CN102197470A - 制造晶片层合体的方法、制造晶片层合体的装置、晶片层合体、剥离支撑体的方法以及制造晶片的方法 - Google Patents

制造晶片层合体的方法、制造晶片层合体的装置、晶片层合体、剥离支撑体的方法以及制造晶片的方法 Download PDF

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Publication number
CN102197470A
CN102197470A CN2009801424501A CN200980142450A CN102197470A CN 102197470 A CN102197470 A CN 102197470A CN 2009801424501 A CN2009801424501 A CN 2009801424501A CN 200980142450 A CN200980142450 A CN 200980142450A CN 102197470 A CN102197470 A CN 102197470A
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CN
China
Prior art keywords
wafer
support
adhesive
manufacturing
resin
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Pending
Application number
CN2009801424501A
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English (en)
Chinese (zh)
Inventor
秋山良太
中岛伸哉
齐藤一太
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN102197470A publication Critical patent/CN102197470A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2009801424501A 2008-09-02 2009-08-27 制造晶片层合体的方法、制造晶片层合体的装置、晶片层合体、剥离支撑体的方法以及制造晶片的方法 Pending CN102197470A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-225231 2008-09-02
JP2008225231A JP2010062269A (ja) 2008-09-02 2008-09-02 ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
PCT/US2009/055142 WO2010027897A1 (en) 2008-09-02 2009-08-27 Method of manufacturing wafer laminated body, device of manufacturing wafer laminated body, wafer laminated body, method of peeling support body, and method of manufacturing wafer

Publications (1)

Publication Number Publication Date
CN102197470A true CN102197470A (zh) 2011-09-21

Family

ID=41213305

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801424501A Pending CN102197470A (zh) 2008-09-02 2009-08-27 制造晶片层合体的方法、制造晶片层合体的装置、晶片层合体、剥离支撑体的方法以及制造晶片的方法

Country Status (7)

Country Link
US (1) US20110151176A1 (https=)
EP (1) EP2335278A1 (https=)
JP (1) JP2010062269A (https=)
KR (1) KR20110074855A (https=)
CN (1) CN102197470A (https=)
TW (1) TW201017743A (https=)
WO (1) WO2010027897A1 (https=)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103128618A (zh) * 2011-11-21 2013-06-05 株式会社东洋质量第一 玻璃研磨方法以及用于该方法的层压板
CN103700584A (zh) * 2012-09-27 2014-04-02 株式会社迪思科 表面保护部件以及加工方法
CN104108063A (zh) * 2013-04-18 2014-10-22 株式会社迪思科 片材
CN104409383A (zh) * 2014-10-20 2015-03-11 上海技美电子科技有限公司 晶圆转移装置
CN105190844A (zh) * 2013-05-24 2015-12-23 富士电机株式会社 半导体装置的制造方法
CN107073681A (zh) * 2014-09-10 2017-08-18 丸石产业株式会社 保持垫片
CN110197812A (zh) * 2018-02-27 2019-09-03 株式会社迪思科 板状物的加工方法
CN110802509A (zh) * 2018-08-06 2020-02-18 株式会社迪思科 保护部件形成装置
CN113165136A (zh) * 2019-02-26 2021-07-23 株式会社迪思科 用于磨削背面的胶粘片及半导体晶片的制造方法
CN113632207A (zh) * 2019-03-27 2021-11-09 三井化学东赛璐株式会社 粘贴装置
CN113953133A (zh) * 2020-07-20 2022-01-21 株式会社迪思科 片材、以及保护部件的形成方法

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5457088B2 (ja) * 2009-06-25 2014-04-02 株式会社日立パワーソリューションズ ダイシングテープ用の真空貼付機
JP5503951B2 (ja) * 2009-12-07 2014-05-28 株式会社ディスコ 貼着装置
JP5841738B2 (ja) * 2011-04-05 2016-01-13 株式会社ディスコ ウェーハの研削方法
JP5421967B2 (ja) * 2011-09-07 2014-02-19 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP5406257B2 (ja) * 2011-09-07 2014-02-05 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP5631343B2 (ja) * 2012-02-08 2014-11-26 東京応化工業株式会社 積層体の製造方法
JP5912657B2 (ja) * 2012-02-27 2016-04-27 株式会社ディスコ 樹脂貼付装置
JP6021362B2 (ja) * 2012-03-09 2016-11-09 株式会社ディスコ 板状物の研削方法
JP6068915B2 (ja) * 2012-10-09 2017-01-25 株式会社ディスコ 樹脂貼着装置
JP6122602B2 (ja) * 2012-10-12 2017-04-26 株式会社ディスコ 樹脂貼着装置
JP6149223B2 (ja) * 2013-04-18 2017-06-21 株式会社ディスコ 板状物の貼着方法
KR20150011072A (ko) 2013-07-22 2015-01-30 삼성전자주식회사 임시 접착제 조성물 및 이를 이용한 반도체 소자의 제조 방법
KR20150042362A (ko) * 2013-10-10 2015-04-21 삼성전자주식회사 발광다이오드 패키지 및 그 제조방법
KR101506854B1 (ko) 2013-12-27 2015-03-31 경기대학교 산학협력단 Uv 마운팅 장치
JP6322472B2 (ja) * 2014-05-01 2018-05-09 スリーエム イノベイティブ プロパティズ カンパニー シート貼付方法、シート貼付装置及びウエハ加工方法
US9514772B2 (en) * 2015-03-20 2016-12-06 Tdk Corporation Magnetic head device having suspension and spacer
CN105711224B (zh) * 2016-03-25 2017-11-24 湖南新中合光电科技股份有限公司 一种光分路器晶圆贴片系统
JP6671797B2 (ja) * 2016-05-30 2020-03-25 株式会社ディスコ テープ貼着方法
JP6767890B2 (ja) * 2017-01-30 2020-10-14 株式会社ディスコ 保護部材形成装置
JP6955904B2 (ja) * 2017-05-26 2021-10-27 東京エレクトロン株式会社 基板処理装置
JP2019220550A (ja) * 2018-06-19 2019-12-26 株式会社ディスコ ウエーハの加工方法
JP7339768B2 (ja) * 2019-05-10 2023-09-06 株式会社ディスコ 保護部材形成装置
JP7339771B2 (ja) * 2019-05-17 2023-09-06 株式会社ディスコ 保護部材形成装置
JP7471746B2 (ja) * 2020-01-15 2024-04-22 株式会社ディスコ チャックテーブル、及びチャックテーブルの製造方法
JP7436288B2 (ja) * 2020-05-27 2024-02-21 株式会社ディスコ 保護部材形成装置
JP7436289B2 (ja) * 2020-05-27 2024-02-21 株式会社ディスコ 保護部材形成装置
JP7488117B2 (ja) * 2020-06-04 2024-05-21 株式会社ディスコ 保護部材の厚み調整方法
JP7667598B2 (ja) * 2021-03-31 2025-04-23 エヌシーシー ナノ， エルエルシー 集積回路製造の間に基板を取付および取外するための方法
JP2024045875A (ja) * 2022-09-22 2024-04-03 株式会社ディスコ 保護部材形成方法

Family Cites Families (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2843555A (en) * 1956-10-01 1958-07-15 Gen Electric Room temperature curing organopolysiloxane
GB923710A (en) * 1960-11-07 1963-04-18 Ici Ltd Production of organosilicon compounds
US3313773A (en) * 1965-12-03 1967-04-11 Gen Electric Platinum addition catalyst system
AT278040B (de) * 1966-12-16 1970-01-26 Degussa Verfahren zur Herstellung von Organosiliziumverbindungen
DE1259888B (de) * 1967-05-27 1968-02-01 Bayer Ag Verfahren zur Herstellung von Organosiliciumverbindungen
US3814730A (en) * 1970-08-06 1974-06-04 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
US3715334A (en) * 1970-11-27 1973-02-06 Gen Electric Platinum-vinylsiloxanes
NL7207442A (https=) * 1971-06-25 1972-12-28
US4189230A (en) * 1977-10-26 1980-02-19 Fujitsu Limited Wafer holder with spring-loaded wafer-holding means
DE2846621A1 (de) * 1978-10-26 1980-05-08 Wacker Chemie Gmbh Verfahren zum anlagern von si-gebundenem wasserstoff an aliphatische mehrfachbindung
US4288345A (en) * 1980-02-06 1981-09-08 General Electric Company Platinum complex
US4313988A (en) * 1980-02-25 1982-02-02 Minnesota Mining And Manufacturing Company Epoxypolysiloxane release coatings for adhesive materials
US4316757A (en) * 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
US4394414A (en) * 1981-05-29 1983-07-19 Ppg Industries, Inc. Aqueous sizing composition for glass fibers for use on chopped glass fibers
US5089536A (en) * 1982-11-22 1992-02-18 Minnesota Mining And Manufacturing Company Energy polmerizable compositions containing organometallic initiators
US4530879A (en) * 1983-03-04 1985-07-23 Minnesota Mining And Manufacturing Company Radiation activated addition reaction
US4510094A (en) * 1983-12-06 1985-04-09 Minnesota Mining And Manufacturing Company Platinum complex
US4603215A (en) * 1984-08-20 1986-07-29 Dow Corning Corporation Platinum (O) alkyne complexes
FR2571732B1 (fr) * 1984-10-15 1987-01-09 Rhone Poulenc Spec Chim Composition organopolysiloxanique de revetement utilisable notamment pour le traitement antiadherent et son procede d'application
US4677137A (en) * 1985-05-31 1987-06-30 Minnesota Mining And Manufacturing Company Supported photoinitiator
US4670531A (en) * 1986-01-21 1987-06-02 General Electric Company Inhibited precious metal catalyzed organopolysiloxane compositions
US5234730A (en) * 1986-11-07 1993-08-10 Tremco, Inc. Adhesive composition, process, and product
US5139804A (en) * 1987-05-14 1992-08-18 Plicon, Inc. Patterned adherent film structures and process for making
US4818323A (en) * 1987-06-26 1989-04-04 Motorola Inc. Method of making a void free wafer via vacuum lamination
DE3850451T2 (de) * 1987-07-08 1995-03-09 Furukawa Electric Co Ltd Strahlungsvernetzbare Klebestreifen.
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
US4916169A (en) * 1988-09-09 1990-04-10 Minnesota Mining And Manufacturing Company Visible radiation activated hydrosilation reaction
US5414297A (en) * 1989-04-13 1995-05-09 Seiko Epson Corporation Semiconductor device chip with interlayer insulating film covering the scribe lines
JPH0774328B2 (ja) * 1989-09-05 1995-08-09 千住金属工業株式会社 電子部品の仮固定用粘着剤
US5091483A (en) * 1989-09-22 1992-02-25 Minnesota Mining And Manufacturing Company Radiation-curable silicone elastomers and pressure sensitive adhesives
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
JPH0432229A (ja) * 1990-05-29 1992-02-04 Mitsubishi Electric Corp ウエハ貼付方法
US6376569B1 (en) * 1990-12-13 2002-04-23 3M Innovative Properties Company Hydrosilation reaction utilizing a (cyclopentadiene)(sigma-aliphatic) platinum complex and a free radical photoinitiator
US5300788A (en) * 1991-01-18 1994-04-05 Kopin Corporation Light emitting diode bars and arrays and method of making same
US5286815A (en) * 1992-02-07 1994-02-15 Minnesota Mining And Manufacturing Company Moisture curable polysiloxane release coating compositions
US5332797A (en) * 1992-04-01 1994-07-26 Minnesota Mining And Manufacturing Company Silicone release compositions
US5633176A (en) * 1992-08-19 1997-05-27 Seiko Instruments Inc. Method of producing a semiconductor device for a light valve
DE4230784A1 (de) * 1992-09-15 1994-03-17 Beiersdorf Ag Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape)
CA2115947A1 (en) * 1993-03-03 1994-09-04 Gregory C. Smith Wafer-like processing after sawing dmds
EP0620242B1 (en) * 1993-04-15 1998-08-19 Dow Corning Toray Silicone Company, Limited Epoxy group-containing silicone resin and compositions based thereon
AU690302B2 (en) * 1994-06-30 1998-04-23 Dade Behring Inc. Bioactive porous partition members
US5604038A (en) * 1994-11-18 1997-02-18 Wisconsin Alumni Research Foundation Polymeric thin layer materials
JP3521099B2 (ja) * 1994-11-29 2004-04-19 リンテック株式会社 ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート
US5534383A (en) * 1995-08-09 1996-07-09 Fuji Photo Film Co., Ltd. Image transfer sheet, its laminate and image forming method
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5967030A (en) * 1995-11-17 1999-10-19 Micron Technology, Inc. Global planarization method and apparatus
US6074287A (en) * 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
US6048953A (en) * 1996-06-03 2000-04-11 Toyo Ink Manufacturing Co., Ltd. Curable liquid resin composition
JPH1065047A (ja) * 1996-08-20 1998-03-06 Tokuyama Corp 半導体素子搭載用パッケージの製造方法
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
US20020007910A1 (en) * 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
JPH10180403A (ja) * 1996-12-26 1998-07-07 Sumitomo Bakelite Co Ltd 樹脂組成物、永久レジスト樹脂組成物及びこれらの硬化物
WO1998040439A1 (en) * 1997-03-14 1998-09-17 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
US6194317B1 (en) * 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
JPH1120309A (ja) * 1997-07-03 1999-01-26 Dainippon Printing Co Ltd 一体型熱転写シートおよびその製造方法
DE19857237A1 (de) * 1997-12-23 1999-06-24 Henkel Kgaa Strahlenhärtbare Kaschierklebestoffe
JP3983887B2 (ja) * 1998-04-09 2007-09-26 沖電気工業株式会社 基板研磨用治具及び半導体ウエハの研磨方法
US6265460B1 (en) * 1998-06-29 2001-07-24 3M Innovative Properties Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
JP2000038556A (ja) * 1998-07-22 2000-02-08 Nitto Denko Corp 半導体ウエハ保持保護用ホットメルトシート及びその貼り付け方法
US6048587A (en) * 1998-10-01 2000-04-11 Ricon Resins, Inc. Water-dispersible, radiation and thermally-curable polymeric compositions
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
JP4275254B2 (ja) * 1999-06-17 2009-06-10 リンテック株式会社 両面粘着シートに固定された物品の剥離方法および剥離装置
US6395124B1 (en) * 1999-07-30 2002-05-28 3M Innovative Properties Company Method of producing a laminated structure
US6180527B1 (en) * 1999-08-09 2001-01-30 Micron Technology, Inc. Method and apparatus for thinning article, and article
US6284425B1 (en) * 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
US6447884B1 (en) * 2000-03-20 2002-09-10 Kodak Polychrome Graphics Llc Low volume ablatable processless imaging member and method of use
TW505942B (en) * 2000-06-29 2002-10-11 Matsushita Electric Industrial Co Ltd Method and apparatus for forming pattern onto panel substrate
JP3485525B2 (ja) * 2000-07-06 2004-01-13 沖電気工業株式会社 半導体装置の製造方法
US6358664B1 (en) * 2000-09-15 2002-03-19 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
CN1315615C (zh) * 2000-09-27 2007-05-16 斯特拉斯保 用于设置弹性带的工具及相关方法
US7022546B2 (en) * 2000-12-05 2006-04-04 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
JP2002203827A (ja) * 2000-12-28 2002-07-19 Lintec Corp 半導体ウエハの裏面研削方法
JP4757398B2 (ja) * 2001-04-24 2011-08-24 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法
US6794751B2 (en) * 2001-06-29 2004-09-21 Intel Corporation Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
TWI250190B (en) * 2001-10-03 2006-03-01 Dow Corning Toray Silicone Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device
US6793759B2 (en) * 2001-10-09 2004-09-21 Dow Corning Corporation Method for creating adhesion during fabrication of electronic devices
TW578222B (en) * 2002-01-11 2004-03-01 Mitsui Chemicals Inc Semiconductor wafer surface protective adhesive tape and backside process method of semiconductor wafer using the same
TWI267168B (en) * 2002-01-15 2006-11-21 Sekisui Chemical Co Ltd Manufacturing method of IC chip
WO2003081653A1 (en) * 2002-03-27 2003-10-02 Mitsui Chemicals, Inc. Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
KR100629764B1 (ko) * 2002-10-25 2006-09-28 마쯔시다덴기산교 가부시키가이샤 반도체 디바이스 및 반도체 디바이스를 조립하기 위한수지 바인더
US7396869B2 (en) * 2002-12-04 2008-07-08 Denovus Llc Metallic acrylate curing agents and usage thereof in intermediate compositions
FR2848563B1 (fr) * 2002-12-16 2006-07-28 Rhodia Chimie Sa Composition silicone pour revetement dur, a base de silice colloidale, durcissable par voie cationique, antibuee et/ou antisalissures
JP2004300231A (ja) * 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP4171898B2 (ja) * 2003-04-25 2008-10-29 信越化学工業株式会社 ダイシング・ダイボンド用接着テープ
US20050016464A1 (en) * 2003-07-24 2005-01-27 General Electric Company Methods and fixtures for facilitating handling of thin films
CA2538268C (en) * 2003-09-10 2013-01-08 Sartomer Technology Co., Inc. Polybutadiene (meth)acrylate composition and method
US7064069B2 (en) * 2003-10-21 2006-06-20 Micron Technology, Inc. Substrate thinning including planarization
JP2005191550A (ja) * 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 基板の貼り付け方法
US7226812B2 (en) * 2004-03-31 2007-06-05 Intel Corporation Wafer support and release in wafer processing
JP5366291B2 (ja) * 2004-09-01 2013-12-11 アプヴィオン インコーポレイテッド カプセル化された硬化系
JP4613709B2 (ja) * 2005-06-24 2011-01-19 セイコーエプソン株式会社 半導体装置の製造方法
JP4799205B2 (ja) * 2006-02-16 2011-10-26 日東電工株式会社 活性面貼付ダイシング用粘着テープ又はシートおよび被加工物の切断片のピックアップ方法
JP4970863B2 (ja) * 2006-07-13 2012-07-11 日東電工株式会社 被加工物の加工方法
US20080014532A1 (en) * 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
DE102006044718A1 (de) * 2006-09-20 2008-04-03 Tesa Ag Klebemasse
JP2008166459A (ja) * 2006-12-28 2008-07-17 Tateyama Machine Kk 保護テープ貼付方法と装置
KR100922684B1 (ko) * 2007-08-31 2009-10-19 제일모직주식회사 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프
CN102015943A (zh) * 2008-03-07 2011-04-13 3M创新有限公司 具有图案化背衬的切割带和晶粒附连粘合剂

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CN110197812A (zh) * 2018-02-27 2019-09-03 株式会社迪思科 板状物的加工方法
CN110802509A (zh) * 2018-08-06 2020-02-18 株式会社迪思科 保护部件形成装置
CN110802509B (zh) * 2018-08-06 2023-07-21 株式会社迪思科 保护部件形成装置
CN113165136A (zh) * 2019-02-26 2021-07-23 株式会社迪思科 用于磨削背面的胶粘片及半导体晶片的制造方法
CN113165136B (zh) * 2019-02-26 2023-06-13 株式会社迪思科 用于磨削背面的胶粘片及半导体晶片的制造方法
CN113632207A (zh) * 2019-03-27 2021-11-09 三井化学东赛璐株式会社 粘贴装置
CN113953133A (zh) * 2020-07-20 2022-01-21 株式会社迪思科 片材、以及保护部件的形成方法

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