薄镀(flash plate)，极薄地形成金(Au)的结构。
此外，作为形成连接电极42和焊膏的焊锡，例如如果使用SnCu等高熔点焊锡(240℃)，则在接合后的其它部件的装载时，能进行基于低熔点焊锡的安装。
下面，说明所述弹性触头20和连接电极42的接合方法。
如图1所示，电子部件40在把设置连接电极42的底面41a向着下方的状态下，装填在连接装置1内形成的凹部11内。
另外，所述连接电极42如上所述，由焊锡以外的金属材料形成时，在各连接电极42的表面或者弹性触头20的前端部22b的表面涂覆焊膏(未图示)之后，把电子部件40装填在所述连接装置1的凹部11内。
这时，各连接电极42与设置在凹部11内的各弹性触头20的前端部22b直接或者通过焊膏接触。然后，如图4所示，如果压入电子部件40，就会压缩所述弹性变形部22，这时，连接电极42的表面和弹性触头焊膏20的前端部22b以适度的按压力直接或者通过所述焊膏局部地(以下，称作接触部O)接触。另外，接触部O是弹性触头20的前端部22b，是具有电阻层33的部分。
接着，通过限定地使弹性触头20的前端部22b发热，把通过接触部O接触的连接电极42加热。这时的理想的加热温度是220℃～250℃左右，据此，形成连接电极42的焊锡或者焊膏局部融解，熔化的焊锡流入所述前端部22b的表面，牢固地接合弹性触头20的前端部22b和连接电极42之间。
这样，本发明中，由于在接触部O的一点接合弹性触头20的前端部22b和连接电极42，所以能提高接合强度。
可是，作为限定地使弹性触头20的前端部22b发热并接合的方法，具有以下所示的几个方法。
首先，作为第一接合方法，是基于电磁感应的感应加热。
在该方法中，使用例如图2和图4所示的在一部分具有间隙51的大致C字形状构成的感应线圈50。在感应线圈50的间隙51内配置连接电极42和弹性触头20的前端部22b的接触部O，如果流过给定的交流电流，就对接触部O提供基于电磁感应的磁力线，在所述电阻层33产生涡电流。然后，通过该涡电流和电阻层33具有的电阻成分，能局部产生焦耳热。通过该焦耳热，限定地加热所述接触部O，用焊锡形成的所述连接电极42或者所述焊膏熔化，能通过所述接触部O使弹性触头20的前端部22b和连接电极42之间金属间接合。因此，在基于电磁感应的感应加热法中，由于能主要仅使弹性触头20的前端部22b的电阻层33局部发热，所以能减小对电子部件40带来的负担。
作为第二接合方法，是对电阻层33直接流过电流的方法。
在该方法中，在弹性触头20的前端部22b和支撑部21之间直接流过电流，使所述电阻层33发热。通过这时产生的热，用焊锡形成的所述连接电极42或者焊膏熔化，能通过所述接触部O使弹性触头20的前端部22b和连接电极42之间金属间接合。
作为第三接合方法，具有基于超声波的接合方法。
在该方法中，在连接装置1内的凹部11内装填电子部件40，在牢固固定的状态下，在超声波振动装置上进行设置，在纵向(板厚方向)，以给定的超声波频率使电子部件40和连接装置1振动。在该过程中，由于在所述接触部O产生摩擦热，所述连接电极42或者焊膏熔化，所以能通过所述接触部O使弹性触头20的前端部22b和连接电极42之间金属间接合。
如上所述，本发明中，在接合之前，电子部件40的连接电极42和弹性触头20的前端部22b在接触部O的一点接触，能通过该接触部O使其接合，所以能提高接合强度。
此外，无论所述何种情形，所述接触部O的面积都很小。因此，能减少接合时所需要的用于接合的能量。即，能用很少的能量进行接合强度大的接合。因此，特别是在基于所述第三超声波振动的接合方法中，能使用振动频率大的区域，能减小对电子部件40的损害。
另外，也能是通过在接合后，在所述电子部件40的底面42a的连接电极42和所述凹部11内的所述弹性触头20之间注入非导电性的粘合剂，用粘合剂固定所述连接电极42和所述弹性触头20之间的结构。这时，能进一步提高电子部件40的连接电极42和弹性触头20之间的接合强度。
在所述图5A所示的实施方式中，表示在弹性层32的周围具有导电层31的结构，但是本发明并不局限于此，也能是在中心侧设置导电层31，弹性层32覆盖其周围的结构。这时，能是由钯等构成的所述电阻层33设置在弹性层32的表面的结构。
此外，在所述任意的实施方式中，使用螺旋状的螺旋触头说明了弹性触头20，但是本发明并不局限于此，例如用在圆顶状的金属膜的背面张贴由橡胶或人造橡胶(elastomer)等构成的弹性膜的膜型接点、成为接点的前端部弯曲形成大致U字形状并且整体能弹性地变形的弹簧销(springpin)(接点销)、应力金属、接触探针(contact probe)(参照特开2002-357622)、或者锥形螺旋板弹簧等的弹性接点形成的触头。

Claims (16)

1.一种弹性触头，具有弹性变形部，其特征在于：
在所述弹性变形部的前端局部设置由比除了所述前端的其它弹性变形部电阻率大的金属材料形成的电阻层。
2.根据权利要求1所述的弹性触头，其特征在于：
所述弹性变形部具有弹性层和导电层，在所述弹性变形部的前端，设置电阻层代替所述导电层，或者设置电阻层覆盖所述导电层的表面。
3.根据权利要求2所述的弹性触头，其特征在于：
所述电阻层由钯(Pd)形成。
4.根据权利要求3所述的弹性触头，其特征在于：
在所述电阻层的表面形成由金(Au)或镀金(Au)构成的表面层。
5.根据权利要求2～4中的任意一项所述的弹性触头，其特征在于：
所述导电层由铜或铜合金形成。
6.根据权利要求2～5中的任意一项所述的弹性触头，其特征在于：
所述导电层由镍(Ni)或镍合金形成。
7.根据权利要求1～6中的任意一项所述的弹性触头，其特征在于：
所述弹性变形部形成为螺旋状。
8.根据权利要求1～7中的任意一项所述的弹性触头，其特征在于：
所述弹性变形部立体成形。
9.一种使用弹性触头的金属端子之间的接合方法，分别接合设置在电子部件上的多个连接端子和与所述连接端子对应配置的多个弹性触头，其特征在于，具有：
(a)在所述多个弹性触头之上装填设置了所述多个连接端子的电子部件的底面，使所述连接端子与所述弹性触头接触的工序；
(b)对所述连接端子和所述弹性触头的接触部进行加热，使两者接合的工序。
10.一种使用弹性触头的金属端子之间的接合方法，分别接合权利要求1～8中的任意一项所述的弹性触头和设置在电子部件上的多个连接端子，其特征在于，具有：
(c)在所述多个弹性触头之上装填设置了所述多个连接端子的电子部件的底面，使所述连接端子与所述弹性触头局部地接触的工序；
(d)局部加热所述连接端子和所述弹性触头接触的接触部，使所述接触部局部熔化的工序；
(e)通过熔化后的所述接触部，使所述连接端子和所述弹性触头接合的工序。
11.根据权利要求9或11所述的使用弹性触头的金属端子之间的接合方法，其特征在于：
在所述工序(a)或(c)之前，具有以下工序：在所述多个连接端子和多个弹性触头的至少一方涂敷焊膏，作为接触部。
12.根据权利要求9～11中的任意一项所述的使用弹性触头的金属端子之间的接合方法，其特征在于：
所述工序(b)或者(d)中，由对所述接触部提供电流时产生的焦耳热进行加热。
13.根据权利要求12所述的使用弹性触头的金属端子之间的接合方法，其特征在于：
所述焦耳热是基于来自外部的电磁感应引起的磁力线产生的涡电流和所述接触部具有的电阻成分而产生的。
14.根据权利要求12所述的使用弹性触头的金属端子之间的接合方法，其特征在于：
所述焦耳热是基于从外部直接对所述接触部提供的电流和所述接触部具有的电阻成分而产生的。
15.根据权利要求9～11中的任意一项所述的使用弹性触头的金属端子之间的接合方法，其特征在于：
所述工序(b)或者(d)中，至少所述电子部件和所述基板的一方由在两者相对的板厚方向振动时产生的摩擦热进行加热。
16.根据权利要求9～15中的任意一项所述的使用弹性触头的金属端子之间的接合方法，其特征在于：
在所述工序(b)或者(e)之后，在所述电子部件的底面的连接端子和所述弹性触头之间注入非导电性的粘合剂，进行固定。
CNA2007800355721A 2006-09-26 2007-09-19 弹性触头和使用它的金属端子之间的接合方法 Pending CN101517734A (zh)

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