MX2013008837A - Tarjeta inteligente de doble interfaz. - Google Patents

Tarjeta inteligente de doble interfaz.

Info

Publication number
MX2013008837A
MX2013008837A MX2013008837A MX2013008837A MX2013008837A MX 2013008837 A MX2013008837 A MX 2013008837A MX 2013008837 A MX2013008837 A MX 2013008837A MX 2013008837 A MX2013008837 A MX 2013008837A MX 2013008837 A MX2013008837 A MX 2013008837A
Authority
MX
Mexico
Prior art keywords
antenna
contact pad
card body
dual
conductive
Prior art date
Application number
MX2013008837A
Other languages
English (en)
Inventor
Carl Mario Sutera
Original Assignee
American Bank Note Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Bank Note Co filed Critical American Bank Note Co
Publication of MX2013008837A publication Critical patent/MX2013008837A/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Una tarjeta inteligente de doble interfaz comprende un módulo de circuito integrado (IC) acoplado a un cuerpo de tarjeta de plástico. El módulo IC incluye múltiples almohadillas de contacto expuestas externamente con caras hacia abajo, que están acopladas eléctricamente a las secciones expuestas externamente correspondientes de una antena de frecuencia de radio (RF) incorporadas en el cuerpo de la tarjeta. Cada almohadilla de contacto está conectada eléctricamente a la antena de RF por un par de elementos conductores, opuestos, en forma de grapas, con un elemento conductor que está soldado de forma permanente a la almohadilla de contacto, y el otro soldado permanentemente a la antena. Cada elemento conductor incluye un par de brazos de resorte elásticos que mantienen la conexión eléctrica entre la almohadilla de contacto y la antena, incluso con el movimiento del módulo IC en relación con el cuerpo de la tarjeta. Para proporcionar una mayor redundancia de conexión entre cada almohadilla de contacto y la antena, los brazos de resorte elásticos de los elementos conductores opuestos se encapsulan con un suministro de material de relleno conductor.
MX2013008837A 2011-01-31 2012-01-31 Tarjeta inteligente de doble interfaz. MX2013008837A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161462238P 2011-01-31 2011-01-31
US201161463897P 2011-02-24 2011-02-24
PCT/US2012/023378 WO2012106365A1 (en) 2011-01-31 2012-01-31 Dual-interface smart card

Publications (1)

Publication Number Publication Date
MX2013008837A true MX2013008837A (es) 2013-11-20

Family

ID=46576524

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013008837A MX2013008837A (es) 2011-01-31 2012-01-31 Tarjeta inteligente de doble interfaz.

Country Status (7)

Country Link
US (1) US8640965B2 (es)
EP (1) EP2671192A4 (es)
AU (1) AU2012212252A1 (es)
BR (1) BR112013019548A2 (es)
CA (1) CA2826196A1 (es)
MX (1) MX2013008837A (es)
WO (1) WO2012106365A1 (es)

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FR2996944B1 (fr) * 2012-10-15 2018-05-04 Smart Packaging Solutions Sps Module electronique simplifie pour carte a puce a double interface de communication
US9167691B2 (en) * 2013-04-16 2015-10-20 Identive Group, Inc. Dual interface module and dual interface card having a dual interface module manufactured using laser welding
US9424507B2 (en) 2014-04-01 2016-08-23 Nxp B.V. Dual interface IC card components and method for manufacturing the dual-interface IC card components
US9536188B2 (en) 2014-04-01 2017-01-03 Nxp B.V. Dual-interface IC card components and method for manufacturing the dual-interface IC card components
WO2015157222A2 (en) * 2014-04-07 2015-10-15 American Banknote Corporation System and method for detecting the depth of an antenna in the card body of a smart card
US9390365B2 (en) 2014-04-10 2016-07-12 American Banknote Corporation Integrated circuit module for a dual-interface smart card
WO2016106251A2 (en) * 2014-12-23 2016-06-30 Composecure, Llc Smart metal card with radio frequency (rf) transmission capability
EP3059698B1 (fr) * 2015-02-20 2021-03-31 Thales Dis France SA Procédé de fabrication d'un module électronique simple face comprenant des zones d'interconnexion
EP3079105B1 (en) * 2015-04-08 2021-03-31 Nxp B.V. Dual-interface ic card components and method for manufacturing the dual-interface ic card components
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
US12056554B2 (en) * 2017-09-29 2024-08-06 Avery Dennison Retail Information Services Llc Strap mounting techniques for wire format antennas
WO2019068077A1 (en) 2017-09-29 2019-04-04 Avery Dennison Retail Information Services, Llc SYSTEMS AND METHODS FOR TRANSFERRING A FLEXIBLE CONDUCTOR TO A MOBILE STRIP
US11003979B1 (en) * 2019-10-18 2021-05-11 Capital One Service, LLC Multi-faced payment card with partitioned dual smart chips and antennae

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US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
DE19654902C2 (de) * 1996-03-15 2000-02-03 David Finn Chipkarte
EP0912962B1 (de) * 1996-07-15 2000-04-05 Austria Card Plastikkarten und Ausweissysteme Gesellschaft MBH Datenträger mit einem modul und einem hologramm
JPH10198950A (ja) * 1996-11-18 1998-07-31 Dainippon Printing Co Ltd 磁気カード
DE19749650C2 (de) * 1997-11-10 2000-01-13 Meinen Ziegel & Co Gmbh Verfahren zum Herstellen einer elektrischen Verbindung eines in einer Kavität eines Kartenkörpers einer Chipkarte eingesetzten, elektronische Komponenten aufweisenden Moduls
US7306158B2 (en) * 2001-07-10 2007-12-11 American Express Travel Related Services Company, Inc. Clear contactless card
TW504864B (en) * 2000-09-19 2002-10-01 Nanopierce Technologies Inc Method for assembling components and antennae in radio frequency identification devices
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DE10257111B4 (de) * 2002-12-05 2005-12-22 Mühlbauer Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
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Also Published As

Publication number Publication date
US20120193436A1 (en) 2012-08-02
BR112013019548A2 (pt) 2017-07-04
US8640965B2 (en) 2014-02-04
EP2671192A1 (en) 2013-12-11
AU2012212252A1 (en) 2013-08-15
WO2012106365A1 (en) 2012-08-09
CA2826196A1 (en) 2012-08-09
EP2671192A4 (en) 2014-10-22

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