FR2831718B1 - Raccordement electrique male d'un plot de connexion d'une puce a une interface de communication, notamment pour objet portable intelligent tel qu'une carte a puce - Google Patents
Raccordement electrique male d'un plot de connexion d'une puce a une interface de communication, notamment pour objet portable intelligent tel qu'une carte a puceInfo
- Publication number
- FR2831718B1 FR2831718B1 FR0114143A FR0114143A FR2831718B1 FR 2831718 B1 FR2831718 B1 FR 2831718B1 FR 0114143 A FR0114143 A FR 0114143A FR 0114143 A FR0114143 A FR 0114143A FR 2831718 B1 FR2831718 B1 FR 2831718B1
- Authority
- FR
- France
- Prior art keywords
- chip
- connection
- communication interface
- plot
- portable object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0114143A FR2831718B1 (fr) | 2001-10-31 | 2001-10-31 | Raccordement electrique male d'un plot de connexion d'une puce a une interface de communication, notamment pour objet portable intelligent tel qu'une carte a puce |
PCT/FR2002/003360 WO2003038746A1 (fr) | 2001-10-31 | 2002-10-02 | Languette deformable integree a un module pour raccordement electrique a coeur |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0114143A FR2831718B1 (fr) | 2001-10-31 | 2001-10-31 | Raccordement electrique male d'un plot de connexion d'une puce a une interface de communication, notamment pour objet portable intelligent tel qu'une carte a puce |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2831718A1 FR2831718A1 (fr) | 2003-05-02 |
FR2831718B1 true FR2831718B1 (fr) | 2004-09-24 |
Family
ID=8868967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0114143A Expired - Fee Related FR2831718B1 (fr) | 2001-10-31 | 2001-10-31 | Raccordement electrique male d'un plot de connexion d'une puce a une interface de communication, notamment pour objet portable intelligent tel qu'une carte a puce |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2831718B1 (fr) |
WO (1) | WO2003038746A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2386986A1 (fr) * | 2010-04-29 | 2011-11-16 | Gemalto SA | Procédé de connexion d'un composant électronique par boucle en fil soudé et dispositif obtenu |
MX2013008837A (es) * | 2011-01-31 | 2013-11-20 | American Bank Note Co | Tarjeta inteligente de doble interfaz. |
EP2575086A1 (fr) * | 2011-09-27 | 2013-04-03 | Gemalto SA | Procédé de connexion d'un microcircuit à des zones conductrices noyées dans un support |
EP2677476A1 (fr) * | 2012-06-21 | 2013-12-25 | Gemalto SA | Procédé de connexion par boucle en fil soudé enrobé de matière conductrice et dispositif obtenu |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2550010A1 (fr) * | 1983-07-28 | 1985-02-01 | Flonic Sa | Module electronique pour carte a memoire et procede de fabrication de ce module |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
FR2740582B1 (fr) * | 1995-10-26 | 1997-11-28 | Gemplus Sca | Dispositif hybride a contacts affleurants et a production de signaux acoustiques, et procede de fabrication |
DE19639025C2 (de) * | 1996-09-23 | 1999-10-28 | Siemens Ag | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
US5856912A (en) * | 1997-03-04 | 1999-01-05 | Motorola Inc. | Microelectronic assembly for connection to an embedded electrical element, and method for forming same |
DE29923853U1 (de) * | 1999-04-10 | 2001-08-02 | Cubit Electronics Gmbh | Kontaktloser Transponder |
-
2001
- 2001-10-31 FR FR0114143A patent/FR2831718B1/fr not_active Expired - Fee Related
-
2002
- 2002-10-02 WO PCT/FR2002/003360 patent/WO2003038746A1/fr not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2003038746A1 (fr) | 2003-05-08 |
FR2831718A1 (fr) | 2003-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100630 |