CN101939832A - 热机械的倒焊芯片的模片焊接 - Google Patents

热机械的倒焊芯片的模片焊接 Download PDF

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Publication number
CN101939832A
CN101939832A CN2008801263666A CN200880126366A CN101939832A CN 101939832 A CN101939832 A CN 101939832A CN 2008801263666 A CN2008801263666 A CN 2008801263666A CN 200880126366 A CN200880126366 A CN 200880126366A CN 101939832 A CN101939832 A CN 101939832A
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China
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numerous
matrix
substrate
copper post
welding
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CN2008801263666A
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S·X·梁
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Skyworks Solutions Inc
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Skyworks Solutions Inc
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Abstract

一种用于将倒焊芯片的模片焊接到基片上的热机械处理过程。倒焊芯片的模片包括众多的铜柱隆起焊盘，众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘都具有附着到模片上的铜的部分，和附着在铜的部分上的焊接端。处理过程包括在基片上确定模片的位置，以致众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘上的焊接端与基片上的对应的众多的焊接垫片的各自的其中之一进行接触，以及通过超声波热焊法将模片焊接到基片上。

Description

热机械的倒焊芯片的模片焊接
技术领域
本发明一般地涉及半导体设备和用于制造半导体设备的方法。更加确切的说，至少一个实施方案涉及倒焊芯片的半导体封装和模片焊接的处理过程。
背景技术
广泛应用于射频(RF)元件业的半导体封装技术是指“倒焊芯片”的封装。倒焊芯片法描述的是将模片或者“芯片”电连接到封装载体上的方法。与标准的芯片和有线封装形成对比的是，其是使用接合线将模片连接到载体上，倒焊芯片封装中的模片和载体之间的相互连接是通过导电性的“隆起”完成的，其直接放置在模片的表面上。然后，有隆起的模片被“翻转”和带有隆起的正面朝下放置将模片直接连接到载体上。
倒焊芯片的组装的过程通常包括三个主要的步骤：1)在模片上形成隆起焊盘；2)将有隆起焊盘的模片“正面朝下”附着到基片或集成版上；以及3)底层填充，是将非导电性的机械性保护材料填充到模片和基片或集成版之间的开口空间中的处理过程。在倒焊芯片的设备中有若干类型的隆起焊盘和形成隆起焊盘的处理过程。举例来说，焊料形成的隆起焊盘包括将没有隆起焊盘的镀金属放置在焊接垫片(例如，通过电镀、阴极真空喷镀或者类似的技术)，然后，将焊料放置在没有隆起焊盘的镀金属上。形成倒焊芯片的隆起焊盘的其他类型是众所周知的“电镀隆起焊盘”。焊接垫片上涂覆有所需要的厚度的镍涂层，以形成隆起焊盘的基础。然后，侵入金涂层被添加到镍隆起焊盘上以起到保护的作用。粘性的隆起焊盘是另外一种倒焊芯片的隆起焊盘的处理过程，其中刻模板导电性地粘合在位于焊接垫片中的没有隆起焊盘的镀金属上。在被处理之后，刻模板的粘合剂用作隆起焊盘。
含金的隆起焊盘是一种好用的形成隆起焊盘的处理过程，由于含金的材料的单片式结构，含金的焊接提供更好的粘合力。与焊料或者其他导电性材料相比，含金的焊接也通常具有更好的高频率性能和低阻抗。含金的隆起焊盘可以在倒焊芯片的模片上通过将金涂层沉淀到需要形成隆起焊盘的位置上的方法来制得，或者将由其他的材料(例如，镍)制成的垫片进行金电镀的方法来制得。具有含金的隆起焊盘的倒焊芯片通过使用超声波的“金对金”连接(GGI)的处理过程来附着到具有含金的焊接垫片的基片上。
GGI是一种超声波热焊接的处理过程，该方法通过使用一种被称之为GGI的接合器，将含金的隆起焊盘和含金的焊接垫片在压力头的作用下借助热量和超声波的能量结合在一起。超声波热焊接处理的连接是通过两层含金的涂层之间的固化阶段的焊接来完成的。在负载和超声波能量的作用下的不同的金(显微焊接)形成金对金的连接来作为焊接层是紧密的和单片式的。超声波GGI处理过程的装配精度为大约+/-10um，并能够可靠地将模片的厚度焊接到大约100um左右。然而，GGI处理过程的不足之处在于隆起焊盘和焊接垫片中都使用的是金，一种昂贵的金属。
发明内容
金对金超声波热焊接的倒焊芯片组装的是一种无铅的低应力的装置，其加热温度通常低于150℃，以及负载压力小于100g/隆起焊盘。这些特征与由含金的隆起焊盘所提供的出色的焊接力和电性能结合起来使得金对金连接(GGI)处理过程对很多的应用来说是有吸引力的。然而，正如上文中所讨论的，金是一种贵重的金属材料，因此，与焊料隆起焊盘相比，含金的隆起焊盘(和具有含金的焊接垫片的基片)是非常昂贵的。
铜柱隆起焊盘的形成是一种比焊料隆起焊盘更有优势的处理过程和结构，由于将要在下文中讨论的原因，以及与含金的隆起焊盘相比，其更为便宜。然而，传统的铜-锡倒焊芯片的模片焊接到具有铜柱隆起焊盘的倒焊芯片上要求一个组装过程，其通常包括用于模片/焊剂放置，焊料倒流和焊剂清洁的分开的步骤。在传统的铜-锡倒焊芯片的模片焊接处理过程中，晶片首先被侵入到焊剂中并放置在基片上，之后，单独的倒流处理过程形成晶片和基片之间的连接。最后，晶片和基片在下一个步骤中进行清理，以去除焊剂。这一组装过程实际上增加了部件的制造成本，如果不是全部，可以通过使用铜-锡焊接而不是GGI处理过程来获得大部分耗掉的节约成本。因此，传统的模片焊接的处理过程，无论是GGI处理的方法还是铜-锡焊接都具有缺陷。因此，本发明的至少某些方面和实施方案是涉及单一步骤的无焊剂的模片焊接的处理过程，其结合了铜柱隆起焊盘，并具有低成本和铜柱隆起焊盘的良好性能以及更为简单的组装过程的优势。
本发明的一个实施方案是涉及一种用于将包括至少一个铜柱隆起焊盘的模片焊接到具有对应的至少一个焊接垫片的基片上的方法，铜柱隆起焊盘包括铜的部分和焊接端。在这一实施方案中，该方法包括在基片上确定模片的位置，以致至少一个铜柱隆起焊盘的焊接端与至少一个焊接垫片接触，并在至少一个铜柱隆起焊盘上适用热能和机械能以将模片焊接基片上。在一个实施例中，确定模片的位置和适用热能和机械能的步骤可以实质上同步进行。在另外一个实施例中，焊接端可以是焊料端，以及适用热能和机械能包括将足够的热能和机械能适用到至少部分融化焊料端以将模片焊接到基片上的程度。在进一步的实施例中，适用热能和机械能包括将超声波能量适用到至少一个铜柱隆起焊盘上，同时使用机械力来将模片压到基片上。方法也可以包括在适用超声波能量和机械力之前，对模片和/或基片进行预先加热。
根据另外一个实施方案，一种半导体设备的制造方法包括在晶片上形成众多的铜柱隆起焊盘，众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘包括铜的部分和焊接垫片，将晶片分解为单数的众多的模片，每一个模片都包括众多的铜柱隆起焊盘中的至少一个铜柱隆起焊盘，将众多的模片在基片上进行定位，和将众多的模片超声波热焊接到基片上。在一个实施例中，基片可以包括众多的导电性的垫片(例如，包括铜、金、镍等金属)，以及在基片上确定众多的模片的位置包括将众多的模片进行定位，以致众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘的焊接端与各自的众多的导电性焊接垫片的各自的其中之一进行接触。在另外一个实施例中，焊接端包括焊料端，以及超声波热焊接众多的模片到基片上包括适用热能到众多的铜柱隆起焊盘上，直到部分融化焊料端的程度。在另外一个实施例中，超声波热焊接众多的模片到基片上包括适用超声波能量到众多的铜柱隆起焊盘上，和适用机械力来将模片压到基片上。在又一个实施例中，超声波热焊接众多的模片到基片上包括对众多的模片进行预热，以及随后适用超声波能量和机械力以便将众多的模片焊接到基片上。方法进一步包括使用上层模压的化合物来至少覆盖部分众多的模片。
其他的实施方案涉及一种将倒焊芯片的模片焊接到基片上的方法，倒焊芯片的模片包括众多的铜柱隆起焊盘，众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘都具有附着到模片上的铜的部分，和附着在铜的部分上的焊接端。在这一实施方案中，该方法包括在基片上确定模片的位置，以致众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘上的焊接端与基片上的对应的众多的焊接垫片中的其中之一分别接触，以及超声波热焊法将模片焊接到基片上。在一个实施例中，焊接端包括焊料端，以及超声波热焊接众多的模片到基片上包括适用热能和机械能到模片上直到部分融化焊料端的程度，以形成众多的铜柱隆起焊盘和基片上的对应的众多的焊接垫片中的其中之一之间的焊接。适用热能和机械能可以包括，例如，适用超声波能量和适用机械能来将模片压到基片上。超声波热焊接也可以选择性地包括对模片和/或基片进行预加热。这些步骤可以分别执行或者实质上同步执行。
本发明的其他方面、实施方案和这些可以效仿的方面和实施方案的优势将在下文中进行详细的讨论。而且，人们将会理解以上全部的信息和下文中将要详细描述的内容仅仅是各个方面和实施方案的用于举例说明的实施例，意在提供对于理解本发明所要求保护的方面和实施方案的特征和本质的预览和框架。所包括的对应过的附图是用于提供对本发明的各个方面和实施方案的举例说明和进一步理解之用，并且被合并到本说明书中作为说明书的连续部分。附图以及说明书的其他部分用于解释所描述的和请求保护的方面和实施方案的原理和操作。
附图说明
本发明的至少一个实施方案的各个方面结合对应的附图进行讨论。在这些附图中，并不是严格按照比例绘制，各个附图中每一个相同或几乎相同的部件都用同一数字进行举例说明。出于简洁的目的，并不是所有的部件都标示在每一幅图中。附图是用于举例说明和描述之用，而非是对本发明的限制。在这些附图中：
附图1是用于举例说明根据本发明的一个实施例的流程图；
附图2是晶片的可以效仿的一个实施例的剖面图解；
附图3是附图2中的晶片的剖面图解，其具有附着于其上的铜柱隆起焊盘；
附图4是电镀基片的一个实施例的剖面图解；
附图5是根据本发明的各个方面的，焊接到附图4中的电镀基片的模片的剖面图解；以及
附图6是具有上层模压和底层填充的结构的剖面图解。
具体实施方式
本发明的至少某些方面和实施方案涉及的是倒焊芯片的模片的焊接技术和处理过程，以及根据所述技术和方法的设备。正如上文中所讨论的那样，传统的倒焊芯片与基片之间的相互连接的铜-锡焊接方法要求具有众多的组装处理步骤，这些都是不理想的。尽管金对金连接(GGI)可以更为简化和清洁，但是金是贵重的金属，因此，对于使用含金的隆起焊盘来说也是不理想的。根据本发明的至少某些方面，倒焊芯片的焊接方法可以包括超声波热焊接模片的处理过程，其中可以适用热能和超声波能量，在力的作用下，以获得基片上的铜柱隆起焊盘和基片上的导电性的焊接垫片之间的焊接。正如上文中所讨论的，超声波热焊接被用于GGI接合器中，以便形成含金的隆起焊盘的模片和基片上的含金焊接垫片之间的含金的焊接。然而，这些含金粘结是同质的，而且，众所周知的是，金是一种软质的有延展性的金属，与大部分焊料合金，尤其是无铅的焊料合金不同的是，金是相当脆弱的。令人惊讶的是，已经发现超声波热焊接的处理过程能够成功适用到铜柱隆起焊盘上，尽管事实上铜柱隆起焊盘包括不同种类的材料，以及甚至使用了无铅焊料。超声波热焊接模片的方法的各个方面和实施方案将在下文中结合对应的附图进行讨论。
人们将会理解，本文中讨论的方法和装置的实施方案并未将其应用限制在以下描述或者举例说明的对应的附图中所示的结构和部件的排列的细节中。方法和装置能够通过其他的方法来执行，并且可以通过各种不同的方式来实践和完成。本文中提供的特定执行的实施例仅仅是出于举例说明的目的，而不是一种限制。特别是，结合一个或更多的实施方案进行讨论的步骤、元素和特征并不将其他任何实施方案中相同的功能排除在外。同样的，本文中使用的术语和措辞只是出于描述的目的，而不应理解为限制。本文中使用的术语“包括”，“包含”，“具有”，“含有”，“包括在其中”以及以上术语的联合使用都是指包括其后所列项目和等同物，以及其他的项目。
附图1中举例说明的是，制造半导体设备的方法和过程的一个实施例的流程图。该处理过程的方法和实施方案将在下文中继续参考附图1进行讨论。
根据一个实施方案，生产半导体设备的过程可以包括在晶片上形成隆起焊盘的处理过程中将“隆起焊盘”附着到半导体晶片上，正如附图1中用步骤100表示的那样。参考附图2，在此举例说明的是半导体晶片200的一个实施例。晶片可以包括模片220和垫片202，在垫片上，隆起焊盘将被附着以允许晶片100将倒焊芯片安装到基片上，正如将要在下文中详细讨论的那样。人们将会理解，在至少一个实施方案中，隆起焊盘的整个处理过程可以在基片的级别上进行，因此，晶片200可以包括众多的模片220。之后，具有隆起的晶片可以分解为单数的(附图1中的步骤102)各个倒焊芯片，其安装在集成版或者基片上，正如将要在下文中进行详细讨论的那样。可以选择的是，隆起焊盘的处理过程可以在芯片的级别上进行，例如，当晶片包含有众多的模片时(或者是众多的模板，每一个模板上都包括两个或更多的模片)，众多的模片上已经具有被分解为单数的各个芯片，以及每一个芯片都可各自地形成隆起。因此，人们将会理解，本文中与晶片200结合使用的术语“晶片”是指包括全部的或者任何具有沉淀在其上的众多的模片或者模板的半导体晶片，一个模片或者一块模板包括至少两个模片。而且，本文中使用的术语“模片焊接”(或者类似的术语)是指将晶片(其包括至少一个模片)焊接到基片上。
在一个实施方案中，在晶片上形成隆起焊盘(步骤100)可以包括执行铜柱隆起焊盘的处理过程。参考附图3，在此举例说明的是一个具有附着到垫片202上的铜柱隆起焊盘204的晶片200的实施例。铜柱隆起焊盘204包括两个部分：铜柱部分206和焊接端208。在一个实施例中，焊接端可以是焊料端，和铜柱206是圆柱形的。然而，人们将会理解，本发明并不限于，焊接端208可以包括除了焊料之外的其他材料，例如，举例来说，金，而且铜柱206可以具有除了圆柱形之外的其他形状。出于各种原因，与其他纯焊料的隆起焊盘相比，铜柱隆起焊盘是优选的。典型的是，铜柱隆起焊盘提供一种更好的电连接和改进的热特性，原因在于，与焊料合金相比，铜具有更高的导电性。除此之外，由于是铜的圆筒，与相同高度的球形焊料的隆起焊盘相比，铜柱隆起焊盘可以更窄。因此，铜柱隆起焊盘可以便于形成更好的连接网格。对应的，根据本发明的各个方面的用于具有铜柱隆起焊盘的焊接设备的方法并不要求与传统的铜-锡焊接处理有关的众多的步骤的组装和清理程序，因此可能是具有优势的。
仍然参考附图3，在一个实施例中，铜柱206的高度可以在大约60-70微米(um)之间。在很多应用中，希望能够提供无铅的“绿色”部件，或者至少是铅的使用量最小的部件。因此，在至少一些实施例中，焊接端208可以包括无铅的焊料合金或者金属，例如，金。在这种情况下，如果焊接端包括焊料，焊料合金可以具有高的锡含量。对应的，焊接端208可以包括共熔的锡-铅焊料。为了制备铜柱隆起焊盘204，形成隆起的步骤100可以包括两个阶段的电镀过程，其中铜柱206被电镀到垫片102上，和焊接端208在铜的圆柱206上沉淀。
正如上文中所讨论的，在至少一个实施方案中，在铜柱隆起焊盘204被附着到晶片200上之后，晶片200可以被分解(附图1中的步骤102)为单数的各个模片216，其可以是安装到基片上的倒焊芯片。晶片可以被分解为单数，以致每一个模片都可以包括至少一块，通常是包括若干块铜柱隆起焊盘。
参考附图4，在此举例说明的是基片的一个实施例的一部分。基片210可以包括导电性的垫片212，晶片(或者被分解为单数的模片)的铜柱隆起焊盘可以附着在其上。在一个实施例中，基片210可以是传统的层状基片，例如FR4，具有含金的漆面，以致垫片212是由金形成的(或者至少是金电镀)。然而，垫片可以选择包含导电性的材料或者是除了金之外的其他金属，例如，举例来说，铜、银、钯或者焊料。在将模片焊接到垫片212上之前，含金的垫片212可以通过使用等离子体的清理方法进行清洁，正如本领域的任何一名普通技术人员所熟知的那样。清洁过程可以作为准备用于焊接的基片的步骤104(请参考附图1)的一部分。准备步骤104也可以包括沉淀绝缘体层(例如，焊料罩面)214。人们将会理解，尽管步骤4是在附图1中进行举例说明的，且跟在步骤100和102之后，本发明并未有任何限制，步骤4可以在焊接之前的任何时间内(即，步骤106)进行。
下一步骤106可以包括焊接一个或更多的模片(来自分解为单数的晶片200)到基片210上。参考附图5，在此举例说明的是定位用于基片210上的焊接的倒焊芯片的模片216(具有在上文中讨论的铜柱隆起焊盘204)的一个实施例。根据一个实施方案，焊接步骤106可以包括热机械的模片焊接过程，在其中，热能和机械能被使用以便获得模片216和基片210之间的连接。一种装置，例如，或者类似于传统的GGI接合器可以用于提供热能和机械能。例如，基片210和模片216可以放置在焊接装置(正如在GGI过程中所进行的那样)的压力头之下。该装置可以被控制用于提供热能以融化铜柱隆起焊盘204的焊料端208，同时压力头提供的机械能将模片216压到基片210上。热能和机械能的联合使用足以使焊接端208变形，以导致铜柱隆起焊盘焊接到基片210上的导电性的垫片212上，并获得模片216和基片210之间的连接。例如，如果焊接端208是焊料端，充足热能和机械力的结合被适用以便至少部分融化焊料端208，以将铜柱隆起焊盘焊接到基片210的导电性的垫片212上。
在一个实施方案中，模片可以被预先加热，例如，当使用焊料端208时，可以软化焊料。基片210也可以被加热以增强连粘性。然后，接合器可以适用超声波能量，当压力头机械地将模片压到基片上时。在焊接端208是焊料端的实施例中，超声波能量与由接合器的压力头所提供的压力一并使用，可以作为一种定位定位机械式倒流压力，以将焊料端208融化形成模片216和基片210之间的永久连接。超声波热焊接的处理过程可以在一个步骤中将模片附着到基片上，而不会像传统的处理方式那样需要分开的准备、倒流和清理步骤。除此之外，根据本发明的实施方案的超声波热焊接的模片焊接是一种焊剂较少的处理过程，因此，更有利于将污染物减到最少。这可能成为部件的制造过程，例如，大声波(BAW)或者是其他的MEMS设备的部分优势，所述设备对于由焊剂残余物的污染非常敏感。
在一个实施例中，连续的焊接需要在具有铜柱隆起焊盘的模片和具有含金的垫片的基片之间获得。在这一实施例中，纯锡焊料被用在焊料端208中。在焊接之前，基片上的含金的垫片使用等离子体进行清理。可以使用一种由松下公司(Pansasonic)提供的PSX303等离子体清理设备。该设备使用氩气进行清理，操作条件是，压力为600瓦和气体压力为20帕斯卡。氩气以5毫升/分的流动速度持续30秒的方式来适用到基片的垫片上。使用大约12牛顿的压力来焊接，超声波能量为大约半瓦。大约260摄氏度的温度被用于熔化纯锡焊料，以及焊接的时间为大约0.3秒。人们将会理解，对于具有焊料合金的铜柱隆起焊盘，而不是纯锡的隆起焊盘来说，可能会需要适用不同的温度、压力和/或超声波能量，而且本发明并未将其适用限制在纯锡焊料上。在焊接之后，模片和基片将经受模片剪切试验，为了测试在模片和基片之间形成的热机械焊接的机械完整性。每一个铜柱隆起焊盘的平均的模片剪切力是大约43克。人们观察到的是失效点是在锡焊料中。
再次参考附图1，在模片已经被焊接到基片上之后，该元件将被进一步处理，以完成部件的封装(步骤108)。进一步的处理可能包括底层填充和上层模压，正如在倒焊芯片设备中通常进行的那样，以及形成与模片的连接，可以选择的是，将球形网格阵列(或者是其他的连接结构)附着到基片上。参考附图6，在此举例说明的是将模片216焊接到基片210上的实施例，其将上层模压的化合物适用到模片216上。人们也可以看到焊接端208由于连接到基片210上的垫片212的焊剂过程(例如，当使用焊料端时，焊料融化并从而改变形状)的作用而变形。
正如上文中所讨论的，传统的铜-锡焊接过程需要若干的，通常是不连续的，组装步骤，包括焊剂沉淀，焊料倒流和焊剂清理，其增加了成本，并且对于便捷地使用铜-锡模片的焊接来说是不方便的。通过对比可知，根据本发明的各个方面和实施方案的热机械的模片焊接过程是一种无焊剂的过程，其仅需要简单的处理流程和低廉的组装成本。在至少一个实施方案中，热能和机械能在将模片放置在基片上的过程中可以适用，由此简化了一步完成的模片焊接处理过程。
尽管本发明的至少一个实施方案的若干方面已经得到描述，但是人们将会理解，对于本领域内的普通技术人员来说，各种不同形式的修改，变化和改进都是显而易见的。例如，电流的改变(和能量的改变)可以在出了最大允许的输入电流和最大允许的电池的充电电流的基础上调节输入的电流。所述的改变、修改和改进都是本发明公开的一部分，并且都在本发明的范围之内。对应地，以上描述和附图仅起到可以效仿的作用，本发明的范围将通过之前的解释和随附的权利要求书及其等同物进行限定。

Claims (19)

1.一种用于将包括至少一个铜柱隆起焊盘的模片焊接到具有对应的至少一个垫片的基片上的方法，铜柱隆起焊盘包括铜的部分和焊接端，该方法包括：
在基片上确定模片的位置，以致至少一个铜柱隆起焊盘上的焊接端与至少一个垫片进行接触；以及
将热能和机械能适用到至少一个铜柱隆起焊盘上，以将模片焊接到基片上。
2.根据权利要求1的方法，其中确定模片的位置和适用热能和机械能可以是实质上同步进行的。
3.根据权利要求1的方法，其中焊接端包括焊料端。
4.根据权利要求3的方法，其中适用热能和机械能包括适用足够的热能和机械能到至少部分融化焊料端上，以将模片焊接到基片上。
5.根据权利要求1的方法，其中适用热能和机械能包括将超声波能适用到至少一个铜柱隆起焊盘上，同时适用机械能将模片压到基片上。
6.根据权利要求5的方法，进一步包括在适用超声波能和机械能之前，对模片进行预先加热。
7.根据权利要求5的方法，进一步包括在适用超声波能和机械能之前，对基片进行预先加热。
8.一种半导体设备的制造方法，该方法包括：
在晶片上形成众多的铜柱隆起焊盘，众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘都包括铜的部分和焊接端；
将晶片分解为单数的众多的模片，每一个模片都包括众多的铜柱隆起焊盘的至少其中之一的铜柱隆起焊盘；
在基片上确定众多模片的位置；以及
通过超声波热焊接将众多的模片焊接到基片上。
9.根据权利要求8的方法，其中基片包括众多的导电性的垫片，以及其中在基片上确定众多的模片的位置包括确定众多的模片的位置，以致众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘的焊接端都与众多的导电性垫片的各自的其中之一接触。
10.根据权利要求9的方法，其中每一个铜柱隆起焊盘中的焊接端包括焊料端。
11.根据权利要求10的方法，其中通过超声波热焊接将众多的模片焊接到基片上包括将热能适用到众多的铜柱隆起焊盘上，以至少部分融化焊料端。
12.根据权利要求9的方法，其中通过超声波热焊接将众多的模片焊接到基片上包括将超声波能适用到众多的铜柱隆起焊盘上，以及适用机械力将众多的模片压到基片上。
13.根据权利要求9的方法，其中通过超声波热焊接将众多的模片焊接到基片上包括预先加热众多的模片和随后适用超声波能和机械力以将众多的模片焊接到基片上。
14.根据权利要求8的方法，进一步包括用上层模压的化合物来覆盖至少部分众多的模片。
15.一种用于将倒焊芯片的模片焊接到基片上的方法，倒焊芯片的模片包括众多的铜柱隆起焊盘，众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘都包括附着到模片上的铜的部分和附着到铜的部分上的焊接端，该方法包括：
在基片上确定模片的位置，以致众多的铜柱隆起焊盘中的每一个铜柱隆起焊盘的焊接端与基片上的众多的焊接垫片的各自对应其中之一接触；以及
通过超声波热焊接将模片焊接到基片上。
16.根据权利要求15的方法，其中焊接端包括焊料端。
17.根据权利要求16的方法，其中通过超声波热焊接将模片焊接到基片上包括适用热能和机械能到模片上，以至少部分融化焊料端以形成众多的铜柱隆起焊盘和对应的基片上的众多的焊接垫片之间的连接。
18.根据权利要求17的方法，其中适用热能和机械能包括适用超声波能和机械力。
19.根据权利要求15的方法，其中通过超声波热焊接将模片焊接到基片上包括预先加热至少模片和基片的其中之一，和随后适用超声波能到众多的铜柱隆起焊盘上，同时适用机械力将模片压到基片上。
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