EA201400820A1 - Бесконтактное устройство передачи данных, содержащий его защищенный от подделки и/или ценный документ и способ изготовления бесконтактного устройства передачи данных - Google Patents
Бесконтактное устройство передачи данных, содержащий его защищенный от подделки и/или ценный документ и способ изготовления бесконтактного устройства передачи данныхInfo
- Publication number
- EA201400820A1 EA201400820A1 EA201400820A EA201400820A EA201400820A1 EA 201400820 A1 EA201400820 A1 EA 201400820A1 EA 201400820 A EA201400820 A EA 201400820A EA 201400820 A EA201400820 A EA 201400820A EA 201400820 A1 EA201400820 A1 EA 201400820A1
- Authority
- EA
- Eurasian Patent Office
- Prior art keywords
- contact
- data transfer
- manufacture
- spiral coil
- fake
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 2
- 239000007787 solid Substances 0.000 abstract 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/305—Associated digital information
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/455—Associating two or more layers using heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/46—Associating two or more layers using pressure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H04B5/26—
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- H04B5/77—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Near-Field Transmission Systems (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
Abstract
Настоящее изобретение служит для упрощенного изготовления устройства (50) передачи данных. Это устройство (50) имеет электроизолирующий носитель (1), расположенный на носителе (1) схемный элемент, который имеет сплошную антенную проводящую дорожку (2) в форме по меньшей мере одного спирального витка (4, 5, 6) и соответственно один соединительный контакт (15, 16) на его концах, и электрически соединенный со схемным элементом электронный конструктивный элемент (3) по меньшей мере с двумя точками (11, 12) контакта. Электронный конструктивный элемент (3) размещен на монтажном участке (10) по меньшей мере над одним спиральным витком (4, 5, 6). По меньшей мере две точки (11, 12) контакта электронного конструктивного элемента (3) электрически соединены с соответственно одним соединительным контактом (15, 16) антенной проводящей дорожки (2). По меньшей мере один спиральный виток (4, 5, 6) вне монтажного участка (10) разветвляется между соответственно двумя точками (7', 7"; 8', 8"; 9', 9") разветвления по меньшей мере на две ветви (4', 4"; 5', 5"; 6', 6") спирального витка. Устройство (50) передачи данных является составной частью ценного и/или защищенного от подделки документа (100).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210203251 DE102012203251B8 (de) | 2012-03-01 | 2012-03-01 | Kontaktlose Datenübertragungseinrichtung, diese enthaltendes Sicherheits- bzw. Wertdokument |
PCT/EP2013/053731 WO2013127745A1 (de) | 2012-03-01 | 2013-02-25 | Kontaktlose datenübertragungseinrichtung, diese enthaltendes sicherheits- und/oder wertdokument und verfahren zur herstellung der kontaktlosen datenübertragungseinrichtung |
Publications (2)
Publication Number | Publication Date |
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EA201400820A1 true EA201400820A1 (ru) | 2014-11-28 |
EA025462B1 EA025462B1 (ru) | 2016-12-30 |
Family
ID=47748645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EA201400820A EA025462B1 (ru) | 2012-03-01 | 2013-02-25 | Бесконтактное устройство передачи данных, содержащий его защищенный от подделки и/или ценный документ и способ изготовления бесконтактного устройства передачи данных |
Country Status (12)
Country | Link |
---|---|
US (1) | US9111194B2 (ru) |
EP (1) | EP2820768B1 (ru) |
JP (1) | JP5980351B2 (ru) |
CN (1) | CN104321790B (ru) |
BR (1) | BR112014021397B1 (ru) |
CA (1) | CA2854256C (ru) |
CL (1) | CL2014002322A1 (ru) |
DE (1) | DE102012203251B8 (ru) |
EA (1) | EA025462B1 (ru) |
SG (1) | SG11201404353WA (ru) |
WO (1) | WO2013127745A1 (ru) |
ZA (1) | ZA201403002B (ru) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014045518A1 (ja) * | 2012-09-18 | 2014-03-27 | パナソニック株式会社 | アンテナ、送信装置、受信装置、三次元集積回路、及び非接触通信システム |
DE102013216753A1 (de) | 2013-08-23 | 2015-02-26 | Novero Dabendorf Gmbh | Vorrichtung und Verfahren zur kombinierten Signalübertragung oder zur kombinierten Signal- und Energieübertragung |
DE102014204553A1 (de) * | 2014-03-12 | 2015-09-17 | Bundesdruckerei Gmbh | Verfahren zum Austauschen von Daten zwischen einem Wert- oder Sicherheitsdokument einer Datenaustausch-Vorrichtung und Wert- oder Sicherheitsdokument |
US9378506B1 (en) * | 2014-12-10 | 2016-06-28 | Piotr Nawrocki | Security chip |
DE102014225720A1 (de) * | 2014-12-12 | 2016-06-16 | Bundesdruckerei Gmbh | LED-Modul |
US9704080B2 (en) * | 2014-12-18 | 2017-07-11 | Piotr Nawrocki | Security element for sensitive documents and a sensitive document |
US20180197835A1 (en) * | 2015-07-02 | 2018-07-12 | Lumileds Holding B.V. | A surface mount device and a method of attaching such a device |
US20180194158A1 (en) * | 2015-07-09 | 2018-07-12 | Assa Abloy Ab | Security document with transparent window |
DE102015222364A1 (de) * | 2015-11-12 | 2017-05-18 | Bundesdruckerei Gmbh | Wert- oder Sicherheitsdokument aus einem Faserverbundwerkstoff und Verfahren zum Herstellen des Wert- oder Sicherheitsdokuments |
US10198890B2 (en) | 2016-04-19 | 2019-02-05 | X-Celeprint Limited | Hybrid banknote with electronic indicia using near-field-communications |
US9997102B2 (en) * | 2016-04-19 | 2018-06-12 | X-Celeprint Limited | Wirelessly powered display and system |
CN106099347A (zh) * | 2016-07-13 | 2016-11-09 | 上海德门电子科技有限公司 | 双面板并联走线形式nfc天线 |
RO132616B1 (ro) | 2016-11-07 | 2020-09-30 | Promar Textil Industries S.R.L. | Transponder de identificare prin radiofrecvenţă pentru medii agresive |
US11521785B2 (en) * | 2016-11-18 | 2022-12-06 | Hutchinson Technology Incorporated | High density coil design and process |
US11387033B2 (en) | 2016-11-18 | 2022-07-12 | Hutchinson Technology Incorporated | High-aspect ratio electroplated structures and anisotropic electroplating processes |
RO133013B1 (ro) * | 2017-06-16 | 2020-09-30 | Promar Textil Industries S.R.L. | Etichetă rfid pentru medii agresive cu cuplaj inductiv în buclă dublă |
WO2020112569A1 (en) * | 2018-11-30 | 2020-06-04 | Hutchinson Technology Incorporated | High density coil design and process |
US11936103B2 (en) | 2019-10-29 | 2024-03-19 | Teijin Limited | Conductive film for antennas, and antenna |
Family Cites Families (18)
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DE19732353A1 (de) * | 1996-09-27 | 1999-02-04 | Fraunhofer Ges Forschung | Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte |
JP3687783B2 (ja) | 1997-11-04 | 2005-08-24 | エルケ ツァケル | コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード |
DE69918308T2 (de) | 1998-04-10 | 2004-10-21 | E Ink Corp | Elektronische anzeige basierend auf organischen feldeffekt-transistoren |
US6522308B1 (en) * | 2000-01-03 | 2003-02-18 | Ask S.A. | Variable capacitance coupling antenna |
US20100156723A1 (en) * | 2001-03-26 | 2010-06-24 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
JP2005516378A (ja) | 2001-06-20 | 2005-06-02 | シタラ リミティド | 薄い平面型スイッチおよびその用途 |
DE10258670A1 (de) * | 2002-12-13 | 2004-06-24 | Giesecke & Devrient Gmbh | Transponder zur berührungslosen Übertragung von Daten |
EP1715374B1 (en) | 2005-04-21 | 2008-03-19 | Samsung SDI Germany GmbH | Active matrix circuit, active matrix display and method for manufacturing the same |
FR2886466B1 (fr) * | 2005-05-25 | 2012-06-15 | Oberthur Card Syst Sa | Entite electronique a antenne magnetique |
FR2890502A1 (fr) * | 2005-09-02 | 2007-03-09 | Gemplus Sa | Ajustement de frequence de resonance par reglage de capacite repartie inter-spires |
JP2008084307A (ja) * | 2006-08-31 | 2008-04-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
DE102007027838B4 (de) * | 2007-06-13 | 2021-01-14 | Leonhard Kurz Gmbh & Co. Kg | Mehrschichtiges Folienelement |
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DE102008052569B3 (de) * | 2008-10-21 | 2010-04-15 | Bundesdruckerei Gmbh | Inlay für ein Sicherheits- und/oder Wertdokument, Verfahren zu seiner Herstellung sowie seine Verwendung in einem Verfahren zur Herstellung eines Sicherheits- und/oder Wertdokumentes |
KR101567023B1 (ko) * | 2008-12-11 | 2015-11-13 | 삼성전자주식회사 | 무선 주파수 식별 태그 및 그것의 형성 방법 |
DE102010028444B4 (de) * | 2010-04-30 | 2016-06-23 | Bundesdruckerei Gmbh | Dokument mit einem Chip und Verfahren zur Herstellung eines Dokuments |
FR2962579A1 (fr) * | 2010-07-12 | 2012-01-13 | Ask Sa | Dispositif d'identification radio frequence en polycarbonate et son procede de fabrication |
CN105977613B (zh) * | 2012-02-01 | 2019-11-22 | 株式会社村田制作所 | 天线装置及通信终端装置 |
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2012
- 2012-03-01 DE DE201210203251 patent/DE102012203251B8/de active Active
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2013
- 2013-02-25 CN CN201380010081.7A patent/CN104321790B/zh active Active
- 2013-02-25 EP EP13705808.7A patent/EP2820768B1/de active Active
- 2013-02-25 US US14/382,138 patent/US9111194B2/en active Active
- 2013-02-25 SG SG11201404353WA patent/SG11201404353WA/en unknown
- 2013-02-25 CA CA2854256A patent/CA2854256C/en active Active
- 2013-02-25 EA EA201400820A patent/EA025462B1/ru not_active IP Right Cessation
- 2013-02-25 WO PCT/EP2013/053731 patent/WO2013127745A1/de active Application Filing
- 2013-02-25 JP JP2014559171A patent/JP5980351B2/ja active Active
- 2013-02-25 BR BR112014021397-6A patent/BR112014021397B1/pt active IP Right Grant
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2014
- 2014-04-24 ZA ZA2014/03002A patent/ZA201403002B/en unknown
- 2014-09-01 CL CL2014002322A patent/CL2014002322A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
BR112014021397B1 (pt) | 2022-07-05 |
WO2013127745A1 (de) | 2013-09-06 |
CA2854256C (en) | 2017-06-20 |
DE102012203251B8 (de) | 2013-11-07 |
DE102012203251B4 (de) | 2013-10-31 |
DE102012203251A1 (de) | 2013-09-05 |
CL2014002322A1 (es) | 2015-05-15 |
JP2015511741A (ja) | 2015-04-20 |
CA2854256A1 (en) | 2013-09-06 |
CN104321790A (zh) | 2015-01-28 |
US9111194B2 (en) | 2015-08-18 |
US20150028107A1 (en) | 2015-01-29 |
EA025462B1 (ru) | 2016-12-30 |
EP2820768A1 (de) | 2015-01-07 |
CN104321790B (zh) | 2017-06-06 |
EP2820768B1 (de) | 2019-02-13 |
JP5980351B2 (ja) | 2016-08-31 |
SG11201404353WA (en) | 2014-10-30 |
BR112014021397A2 (pt) | 2021-05-25 |
ZA201403002B (en) | 2015-04-29 |
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