JP2006194682A - Pressure sensor system with integrated temperature sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a stain of oil and contamination to the surface of a temperature detection element in a pressure sensor system with an integrated temperature sensor. <P>SOLUTION: The pressure sensor system with an integrated temperature sensor 100 comprises a case 10 in which a terminal 11 connected to the outside is insert molded, a pressure detection element 20 which is provided in the case 10 with electrically connected to the terminal 11 to perform pressure detection, a port section 30 which is connected to the case 10 and has a pressure introduction hole 31 for introducing a pressure medium into the pressure detection element 20, and the temperature detection element 40 which is provided in the pressure introduction hole 31 with electrically connected to the terminal 11 to detect the temperature of the pressure medium. The temperature detection element 40 is covered with a film 50 made of polytetrafluoroethylene. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pressure sensor device and a temperature sensor integrated pressure sensor device including the temperature detection device, and more particularly to a temperature sensor integrated pressure sensor device in which the reliability of the temperature detection device is improved.

  A conventional temperature sensor-integrated pressure sensor device of this type includes a case in which a terminal connected to the outside is insert-molded, and a pressure that is provided in the case in a state of being electrically connected to the terminal and performs pressure detection. A detection element, a port portion connected to the case and having a pressure introduction hole for introducing the pressure medium into the pressure detection element, and a temperature at which the temperature of the pressure medium is provided in the pressure introduction hole while being electrically connected to the terminal And a detection element (see, for example, Patent Document 1).

  FIG. 2 is a diagram showing a schematic cross-sectional configuration of a conventional general temperature sensor integrated pressure sensor device 900.

  This sensor device 900 is used, for example, in a vehicle to measure the pressure of the intake manifold and the intake air temperature, and controls the vehicle engine based on the measurement signals.

  As shown in FIG. 2, the sensor case 10 includes a mold IC 21 including a pressure detection element 20 that detects pressure inside the sensor case 10, and the mold IC 21 externally processes a pressure signal via a lead frame 22. It is electrically connected to a terminal 11 that outputs to the circuit.

  A port portion 30 is connected to the sensor case 10 so as to form a pressure detection chamber with the sensor case 10. The port portion 30 has a pressure introduction hole 31 divided into two by a partition plate 32, and one is configured as a pressure introduction hole 31 a for transmitting a pressure medium to the pressure detection element 20.

  A lead wire 24 as a wiring member that is electrically and mechanically connected to the terminal 11 by welding or the like is extended to the other end of the pressure introducing hole 31 divided by the partition plate 32. A temperature detecting element 40 for detecting the temperature is disposed near the protruding tip of the lead wire 24. That is, the other of the pressure introduction holes 31 is configured as a temperature detection element arrangement hole 31b.

  Further, in this temperature sensor integrated pressure sensor device 900, in order to suppress vibration of the temperature detection element 40 and the lead wire 24 inside the temperature detection element arrangement hole 31b, the lead wire 24 and the temperature detection element arrangement hole 31b. A buffer member 25 made of resin or the like is interposed between the two.

Further, in this sensor device 900, the surface of the temperature detection element 40 and the lead wire 24 is protected from corrosion and dirt in the measurement environment so that the temperature detection element 40 and the lead wire 24 are not exposed in the measurement environment. Tubes and coating materials are provided. In addition, the connection part 23 is covered with a potting material 26 in order to protect the connection part 23 of the lead wire 24 from the measurement environment.
JP 2004-198494 A

  However, in the case where such a temperature sensor integrated pressure sensor device 900 is used for measuring the pressure and intake air temperature in the intake manifold, the inside of the intake manifold is an environment in which oil or dirt flows, The temperature detection element 40 detects the intake air temperature.

  When used in an environment where such oil and dirt flow, there is a problem that oil and dirt adhere to the temperature detection element 40.

  Conventionally, as described above, the surface of the temperature detection element 40 or the lead wire 24 is provided with a tube or a coating material that protects against corrosion or dirt in the measurement environment. The element 40 is applied with a polyamide coating and the lead wire 24 is applied with a polyimide tube.

  However, these conventional surface treatments using polyamide or polyimide cannot prevent the adhesion of oil and dirt, and do not lead to a fundamental solution.

  The present invention has been made in view of the above problems, and an object of the present invention is to more reliably prevent adhesion of oil, dirt, and the like to the surface of a temperature detection element in a temperature sensor integrated pressure sensor device. To do.

  To achieve the above object, according to the first aspect of the present invention, a case (10) in which a terminal (11) to be connected to the outside is insert-molded and a case in which the terminal (11) is electrically connected to the terminal (11). (10) A port portion (30) having a pressure detection element (20) for detecting pressure and a pressure introduction hole (31) connected to the case (10) for introducing a pressure medium into the pressure detection element (20). And a temperature sensor integrated pressure sensor device provided with a temperature detection element (40) that is provided in the pressure introduction hole (31) and detects the temperature of the pressure medium while being electrically connected to the terminal (11). The detection element (40) is covered with a film (50) made of polytetrafluoroethylene.

  According to this, since the temperature detection element (40) is covered with the film (50) made of polytetrafluoroethylene, oil, dirt, and the like are less likely to adhere as compared with the conventional surface processing using polyamide or polyimide. .

  Therefore, according to the present invention, in the temperature sensor integrated pressure sensor device including the pressure detection element (20) and the temperature detection element (40), the surface of the temperature detection element (40) is more adhered to oil, dirt, and the like. It can be surely prevented.

  Here, in the invention according to claim 2, in the temperature sensor integrated pressure sensor device according to claim 1, the temperature detecting element (40) and the terminal (11) are connected via the wiring member (24). The wiring member (24) is electrically connected to the wiring member (24), and the wiring member (24) is also covered with a film (50) made of polytetrafluoroethylene.

  According to this, in addition to the temperature detection element (40), the wiring member (24) can more reliably prevent oil and dirt from adhering to the surface thereof, which is preferable.

  In addition, the code | symbol in the bracket | parenthesis of each said means is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram showing an overall schematic cross-sectional configuration of a temperature sensor integrated pressure sensor device 100 according to an embodiment of the present invention.

  Although not limited thereto, this temperature sensor integrated pressure sensor device 100 can be applied to, for example, an intake pressure sensor attached to an intake manifold of an automobile and used to measure the pressure of the intake manifold and the intake air temperature. .

[Configuration]
This pressure sensor device 100 is roughly divided into a case 10 in which a terminal 11 connected to the outside is insert-molded, and a pressure detection element 20 that is provided in the case 10 in a state of being electrically connected to the terminal 11 and detects pressure. And a port portion 30 having a pressure introducing hole 31 connected to the case 10 and introducing the pressure medium to the pressure detecting element 20, and a pressure medium provided in the pressure introducing hole 31 in a state of being electrically connected to the terminal 11. A temperature detection element 40 for detecting the temperature is provided.

  The case 10 is formed by molding a resin material such as PPS (polyphenylene sulfide), PBT (polybutylene terephthalate) or epoxy resin using a mold. A recess 12 for mounting the pressure detection element 20 is formed on the upper end surface of the case 10.

  The case 10 is integrally provided with a plurality of the terminals 11 connected to the outside by insert molding. The terminal 11 is made of a conductive material such as copper or 42 alloy.

  One end of some of the terminals 11 is arranged so as to be exposed in the recess 12. It should be noted that the exposed portion of the recessed portion 12 in some of the terminals 11 is configured to function as a bonding pad by being plated with gold or the like.

  Moreover, the edge part exposed in the opening part 13 in case 10 among each terminal 11 can be connected to the external apparatus (external wiring member etc.) which is not shown in figure. That is, the portion of the opening portion 13 of the case 10 is configured as a connector portion in the sensor device 100 together with the end portion of each terminal 11 located in the opening portion 13.

  The pressure detection element 20 mounted in the recess 12 of the case 10 detects pressure and generates an electric signal at a level corresponding to the detected value. The pressure detection element 20 is constituted by, for example, a sensor chip made of a semiconductor and a glass pedestal that holds the sensor chip.

  Here, although the sensor chip is not limited, for example, it has a well-known structure using a piezoresistive effect made of a silicon semiconductor chip or the like, and is formed by a diaphragm and a diffused resistor which are distorted by pressure on its upper surface. The configuration includes a bridge circuit and the like.

  The pressure detection element 20 is die bonded between the bottom surface of the recess 12 of the case 10 and the glass pedestal with an adhesive (not shown) such as silicone rubber interposed therebetween.

  Each input / output terminal (not shown) of the pressure detection element 20 is electrically connected to the bonding pad of the terminal 11 via a bonding wire 14 such as gold or aluminum. Thus, the pressure detection element 20 is provided in the case 10 in a state of being electrically connected to the terminal 11.

  The concave portion 12 of the case 10 is filled with a protective member 15 made of fluorine gel or fluorine rubber having excellent electrical insulation and chemical resistance. The interface, the pressure detecting element 20 and the bonding wire 14 are sealed and protected.

  The protective member 15 covers the pressure detection element 20, the terminal 11, the bonding wire 14, the connection between the pressure detection element 20 and the bonding wire 14, and the connection between the terminal 11 and the bonding wire 14. Protection, electrical insulation, and anticorrosion.

  In the example shown in FIG. 1, the protective member 15 has a two-layer protective structure. For example, the protective member located in the lower layer can be made of a material having a high elastic modulus and chemical resistance in order to suppress the generation of bubbles from the interface between the terminal 11 and the case 10. Although not limited, for example, a fluorine-based rubber material or the like can be employed.

  Further, the protective member positioned in the upper layer can be made of a material having a low elastic modulus and chemical resistance that does not apply stress to the pressure detecting element 20 and the bonding wire 14. Although not limited, for example, a fluorine-based gel material or a fluorosilicone gel can be employed.

  The port portion 30 is connected to the case 10 so as to cover the opening of the concave portion 12 of the case 10, and the pressure detection chamber 16 is formed between the case 10 and the port portion 30.

  The port portion 30 is made of a heat-resistant resin material such as PBT or PPS, as in the case 10, for example, and is formed by molding these resin materials using a mold. Further, here, the port portion 30 is fixed and attached to the case 10 by an adhesive 17 having excellent chemical resistance such as hard epoxy resin and having high elasticity.

  The port portion 30 protrudes in a direction opposite to the case 10, and a pressure introduction hole 31 that leads from the protruding tip to the pressure detection chamber 16 is formed in the port portion 30.

  In the example shown in FIG. 1, the pressure introduction hole 31 is divided into two by a partition plate 32. The partition plate 32 is formed along the pressure medium introduction direction indicated by the white arrow in the figure.

  The pressure introduction hole 31 partitioned by the partition plate 32 is a pressure introduction hole 31a for transmitting a pressure medium whose pressure is to be measured to the pressure receiving surface of the pressure detection element 20, and the other is a temperature detection inside thereof. This is a temperature detection element arrangement hole 31b in which a lead wire 24 as a wiring member connected to the element 40 is arranged.

  The pressure introduction hole 31 a and the temperature detection element arrangement hole 31 b are separate holes on the projecting tip side of the port portion 30 by the partition plate 32, but both inside the port portion 30, the pressure detection chamber 16. It is merged and integrated. The partition plate 32 is integrally formed when the port portion 30 is formed.

  Here, the lead wire 24 is made of a metal wire or the like, and is connected to the portion of the terminal 11 exposed from the case 10 by welding or soldering as shown in FIG.

  The connecting portion 23 between the lead wire 24 and the terminal 11 is shown in FIG. 1, and this connecting portion 23 is covered with a potting material 26 made of resin or the like in order to protect the connecting portion 23 from the measurement environment. ing.

  Further, inside the temperature detection element arrangement hole 31b, a buffer member 25 made of resin or the like is interposed between the lead wire 24 and the temperature detection element arrangement hole 31b. The buffer member 25 is provided to suppress vibration of the temperature detection element 40 and the lead wire 24. In addition, as this buffer member 25, the thing similar to the thing of the said patent document 1 is employable.

  The lead wire 24 is extended from the connection portion 23 on the case 10 side to the vicinity of the distal end portion of the port portion 30 through the temperature detection element arrangement hole 31b. The wire 24 and the temperature detection element 40 are electrically connected.

  Here, the temperature detection element 40 is composed of a normal thermistor element having a temperature characteristic of resistance, and the lead wire 24 and the temperature detection element 40 are electrically joined by soldering or welding.

  Here, in the temperature sensor integrated pressure sensor device 100 of the present embodiment, the temperature detection element 40 is covered with a film 50 made of polytetrafluoroethylene. Such a film 50 made of polytetrafluoroethylene can be formed by coating the surface of the temperature detecting element 40 by vapor deposition or the like.

  Further, preferably, in addition to the temperature detecting element 40, the lead wire 24 is also covered with a film 50 made of polytetrafluoroethylene. In the example shown in FIG. 1, a film 50 made of polytetrafluoroethylene is provided on both surfaces of the temperature detecting element 40 and the lead wire 24 by coating.

  An O-ring 33 is provided on the outer periphery of the port portion 30, and the sensor device 100 can be airtightly attached to a sensor attachment portion (not shown) via the O-ring 33.

[Manufacturing method]
The manufacturing method of the temperature sensor integrated pressure sensor device 100 is, for example, as follows. A case 10 in which the terminal 11 is insert-molded is prepared.

  Then, the pressure detection element 20 is mounted and fixed to the concave portion 12 of the case 10 via an adhesive or the like, wire bonding is performed between the pressure detection element 20 and the terminal 11, and both of these 11 and 20 are connected by the bonding wire 14. To do. Thereafter, the protective member 15 is injected and filled into the recess 12 of the case 10, and the protective member 15 is cured by performing a thermosetting process.

  Next, the three members of the terminal 11, the lead wire 24, and the temperature detection element 40 are connected by welding, soldering, or the like.

  Here, with respect to the lead wire 24 and the temperature detection element 40, after both are joined, coating with the film 50 made of the above polytetrafluoroethylene is performed by vapor deposition or the like. Further, the connecting portion 23 between the terminal 11 and the lead wire 24 is covered with the potting material 26.

  And the port part 30 and the case 10 are connected by fixing the port part 30 to the case 10 via the adhesive material 17. At this time, the port portion 30 is attached so that the lead wire 24 and the temperature detection element 40 are inserted into the temperature detection element arrangement hole 31 b of the port portion 30.

  A buffer member 25 is disposed between the lead wire 24 and the temperature detection element arrangement hole 31b. Thus, the temperature sensor integrated pressure sensor device 100 of the present embodiment shown in FIG. 1 is completed.

  When the sensor device 100 is applied to the above-described intake pressure sensor, for example, the intake manifold in the automobile and the pressure introduction hole 31 of the port portion 30 are in communication with each other, and the intake pressure (negative pressure) is detected by the pressure detection element 20. It is mounted on the automobile so that it can be detected.

  Thereby, when pressure is applied in the direction of the white arrow shown in FIG. 1, the pressure medium is transmitted to the pressure receiving surface of the pressure detecting element 20 in the case 10 through the pressure introducing hole 31 a of the port portion 30.

  The pressure detection element 20 detects this pressure and generates an electric signal having a level corresponding to the detected value, and the electric signal is output from the bonding wire 14 to the outside via the terminal 11.

  Further, the temperature of the pressure medium is detected by the temperature detection element 40 disposed at a position close to the flow of the pressure medium, and the detection signal is output to the outside from the lead wire 24 via the terminal 11.

[Effects]
By the way, according to the present embodiment, the case 10 in which the terminal 11 connected to the outside is insert-molded, and the pressure detection element 20 that is provided in the case 10 in a state of being electrically connected to the terminal 11 and detects pressure. A port portion 30 having a pressure introduction hole 31 connected to the case 10 and introducing the pressure medium to the pressure detection element 20; and a temperature of the pressure medium provided in the pressure introduction hole 31 in a state of being electrically connected to the terminal 11. In the temperature sensor integrated pressure sensor device including the temperature detecting element 40 for detection, the temperature detecting element 40 is covered with a film 50 made of polytetrafluoroethylene, and the temperature sensor integrated pressure sensor device 100 is characterized in that Is provided.

  Polytetrafluoroethylene is often used under the trade name Teflon (registered trademark) of DuPont, and its surface has a small coefficient of friction and is difficult to adhere, so it is often used as a release agent. It is hard to adhere.

  According to the sensor device 100 of the present embodiment, since the temperature detection element 40 is covered with the film 50 made of polytetrafluoroethylene, oil, dirt, etc., as compared with the conventional surface processing using polyamide or polyimide. Becomes difficult to adhere.

  Therefore, according to the present embodiment, in the temperature sensor integrated pressure sensor device 100 including the pressure detection element 20 and the temperature detection element 40, adhesion of oil, dirt, or the like to the surface of the temperature detection element 40 is more reliably prevented. be able to.

  Here, in the temperature sensor integrated pressure sensor device 100 of the present embodiment, the temperature detection element 40 and the terminal 11 are connected via a lead wire 24 as a wiring member, and the temperature detection element 40 and the terminal are connected. 11 is electrically connected through the lead wire 24, and the lead wire 24 is also covered with a film 50 made of polytetrafluoroethylene.

  According to this, in addition to the temperature detecting element 40, the lead wire 24 can also more reliably prevent the adhesion of oil or dirt to the surface thereof, which is preferable.

(Other embodiments)
In the above embodiment, both the temperature detection element 40 and the lead wire 24 are covered with the film 50 made of polytetrafluoroethylene. However, at least the temperature detection element 40 is covered with the film 50 made of polytetrafluoroethylene. In some cases, the lead wire 24 may not be covered with the film 50 made of polytetrafluoroethylene.

  Further, the wiring member that electrically connects the temperature detection element 40 and the terminal 11 is not limited to the lead wire 24.

  Moreover, in the said embodiment, although the pressure introduction hole 31 was divided into 2 with the partition plate 32 and the temperature detection element 40 was arrange | positioned in one temperature detection element arrangement | positioning hole 31b, it was set as the structure which eliminated this partition plate. A configuration including one pressure introduction hole 31 may be employed.

  Further, the configuration of the case 10, the pressure detection element 20 provided in the case 10 and its electrical connection configuration, the configuration of the port portion 30, etc. are not limited to the example shown in FIG. Various design changes can be made as appropriate.

  In short, the present invention includes a case in which a terminal connected to the outside is insert-molded, a pressure detection element that is provided in the case in a state of being electrically connected to the terminal, and a pressure detection element that is connected to the case and connected to the case. Temperature sensor integrated pressure sensor comprising a port portion having a pressure introduction hole for introducing a pressure medium into the pressure sensor, and a temperature detection element that is provided in the pressure introduction hole and is electrically connected to the terminal and detects the temperature of the pressure medium The main part of the apparatus is that the temperature detecting element is covered with a film made of polytetrafluoroethylene, and the other parts can be appropriately changed in design.

1 is an overall schematic cross-sectional view of a temperature sensor integrated pressure sensor device according to an embodiment of the present invention. It is a schematic sectional drawing of the conventional general temperature sensor integrated pressure sensor apparatus.

Explanation of symbols

10 ... Case, 11 ... Terminal, 20 ... Pressure detection element,
24 ... Lead wire as a wiring member, 30 ... Port portion, 31 ... Pressure introduction hole,
40 ... temperature detecting element, 50 ... film made of polytetrafluoroethylene.

Claims (2)

A case (10) in which a terminal (11) connected to the outside is insert-molded;
A pressure detection element (20) that is provided in the case (10) in a state of being electrically connected to the terminal (11) and that performs pressure detection;
A port portion (30) connected to the case (10) and having a pressure introduction hole (31) for introducing a pressure medium into the pressure detection element (20);
In the temperature sensor integrated pressure sensor device, which is provided in the pressure introduction hole (31) in a state of being electrically connected to the terminal (11), and includes a temperature detection element (40) for detecting the temperature of the pressure medium. ,
The temperature sensor integrated pressure sensor device, wherein the temperature detection element (40) is covered with a film (50) made of polytetrafluoroethylene. The temperature detection element (40) and the terminal (11) are connected via a wiring member (24), and are electrically connected via the wiring member (24),
The temperature sensor-integrated pressure sensor device according to claim 1, wherein the wiring member (24) is also covered with a film (50) made of polytetrafluoroethylene.

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