CN104995642A - 具有双通信接口的用于芯片卡的简化的电子模块 - Google Patents
具有双通信接口的用于芯片卡的简化的电子模块 Download PDFInfo
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Abstract
本发明涉及一种具有接触式和无接触式双通信接口的电子模块(21),其尤其用于芯片卡,所述模块一方面包括基底(8),所述基底(8)在第一面上呈现电接触部的接线端(35),其使得能够实现通过与芯片卡的读取器的对应接触部的接触的运转,并且在第二面上包括装备有至少一个螺旋圈的天线(3)以及被绝缘树脂滴(7)包裹的并且装备有无接触式通信接口的微电子芯片(2),所述天线包括用于连接到芯片(2)的所述无接触式通信接口的对应端子(30,31)的近端连接接点(4)和远端连接接点(5),其特征在于,天线(3)的近端(4)和远端(5)的两个连接接点被布置在通过绝缘树脂的封装区(7)的内部,以便通过在所述连接接点(4,5)和芯片的对应端子(32,31)之间的连接线(12)而直接地、在不使用通孔的情况下实现在每个近端(4)或远端(5)连接接点和芯片的对应端子(32,31)之间的导体桥接。
Description
技术领域
本发明涉及具有接触式和无接触式的双通信接口的电子模块,以及集成了这样的模块的芯片卡。
背景技术
在现有技术中已经存在以具有接触和没有接触的混合运转的芯片卡。大部分呈现装备有接触部的微电子模块,所述模块具有连接到天线的端子的射频通信接口,所述天线本身实现在卡的主体中,并且不在模块本身上。
因此,遵照现有技术的具有双通信接口的大部分卡由以下构成:
-电子模块,其包括微电子芯片,用于与接触式芯片卡的读取器的对应端子接触的接触式连接接线端(bornier),以及位于后部面的使得能够连接到天线的两个接触部
-塑料材料制成的卡,其包括天线
-导电材料,其使得能够实现在电子模块和天线之间的连接。
该结构经常存在着在天线和模块之间的机械连接的实现的一系列问题,促使可靠性或者制造效率的损失。
所使用的模块和天线之间的互连方法因此强烈地限制最终的卡的可靠性。事实上,在卡的使用期间被强加在卡上的机械和热应力导致在模块和天线之间的连接的中断,或者该连接的电阻的强烈增大,导致卡在使用过程中的性能的损失。
因此,该类型的卡不能在非常长的使用时间(例如>5年)上得以确保,这限制对于该类型的卡的可用应用。
为了缓和这些制造问题,已经在另一已知类型的芯片卡中考虑在微电子模块上直接集成天线,并且然后简单地将模块转移(reporter)到芯片卡的主体中,这容易在用于制造接触式芯片卡的大部分传统插夹(encartage)机器的情况下以低成本和大的可靠性来实现。
然而,出现剩余的问题,甚至是利用现有技术中已知的最演进的模块,在接线端的电接触部位于基底的一面上并且天线的螺旋圈位于基底的相对的面上的情况下,这迫使在基底的两个面之间实现金属化通孔以用于能够将芯片的端子连接到模块的接线端的电接触部,和连接到位于相对面上的天线的端子。
这些通孔使得能够实现电连接的桥,或者在英语中为“strap(搭接部)”,由在其之间通过电连接相连的两个通孔构成,所述电连接跨过天线的螺旋圈并且将最偏离中心的天线连接接点或者远端接点连到天线的近端连接接点,所述近端连接接点位于芯片的无接触式通信接口的端子附近。该布置使得能够一方面以在环路的高度和线的长度方面标准的方式将连接线连接到芯片,并且另一方面在模块上提供外围的贴合区,所述贴合区对于稍后将其转移到卡的主体上而言是足够的。
但是使用搭接部的该结构同样存在电子模块的实现的一系列问题。
事实上,使用配备有通孔的基底的事实是昂贵的结构,因为为了实现通孔,需要首先在基底中钻一些孔洞,然后清洁这些钻孔,用碳或钯激活孔洞的侧面以用于使其成为导体,以便使得能够实现它们在稍后步骤中的金属化,然后终止通孔并且这样使基底的两面电接合。
已知通孔的金属化将促使铜的厚度的增加,能够达到基底的每边20微米,这对于用于芯片卡的模块所作为的薄的产品而言经常是关键的。
此外,通孔的制造步骤引入复核质量的附加步骤和制造的全局效率的降低,这导致相对于没有通孔的产品而言的增加的单位成本。
发明内容
发明目的
本发明的一般目的因此是提出一种具有接触式和无接触式的双通信接口的电子模块,其没有前述缺点。
本发明的另一目的是提出一种具有接触式和无接触式的双通信接口的电子模块,其制造起来更加简单并且有比已知模块更少的成本,而在高的可靠性水平上没有损害。
本发明的特定目的是提出一种具有接触式和无接触式双通信接口的用于芯片卡的电子模块,其不需要在基底的面之间的互连或通孔。
发明概述
根据本发明,电子模块包括对包含了在芯片和其保护树脂滴的方向上的螺旋圈的凹处区的天线的设计的修改,并且天线的两个连接接点,即远端接点和近端接点两者都位于封装滴(或者任何其它等同的封装或保护手段)的区中,这使得能够连接芯片的无接触式接口的端子与天线的连接接点,而没有借助于金属化的通孔或者在膜的面之间的任何其它类型的电连接。
因此,模块的无接触式功能排他地位于模块的前部的面上,所述模块的前部的面支撑天线、芯片及其互连,ISO 7816接触部位于相对的面上。
本发明的目的因此在于具有接触式和无接触式的双通信接口的电子模块,其尤其用于芯片卡,所述模块一方面包括基底,所述基底在第一面上呈现电接触部的接线端,其使得能够实现通过与芯片卡的读取器的对应接触部的接触的运转,并且在第二面上包括装备有至少一个螺旋圈的天线以及位于封装区中并且装备有无接触式通信接口的微电子芯片,所述天线包括近端连接接点和远端连接接点,所述近端连接接点和远端连接接点用于连接到芯片的所述无接触式通信接口的对应端子,其特征在于,天线的近端和远端的两个连接接点被布置在封装区的内部,以使得在不使用通孔的情况下在近端或远端连接接点的每一个和芯片的对应端子之间实现直接的电连接,并且特征在于该直接的电连接还位于芯片的封装区中。
根据模块的实施变型,天线至少部分地布置在芯片下方,并且在天线的近端和远端连接接点之间的导体桥接于是直接通过芯片以及通过将远端连接接点连至芯片并且将芯片连至近端连接接点的导线来实现。
有利地,为了将天线的近端和远端的两个连接接点保持在芯片的封装区内,本发明预备:正常位于模块外围的天线的螺旋圈在离芯片最远的连接接点(远端接点)的邻近处包括在芯片的方向上伸展的螺旋圈的局部化的凹处,以便使得能够实现在受封装保护的区的内部的、所述远端连接接点到芯片的对应端子的连接。
以此方式,将天线的连接区(英语中“pad(焊盘)”)和射频通信功能保持在模块的基底的单面上,而不需要通过搭接部经过另一面。这尤其使得能够将微电子芯片的无接触式接口与天线的连接接点直接连接,而不使用在基底的相对的两个面之间的通孔或其它电连接。
在一个实施变型中,可能的是天线的螺旋圈本身通到模块侧边上的芯片的邻近处,而没有自模块的外围在芯片的方向上的局部化的凹处。在该情况下,螺旋圈有覆盖在芯片的接触式接口的端子和模块的ISO接触部之间的连接井的风险。
为了避免这点,本发明在该变型中预备螺旋圈包括局部化的偏离以便使其绕过在芯片的接触式接口的端子和模块的ISO连接端子之间安置的所述连接井。
根据本发明的另一有利变型,天线被配置成串联的螺旋圈的两个面层(nappe),即接近模块的外围的外部面层以及更接近芯片的内部面层,并且至少内部面层装备有凹处以及位于封装区中的接触端子,以使得能够在模块的实现期间将仅仅内部面层(3i)或螺旋圈的两个面层(3i,3e)连接到芯片。
连接串联的螺旋圈的两个面层的该可能性还使得能够根据微电子芯片的无接触式通信接口的进口的阻抗来选择天线的特性。
根据本发明的另一有利变型,天线部分地布置在芯片下方,以便使天线的远端连接接点更靠近芯片的封装区(其尤其通过绝缘树脂滴形成),以使得获得缩减的封装表面和在天线的连接接点和芯片的无接触式接口端子之间的更短的互连线。
根据本发明的附加变型,芯片可以布置在被安置在基底的厚度中的窗口中,以使得获得厚度小于或约计芯片和基底的厚度总和的模块,这使得能够将根据本发明的模块适配于非常薄的产品的需求,所述模块于是具有小于大约350微米的厚度。
本发明的目的还在于一种芯片卡,其包括根据以上特征被改善和简化的电子模块。
附图说明
在阅读详细描述和附图时,本发明的其它特征和优点将显而易见,在附图中:
-图1A和1B分别图示了按照现有技术的、尤其用于芯片卡的具有双通信接口的电子模块的平面和剖面视图;
-图2A和2B到2E分别图示了按照本发明的具有双通信接口的电子模块的平面视图和多个剖面视图;
-图3图示了图2的电子模块的变型的平面视图。
具体实施方式
如以上所指示的,图1A和1B示出了已知的电子模块1,其包括借助于贴合层13被贴合在包括绝缘层16的基底8上的芯片2。芯片2一方面连接到位于与承载芯片的面相对的模块面上的(未表示的)电接触部的接线端,这些接触部用于确保与接触式读取器进行模式接触的运转。该连接通过众所周知的导体通孔11来进行,所述通孔使得能够使位于模块的相对面上的点电相连,并且是本发明寻求消除的。
芯片2另一方面连接到定位于卡的主体中或直接在模块上的天线3,以使得确保与未表示出的无接触式芯片卡读取器的射频通信。
在天线以及在模块上预备的接触区段(plage)之间的电连接通过由导电材料实现的连接接点4、5和导体轨迹(piste)6来实现。
接线端的电接触部位于模块的基底8的一个面上,并且微电子模块的天线3的螺旋圈和芯片2位于基底的相对面上。
如所见的,天线3的螺旋圈在现有技术中集成地位于沿着模块的外围处,这使得能够最大化天线的表面并且因此在模块1和远隔的无接触式读取器之间的射频通信的范围。
在该配置中,天线3的连接接点4、5位于用斜线条表示的并且实际上经常对应于封装和保护芯片的绝缘树脂滴的表面的封装区7的外部。天线的远端连接接点5,其对应于离芯片最远的天线端部,连接到通孔10,所述通孔10本身连接到轨迹6,所述轨迹6连接到天线的近端连接接点4(即离芯片最近的连接接点),这通过另一通孔9。轨迹6因此充当导体桥接,用于在天线3的螺旋圈上方通过,并且将天线的远端连接接点带回到对应的芯片的端子附近。
由轨迹6和两个通孔9、10构成的整体因此构成导体桥接,所述导体桥接在英语中通常被称为“strap(搭接部)”。
图1B表示图1的模块的剖面图,其沿着穿过通孔9、10和连接轨迹6的虚拟剖线。在图1B的上部分中,通孔9、10是不通的,而在下方的图1B中,它们被开通。
还表示了寄生金属层14,其是由于通过金属化的通孔9、10的实现所引起的。
此外,如以上已经解释的,轨迹6和通孔9、10的实现导致本发明意图消除的超额成本和制造效率的损失。
现在参考图2,图2对应于根据本发明的电子模块的多个实施例。在这些图中已经表示了按照本发明的电子模块21,通过仰视图(图2A),也就是说芯片和天线的侧视图,和根据示出了变型的细节的不同剖面平面的剖视图(图2B到2E)。
如在图2A上所表示的,天线的远端连接接点5被带回到通过线27具体化的封装区的内部。
为了将该远端接点5带回到封装区中,而不使用通孔或搭接部,本发明预备在芯片的方向上将天线3的螺旋圈的整个面层局部地偏离到远端接点5的邻近处。因此,天线3形成自模块21的外围向模块中心延伸的局部凹处40,并且天线的螺旋圈局部地在模块的ISO接触区下方通过。
在该图2A上还表示了互连井23,其是基底中的开口,使得能够造成在芯片的接触式接口的端子和位于模块的相对面上的ISO 35金属接触部之间的连接线22。
在图2B上,所述图2B对应于图2A的沿B-B的剖面,特别地看到在芯片的接触式接口25和ISO接触部35之间的穿过被安置在基底的电介质16中的互连井23(或者英语中为“bonding(接合)”井)的连接线22。
在图2C上,所述图2C对应于图2A的沿C-C的剖面,表示了在芯片2的无接触式接口30和天线的近端连接接点4之间的金属连接线12,所述近端连接接点4即对应于最接近芯片的天线螺旋圈端部的天线连接接点。如所见的,该近端接点4位于封装区7的内部,以使得所讨论的线12是不需要任何通孔的简单的直接金属线。
在图2D上,所述图2D对应于图2A的沿D-D的剖面,表示了在芯片的无接触式接口32和天线的远端连接接点5之间的金属连接线12,所述远端连接接点5即对应于离芯片最远的天线螺旋圈端部的天线的外部连接接点。如所见的,在根据现有技术的模块的差异上,该远端接点5也位于封装区7内,以使得所讨论的线12也是直接的电连接,例如简单的直接金属线,不需要任何通孔。
该结果凭借自模块的外围向芯片的封装区(诸如在图2A上可见的)的螺旋圈面层的凹处40而获得。
在图2E上,表示了类似于图2B到2D的图,具有的差异是偏离向芯片的天线3的螺旋圈面层(凹处40)延伸直到芯片2下方,这使得能够减小封装区7的尺寸并且还缩短在天线和芯片之间的连接线12的长度。
根据很好地适合于非常薄的模块的本发明的另一变型(未表示),芯片2可以布置在被安置在基底8的厚度中的窗口中,以使得获得厚度小于芯片2和基底8的厚度总和的模块21。
参考图3,所述图3示出了类似于图2A的平面视图,但是天线3的螺旋圈面层被细分成串联的两个面层,即位于模块外围处的外部面层3e和位于外部面层和芯片的封装区之间的内部面层3i。
根据本发明的该变型,仅仅内部面层3i包括在芯片方向上的凹处,以及位于封装区中的远端接触接点5。所使用的天线于是根据所实现的连接,要么仅仅是通过螺旋圈的内部面层所形成的天线,要么是通过串联的内部和外部面层所形成的天线。
这尤其使得能够根据所使用的芯片的进口的电容而选择最佳适配的自感值。该选项因此使得能够实现更加通用的模块,以用于多种类型的芯片的物理装配,并且使得能够通过以适当的天线螺旋圈数目的连接而选择天线的电特性。
发明优点
最终地,本发明提出一种模块设计,尤其是用于芯片卡的模块,特别地在于其使得能够节省在膜的面之间的互连和通孔,而同时使得能够实现模块的传统装配。
这使得能够降低具有双通信接口的用于芯片卡的模块的制造成本,并且由此增加可靠性,因为一些制造步骤被删除。
Claims (8)
1.一种具有接触式和无接触式双通信接口的电子模块(21),其尤其用于芯片卡,所述模块一方面包括基底(8),所述基底(8)在第一面上呈现电接触部的接线端(35),其使得能够实现通过与芯片卡的读取器的对应接触部的接触的运转,并且在第二面上包括装备有至少一个螺旋圈的天线(3)以及被封装区(7)保护的并且装备有无接触式通信接口的微电子芯片(2),所述天线(3)包括用于连接到芯片(2)的所述无接触式通信接口的对应端子(30,31)的近端连接接点(4)和远端连接接点(5),其特征在于,天线(3)的近端(4)和远端(5)的两个连接接点被布置在封装区(7)的内部,并且在于电连接(12)将天线(3)的每个近端(4)或远端(5)连接接点连至芯片的对应端子(32,31),而不使用通孔。
2.根据权利要求1所述的电子模块(21),其特征在于,天线(3)至少部分地被布置在芯片(2)下方,并且特征在于在天线的近端(4)和远端(5)连接接点和天线的对应端子(32,31)之间的所述电连接(12)直接通过芯片和通过将远端连接接点(5)连至芯片并且将芯片连至近端连接接点(4)的电连接(12)来实现。
3.根据权利要求1或权利要求2所述的电子模块(21),其特征在于,天线(3)的螺旋圈位于模块的外围,并且在于,为了将天线的远端连接接点(5)带到封装区(7)的内部,天线(3)的螺旋圈在远端连接接点(5)的邻近处包括在芯片的方向上取向的局部化的凹处(40),以便使得能够实现在封装区(7)内部的在所述远端连接接点(5)和芯片的对应端子之间的连接。
4.根据前述权利要求中之一所述的电子模块(21),其特征在于,天线(3)的螺旋圈在模块的至少一侧上穿过封装区(7),并且在于其包括螺旋圈的局部化的偏离,用于使其绕过被安置在芯片的接触式接口的端子(30、31)和模块的ISO连接端子之间的连接井(23)。
5.根据前述权利要求中任一项所述的电子模块(21),其特征在于,天线(3)被配置成串联的螺旋圈的两个面层,即接近模块的外围的外部面层(3e)和更接近芯片(2)的内部面层(3i),至少内部面层(3i)装备有凹处和位于封装区中的接触端子,以使得能够在模块的实现期间将仅仅内部面层(3i)或螺旋圈的两个面层(3i,3e)连接到芯片。
6.根据前述权利要求中任一项所述的电子模块(21),其特征在于,天线(3)部分地布置在芯片(2)下方,以便使天线的远端连接接点(5)更靠近封装区(7),以便获得缩减的封装表面和在天线的连接接点(4,5)和芯片的无接触式接口的端子(30,31)之间的更短的电连接(12)。
7.根据前述权利要求中任一项所述的电子模块(21),其特征在于,芯片(2)布置在被安置在基底(8)的厚度中的窗口中,以便获得厚度小于或约计芯片(2)和基底(8)的厚度总和的模块(21)。
8.具有接触式和无接触式双通信接口的芯片卡,其特征在于,包括根据权利要求1至7中任一项所述的电子模块(21)。
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FR3020548B1 (fr) * | 2014-04-24 | 2020-02-14 | Linxens Holding | Procede de fabrication d'une structure pour carte a puce et structure de carte a puce obtenue par ce procede |
FR3047101B1 (fr) | 2016-01-26 | 2022-04-01 | Linxens Holding | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
CN106339729B (zh) * | 2016-10-15 | 2023-06-06 | 广州明森科技股份有限公司 | 一种智能卡生产线的末端接卡和收卡装置 |
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US20150269476A1 (en) | 2015-09-24 |
WO2014060659A1 (fr) | 2014-04-24 |
EP2907084A1 (fr) | 2015-08-19 |
PH12015500827A1 (en) | 2015-06-08 |
FR2996944A1 (fr) | 2014-04-18 |
FR2996944B1 (fr) | 2018-05-04 |
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