TWI266376B - Semiconductor device and its production method - Google Patents

Semiconductor device and its production method

Info

Publication number
TWI266376B
TWI266376B TW092136473A TW92136473A TWI266376B TW I266376 B TWI266376 B TW I266376B TW 092136473 A TW092136473 A TW 092136473A TW 92136473 A TW92136473 A TW 92136473A TW I266376 B TWI266376 B TW I266376B
Authority
TW
Taiwan
Prior art keywords
semiconductor
semiconductor construction
insulating material
grinding
resin
Prior art date
Application number
TW092136473A
Other languages
English (en)
Other versions
TW200416912A (en
Inventor
Hiroyasu Jobetto
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Publication of TW200416912A publication Critical patent/TW200416912A/zh
Application granted granted Critical
Publication of TWI266376B publication Critical patent/TWI266376B/zh

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Classifications

    • H—ELECTRICITY
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW092136473A 2002-12-24 2003-12-23 Semiconductor device and its production method TWI266376B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002371538A JP3888302B2 (ja) 2002-12-24 2002-12-24 半導体装置

Publications (2)

Publication Number Publication Date
TW200416912A TW200416912A (en) 2004-09-01
TWI266376B true TWI266376B (en) 2006-11-11

Family

ID=32652650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092136473A TWI266376B (en) 2002-12-24 2003-12-23 Semiconductor device and its production method

Country Status (6)

Country Link
US (3) US6882054B2 (zh)
JP (1) JP3888302B2 (zh)
KR (2) KR100651076B1 (zh)
CN (1) CN1322583C (zh)
HK (1) HK1067788A1 (zh)
TW (1) TWI266376B (zh)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134650A (ja) * 2000-10-23 2002-05-10 Rohm Co Ltd 半導体装置およびその製造方法
JP3951854B2 (ja) * 2002-08-09 2007-08-01 カシオ計算機株式会社 半導体装置およびその製造方法
JP3918681B2 (ja) * 2002-08-09 2007-05-23 カシオ計算機株式会社 半導体装置
WO2004064153A1 (en) * 2003-01-16 2004-07-29 Casio Computer Co., Ltd. Semiconductor device and method of manufacturing the same
JP4093186B2 (ja) 2004-01-27 2008-06-04 カシオ計算機株式会社 半導体装置の製造方法
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US20040124547A1 (en) 2004-07-01
CN1510745A (zh) 2004-07-07
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CN1322583C (zh) 2007-06-20
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