CN105711224B - 一种光分路器晶圆贴片系统 - Google Patents
一种光分路器晶圆贴片系统 Download PDFInfo
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- CN105711224B CN105711224B CN201610177889.XA CN201610177889A CN105711224B CN 105711224 B CN105711224 B CN 105711224B CN 201610177889 A CN201610177889 A CN 201610177889A CN 105711224 B CN105711224 B CN 105711224B
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- Prior art keywords
- vacuum suction
- suction seat
- wafer
- circular arc
- optical branching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610177889.XA CN105711224B (zh) | 2016-03-25 | 2016-03-25 | 一种光分路器晶圆贴片系统 |
Applications Claiming Priority (1)
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CN201610177889.XA CN105711224B (zh) | 2016-03-25 | 2016-03-25 | 一种光分路器晶圆贴片系统 |
Publications (2)
Publication Number | Publication Date |
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CN105711224A CN105711224A (zh) | 2016-06-29 |
CN105711224B true CN105711224B (zh) | 2017-11-24 |
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CN201610177889.XA Active CN105711224B (zh) | 2016-03-25 | 2016-03-25 | 一种光分路器晶圆贴片系统 |
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CN (1) | CN105711224B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010027897A1 (en) * | 2008-09-02 | 2010-03-11 | 3 M Innovative Properties Company | Method of manufacturing wafer laminated body, device of manufacturing wafer laminated body, wafer laminated body, method of peeling support body, and method of manufacturing wafer |
CN102809777A (zh) * | 2011-06-03 | 2012-12-05 | 住友化学株式会社 | 带保护膜的导光板的制造方法 |
CN104637854A (zh) * | 2013-11-13 | 2015-05-20 | 沈阳新松机器人自动化股份有限公司 | 一种用于吸附硅片的吸盘 |
CN205467772U (zh) * | 2016-03-25 | 2016-08-17 | 湖南新中合光电科技股份有限公司 | 一种光分路器晶圆贴片系统 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5636319B2 (ja) * | 2011-03-18 | 2014-12-03 | シチズンホールディングス株式会社 | 光モジュールの製造方法 |
CN102305978B (zh) * | 2011-08-31 | 2013-04-17 | 深圳市长江力伟股份有限公司 | 硅基液晶屏生产系统及其生产方法 |
CN103192581B (zh) * | 2013-01-23 | 2015-06-17 | 福建宝发光电科技集团有限公司 | 一种高精度贴合机 |
CN203376534U (zh) * | 2013-08-07 | 2014-01-01 | 深圳市长江力伟股份有限公司 | 一种硅基液晶屏贴合机构 |
-
2016
- 2016-03-25 CN CN201610177889.XA patent/CN105711224B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010027897A1 (en) * | 2008-09-02 | 2010-03-11 | 3 M Innovative Properties Company | Method of manufacturing wafer laminated body, device of manufacturing wafer laminated body, wafer laminated body, method of peeling support body, and method of manufacturing wafer |
CN102809777A (zh) * | 2011-06-03 | 2012-12-05 | 住友化学株式会社 | 带保护膜的导光板的制造方法 |
CN104637854A (zh) * | 2013-11-13 | 2015-05-20 | 沈阳新松机器人自动化股份有限公司 | 一种用于吸附硅片的吸盘 |
CN205467772U (zh) * | 2016-03-25 | 2016-08-17 | 湖南新中合光电科技股份有限公司 | 一种光分路器晶圆贴片系统 |
Also Published As
Publication number | Publication date |
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CN105711224A (zh) | 2016-06-29 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Fu Xiaodong Inventor after: Jie Shuiping Inventor after: Ma Zongyang Inventor after: Zhang Wei Inventor after: Yao Qiufei Inventor before: Chen Bo Inventor before: Li Shuncheng Inventor before: Tang Lin Inventor before: Yu Chaohuang |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180206 Address after: 226463 Rudong, Jiangsu province Hekou Town Industrial Park Patentee after: Zhongtian Broadband Technology Co., Ltd. Address before: 416500 Baojing County Hi-tech Industrial Park in Xiangxi Tujia and Miao Autonomous Prefecture, Hunan province (near the high speed intersection of Meihua Hua well village in the town of Qian Ling town) Patentee before: HUNAN NEWFIBER OPTICAL ELECTRONICS CO., LTD. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211215 Address after: 226463 Zhongtian Industrial Park, Hekou Town, Rudong, Nantong, Jiangsu Patentee after: ZHONGTIAN BROADBAND TECHNOLOGY Co.,Ltd. Patentee after: Zhongtian Communication Technology Co., Ltd Address before: 226463 Zhongtian Industrial Park, Hekou Town, Rudong, Nantong, Jiangsu Patentee before: ZHONGTIAN BROADBAND TECHNOLOGY Co.,Ltd. |