FR2996944B1 - Module electronique simplifie pour carte a puce a double interface de communication - Google Patents
Module electronique simplifie pour carte a puce a double interface de communicationInfo
- Publication number
- FR2996944B1 FR2996944B1 FR1202740A FR1202740A FR2996944B1 FR 2996944 B1 FR2996944 B1 FR 2996944B1 FR 1202740 A FR1202740 A FR 1202740A FR 1202740 A FR1202740 A FR 1202740A FR 2996944 B1 FR2996944 B1 FR 2996944B1
- Authority
- FR
- France
- Prior art keywords
- communication interface
- chip
- antenna
- proximal
- distal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 230000009977 dual effect Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000004377 microelectronic Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
L'invention concerne un module électronique (21) à double interface de communication à contact et sans contact, notamment pour carte à puce, ledit module comportant d'une part un substrat (8) présentant sur une première face un bornier de contacts électriques (35) permettant un fonctionnement par contact avec les contacts correspondants d'un lecteur de carte à puce, et comportant sur une seconde face une antenne (3) pourvue d'au moins une spire et une puce microélectronique (2) enrobée par une goutte de résine isolante (7) et pourvue d'une interface de communication sans contact, ladite antenne comportant un plot de connexion proximal (4) et un plot de connexion distal (5) destinés à être connectés aux bornes correspondantes (30,31) de ladite interface de communication sans contact de la puce (2), caractérisé en ce que les deux plots de connexion proximal (4) et distal (5) de l'antenne (3) sont disposés à l'intérieur de la zone d'encapsulation par une résine isolante (7), de façon à réaliser un pontage conducteur entre chaque plot de connexion proximal (4) ou distal (5) et la borne correspondante (32,31) de la puce, directement par l'intermédiaire de fils de connexion (12) entre lesdits plots de connexion (4,5) et les bornes correspondantes (32,31) de la puce, sans utiliser de vias.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1202740A FR2996944B1 (fr) | 2012-10-15 | 2012-10-15 | Module electronique simplifie pour carte a puce a double interface de communication |
PCT/FR2013/000269 WO2014060659A1 (fr) | 2012-10-15 | 2013-10-14 | Module électronique simplifié pour carte à puce à double interface de communication |
US14/435,680 US20150269476A1 (en) | 2012-10-15 | 2013-10-14 | Simplified electronic module for a smart card with a dual communication interface |
CN201380065513.4A CN104995642A (zh) | 2012-10-15 | 2013-10-14 | 具有双通信接口的用于芯片卡的简化的电子模块 |
EP13795543.1A EP2907084A1 (fr) | 2012-10-15 | 2013-10-14 | Module électronique simplifié pour carte à puce à double interface de communication |
PH12015500827A PH12015500827A1 (en) | 2012-10-15 | 2015-04-15 | Simplified electronic module for a smart card with a dual communication interface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1202740A FR2996944B1 (fr) | 2012-10-15 | 2012-10-15 | Module electronique simplifie pour carte a puce a double interface de communication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2996944A1 FR2996944A1 (fr) | 2014-04-18 |
FR2996944B1 true FR2996944B1 (fr) | 2018-05-04 |
Family
ID=49378305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1202740A Active FR2996944B1 (fr) | 2012-10-15 | 2012-10-15 | Module electronique simplifie pour carte a puce a double interface de communication |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150269476A1 (fr) |
EP (1) | EP2907084A1 (fr) |
CN (1) | CN104995642A (fr) |
FR (1) | FR2996944B1 (fr) |
PH (1) | PH12015500827A1 (fr) |
WO (1) | WO2014060659A1 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2992761B1 (fr) | 2012-07-02 | 2015-05-29 | Inside Secure | Procede de fabrication d'un microcircuit sans contact |
FR3020548B1 (fr) * | 2014-04-24 | 2020-02-14 | Linxens Holding | Procede de fabrication d'une structure pour carte a puce et structure de carte a puce obtenue par ce procede |
EP3182507A1 (fr) * | 2015-12-15 | 2017-06-21 | Gemalto Sa | Module antenne simple face avec composant cms |
FR3047101B1 (fr) * | 2016-01-26 | 2022-04-01 | Linxens Holding | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
DE102016110780A1 (de) * | 2016-06-13 | 2017-12-14 | Infineon Technologies Austria Ag | Chipkartenmodul und Verfahren zum Herstellen eines Chipkartenmoduls |
CN106339729B (zh) * | 2016-10-15 | 2023-06-06 | 广州明森科技股份有限公司 | 一种智能卡生产线的末端接卡和收卡装置 |
FR3058545B1 (fr) * | 2016-11-04 | 2018-10-26 | Smart Packaging Solutions | Procede de fabrication d'un module electronique pour carte a puce |
FR3074335B1 (fr) * | 2017-11-24 | 2019-10-18 | Smart Packaging Solutions | Module electronique a antenne optimisee pour carte a puce a double interface de communication |
CN108764436A (zh) * | 2018-08-17 | 2018-11-06 | 恒宝股份有限公司 | 一种单界面条带单元、单界面条带、模块和智能卡 |
FR3086098B1 (fr) * | 2018-09-18 | 2020-12-04 | Smart Packaging Solutions | Procede de fabrication d'un module electronique pour objet portatif |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19632113C1 (de) * | 1996-08-08 | 1998-02-19 | Siemens Ag | Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte |
DE19632115C1 (de) * | 1996-08-08 | 1997-12-11 | Siemens Ag | Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls |
FR2765010B1 (fr) * | 1997-06-20 | 1999-07-16 | Inside Technologies | Micromodule electronique, notamment pour carte a puce |
US6634564B2 (en) * | 2000-10-24 | 2003-10-21 | Dai Nippon Printing Co., Ltd. | Contact/noncontact type data carrier module |
FR2915011B1 (fr) * | 2007-03-29 | 2009-06-05 | Smart Packaging Solutions Sps | Carte a puce a double interface de communication |
US8366009B2 (en) * | 2010-08-12 | 2013-02-05 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
MX2013008837A (es) * | 2011-01-31 | 2013-11-20 | American Bank Note Co | Tarjeta inteligente de doble interfaz. |
FR2977958A1 (fr) * | 2011-07-12 | 2013-01-18 | Ask Sa | Carte a circuit integre hybride contact-sans contact a tenue renforcee du module electronique |
FR2992761B1 (fr) * | 2012-07-02 | 2015-05-29 | Inside Secure | Procede de fabrication d'un microcircuit sans contact |
-
2012
- 2012-10-15 FR FR1202740A patent/FR2996944B1/fr active Active
-
2013
- 2013-10-14 US US14/435,680 patent/US20150269476A1/en not_active Abandoned
- 2013-10-14 CN CN201380065513.4A patent/CN104995642A/zh active Pending
- 2013-10-14 WO PCT/FR2013/000269 patent/WO2014060659A1/fr active Application Filing
- 2013-10-14 EP EP13795543.1A patent/EP2907084A1/fr not_active Withdrawn
-
2015
- 2015-04-15 PH PH12015500827A patent/PH12015500827A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN104995642A (zh) | 2015-10-21 |
PH12015500827A1 (en) | 2015-06-08 |
EP2907084A1 (fr) | 2015-08-19 |
US20150269476A1 (en) | 2015-09-24 |
WO2014060659A1 (fr) | 2014-04-24 |
FR2996944A1 (fr) | 2014-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2996944B1 (fr) | Module electronique simplifie pour carte a puce a double interface de communication | |
CY1123448T1 (el) | Μεταλλικη έξυπνη καρτα με δυνατοτητα διπλης διεπαφης | |
MA29778B1 (fr) | Module electronique a double interface de communication, notamment pour carte a puce. | |
MY151844A (en) | Chip card with a dual communication interface | |
WO2007146307A3 (fr) | Boîtiers de puce à empiler | |
TW200703429A (en) | Stacked semiconductor chip package | |
JP2013546199A5 (fr) | ||
MY141371A (en) | Smart card body, smart card and manufacturing process for same | |
MY171050A (en) | Semiconductor component and method of manufacture | |
TW200715499A (en) | Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts | |
EA201400820A1 (ru) | Бесконтактное устройство передачи данных, содержащий его защищенный от подделки и/или ценный документ и способ изготовления бесконтактного устройства передачи данных | |
MX2013006272A (es) | Tarjeta electronica que tiene un conector externo. | |
WO2009140939A3 (fr) | Puce semi-conductrice optoélectronique comprenant une couche réflectrice | |
MY176260A (en) | Rfid transponder antenna | |
PH12018501842B1 (en) | Integrated circuit modules and smart cards incorporating the same | |
MX355765B (es) | Cristal con al menos dos elementos de conexión eléctrica y un conductor de conexionó. | |
GB2532869A (en) | Semiconductor die and package jigsaw submount | |
RU2014124151A (ru) | Устройство радиочастотной связи, функционирование которого контролируется целенаправленным действием владельца | |
TW200514484A (en) | Substrate for electrical device and methods of fabricating the same | |
MX2018009123A (es) | Metodo para producir un modulo de tarjeta de chip y una tarjeta de chip. | |
JP2014078646A5 (ja) | パワーモジュール | |
SG138501A1 (en) | Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames | |
US8497579B1 (en) | Semiconductor packaging method and structure thereof | |
TW200609516A (en) | Probe device of probe card | |
FR3105857B1 (fr) | Module électronique à antenne optimisée pour carte à puce à double interface de communication |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 9 |
|
PLFP | Fee payment |
Year of fee payment: 10 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 12 |