FR2915011B1 - Carte a puce a double interface de communication - Google Patents

Carte a puce a double interface de communication

Info

Publication number
FR2915011B1
FR2915011B1 FR0702299A FR0702299A FR2915011B1 FR 2915011 B1 FR2915011 B1 FR 2915011B1 FR 0702299 A FR0702299 A FR 0702299A FR 0702299 A FR0702299 A FR 0702299A FR 2915011 B1 FR2915011 B1 FR 2915011B1
Authority
FR
France
Prior art keywords
communication interface
chip card
double communication
double
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0702299A
Other languages
English (en)
Other versions
FR2915011A1 (fr
Inventor
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smart Packaging Solutions SAS
Original Assignee
Smart Packaging Solutions SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0702299A priority Critical patent/FR2915011B1/fr
Application filed by Smart Packaging Solutions SAS filed Critical Smart Packaging Solutions SAS
Priority to MX2009010433A priority patent/MX2009010433A/es
Priority to US12/593,570 priority patent/US8317108B2/en
Priority to PCT/FR2008/000435 priority patent/WO2008142245A2/fr
Priority to KR1020097022611A priority patent/KR101494916B1/ko
Priority to JP2010500322A priority patent/JP2010522919A/ja
Priority to MYPI20094027 priority patent/MY151844A/en
Priority to BRPI0809495-0A2A priority patent/BRPI0809495A2/pt
Priority to EP08787875A priority patent/EP2143048A2/fr
Publication of FR2915011A1 publication Critical patent/FR2915011A1/fr
Application granted granted Critical
Publication of FR2915011B1 publication Critical patent/FR2915011B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
FR0702299A 2007-03-29 2007-03-29 Carte a puce a double interface de communication Active FR2915011B1 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FR0702299A FR2915011B1 (fr) 2007-03-29 2007-03-29 Carte a puce a double interface de communication
US12/593,570 US8317108B2 (en) 2007-03-29 2008-03-28 Chip card with dual communication interface
PCT/FR2008/000435 WO2008142245A2 (fr) 2007-03-29 2008-03-28 Carte à puce à double interface de communication
KR1020097022611A KR101494916B1 (ko) 2007-03-29 2008-03-28 듀얼 통신 인터페이스를 갖는 칩 카드
MX2009010433A MX2009010433A (es) 2007-03-29 2008-03-28 Tarjeta de memoria con interfaz de comunicacion doble.
JP2010500322A JP2010522919A (ja) 2007-03-29 2008-03-28 ダブル通信インターフェースｉｃカード
MYPI20094027 MY151844A (en) 2007-03-29 2008-03-28 Chip card with a dual communication interface
BRPI0809495-0A2A BRPI0809495A2 (pt) 2007-03-29 2008-03-28 Cartão com chip com interface de comunicação dual
EP08787875A EP2143048A2 (fr) 2007-03-29 2008-03-28 Carte à puce à double interface de communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0702299A FR2915011B1 (fr) 2007-03-29 2007-03-29 Carte a puce a double interface de communication

Publications (2)

Publication Number Publication Date
FR2915011A1 FR2915011A1 (fr) 2008-10-17
FR2915011B1 true FR2915011B1 (fr) 2009-06-05

Family

ID=38610900

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0702299A Active FR2915011B1 (fr) 2007-03-29 2007-03-29 Carte a puce a double interface de communication

Country Status (9)

Country Link
US (1) US8317108B2 (fr)
EP (1) EP2143048A2 (fr)
JP (1) JP2010522919A (fr)
KR (1) KR101494916B1 (fr)
BR (1) BRPI0809495A2 (fr)
FR (1) FR2915011B1 (fr)
MX (1) MX2009010433A (fr)
MY (1) MY151844A (fr)
WO (1) WO2008142245A2 (fr)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9001527B2 (en) * 2008-02-18 2015-04-07 Cyntec Co., Ltd. Electronic package structure
WO2010066955A1 (fr) 2008-12-11 2010-06-17 Yves Eray Circuit d'antenne rfid
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8366009B2 (en) * 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
FR2963137B1 (fr) * 2010-07-20 2016-02-19 Oberthur Technologies Insert a transpondeur et dispositif comprenant un tel insert
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
EP2603883A2 (fr) 2010-08-12 2013-06-19 Féinics Amatech Teoranta Limited Modules d'antenne rfid et amélioration de couplage
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
EP2426627B1 (fr) * 2010-09-02 2016-10-12 Oberthur Technologies Module lumineux pour dispositif à microcircuit
FR2964487B1 (fr) * 2010-09-02 2013-07-12 Oberthur Technologies Carte a microcircuit comprenant un moyen lumineux
EP2525304A1 (fr) 2011-05-17 2012-11-21 Gemalto SA Dispositif transpondeur radiofréquence à circuit résonant passif optimisé
US10867235B2 (en) 2011-08-08 2020-12-15 Féinics Amatech Teoranta Metallized smartcard constructions and methods
US9390364B2 (en) 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
BR112014003133A2 (pt) 2011-08-08 2017-06-06 Féinics Amatech Teoranta aperfeiçoamento de acoplamento em e para cartões inteligentes rfid
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
CN103907125A (zh) 2011-08-08 2014-07-02 菲尼克斯阿美特克有限公司 改进rfid智能卡中的耦合和与rfid智能卡的耦合
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
WO2013034426A1 (fr) 2011-09-11 2013-03-14 Féinics Amatech Teoranta Modules d'antenne rfid et leurs procédés de fabrication
JP2015513712A (ja) 2012-01-23 2015-05-14 フェイニクス アマテック テオランタ メタライズド・スマート・カードの遮蔽の相殺および結合の増強
JP2015511353A (ja) 2012-02-05 2015-04-16 フェイニクス アマテック テオランタ Ｒｆｉｄアンテナ・モジュールおよび方法
FR2996944B1 (fr) * 2012-10-15 2018-05-04 Smart Packaging Solutions Sps Module electronique simplifie pour carte a puce a double interface de communication
US11341389B2 (en) 2013-01-18 2022-05-24 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US10599972B2 (en) * 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11928537B2 (en) 2013-01-18 2024-03-12 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
EP3005242A1 (fr) 2013-05-28 2016-04-13 Féinics AmaTech Teoranta Modules d'antennes pour cartes à puce à double interface, configurations d'antenne d'amplification, et procédés
EP3069303B1 (fr) 2013-11-13 2022-07-20 Féinics AmaTech Teoranta Carte a puce avec cadre de couplage et procede d'augmentation de la distance d'activation d'un module de puce transpondeur
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
WO2015144261A1 (fr) * 2014-03-26 2015-10-01 Féinics Amatech Teoranta Module de puce répondeur, équipé d'un cadre de couplage situé sur un substrat commun, et destiné à des cartes intelligentes et à des étiquettes sécurisées et non sécurisées
US10381707B2 (en) * 2016-02-04 2019-08-13 Advantest Corporation Multiple waveguide structure with single flange for automatic test equipment for semiconductor testing
US10089568B2 (en) 2016-06-01 2018-10-02 CPI Card Group—Colorado, Inc. IC chip card with integrated biometric sensor pads
US10783337B2 (en) 2016-08-16 2020-09-22 CPI Card Group—Colorado, Inc. IC chip card
EP4075332A1 (fr) * 2017-01-11 2022-10-19 Composecure LLC Carte à double interface métallique
JP6888402B2 (ja) * 2017-05-01 2021-06-16 凸版印刷株式会社 基板モジュール
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
JP3960645B2 (ja) * 1996-12-27 2007-08-15 ローム株式会社 回路チップ搭載カードおよび回路チップモジュール
EP1031939B1 (fr) * 1997-11-14 2005-09-14 Toppan Printing Co., Ltd. Carte ci composite
JP2000172812A (ja) * 1998-12-08 2000-06-23 Hitachi Maxell Ltd 非接触情報媒体
FR2823888B1 (fr) * 2001-04-24 2005-02-18 Gemplus Card Int Procede de fabrication d'une carte sans contact ou hybride et carte obtenue
JP2006507569A (ja) * 2002-09-17 2006-03-02 アクサルト ソシエテ アノニム ハイブリッドカード
EP1437684A1 (fr) * 2003-01-08 2004-07-14 SCHLUMBERGER Systèmes Module pour carte hybride
KR100567809B1 (ko) * 2003-06-13 2006-04-07 (주)아이피에스 절전형 비접촉식 아이씨카드리더 및 리딩방법
US7198199B2 (en) * 2005-02-04 2007-04-03 Chun-Hsin Ho Dual universal integrated circuit card (UICC) system for a portable device
FR2890212B1 (fr) * 2005-08-30 2009-08-21 Smart Packaging Solutions Sps Module electronique a double interface de communication, notamment pour carte a puce
US7546671B2 (en) * 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US8030746B2 (en) * 2008-02-08 2011-10-04 Infineon Technologies Ag Integrated circuit package

Also Published As

Publication number Publication date
US20100176205A1 (en) 2010-07-15
EP2143048A2 (fr) 2010-01-13
WO2008142245A2 (fr) 2008-11-27
JP2010522919A (ja) 2010-07-08
MX2009010433A (es) 2010-09-14
MY151844A (en) 2014-07-14
KR20100022453A (ko) 2010-03-02
BRPI0809495A2 (pt) 2014-09-23
FR2915011A1 (fr) 2008-10-17
WO2008142245A3 (fr) 2009-01-29
US8317108B2 (en) 2012-11-27
KR101494916B1 (ko) 2015-03-02

Similar Documents

Publication Publication Date Title
FR2915011B1 (fr) Carte a puce a double interface de communication
BRPI0818278A2 (pt) Dispositivo de acoplamento inteligente
FI20075142A0 (fi) Monipistelähetys
FR2890212B1 (fr) Module electronique a double interface de communication, notamment pour carte a puce
DK2248066T3 (da) Forespørgsel i RFID Kommunikationsenheder
BRPI0815900A2 (pt) Conformidade promocional de rfid
FI20106316A (fi) Kortin vastake
FR2951342B1 (fr) Reseau sur puce a latence nulle
BRPI0719167A2 (pt) Módulo de interface
DE602007012822D1 (de) RFID-Etikett
GB0718001D0 (en) Smart card chip arrangement
DK1958127T3 (da) Chipkort
EP2350888A4 (fr) Collecte de données environnementales
AU318433S (en) Double snap card
FI20075577A0 (fi) Turvallinen tiedonsiirto
DE602007008650D1 (de) RFID-Lesegerät
BRPI0817215A2 (pt) serviços de cartão comercial
FI20080084A0 (fi) Tietoliikennelaite
DE602007013156D1 (de) Kartenleser
DE602006020677D1 (de) Kartenleser
DE602007012519D1 (de) Integrierte Schaltung mit beschränktem Datenzugang
BRPI0904807A2 (pt) Leitor de cartão
FR2976382B1 (fr) Module a microcircuit et carte a puce le comportant
FR2998395B1 (fr) Module electronique simple face pour carte a puce a double interface de communication
FR2917871B1 (fr) Insert securise notamment pour carte a puce

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18