JP2013024824A - Manufacturing method of sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a sensor device, wherein bonding wires connected to input/output terminals of a sensor chip can be protected by using a simple facility.SOLUTION: Pads 42a-42f of a sensor chip 40 and pads 51a-51h of a circuit chip 50 which are assembled to the inside of a recess 23 in a step 2 and bonding pads 21a-21d are respectively connected electrically by bonding wires 61-69 in a third step. In a fourth step, a colloidal solution 80 in which electrically charged particles are dispersed in an organic solvent is injected into the recess 23 in such a manner that the bonding wires 61-69 are immersed in it. In a fifth step, a potential gradient is generated in the colloidal solution 80 by applying a prescribed voltage to the terminals 21, thereby attaching the electrically charged particles to the surfaces of the bonding wires 61-69 by electrophoresis and forming protection films 71-79.

Description

  The present invention relates to a method for manufacturing a sensor device in which a sensor chip is exposed to a medium to be measured.

  Conventionally, in a sensor device in which a sensor chip is exposed to a medium to be measured, it is necessary to protect a bonding wire or the like connected to an input / output terminal of the sensor chip from the medium to be measured. Therefore, in the pressure sensor device disclosed in Patent Document 1 below, a pressure detection element electrically connected to a terminal via a bonding wire is die-bonded in a concave portion of the case, and fluorine gel or By filling a protective member made of fluorine rubber or the like, the bonding wire or the like is sealed and protected.

  However, in the configuration of the sensor device as disclosed in Patent Document 1, for example, when measuring a physical quantity such as the pressure of a high-pressure medium to be measured, air is dissolved in the protective member due to a high-pressure environment, and the protection is performed. Bubbles may be generated in the member. When bubbles are expanded after the bubbles are generated in the protective member in this way, the bubbles are cracked, and if the bubbles generated near the bonding wire are cracked, the bonding wire is disconnected. There are concerns.

  For this reason, the semiconductor pressure sensor disclosed in Patent Document 2 below employs an alloy composed of gold and palladium as a bonding wire for electrically connecting the sensor chip and the conductor portion. Thereby, the diffusion of aluminum from the bonding pad made of the aluminum base material into the bonding wire is suppressed, and the strength of the bonding wire is improved without making the bonding wire as thick as possible.

  Further, in the semiconductor pressure sensor device disclosed in Patent Document 3 below, the protective member filled in the concave portion for covering the sensor chip and the bonding wire includes the first protective member on the lower layer side and the first protective member. It has a two-layer structure with the second protective member on the upper layer side. The first protective member on the lower layer side is made of a fluorine-based adhesive rubber material having electrical insulation and a relatively high Young's modulus, and the second protective member on the upper layer side is electrically The protective member is made of a fluorine-based gel material having an insulating property and a relatively low Young's modulus. Both protective members have a saturation swelling ratio of 7% by weight or less when immersed in gasoline at 20 ° C. This prevents the generation of bubbles in the protective member due to chemicals and moisture in the environment.

  Further, in the semiconductor pressure sensor device disclosed in Patent Document 4 below, the first protective film is formed on the surface of the Al film constituting the pad, the contact hole portion of the first protective film is removed, and then the first (2) A protective film is formed and the contact hole portion of the second protective film is removed. And after forming Au film | membrane on the surface of a 2nd protective film by sputtering method, the Au film and the upper part of a 2nd protective film are scraped off, The side wall surface of the opening part of a 2nd protective film, and a 2nd protective film An Au film is formed only on the surfaces of the first protective film and the Al film exposed from the opening. By bonding a bonding wire to the surface of the Au film thus configured, the corrosive medium is prevented from entering a bonding pad composed of Al, and the electrical connection structure at the bonding location Prevents deterioration of durability.

  Further, in the semiconductor device disclosed in Patent Document 5 below, after a plasma nitride film and a CVD oxide film are formed on the entire surface of the substrate including the electrode wiring, a predetermined position on the electrode wiring is opened and gold is deposited by a vapor deposition method. Then, by etching other than the bonding pad portion of the gold film, entry of water into the bonding pad portion is suppressed and corrosion of the bonding pad portion is suppressed.

JP 2006-194682 A JP 2004-257950 A Japanese Patent Laid-Open No. 2005-283587 JP 2007-024777 A Japanese Patent Laid-Open No. 01-318240

  However, in the sensor device configured as disclosed in Patent Document 2, the alloy composed of gold and palladium is used as the bonding wire material as described above. Compared to the above, there is a problem that a dedicated wire forming facility is required and it is difficult to reduce the manufacturing cost. Further, in the sensor device having the configuration disclosed in Patent Document 3, since two types of protective members having a specified saturation swelling rate are used, compared to the case of using a single protective member, the material There is a problem that not only the cost is increased, but a dedicated facility for filling the two protective members without mixing them is required, and it is difficult to reduce the manufacturing cost. Further, in the sensor device having the configuration disclosed in Patent Documents 4 and 5, since a metal thin film is formed by vapor deposition or the like, not only a large vacuum facility is required, but also a running cost increases and a manufacturing cost increases. There is a problem that it is difficult to reduce the amount of the light.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a sensor device capable of protecting a bonding wire connected to an input / output terminal of a sensor chip with simple equipment. Is to provide.

  In order to achieve the above object, in the method of manufacturing a sensor device according to claim 1, the sensor is exposed to a medium to be measured and outputs a signal corresponding to a physical quantity of the medium to be measured through a terminal. A method of manufacturing a sensor device having a chip, comprising: a first step of preparing a case in which a recess for assembling the sensor chip is formed and a part of the terminal is exposed in the recess; A second step of assembling the sensor chip, a third step of electrically connecting a part of the terminal corresponding to the input / output terminal of the sensor chip with a bonding wire, and a colloidal solution in which charged particles are dispersed in a solvent A fourth step of injecting the bonding wire into the recess so that the bonding wire is immersed, and applying a predetermined voltage to the terminal. By generating a potential gradient in the colloidal solution, characterized in that it and a fifth step of attaching to the surface of the bonding wire by electrophoresis the charged particles.

  According to a second aspect of the present invention, in the method for manufacturing a sensor device according to the first aspect, the sensor chip is a pressure sensor chip that outputs a signal corresponding to the pressure of the measured medium.

  According to a third aspect of the present invention, in the method for manufacturing a sensor device according to the first or second aspect, in the second step, a circuit chip for processing a signal from the sensor chip and the sensor chip are assembled in the recess. The third step is characterized in that the input / output terminals of the circuit chip are electrically connected to the corresponding input / output terminals of the sensor chip and a part of the terminals by bonding wires.

  According to a fourth aspect of the present invention, in the method of manufacturing a sensor device according to any one of the first to third aspects, the solvent is a volatile organic solvent.

  According to a fifth aspect of the present invention, in the method of manufacturing a sensor device according to any one of the first to fourth aspects, the charged particles are titanium dioxide.

  In the first aspect of the invention, the input / output terminals of the sensor chip assembled in the recesses in the second step and a part of the corresponding terminals are electrically connected by bonding wires in the third step. Then, in the fourth step, a colloid solution in which charged particles are dispersed in a solvent is injected into the recess so that the bonding wire is immersed, and in the fifth step, a predetermined voltage is applied to the terminal to colloid. A potential gradient is generated in the solution, and charged particles are attached to the surface of the bonding wire by electrophoresis.

In this way, the protective film is formed on the surface of the bonding wire by adhering charged particles simply by applying a predetermined voltage to the terminal, so that the bonding wire can be easily protected. In particular, not only the protective member such as fluorine gel that has been used to protect the bonding wire in the past is unnecessary, but also a large dedicated equipment for sputtering or vapor deposition is not required. Since the equipment for protection is simplified, the manufacturing cost of the sensor device can be reduced.
Therefore, the bonding wire connected to the input / output terminal of the sensor chip can be protected with simple equipment.

  In the invention of claim 2, since the sensor chip is a pressure sensor chip that outputs a signal according to the pressure of the medium to be measured, even if the sensor device to be measured is a high-pressure medium to be measured, Bonding wires connected to the input / output terminals can be easily protected with simple equipment.

  In the invention of claim 3, the input / output terminal of the circuit chip assembled in the recess in the second step and the input / output terminal of the corresponding sensor chip and a part of the terminal are connected by the bonding wire in the third step. Connect each one electrically. Thus, in the fourth step, a colloidal solution in which charged particles are dispersed in a solvent is injected into the recess so that the bonding wire is immersed, and in the fifth step, a predetermined voltage is applied to the terminal. The charged particles adhere to the surfaces of the bonding wire that electrically connects the sensor chip and the circuit chip and the bonding wire that electrically connects the circuit chip and the terminal.

  For this reason, even when the circuit chip that processes the signal from the sensor chip is placed in the recess exposed to the medium to be measured, the bonding wires connected to the input / output terminals of the circuit chip are easily protected with simple equipment. can do.

  In the invention of claim 4, since the solvent is a volatile organic solvent, the evaporation of the solvent after the charged particles are attached to the surface of the bonding wire in the fifth step, that is, the removal of the solvent is easily performed. be able to.

  In the invention of claim 5, since the charged particles are titanium dioxide, the dispersibility is better than other charged particles, and the availability and safety can be improved.

It is sectional drawing which shows schematically the structure of the pressure sensor which concerns on this embodiment. It is the figure which looked at the case of FIG. 1 from the port side end surface side. It is a figure which expands and shows the recessed part vicinity of FIG. FIG. 4 is a cross-sectional view corresponding to a cut surface of line 4-4 shown in FIG. 3. It is process drawing which shows the flow of the manufacturing process of a pressure sensor. It is explanatory drawing for demonstrating the 2nd process of FIG. It is explanatory drawing for demonstrating the 3rd process of FIG. It is explanatory drawing for demonstrating the 4th process of FIG. It is explanatory drawing for demonstrating the 5th process of FIG. It is explanatory drawing for demonstrating the modification of a 5th process.

  Hereinafter, an embodiment in which a sensor device according to the present invention is applied to a pressure sensor will be described with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of a pressure sensor 10 according to the present embodiment. FIG. 2 is a view of the case 20 of FIG. 1 as viewed from the port side end face 22 side. FIG. 3 is an enlarged view of the recess 23 of FIG. FIG. 4 is a cross-sectional view corresponding to the section taken along line 4-4 shown in FIG. In FIGS. 3 and 4, the thicknesses of the protective films 71 to 79 are exaggerated for convenience of explanation. 2 and 3 and FIGS. 6, 7, 9, and 10 to be described later, the protective member 25 is not shown for convenience of explanation.

  The pressure sensor 10 according to the present embodiment is attached to an intake manifold of an automobile and used as a sensor device that detects the pressure as a physical quantity of a medium to be measured in the intake manifold. As shown in FIG. 1, the pressure sensor 10 mainly includes a case 20 in which a plurality of terminals 21 connected to the outside are insert-molded, a pressure detection sensor chip (pressure sensor chip) 40, and the sensor. A circuit chip 50 that performs processing such as amplification of a signal output from the chip 40 and a port portion 30 having a pressure introduction hole 34 for introducing a measured medium into the sensor chip 40 are provided.

  The case 20 is formed by molding a resin material such as PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), or epoxy resin using a mold. A recess 23 for installing the sensor chip 40 and the circuit chip 50 is provided on the port side end face 22 of the case 20.

  Each terminal 21 is made of, for example, a conductive material such as copper. One end of the terminal 21 is exposed in the recess 23 and the other end protrudes into the opening 24 so as to be connectable to an external device (not shown). So that each is arranged. As shown in FIG. 3, one side end exposed in the recess 23 of each terminal 21 is configured to function as bonding pads 21 a to 21 d by being subjected to gold plating or the like. The bonding pad 21a is an electric trim pad, the bonding pad 21b is a power supply pad, the bonding pad 21c is an output pad, and the bonding pad 21d is a GND pad.

  The port portion 30 guides the medium to be measured to the sensor chip 40, and one end 31 is connected to the case 20 with an adhesive or the like so as to cover the port side end surface 22 of the case 20. Accordingly, a pressure detection chamber 33 is formed between the port side end face 22 of the case 20 and the port portion 30. The other end 32 of the port portion 30 protrudes in the direction opposite to the case 20, and a pressure introduction hole 34 that leads from the protruding tip to the pressure detection chamber 33 is formed in the other end 32. A medium to be measured such as intake air in the intake manifold is introduced into the pressure detection chamber 33 through the pressure introduction hole 34, and the pressure of the medium to be measured is detected by the sensor chip 40.

  The port portion 30 formed in this manner is formed by molding a resin material such as PBT or PPS using a mold, as in the case 20. Further, the port portion 30 is provided with an O-ring (not shown) on its outer peripheral portion, and is configured to be airtightly attachable to the intake pipe of the intake manifold via the O-ring.

  The sensor chip 40 is a silicon semiconductor chip, and includes a diaphragm 41 as a distortion portion and a bridge circuit formed on the diaphragm 41 with a diffusion resistor or the like as shown in FIG. A pressure signal based on the displacement (strain) of the diaphragm 41 according to the pressure is output to the circuit chip 50. Further, pads 42 a to 42 f and the like are formed on the surface of the sensor chip 40 as input / output terminals. The sensor chip 40 configured in this way is bonded and fixed on a glass pedestal 43 fixed to the recess 23 of the case 20.

  The circuit chip 50 is a chip configured as a silicon semiconductor chip on which MOS transistor elements and the like are formed. The circuit chip 50 outputs a drive signal to the sensor chip 40, and calculates and amplifies the pressure signal input from the sensor chip 40 to the outside And a control circuit having a function of outputting to. Also, pads 51a to 51h and the like are formed on the surface of the circuit chip 50 as input / output terminals. The circuit chip 50 configured as described above is disposed in the vicinity of the sensor chip 40 in the recess 23 of the case 20.

  The pads 42a to 42e of the sensor chip 40 and the pads 51a to 51e of the circuit chip 50 are electrically connected through bonding wires 61 to 65. The pad 42 f of the sensor chip 40 and the bonding pad 21 a of the terminal 21 are electrically connected via a bonding wire 66. The pads 51f to 51h of the circuit chip 50 and the bonding pads 21b to 21d of the terminal 21 are electrically connected via bonding wires 67 to 69. Each of the bonding wires 61 to 69 is made of a gold wire.

  And each of these bonding wires 61-69, the pads 42a-42f of the sensor chip 40, and the pads 51a-51h of the circuit chip 50 have the surfaces thereof for the purpose of protection or corrosion prevention from the measured medium, etc. It is covered and protected by protective films 71 to 79 described later.

  The bottom of the recess 23 of the case 20 is filled with a protective member 25 made of fluororubber in order to ensure the airtightness of the pressure detection chamber 33 (see FIG. 4).

  Next, the manufacturing process of the pressure sensor 10 configured as described above will be described with reference to FIGS. FIG. 5 is a process diagram showing the flow of the manufacturing process of the pressure sensor 10. FIG. 6 is an explanatory diagram for explaining the second step of FIG. 5. FIG. 7 is an explanatory diagram for explaining the third step of FIG. 5. FIG. 8 is an explanatory diagram for explaining the fourth step of FIG. 5. FIG. 9 is an explanatory diagram for explaining the fifth step of FIG.

  First, the case 20, the port part 30, the sensor chip 40, and the circuit chip 50 described above are prepared (first process). Next, as shown in FIG. 6, the sensor chip 40 and the circuit chip 50 are assembled in the recess 23 of the case 20 prepared in the first process (second process).

  Subsequently, as shown in FIG. 7, the pads 42 a to 42 e of the sensor chip 40 and the pads 51 a to 51 e of the circuit chip 50 are electrically connected by bonding wires 61 to 65 by wire bonding. The pad 42f and the bonding pad 21a of the terminal 21 are electrically connected by a bonding wire 66, and the pads 51f to 51h of the circuit chip 50 and the bonding pads 21b to 21d of the terminal 21 are electrically connected by bonding wires 67 to 69. (Third step).

  Next, a colloidal solution 80 in which nano colloidal particles of titanium dioxide are dispersed as charged particles in an acidic volatile organic solvent to generate an electrokinetic potential is produced. This colloidal solution 80 is as shown in FIG. Then, the bonding wires 61 to 69 and the pads 42a to 42f and 51a to 51h are injected into the recess 23 (fourth step).

  Subsequently, a predetermined voltage is applied to each terminal 21 in order to deposit colloidal particles (charged particles) on the surfaces of the bonding wires 61 to 69 by electrophoresis (fifth step). Specifically, first, a predetermined voltage is applied to each terminal 21 so that a positive voltage is applied to the bonding pads 21a and 21b and a negative voltage is applied to the bonding pads 21c and 21d.

  Since the bonding wires 61 to 69 and the pads 42 a to 42 f and 51 a to 51 h are immersed in the colloid solution 80, a potential gradient is generated in the colloid solution 80. For this reason, the conductive parts to which a voltage opposite to the polarity with which the colloidal particles are charged are applied, that is, the bonding wires 64 to 67, the pads 42d to 42f of the sensor chip 40, and the pads 51d and 51e of the circuit chip 50. , 51g and the surfaces of the bonding pads 21a, 21b are attached by electrophoresis. As shown in FIG. 9, the surface of the bonding wires 64 to 67 is covered and protected by the protective films 74 to 77, and the pads 42d to 42f, 51d, 51e, 51g, 21a, and 21c are attached. The surface is covered and protected by a protective film (not shown).

  When the protective films 74 to 77 and the like are formed, a negative voltage is applied to the bonding pads 21a and 21b and a positive voltage is applied to the bonding pads 21c and 21d. A predetermined voltage is applied to each terminal 21 so that a polarity voltage is applied.

  Thereby, the colloidal particles are bonded to the surfaces of the bonding wires 61 to 63, 68 and 69, the pads 42a to 42c of the sensor chip 40, the pads 51a to 51c, 51f and 51h of the circuit chip 50, and the bonding pads 21b and 21d. It adheres by electrophoresis. Due to the adhesion of the colloidal particles, the surfaces of the bonding wires 61 to 63, 68 and 69 are covered and protected by the protective films 71 to 73, 78 and 79, and the pads 42a to 42c, 51a to 51c, 51f, 51h and 21c. , 21d are covered and protected by a protective film (not shown). The predetermined voltage is set such that, for example, the thickness of the protective films 71 to 79 formed on the surfaces of the bonding wires 61 to 69 is 1 to 4 μm.

  Next, the solvent (colloidal solution 80) in the recess 23 is evaporated to remove the solvent (sixth step). Here, in the present embodiment, the solvent is evaporated by exposing it to a high temperature environment. However, the present invention is not limited to this. For example, the solvent may be evaporated by directly heating, or the solvent may be blown by a blower or the like. It may be evaporated.

  Subsequently, the protective member 25 made of fluororubber is filled in the bottom of the recess 23 in the state where the protective films 71 to 79 are formed as described above (seventh step). Thereby, the clearance between the case main body and the terminal at the bottom of the recess 23 is closed by the protective member 25, and the airtightness of the pressure detection chamber 33 is ensured. The seventh step is performed after the third step of performing the wire bonding process and before the fourth step of injecting the colloid solution 80 into the recess 23 according to the characteristics of the protective member to be filled. May be.

  And the pressure sensor 10 shown in FIG. 1 is completed by assembling | attaching the port part 30 so that the port side end surface 22 may be covered with respect to case 20 with which sensor chip 40 and circuit chip 50 were assembled in this way.

  As described above, in the method for manufacturing the pressure sensor 10 according to this embodiment, the pads 42a to 42f of the sensor chip 40 and the pads 51a to 51h of the circuit chip 50 assembled in the recess 23 in the second step. And bonding pads 21a-21d are electrically connected by bonding wires 61-69, respectively, in the third step. Then, in the fourth step, the colloidal solution 80 in which charged particles are dispersed in an organic solvent is injected into the recess 23 so that the bonding wires 61 to 69 and the like are immersed, and in the fifth step, each terminal 21 is injected. By applying a predetermined voltage, a potential gradient is generated in the colloidal solution 80, and charged particles are adhered to the surfaces of the bonding wires 61 to 69 by electrophoresis to form the protective films 71 to 79.

In this way, the protective films 71 to 79 are formed on the surfaces of the bonding wires 61 to 69 by the adhesion of charged particles simply by applying a predetermined voltage to each terminal 21. Therefore, the bonding wires 61 to 69 can be easily formed. Can be protected. In particular, not only the protective member such as fluorine gel that has been used to protect the bonding wire in the past is unnecessary, but also a large dedicated equipment for sputtering or vapor deposition is not required. Since the equipment for protection is simplified, the manufacturing cost of the pressure sensor 10 can be reduced.
Therefore, even when the sensor chip 40 and the circuit chip 50 are arranged in the recess 23 exposed to the medium to be measured, the bonding wires 61 to 69 connected to the pads of the sensor chip 40 and the circuit chip 50 with simple equipment. Etc. can be protected.

  In particular, since the sensor chip 40 is a pressure sensor chip that outputs a signal corresponding to the pressure of the medium to be measured, even if the high-pressure medium to be measured is the pressure sensor 10 to be measured, each pad of the sensor chip 40 The bonding wire connected to the can be easily protected with simple equipment.

  Further, since the solvent for dispersing the charged particles is a volatile organic solvent, the evaporation of the solvent in the seventh step after the charged particles are attached to the surfaces of the bonding wires 61 to 69 in the fifth step, that is, Removal of the solvent can be easily performed. Note that a solvent capable of generating an electrokinetic potential by dispersing charged particles may be employed in place of the volatile organic solvent depending on the manufacturing equipment or the like.

  Furthermore, since the charged particles are titanium dioxide, the dispersibility is better than other charged particles, and the availability and safety can be improved. In addition, according to manufacturing equipment etc., you may employ | adopt zinc oxide etc. as a charged particle, for example.

FIG. 10 is an explanatory diagram for describing a modified example of the fifth step.
In the fifth step described above, by applying a negative voltage to the bonding pads 21a and 21b and applying a positive voltage to the bonding pads 21c and 21d, as shown in FIG. 10, the surfaces of the bonding wires 61 to 63, 68, 69, etc. After the protective films 71 to 73, 78, 79, etc. are formed, a positive voltage is applied to the bonding pads 21a, 21b and a negative voltage is applied to the bonding pads 21c, 21d, so that the remaining bonding wires 64-67, etc. A protective film 74-7 or the like may be formed on the surface.

As a modification of the present embodiment, the pressure sensor manufacturing method according to the present embodiment may be applied to the pressure sensor 10 excluding the circuit chip 50.
Even in the pressure sensor 10 configured in this way, each pad of the sensor chip 40 assembled in the recess 23 in the second step and the corresponding bonding pad are electrically connected by bonding wires in the third step. In the fourth step, the colloid solution 80 is injected into the recess 23 so that the bonding wire is immersed, and a predetermined voltage is applied to each terminal 21 in the fifth step. A protective film can be formed on the surface.

In addition, this invention is not limited to the said embodiment, You may actualize as follows.
(1) The manufacturing method of the sensor device according to the present embodiment is not limited to being applied to the manufacturing method of the pressure sensor that detects the pressure of the medium to be measured in the intake manifold, and detects the pressure of another medium to be measured. The sensor device may be applied to a manufacturing method of a pressure sensor, or a sensor chip that measures a physical quantity of a measured medium such as a temperature sensor is exposed to an atmosphere to be protected such as the measured medium or a corrosive atmosphere. It may be applied to the method.

(2) Each of the bonding wires 61 to 69 is not limited to being composed of a gold wire, but may be composed of a conductive member on which the protective film described above can be formed.

10 ... Pressure sensor (sensor device)
20 ... Case 21 ... Terminal 21a-21d ... Bonding pad (part of terminal)
23 ... Recess 30 ... Port 40 ... Sensor chip 42a-42f ... Pad (input / output terminal)
50: Circuit chips 51a to 51h: Pads (input / output terminals)
61-69 ... Bonding wire 71-79 ... Protective film

Claims (5)

A method of manufacturing a sensor device having a sensor chip that is exposed to a medium to be measured and outputs a signal corresponding to a physical quantity of the medium to be measured through a terminal,
A first step of preparing a case in which a recess for assembling the sensor chip is formed and a part of the terminal is exposed in the recess;
A second step of assembling the sensor chip in the recess;
A third step of electrically connecting the input / output terminals of the sensor chip and a part of the corresponding terminals by bonding wires;
A fourth step of injecting a colloidal solution in which charged particles are dispersed in a solvent into the recess so that the bonding wire is immersed;
A fifth step of generating a potential gradient in the colloidal solution by applying a predetermined voltage to the terminal and attaching the charged particles to the surface of the bonding wire by electrophoresis;
A method for manufacturing a sensor device.   The method of manufacturing a sensor device according to claim 1, wherein the sensor chip is a pressure sensor chip that outputs a signal corresponding to a pressure of the medium to be measured. In the second step, a circuit chip for processing a signal from the sensor chip and the sensor chip are assembled in the recess,
The input / output terminal of the circuit chip, the input / output terminal of the corresponding sensor chip, and a part of the terminal are electrically connected to each other by bonding wires in the third step, respectively. A manufacturing method of the sensor device according to 2.   The method for manufacturing a sensor device according to claim 1, wherein the solvent is a volatile organic solvent.   The method for manufacturing a sensor device according to claim 1, wherein the charged particles are titanium dioxide.

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