CN1510745A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN1510745A CN1510745A CNA2003101131384A CN200310113138A CN1510745A CN 1510745 A CN1510745 A CN 1510745A CN A2003101131384 A CNA2003101131384 A CN A2003101131384A CN 200310113138 A CN200310113138 A CN 200310113138A CN 1510745 A CN1510745 A CN 1510745A
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- semiconductor device
- semiconductor
- insulating component
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002371538 | 2002-12-24 | ||
JP2002371538A JP3888302B2 (ja) | 2002-12-24 | 2002-12-24 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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CN1510745A true CN1510745A (zh) | 2004-07-07 |
CN1322583C CN1322583C (zh) | 2007-06-20 |
Family
ID=32652650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2003101131384A Expired - Fee Related CN1322583C (zh) | 2002-12-24 | 2003-12-24 | 半导体器件及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (3) | US6882054B2 (zh) |
JP (1) | JP3888302B2 (zh) |
KR (2) | KR100651076B1 (zh) |
CN (1) | CN1322583C (zh) |
HK (1) | HK1067788A1 (zh) |
TW (1) | TWI266376B (zh) |
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CN110651007A (zh) * | 2017-06-09 | 2020-01-03 | 长濑化成株式会社 | 环氧树脂组合物、电子部件安装结构体及其制造方法 |
WO2023123106A1 (zh) * | 2021-12-29 | 2023-07-06 | 华为技术有限公司 | 芯片封装结构及其制备方法、电子设备 |
CN116798876A (zh) * | 2023-06-28 | 2023-09-22 | 华天科技(昆山)电子有限公司 | 一种晶圆级扇出封装方法及封装结构 |
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TWI239581B (en) * | 2003-01-16 | 2005-09-11 | Casio Computer Co Ltd | Semiconductor device and method of manufacturing the same |
-
2002
- 2002-12-24 JP JP2002371538A patent/JP3888302B2/ja not_active Expired - Fee Related
-
2003
- 2003-12-15 US US10/736,810 patent/US6882054B2/en not_active Ceased
- 2003-12-19 KR KR1020030093502A patent/KR100651076B1/ko not_active IP Right Cessation
- 2003-12-23 TW TW092136473A patent/TWI266376B/zh not_active IP Right Cessation
- 2003-12-24 CN CNB2003101131384A patent/CN1322583C/zh not_active Expired - Fee Related
-
2005
- 2005-01-07 HK HK05100104A patent/HK1067788A1/xx not_active IP Right Cessation
- 2005-01-26 US US11/043,355 patent/US7192805B2/en not_active Expired - Lifetime
-
2006
- 2006-09-29 KR KR1020060095323A patent/KR100651628B1/ko not_active IP Right Cessation
-
2007
- 2007-04-19 US US11/788,397 patent/USRE41369E1/en not_active Expired - Lifetime
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CN101256962B (zh) * | 2004-11-24 | 2010-06-02 | 精工爱普生株式会社 | 电子部件及其制造方法 |
CN102332408A (zh) * | 2010-07-13 | 2012-01-25 | 矽品精密工业股份有限公司 | 芯片尺寸封装件及其制法 |
CN102332408B (zh) * | 2010-07-13 | 2015-05-13 | 矽品精密工业股份有限公司 | 芯片尺寸封装件及其制法 |
CN105489516A (zh) * | 2016-01-22 | 2016-04-13 | 中芯长电半导体(江阴)有限公司 | 一种扇出型芯片的封装方法及封装结构 |
CN110651007A (zh) * | 2017-06-09 | 2020-01-03 | 长濑化成株式会社 | 环氧树脂组合物、电子部件安装结构体及其制造方法 |
US11608435B2 (en) | 2017-06-09 | 2023-03-21 | Nagase Chemtex Corporation | Epoxy resin composition, electronic component mounting structure, and method for producing the same |
CN110614762A (zh) * | 2018-06-18 | 2019-12-27 | 卡西欧计算机株式会社 | 树脂片的制造方法 |
CN110614762B (zh) * | 2018-06-18 | 2022-01-21 | 卡西欧计算机株式会社 | 树脂片的制造方法 |
WO2023123106A1 (zh) * | 2021-12-29 | 2023-07-06 | 华为技术有限公司 | 芯片封装结构及其制备方法、电子设备 |
CN116798876A (zh) * | 2023-06-28 | 2023-09-22 | 华天科技(昆山)电子有限公司 | 一种晶圆级扇出封装方法及封装结构 |
Also Published As
Publication number | Publication date |
---|---|
TW200416912A (en) | 2004-09-01 |
KR20060109399A (ko) | 2006-10-20 |
KR20040057934A (ko) | 2004-07-02 |
US6882054B2 (en) | 2005-04-19 |
US20050146051A1 (en) | 2005-07-07 |
JP2004207306A (ja) | 2004-07-22 |
US20040124547A1 (en) | 2004-07-01 |
HK1067788A1 (en) | 2005-04-15 |
KR100651628B1 (ko) | 2006-12-01 |
JP3888302B2 (ja) | 2007-02-28 |
CN1322583C (zh) | 2007-06-20 |
USRE41369E1 (en) | 2010-06-08 |
TWI266376B (en) | 2006-11-11 |
KR100651076B1 (ko) | 2006-11-30 |
US7192805B2 (en) | 2007-03-20 |
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