JP2018155670A - Pressure sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a temperature sensor-integrated semiconductor pressure sensor in which resistance to corrosion of a connection part connecting a lead wire and a temperature sensor terminal of a temperature sensor is improved and the temperature sensor can be prevented from being damaged by vibration.SOLUTION: A connection part 41 of a temperature sensor terminal 11b, and a lead wire 42 of a temperature sensor 44 coated in the entire region other than the connection part 41 are pre-molded by a resin material 25 so that the lead wire 42 is less exposed, and a pre-molded resin part is coated with resin constituting a case 10.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a temperature sensor integrated semiconductor pressure sensor.

  As a device for detecting the pressure and temperature in an intake pipe of an internal combustion engine, there is a technique described in Patent Document 1. According to Patent Document 1, the connection portion installation chamber in which the connection portion between the lead wire and the terminal of the temperature sensor is a portion different from the installation portion of the pressure detection element and the pressure introduction hole and is isolated from the pressure medium. Is shown.

JP 2006-194683 A

  However, the above-described temperature sensor integrated semiconductor pressure sensor has the following problems. The connection portion between the lead wire and the terminal of the temperature sensor has a structure exposed in the air. For this reason, there is a concern about corrosion due to gas and moisture entering through the connector harness. Further, when a case is exposed to a high temperature and a low-temperature gas flows in the intake manifold, there is a concern that the connection portion may be electrically contacted by condensation if a low temperature is conducted through the temperature sensor or the lead wire. Another problem is that when lead wires are insert-molded into the port part, an interface is formed between the lead wire and the resin material, and corrosive gas may enter the connection part installation chamber and corrode the connection part. is there.

  This invention is made | formed in view of the said subject, The objective is to provide a pressure sensor provided with a temperature sensor with high corrosion resistance.

  In order to solve the above problems, a pressure sensor of the present invention has a lead wire partially coated with a temperature sensor having a temperature detection element, and a temperature sensor terminal connected to the lead wire, A pre-mold for sealing a part of the coating portion and a connecting portion between the lead wire and the temperature sensor terminal with a resin so as to expose the temperature detecting element is provided.

  ADVANTAGE OF THE INVENTION According to this invention, a pressure sensor provided with a temperature sensor with high corrosion resistance can be provided.

It is sectional drawing of the temperature sensor integrated semiconductor pressure sensor in 1st embodiment of this invention. It is the partial assembly figure which joined the lead wire and temperature sensor terminal of the temperature sensor in a first embodiment of the present invention. It is the partial assembly figure which carried out the premold after joining the lead wire and temperature sensor terminal of a temperature sensor in a first embodiment of the present invention. It is the figure which arranged the pressure sensor terminal in the pre-mold of the lead wire of the temperature sensor and temperature sensor terminal in a first embodiment of the present invention. It is sectional drawing of the temperature sensor integrated semiconductor pressure sensor in 2nd embodiment of this invention.

  Embodiments of a temperature sensor integrated semiconductor pressure sensor according to the present invention will be described below in detail with reference to the drawings. The present invention is not limited to the description of the examples described below unless it exceeds the gist.

  A first embodiment of the present invention will be described with reference to FIGS.

  A temperature sensor integrated semiconductor pressure sensor 100 (hereinafter abbreviated as an integrated pressure sensor) is roughly provided with a case 10, a pressure sensor cell 21, a cover 9, and a pre-mold 26.

  As shown in FIGS. 2A and 2B, the temperature detection sensor 44 and the temperature sensor terminal 11b are pre-molded (sealed) with the connecting portion 41 molded (sealed) with the resin material 25 after the lead wire 42 and the temperature sensor terminal 11b are connected. A mold 26 is formed. The temperature sensor 44 includes a temperature detection element 40 that detects temperature and a lead wire 42 that is electrically connected to the temperature sensor terminal 11b. The lead wire 42 is coated to prevent corrosion. In particular, the coating material is more preferably a resin material from the viewpoint of adhesion to a pre-mold resin described later. Examples of the resin material for coating include resins such as epoxy.

  Before the lead wire 42 is molded with the resin material 25, at least the region excluding the connection portion 41 is coated. The coating interface (the boundary between the coated part and the non-coated part) is covered with the resin material 25 for protection. According to this configuration, since the interface between the lead wire 42 and the coating is protected by the resin material 25 and is not directly exposed to the gas, the corrosion resistance of the temperature sensor can be improved.

  About half of the lead wires 42 of the temperature sensor 44 are preferably insert-molded in the resin material 25 of the pre-mold 26. This is because it is effective to lower the resonance point in the vibration of the temperature sensor 44 by substantially shortening the length of the lead wire 42 from the fixed end. As a result, it contributes to the improvement of vibration resistance. Further, in order to dissipate heat transmitted from the case 10 to the temperature detecting element 40 via the lead wire 42 from the lead wire 42, it is preferable that the lead wire 42 is exposed to some extent from the resin 25 and the case 10. If the lead wire 42 is half exposed from the resin 25, the function is sufficiently achieved. Therefore, according to this embodiment, it is possible to achieve both vibration resistance and heat dissipation. In this embodiment, the shape in which about half of the length of the lead wire 42 is insert-molded is shown. However, for example, if the insert molding is performed to a length of 2/3, further improvement in vibration resistance is expected. The

  By disposing the temperature sensor 44 in the vicinity of the pressure inlet, the amount of the lead wire 42 of the temperature sensor 44 in the pre-mold 26 covered with the resin material 25 is increased, and the exposed length of the lead wire 44 from the fixed end is shortened. Can be configured.

  As shown in FIGS. 1 and 3, a pressure sensor cell 21 is mounted on the case 10, and a pressure introduction hole 31 for transmitting a gas pressure as a measurement medium to the pressure sensor cell 21 is formed. In addition, the case 10 holds a pre-mold 26 including a temperature sensor terminal 11 b (partly serving as a pressure sensor terminal 11 a) and a temperature sensor 44. The case 10 is formed, for example, by molding a resin material such as PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), or epoxy resin using a mold.

  Of each terminal 11, the end exposed at the opening 13 in the case 10 can be connected to an external device (external wiring member or the like) (not shown). That is, the opening 13 portion of the case 10 is configured as a connector portion in the sensor device 100 together with the end portions of the terminals 11 positioned in the opening 13.

  The pressure sensor cell 21 is bonded to one end side of the port portion 30 with an adhesive 17. A pressure detection chamber 16 is provided on one end side of the port portion 30, and a pressure introduction hole 31 is provided on the other end side of the port portion 30.

  In the case 10, a guard 35 is provided on the tip side (the pressure introduction hole 31 side of the port portion 30) in order to protect the temperature detection element 40. The guard 35 reduces the collision with the temperature detection element 40 when foreign matter flows into the intake pipe of the internal combustion engine, or protects the temperature detection element 40 from an external force due to dropping when the integrated pressure sensor 100 is handled. You can do it. The guard 35 has a thin columnar structure that can be removed when molding the case 10 and does not prevent the inflow / outflow of gas flowing through the intake pipe, and connects the tips of a plurality of thin columns to ensure strength. This ensures strength.

  Desirably, the resin material of the case 1 and the resin material 25 of the pre-mold are the same in consideration of the difference in linear expansion at high temperature or low temperature.

  The terminals of the pressure sensor cells 21 are welded to the pressure sensor terminals 11a insert-molded in the case 10, and are sealed with a gel 22 from above. This is intended to protect the joint 23 from water and corrosive substances by sealing the joint 23. The pressure sensor cell 21 has three terminals (power supply, output, GND) and two terminals of the temperature sensor 44, and a total of five terminals. By using the GND as the temperature sensor 44, four terminals are provided. can do. That is, the number of terminals can be reduced by combining the GND of the pressure sensor terminal 11a and the GND of the temperature sensor terminal 11b.

  The case 10 and the cover 9 are bonded with an adhesive 17. By adopting such a structure, the pressure applied from the pressure introducing hole 31 can be applied to the pressure sensor cell 21 without diffusing inside the case 10, and the cover 9 and the adhesive 17 can keep airtightness. It is possible to prevent the pressure from leaking outside the case 10.

  The present embodiment includes a case having an introduction port to the pressure sensor, a temperature sensor having a lead wire and a temperature detection element, and a temperature sensor terminal connected to the lead wire, and the lead wire is coated. A sealing portion that seals a part of the coating portion and a connecting portion of the lead wire and the temperature sensor terminal with a resin so as to expose the temperature detection element, and the case and the sealing portion are It is formed separately.

  In the present embodiment, the example in which the premold 26 is fixed by being inserted into the case 10 has been described. However, the present invention is not limited to this, and the premold 26 is inserted into the port portion 30. May be fixed to the case 10.

  Further, the connection between the lead wire 42 and the temperature sensor terminal 11b may be a technique that can achieve electrical conduction, such as soldering, laser welding, resistance welding, or the like.

  Examples of the lead wire 42 include a nickel wire and a CP wire obtained by electroless nickel plating (chemical nickel plating). Examples of the temperature sensor terminal 11b include a brass material tin-plated, a phosphor bronze material tin-plated, and a stainless steel material.

  A second embodiment of the present invention will be described with reference to FIG. Note that a description of the same configuration as in the embodiment is omitted.

  The present embodiment is a coverless structure in which the cover 9 is eliminated from the first embodiment. In this embodiment, the terminal of the pressure sensor cell 21 is welded to the pressure sensor terminal 11a, and then the adhesive 17 is filled into the upper portion of the case 1 and sealed. Case 10 is made of PPS resin (polyphenylene sulfide resin). As the PPS resin, “Fortron 6565A7 HD9050 manufactured by polyplastics” is used. This resin has good adhesion to the adhesive material 17 and has a similar linear expansion coefficient, and is also used in the pressure sensor cell 21. Since the materials of the pressure sensor cell 21 and the case 10 are the same, the influence of the stress from the case 10 to the pressure sensor cell 21 due to the difference in linear expansion at high temperature or low temperature is small, and the adverse effect on the output of the pressure sensor cell 9 is prevented. Is possible.

  The terminals of the pressure sensor cell 21 are welded to the pressure sensor terminals 11a insert-molded in the case 10, and are sealed with an adhesive 17 from above. The purpose of this is to protect the welded part from water and corrosive substances by sealing the joint part 23 and to increase the strength of the connecting part itself by sealing.

  The pressure sensor cell 21 itself is bonded to the case 10 using an adhesive 17. By adopting such a structure, the pressure applied from the pressure introducing hole 31 can be applied to the pressure sensor cell 21 without diffusing into the case 10.

  Moreover, it seals with the adhesive material 17 to the upper side of the pressure sensor cell 21 arrange | positioned by adhesion | attachment with the adhesive material 17 at the one end side (upper end side) of the port part 30, and plays the role of the cover of the case 10, and airtightly covers it. Yes. This does not require the cover 9 that is a lid, can be kept airtight, and can prevent pressure from leaking outside the case 10.

  In addition, the resin material 25 of the pre-mold 26 is more effective in improving resistance from corrosive substances by being completely covered by the over-mold when the case 1 is over-molded. Desirably, the resin material of the case 1 and the resin material 25 of the pre-mold are the same in consideration of the difference in linear expansion at high temperature or low temperature.

DESCRIPTION OF SYMBOLS 9 Cover 10 Case 11 Terminal 11a Pressure sensor terminal 11b Temperature sensor terminal 12 1st recessed part 13 Connector opening part 14 Bonding wire 16 Pressure detection chamber 17 Adhesive material 19 Connection part installation chamber 20 Pressure detection element 21 Pressure sensor cell 22 Gel 23 Connection part (Between pressure sensor and terminal)
25 resin material 26 pre-mold 30 port portion 31 pressure introducing hole 32 wall portion 33 O-ring 35 guard 40 temperature detecting element 41 connecting portion (between temperature sensor and terminal)
42 Lead wire 43 Other end of lead wire 44 Temperature sensor 45 Epoxy coating 100 Temperature sensor integrated pressure sensor device 200 according to the first embodiment Temperature sensor integrated pressure sensor device 900 according to the second embodiment Temperature of Patent Document 1 Sensor integrated pressure sensor device

Claims (14)

In the pressure sensor where the pressure sensor is mounted on the case,
A part of the coating portion having a temperature sensor having a partially coated lead wire and a temperature detection element, and a temperature sensor terminal connected to the lead wire, and exposing the temperature detection element And a pressure sensor device comprising a pre-mold for sealing a connecting portion between the lead wire and the temperature sensor terminal with a resin.   The pressure sensor device according to claim 1, wherein the premold is insert-fixed to the case so that at least the temperature detection element is exposed.   The pressure sensor according to claim 1 or 2, wherein the case includes a port portion having a pressure introduction hole for introducing pressure into the pressure sensor, and the temperature detection element protrudes from the port portion.   The pressure sensor according to claim 3, wherein the resin portion of the pre-mold is disposed in the pressure introduction hole.   The pressure sensor according to claim 1, wherein the lead wire is coated with an epoxy resin.   The pressure sensor according to claim 2, wherein the resin portion of the pre-mold is completely covered with the resin constituting the case.   The temperature sensor integrated semiconductor pressure sensor according to claim 2, wherein the resin portion of the pre-mold is partially exposed from the resin constituting the case.   The pressure sensor according to claim 1, wherein a GND terminal of the temperature sensor terminal also serves as a GND terminal of the pressure sensor.   The pressure sensor according to claim 1, wherein the connection between the lead wire and the temperature sensor terminal is solder bonding, laser welding, resistance welding, or the like.   The pressure sensor according to claim 1, wherein the lead wire is a nickel wire, and the temperature sensor terminal is tin-plated on a brass material.   2. The pressure sensor according to claim 1, wherein the lead wire is a CP wire using electroless nickel plating (chemical nickel plating) and the temperature sensor terminal is tin-plated on a brass material.   The pressure sensor according to claim 1, wherein the lead wire is a nickel wire, and the temperature sensor terminal is a tin-plated phosphor bronze material.   The pressure sensor according to claim 1, wherein the lead wire is a nickel wire and the temperature sensor terminal is a stainless steel material. A coating process in which at least the lead wire connection part of the temperature sensor is coated with an epoxy resin; and
A pre-molding step of connecting the lead wire and the temperature sensor terminal and pre-molding a part of the lead wire covered with the connecting portion and the coating material with a resin;
An insert step of inserting the premolded body into a case.

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