BRPI0813479A2 - Módulo de chip de transponder, etiqueta têxtil e uso do módulo de chip de transponder - Google Patents

Módulo de chip de transponder, etiqueta têxtil e uso do módulo de chip de transponder

Info

Publication number
BRPI0813479A2
BRPI0813479A2 BRPI0813479-0A2A BRPI0813479A BRPI0813479A2 BR PI0813479 A2 BRPI0813479 A2 BR PI0813479A2 BR PI0813479 A BRPI0813479 A BR PI0813479A BR PI0813479 A2 BRPI0813479 A2 BR PI0813479A2
Authority
BR
Brazil
Prior art keywords
transponder chip
chip module
connection
feet
electrical
Prior art date
Application number
BRPI0813479-0A2A
Other languages
English (en)
Inventor
Francisco Speich
Original Assignee
Textilma Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Textilma Ag filed Critical Textilma Ag
Publication of BRPI0813479A2 publication Critical patent/BRPI0813479A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Textile Engineering (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
  • Radar Systems Or Details Thereof (AREA)
BRPI0813479-0A2A 2007-07-03 2008-06-25 Módulo de chip de transponder, etiqueta têxtil e uso do módulo de chip de transponder BRPI0813479A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH10662007 2007-07-03
PCT/CH2008/000286 WO2009003299A1 (de) 2007-07-03 2008-06-25 Rfid-transponderchipmodul mit verbindungsmittel für eine antenne, textiles etikett mit einem rfid-transponderchipmodul, sowie verwendung eines rfid-transponderchipmoduls

Publications (1)

Publication Number Publication Date
BRPI0813479A2 true BRPI0813479A2 (pt) 2015-01-06

Family

ID=38669413

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0813479-0A2A BRPI0813479A2 (pt) 2007-07-03 2008-06-25 Módulo de chip de transponder, etiqueta têxtil e uso do módulo de chip de transponder

Country Status (10)

Country Link
US (1) US8844828B2 (pt)
EP (1) EP2162851B1 (pt)
JP (1) JP5300843B2 (pt)
CN (1) CN101689253B (pt)
AT (1) ATE556385T1 (pt)
BR (1) BRPI0813479A2 (pt)
ES (1) ES2385067T3 (pt)
HK (1) HK1138927A1 (pt)
TW (1) TW200905574A (pt)
WO (1) WO2009003299A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009038511A1 (de) * 2009-08-25 2011-03-10 ASTRA Gesellschaft für Asset Management mbH & Co. KG Gefaltetes und bedrucktes Pflegeetikett für Textilien
EP2296109B8 (en) * 2009-09-04 2014-08-27 STMicroelectronics International N.V. Dual interface IC card and method for producing such a card
ES2386614T3 (es) 2010-02-06 2012-08-23 Textilma Ag Dispositivo de montaje para aplicar un módulo de chip RFID sobre un sustrato, especialmente una etiqueta
DE102012212332A1 (de) * 2012-07-13 2014-01-16 Smartrac Ip B.V. Transponderlage und Verfahren zu deren Herstellung
EP2936945B1 (de) * 2012-12-19 2020-07-01 Forster Rohner Ag Bauelement, verfahren zur herstellung eines bauelements, bauelementanordnung, sowie verfahren zum applizieren eines bauelements
WO2014197573A1 (en) 2013-06-05 2014-12-11 Haemonetics Corporation Frangible rfid tag and method of producing same
WO2014204844A1 (en) * 2013-06-18 2014-12-24 Haemonetics Corporation Rfid tag and method of securing same to object
EP2897084A1 (en) * 2014-01-20 2015-07-22 King's Metal Fiber Technologies Co., Ltd. Structure of textile
CN104268607A (zh) * 2014-09-30 2015-01-07 江南大学 一种基于rfid技术的纺织面料管理系统及方法
US10321590B2 (en) 2016-09-06 2019-06-11 Apple Inc. Interlock features of a portable electronic device
EP3640850A1 (de) * 2018-10-16 2020-04-22 Relytex GmbH & Co. KG Rfid-system und verfahren zur herstellung eines rfid-systems
US11913143B2 (en) 2019-03-08 2024-02-27 Apple Inc. Fabric with electrical components

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2660465B1 (fr) * 1990-04-02 1992-06-12 Gemplus Card Int Carte securite associant un support d'informations a haute densite de stockage et un microcircuit, et son utilisation dans un lecteur de cartes.
DE19618103C2 (de) 1996-05-06 1998-05-14 Siemens Ag Chipkartenmodul mit Beschichtung aus leitfähigem Kunststoff und Verfahren zu dessen Herstellung
DE19708617C2 (de) * 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
FR2785071B1 (fr) * 1998-10-26 2002-10-25 Gemplus Card Int Procede de fabrication d'une carte a puce et d'un module electronique destine a etre insere dans une telle carte
FR2826154B1 (fr) * 2001-06-14 2004-07-23 A S K Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux
DE10155935A1 (de) * 2001-11-14 2003-05-28 Infineon Technologies Ag Intelligentes Etikett
JP3960523B2 (ja) * 2002-02-13 2007-08-15 株式会社日立製作所 無線タグ、無線タグ束、及び無線タグ装着装置
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
DE20303318U1 (de) * 2003-02-28 2004-07-08 Checkpoint Systems International Gmbh Sicherheitsetikett
DE102004003461C5 (de) * 2004-01-22 2009-11-19 ASTRA Gesellschaft für Asset Management mbH & Co. KG Textilmaterial mit einem HF-Transponder
DE102005016930A1 (de) * 2005-03-09 2006-09-21 Mühlbauer Ag Verfahren zum elektrischen und mechanischem Verbinden von Chipanschlussflächen mit Antennenanschlussflächen und Transponder
US7842156B2 (en) * 2005-04-27 2010-11-30 Avery Dennison Corporation Webs and methods of making same
DE102006011596A1 (de) 2006-03-10 2007-09-13 Mühlbauer Ag Verfahren zur Fixierung und Kontaktierung von RFID-Chipmodulen zur Herstellung von Transpondern mit textilem Substrat sowie Transponder für Textilgewebe

Also Published As

Publication number Publication date
JP5300843B2 (ja) 2013-09-25
US8844828B2 (en) 2014-09-30
EP2162851A1 (de) 2010-03-17
CN101689253A (zh) 2010-03-31
TW200905574A (en) 2009-02-01
EP2162851B1 (de) 2012-05-02
US20100181382A1 (en) 2010-07-22
HK1138927A1 (en) 2010-09-03
ES2385067T3 (es) 2012-07-17
ATE556385T1 (de) 2012-05-15
JP2010532028A (ja) 2010-09-30
CN101689253B (zh) 2013-04-03
WO2009003299A1 (de) 2009-01-08

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Legal Events

Date Code Title Description
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]