WO2008142245A3 - Carte à puce à double interface de communication - Google Patents
Carte à puce à double interface de communication Download PDFInfo
- Publication number
- WO2008142245A3 WO2008142245A3 PCT/FR2008/000435 FR2008000435W WO2008142245A3 WO 2008142245 A3 WO2008142245 A3 WO 2008142245A3 FR 2008000435 W FR2008000435 W FR 2008000435W WO 2008142245 A3 WO2008142245 A3 WO 2008142245A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- microelectronic
- communication interface
- chip card
- face
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08787875A EP2143048A2 (fr) | 2007-03-29 | 2008-03-28 | Carte à puce à double interface de communication |
KR1020097022611A KR101494916B1 (ko) | 2007-03-29 | 2008-03-28 | 듀얼 통신 인터페이스를 갖는 칩 카드 |
MX2009010433A MX2009010433A (es) | 2007-03-29 | 2008-03-28 | Tarjeta de memoria con interfaz de comunicacion doble. |
BRPI0809495-0A2A BRPI0809495A2 (pt) | 2007-03-29 | 2008-03-28 | Cartão com chip com interface de comunicação dual |
JP2010500322A JP2010522919A (ja) | 2007-03-29 | 2008-03-28 | ダブル通信インターフェースicカード |
US12/593,570 US8317108B2 (en) | 2007-03-29 | 2008-03-28 | Chip card with dual communication interface |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0702299A FR2915011B1 (fr) | 2007-03-29 | 2007-03-29 | Carte a puce a double interface de communication |
FR0702299 | 2007-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008142245A2 WO2008142245A2 (fr) | 2008-11-27 |
WO2008142245A3 true WO2008142245A3 (fr) | 2009-01-29 |
Family
ID=38610900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2008/000435 WO2008142245A2 (fr) | 2007-03-29 | 2008-03-28 | Carte à puce à double interface de communication |
Country Status (9)
Country | Link |
---|---|
US (1) | US8317108B2 (fr) |
EP (1) | EP2143048A2 (fr) |
JP (1) | JP2010522919A (fr) |
KR (1) | KR101494916B1 (fr) |
BR (1) | BRPI0809495A2 (fr) |
FR (1) | FR2915011B1 (fr) |
MX (1) | MX2009010433A (fr) |
MY (1) | MY151844A (fr) |
WO (1) | WO2008142245A2 (fr) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9001527B2 (en) * | 2008-02-18 | 2015-04-07 | Cyntec Co., Ltd. | Electronic package structure |
WO2010066955A1 (fr) | 2008-12-11 | 2010-06-17 | Yves Eray | Circuit d'antenne rfid |
US8474726B2 (en) | 2010-08-12 | 2013-07-02 | Feinics Amatech Teoranta | RFID antenna modules and increasing coupling |
US8366009B2 (en) * | 2010-08-12 | 2013-02-05 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
FR2963137B1 (fr) * | 2010-07-20 | 2016-02-19 | Oberthur Technologies | Insert a transpondeur et dispositif comprenant un tel insert |
US9033250B2 (en) | 2010-08-12 | 2015-05-19 | Féinics Amatech Teoranta | Dual interface smart cards, and methods of manufacturing |
WO2012020073A2 (fr) | 2010-08-12 | 2012-02-16 | Féinics Amatech Teoranta Limited | Modules d'antenne rfid et amélioration de couplage |
US8870080B2 (en) | 2010-08-12 | 2014-10-28 | Féinics Amatech Teoranta | RFID antenna modules and methods |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US9112272B2 (en) | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
US9195932B2 (en) | 2010-08-12 | 2015-11-24 | Féinics Amatech Teoranta | Booster antenna configurations and methods |
EP2426627B1 (fr) * | 2010-09-02 | 2016-10-12 | Oberthur Technologies | Module lumineux pour dispositif à microcircuit |
FR2964487B1 (fr) * | 2010-09-02 | 2013-07-12 | Oberthur Technologies | Carte a microcircuit comprenant un moyen lumineux |
EP2525304A1 (fr) | 2011-05-17 | 2012-11-21 | Gemalto SA | Dispositif transpondeur radiofréquence à circuit résonant passif optimisé |
US9489613B2 (en) | 2011-08-08 | 2016-11-08 | Féinics Amatech Teoranta | RFID transponder chip modules with a band of the antenna extending inward |
US9634391B2 (en) | 2011-08-08 | 2017-04-25 | Féinics Amatech Teoranta | RFID transponder chip modules |
US9390364B2 (en) | 2011-08-08 | 2016-07-12 | Féinics Amatech Teoranta | Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags |
CN103930906A (zh) | 2011-08-08 | 2014-07-16 | 菲尼克斯阿美特克有限公司 | 改进rfid智能卡中的耦合和改进与rfid智能卡的耦合 |
US9812782B2 (en) | 2011-08-08 | 2017-11-07 | Féinics Amatech Teoranta | Coupling frames for RFID devices |
US9622359B2 (en) | 2011-08-08 | 2017-04-11 | Féinics Amatech Teoranta | RFID transponder chip modules |
JP2014529927A (ja) | 2011-08-08 | 2014-11-13 | フェニックスアマテック テオランタ | Rfidスマートカードに関する結合の向上 |
US10867235B2 (en) | 2011-08-08 | 2020-12-15 | Féinics Amatech Teoranta | Metallized smartcard constructions and methods |
MX336040B (es) | 2011-09-11 | 2016-01-07 | Feinics Amatech Teoranta | Modulos de antena rfid y procedimientos de fabricacion. |
WO2013110625A1 (fr) | 2012-01-23 | 2013-08-01 | Féinics Amatech Teoranta | Décalage de protection et amélioration de couplage de cartes à puce métallisées |
KR20140123562A (ko) | 2012-02-05 | 2014-10-22 | 페이닉스 아마테크 테오란타 | Rfid 안테나 모듈 및 방법 |
FR2996944B1 (fr) * | 2012-10-15 | 2018-05-04 | Smart Packaging Solutions Sps | Module electronique simplifie pour carte a puce a double interface de communication |
US11928537B2 (en) | 2013-01-18 | 2024-03-12 | Amatech Group Limited | Manufacturing metal inlays for dual interface metal cards |
US11341389B2 (en) | 2013-01-18 | 2022-05-24 | Amatech Group Limited | Manufacturing metal inlays for dual interface metal cards |
US10248902B1 (en) | 2017-11-06 | 2019-04-02 | Féinics Amatech Teoranta | Coupling frames for RFID devices |
US11551051B2 (en) | 2013-01-18 | 2023-01-10 | Amatech Group Limiied | Coupling frames for smartcards with various module opening shapes |
US11354560B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Smartcards with multiple coupling frames |
US10599972B2 (en) * | 2013-01-18 | 2020-03-24 | Féinics Amatech Teoranta | Smartcard constructions and methods |
EP3005242A1 (fr) | 2013-05-28 | 2016-04-13 | Féinics AmaTech Teoranta | Modules d'antennes pour cartes à puce à double interface, configurations d'antenne d'amplification, et procédés |
EP3069303B1 (fr) | 2013-11-13 | 2022-07-20 | Féinics AmaTech Teoranta | Carte a puce avec cadre de couplage et procede d'augmentation de la distance d'activation d'un module de puce transpondeur |
US10839282B2 (en) | 2014-03-08 | 2020-11-17 | Féinics Amatech Teoranta | RFID transponder chip modules, elements thereof, and methods |
WO2015144261A1 (fr) * | 2014-03-26 | 2015-10-01 | Féinics Amatech Teoranta | Module de puce répondeur, équipé d'un cadre de couplage situé sur un substrat commun, et destiné à des cartes intelligentes et à des étiquettes sécurisées et non sécurisées |
US10381707B2 (en) * | 2016-02-04 | 2019-08-13 | Advantest Corporation | Multiple waveguide structure with single flange for automatic test equipment for semiconductor testing |
WO2017210305A1 (fr) | 2016-06-01 | 2017-12-07 | Cpi Card Group - Colorado, Inc. | Carte à puce à circuit intégré comprenant des plages de détection biométriques |
WO2018035258A1 (fr) | 2016-08-16 | 2018-02-22 | Cpi Card Group - Colorado, Inc. | Carte à puce à circuit intégré améliorée |
JP7140776B2 (ja) * | 2017-01-11 | 2022-09-21 | コンポセキュア,リミティド ライアビリティ カンパニー | 金属製デュアルインタフェースカード |
JP6888402B2 (ja) * | 2017-05-01 | 2021-06-16 | 凸版印刷株式会社 | 基板モジュール |
USD942538S1 (en) | 2020-07-30 | 2022-02-01 | Federal Card Services, LLC | Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module |
USD943024S1 (en) | 2020-07-30 | 2022-02-08 | Federal Card Services, LLC | Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1031939A1 (fr) * | 1997-11-14 | 2000-08-30 | Toppan Printing Co., Ltd. | Module ci composite et carte ci composite |
FR2823888A1 (fr) * | 2001-04-24 | 2002-10-25 | Gemplus Card Int | Procede de fabrication d'une carte sans contact ou hybride et carte obtenue |
WO2004027863A2 (fr) * | 2002-09-17 | 2004-04-01 | Axalto Sa | Carte hybride |
EP1437684A1 (fr) * | 2003-01-08 | 2004-07-14 | SCHLUMBERGER Systèmes | Module pour carte hybride |
FR2890212A1 (fr) * | 2005-08-30 | 2007-03-02 | Smart Packaging Solutions Sps | Module electronique a double interface de communication, notamment pour carte a puce |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
JP3960645B2 (ja) * | 1996-12-27 | 2007-08-15 | ローム株式会社 | 回路チップ搭載カードおよび回路チップモジュール |
JP2000172812A (ja) * | 1998-12-08 | 2000-06-23 | Hitachi Maxell Ltd | 非接触情報媒体 |
KR100567809B1 (ko) * | 2003-06-13 | 2006-04-07 | (주)아이피에스 | 절전형 비접촉식 아이씨카드리더 및 리딩방법 |
US7198199B2 (en) * | 2005-02-04 | 2007-04-03 | Chun-Hsin Ho | Dual universal integrated circuit card (UICC) system for a portable device |
US7546671B2 (en) * | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
US8030746B2 (en) * | 2008-02-08 | 2011-10-04 | Infineon Technologies Ag | Integrated circuit package |
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2007
- 2007-03-29 FR FR0702299A patent/FR2915011B1/fr active Active
-
2008
- 2008-03-28 KR KR1020097022611A patent/KR101494916B1/ko active IP Right Grant
- 2008-03-28 US US12/593,570 patent/US8317108B2/en active Active
- 2008-03-28 EP EP08787875A patent/EP2143048A2/fr not_active Withdrawn
- 2008-03-28 BR BRPI0809495-0A2A patent/BRPI0809495A2/pt not_active Application Discontinuation
- 2008-03-28 MX MX2009010433A patent/MX2009010433A/es active IP Right Grant
- 2008-03-28 WO PCT/FR2008/000435 patent/WO2008142245A2/fr active Application Filing
- 2008-03-28 JP JP2010500322A patent/JP2010522919A/ja active Pending
- 2008-03-28 MY MYPI20094027 patent/MY151844A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1031939A1 (fr) * | 1997-11-14 | 2000-08-30 | Toppan Printing Co., Ltd. | Module ci composite et carte ci composite |
FR2823888A1 (fr) * | 2001-04-24 | 2002-10-25 | Gemplus Card Int | Procede de fabrication d'une carte sans contact ou hybride et carte obtenue |
WO2004027863A2 (fr) * | 2002-09-17 | 2004-04-01 | Axalto Sa | Carte hybride |
EP1437684A1 (fr) * | 2003-01-08 | 2004-07-14 | SCHLUMBERGER Systèmes | Module pour carte hybride |
FR2890212A1 (fr) * | 2005-08-30 | 2007-03-02 | Smart Packaging Solutions Sps | Module electronique a double interface de communication, notamment pour carte a puce |
Also Published As
Publication number | Publication date |
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BRPI0809495A2 (pt) | 2014-09-23 |
JP2010522919A (ja) | 2010-07-08 |
MX2009010433A (es) | 2010-09-14 |
EP2143048A2 (fr) | 2010-01-13 |
FR2915011B1 (fr) | 2009-06-05 |
MY151844A (en) | 2014-07-14 |
KR20100022453A (ko) | 2010-03-02 |
FR2915011A1 (fr) | 2008-10-17 |
US8317108B2 (en) | 2012-11-27 |
KR101494916B1 (ko) | 2015-03-02 |
US20100176205A1 (en) | 2010-07-15 |
WO2008142245A2 (fr) | 2008-11-27 |
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