CN103378119B - 电子组件、电子模块、其制造方法、安装构件和电子装置 - Google Patents

电子组件、电子模块、其制造方法、安装构件和电子装置 Download PDF

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Publication number
CN103378119B
CN103378119B CN201310151446.XA CN201310151446A CN103378119B CN 103378119 B CN103378119 B CN 103378119B CN 201310151446 A CN201310151446 A CN 201310151446A CN 103378119 B CN103378119 B CN 103378119B
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China
Prior art keywords
base body
frame body
electronic device
central area
expansion
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English (en)
Chinese (zh)
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CN103378119A (zh
Inventor
都筑幸司
铃木隆典
小坂忠志
松木康浩
长谷川真
伊藤富士雄
小森久种
栗原康
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Canon Inc
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Canon Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN201310151446.XA 2012-04-27 2013-04-27 电子组件、电子模块、其制造方法、安装构件和电子装置 Active CN103378119B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012103828 2012-04-27
JP2012-103828 2012-04-27
JP2013039449A JP6296687B2 (ja) 2012-04-27 2013-02-28 電子部品、電子モジュールおよびこれらの製造方法。
JP2013-039449 2013-02-28

Publications (2)

Publication Number Publication Date
CN103378119A CN103378119A (zh) 2013-10-30
CN103378119B true CN103378119B (zh) 2016-02-03

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Country Status (3)

Country Link
US (1) US9220172B2 (https=)
JP (1) JP6296687B2 (https=)
CN (1) CN103378119B (https=)

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JP6650958B2 (ja) * 2012-04-27 2020-02-19 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法
DE102013217888B4 (de) * 2012-12-20 2024-07-04 Continental Automotive Technologies GmbH Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
JP5904957B2 (ja) * 2013-02-28 2016-04-20 キヤノン株式会社 電子部品および電子機器。
CN104393014B (zh) * 2014-10-22 2017-09-26 京东方科技集团股份有限公司 一种阵列基板及其制备方法、柔性显示面板和显示装置
JP6555942B2 (ja) * 2015-06-15 2019-08-07 キヤノン株式会社 電子モジュールの製造方法
JP2017188621A (ja) * 2016-04-08 2017-10-12 クラスターテクノロジー株式会社 半導体素子実装パッケージおよびその製造方法、ならびに当該パッケージ製造のための基板プレート
CN109155115B (zh) * 2016-05-23 2020-12-08 堺显示器制品株式会社 显示装置
JP6845671B2 (ja) * 2016-11-30 2021-03-24 川崎重工業株式会社 部品実装装置及びその制御方法
JP6908506B2 (ja) * 2017-03-28 2021-07-28 京セラ株式会社 撮像装置
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TWI639880B (zh) * 2017-11-10 2018-11-01 群光電子股份有限公司 改善熱飄移之鏡頭結構及其方法
CN111742410B (zh) * 2018-02-22 2021-06-15 富士胶片株式会社 摄像单元、摄像装置
JP7292828B2 (ja) * 2018-04-27 2023-06-19 キヤノン株式会社 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法
JP7134763B2 (ja) 2018-07-23 2022-09-12 キヤノン株式会社 モジュール及びその製造方法
JP7218126B2 (ja) 2018-08-30 2023-02-06 キヤノン株式会社 配線板を備えるユニット、モジュールおよび機器
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JP7235379B2 (ja) * 2019-06-19 2023-03-08 住友電工デバイス・イノベーション株式会社 電子デバイスの製造方法
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器
JP7449816B2 (ja) * 2020-08-21 2024-03-14 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 光モジュール
CN114682948B (zh) * 2022-03-04 2023-10-31 广东风华高新科技股份有限公司 片式元器件的可焊性测试方法、装置及系统
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US12379510B2 (en) * 2022-05-17 2025-08-05 Canon Kabushiki Kaisha Radiation detector and radiation image capturing system

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Publication number Publication date
US9220172B2 (en) 2015-12-22
US20130286565A1 (en) 2013-10-31
JP2013243339A (ja) 2013-12-05
JP6296687B2 (ja) 2018-03-20
CN103378119A (zh) 2013-10-30

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