AU5965796A - Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices - Google Patents

Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices

Info

Publication number
AU5965796A
AU5965796A AU59657/96A AU5965796A AU5965796A AU 5965796 A AU5965796 A AU 5965796A AU 59657/96 A AU59657/96 A AU 59657/96A AU 5965796 A AU5965796 A AU 5965796A AU 5965796 A AU5965796 A AU 5965796A
Authority
AU
Australia
Prior art keywords
methods
semiconductor devices
spring contacts
mounting spring
chip interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU59657/96A
Inventor
Sung Chul Chang
Igor Y. Khandros
William D Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/452,255 external-priority patent/US6336269B1/en
Priority claimed from US08/533,584 external-priority patent/US5772451A/en
Priority claimed from US08/554,902 external-priority patent/US5974662A/en
Priority claimed from PCT/US1995/014909 external-priority patent/WO1996017378A1/en
Priority claimed from US08/558,332 external-priority patent/US5829128A/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of AU5965796A publication Critical patent/AU5965796A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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AU59657/96A 1995-05-26 1996-05-28 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices Abandoned AU5965796A (en)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
US452255 1995-05-26
US08/452,255 US6336269B1 (en) 1993-11-16 1995-05-26 Method of fabricating an interconnection element
US52624695A 1995-09-21 1995-09-21
US526246 1995-09-21
US533584 1995-10-18
US08/533,584 US5772451A (en) 1993-11-16 1995-10-18 Sockets for electronic components and methods of connecting to electronic components
US554902 1995-11-09
US08/554,902 US5974662A (en) 1993-11-16 1995-11-09 Method of planarizing tips of probe elements of a probe card assembly
WOUS9514909 1995-11-13
PCT/US1995/014909 WO1996017378A1 (en) 1994-11-15 1995-11-13 Electrical contact structures from flexible wire
US08/558,332 US5829128A (en) 1993-11-16 1995-11-15 Method of mounting resilient contact structures to semiconductor devices
US558332 1995-11-15
US60217996A 1996-02-15 1996-02-15
US602179 1996-02-15
PCT/US1996/008328 WO1997016866A2 (en) 1995-05-26 1996-05-28 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices

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AU5965796A true AU5965796A (en) 1997-05-22

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AU59657/96A Abandoned AU5965796A (en) 1995-05-26 1996-05-28 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices

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KR (1) KR100299465B1 (en)
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6799976B1 (en) 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP4050732B2 (en) 2004-08-30 2008-02-20 株式会社ルネサステクノロジ Semiconductor device and manufacturing method thereof
JP4711800B2 (en) * 2005-10-07 2011-06-29 日本電子材料株式会社 Probe card manufacturing method
JP2013024824A (en) * 2011-07-26 2013-02-04 Denso Corp Manufacturing method of sensor device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US5414298A (en) * 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact

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KR100299465B1 (en) 2001-10-27
WO1997016866A3 (en) 1997-06-19
KR19990021993A (en) 1999-03-25
JP2968051B2 (en) 1999-10-25
JPH10510107A (en) 1998-09-29
WO1997016866A2 (en) 1997-05-09

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