CN101978490A - 电子元器件组件及该电子元器件组件的制造方法 - Google Patents
电子元器件组件及该电子元器件组件的制造方法 Download PDFInfo
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Abstract
本发明提供一种可在树脂密封型的电子元器件组件中有效地利用电路基板的表面空间、并且可以实现小型化的电子元器件组件及该电子元器件组件的制造方法。电子元器件组件(11)包括:装载有表面安装元器件(2、3)的电路基板(1);埋设表面安装元器件(2、3)的树脂层(4);以及设置于树脂层(4)表面的导电体层(5),在表面安装元器件(3)上形成导电柱(6),表面安装元器件(3)的处于接地电位的外部电极(3b)与导电体层(5)通过导电柱(6)相连接,从而使导电体层(5)起到作为屏蔽层的功能。
Description
技术领域
本发明提供一种电子元器件组件及该电子元器件组件的制造方法,该电子元器件组件包括:装载有表面安装元器件的电路基板;覆盖表面安装元器件的树脂层;以及设置于树脂层表面的、起到作为屏蔽层等的功能的导电体层。
背景技术
作为用于移动通信设备等电子设备的电子元器件组件,随着市场对小型化、多功能化的要求越来越高,很多时候是以在由陶瓷、合成树脂等构成的电路基板上装载各种表面安装元器件的高频组件的方式使用的。
为了避免配置有这种高频组件的框体、母板等受到周边所配置的各种电气元件的电磁影响,或者为了防止其对各种电气元件造成电磁影响,有时采用以处于接地电位的屏蔽层覆盖电路基板上所装载的表面安装元器件的结构。
例如,专利文献1中,揭示了以下高频组件:在埋设了表面安装元器件的树脂层的表面设置具有屏蔽效果的导电膜,通过设置于电路基板上的具有导电性的销状接地端子,将电路基板与导电膜直接连接。另外,专利文献2中,揭示了以下高频组件:同样在埋设了表面安装元器件的树脂层的表面设置具有屏蔽效果的导电膜,通过设置于电路基板上的具有导电性的块状隔断构件,将电路基板与导电膜直接连接。
专利文献1:日本专利特开2000-223647号公报
专利文献2:日本专利特开2005-317935号公报
发明内容
然而,专利文献1和专利文献2所揭示的任一种组件中,由于都需要在电路基板上设置销状接地端子、块状隔断构件等,因此,电路基板上需要有用于设置接地端子、隔断构件等的空间,从而妨碍了电路基板的小型化,进而妨碍了电子元器件组件的小型化。
即,在具有包括装载有表面安装元器件的电路基板、覆盖表面安装元器件的树脂层、以及设置于树脂层表面的导电膜的结构的、所谓带导电膜的树脂密封型电子元器件组件中,采用用销状接地端子、块状隔断构件等导电性构件将电路基板与导电膜直接连接的结构,由于电路基板上需要有用于设置导电性构件的空间,因此,限制了电路基板的小型化。
本发明是鉴于上述情况而完成的,其目的在于提供一种能够有效地利用电路基板上的空间、并且能够将电路基板小型化的电子元器件组件及该电子元器件组件的制造方法。
为了达到上述目的,本发明提供一种电子元器件组件,包括至少装载有一个表面安装元器件的电路基板、覆盖所述表面安装元器件的树脂层、以及形成于该树脂层表面的导电体层,其特征在于,在所述表面安装元器件上至少形成有一个导电柱,所述表面安装元器件与所述导电体层通过所述导电柱进行导电连接。
本发明还提供一种电子元器件组件的制造方法,包括:准备至少装载有一个表面安装元器件的电路基板的工序;在所述表面安装元器件上形成预定高度的导电柱的工序;在所述电路基板上设置覆盖所述表面安装元器件的树脂层、并且使所述导电柱的一部分露出到所述树脂层表面的工序;以及在所述树脂层的表面形成与露出到所述树脂层表面的所述导电柱进行导电连接的导电体层的工序。
根据本发明的电子元器件组件,由于树脂层表面的导电体层通过装载于电路基板的表面安装元器件上所形成的导电柱,与表面安装元器件进行导电连接,因此,能够有效地利用电路基板上的空间,能够实现电路基板的小型化,进而能够实现电子元器件组件的小型化。
根据本发明的电子元器件组件的制造方法,由于能够以很好的重复性来制造电子元器件组件,特别是在装载于电路基板的表面安装元器件上形成导电柱后设置树脂层,因此,不需要预先在覆盖表面安装元器件的树脂层中形成用于形成导电柱的孔,从而能够高效地制造电子元器件组件。
附图说明
图1是表示本发明的实施例1所涉及的电子元器件组件的结构的剖视图。
图2是表示在树脂层的侧面也形成有导电体层时的本发明的实施例1所涉及的电子元器件组件的结构的剖视图。
图3是表示包含将电路基板与导电体层直接连接的导电柱时的本发明的实施例1所涉及的电子元器件组件的结构的剖视图。
图4是表示本发明的实施例1所涉及的电子元器件组件装载有表面安装元器件的状态的剖视图。
图5是表示本发明的实施例1所涉及的电子元器件组件形成了导电柱的状态的剖视图。
图6是表示本发明的实施例1所涉及的电子元器件组件形成了树脂层的状态的剖视图。
图7是表示本发明的实施例1所涉及的电子元器件组件将树脂层研磨成预定厚度的状态的剖视图。
图8是表示本发明的实施例1所涉及的电子元器件组件的导电柱的一部分露出到固化后的树脂层表面的状态的剖视图。
图9是表示本发明的实施例2所涉及的电子元器件组件的结构的剖视图。
图10是表示本发明的实施例3所涉及的电子元器件组件的结构的剖视图。
图11是表示本发明的实施例4所涉及的电子元器件组件的结构的剖视图。
图12是表示本发明的实施例5所涉及的电子元器件组件的结构的剖视图。
标号说明
1 电路基板
2、3 表面安装元器件
4 树脂层
5 导电体层
6 导电柱
7、8 电极焊盘
9 焊锡
11 电子元器件组件
具体实施方式
下面,基于具体例,对本发明进行说明。
<实施例1>
首先,参照图1,对实施例1的电子元器件组件的结构进行说明。图1是表示本发明的实施例1所涉及的电子元器件组件11的结构的剖视图。
如图1所示,本实施例1的电子元器件组件11包括:装载有表面安装元器件2、3、3的电路基板1;覆盖表面安装元器件2、3、3的树脂层4;以及形成于树脂层4表面的导电体层5。而且,在表面安装元器件3、3的上表面形成有导电柱6、6,表面安装元器件3与导电体层5通过导电柱6进行导电连接。
更具体而言,在电子元器件组件11中,在电路基板1上侧的面上设有多个电极焊盘8,表面安装元器件2、3、3通过焊锡9等导电性接合材料,分别与电路基板1的各电极焊盘8进行电连接。在电路基板1下侧的面上设有多个电极焊盘7,这多个电极焊盘7成为与母板(省略图示)等连接用的连接用电极。表面安装元器件2、3、3被树脂层4密封,从而使表面安装元器件2、3、3固定到电路基板1上,并且保护表面安装元器件2、3、3,使其不受外部环境的影响。
与导电柱6相连接的表面安装元器件3像通常的层叠型片状电容那样,具有外部电极3b,该外部电极3b与该长方体形状的元器件本体3a的端面、及与端面相邻的侧面的一部分相连续而形成,表面安装元器件3的外部电极3b在电路基板1一侧与电路基板1的电极焊盘8相连接,在相反侧与导电柱6相连接。即,本实施例1中,导电柱6形成在表面安装元器件3的外部电极3b上,导电体层5与表面安装元器件3的外部电极3b通过导电柱6进行电连接。
特别是本实施例1中,表面安装元器件3的外部电极3b处于接地电位,外部电极3b与导电体层5通过导电柱6进行电连接,从而使导电体层5起到作为屏蔽层的功能。此外,起到作为屏蔽层的功能的导电体层5最好设置于树脂层4的整个上表面,但也可以只形成在例如容易对其它电气元件带来电磁影响的表面安装元器件3、或容易受其它电气元件的电磁影响的表面安装元器件3的上侧部分。另外,导电体层5除了形成于树脂层4的上表面,也可以形成在电子元器件组件11的整个侧面,或者也可以形成在树脂层4的侧面。
图2是表示在树脂层4的侧面也形成有导电体层5时的本发明的实施例1所涉及的电子元器件组件11的结构的剖视图。如图2所示,导电体层5不仅形成于表面安装元器件3的上侧部分,还形成于树脂层4的侧面。
在树脂层4的侧面也要形成导电体层5时,是在形成了树脂层4的状态下,在要切取作为电子元器件组件11的边界部分,用刀片等形成具有预定深度的槽状的切口部。通过对切口部涂布具有流动性的导电材料,使其内部充满该导电材料,从而在所切取的电子元器件组件11的侧面形成导电体层5。
形成切口部的深度可以是到达电路基板1,也可以不到达电路基板1。在切口部的深度到达电路基板1的情况下,可以起到作为可靠性更高的屏蔽层的功能,在未到达电路基板1的情况下,只要在树脂层4中形成切口部即可,因此,能力图简化制造工艺。
表面安装元器件2是半导体裸芯片、半导体封装等芯片型有源元器件,表面安装元器件3是片状电容、片状电感、片状电阻等芯片型无源元器件。作为电路基板1,可以使用主要由陶瓷材料形成的陶瓷基板、由合成树脂材料形成的树脂基板等,在其表面和/或内部具有电容、电感等功能性元件或走线布线等预定的电路图案(省略图示)。作为树脂层4,最好使用热固化性树脂,为了控制其强度、介电常数、温度特性、粘性等,也可以使材料中包含陶瓷等填料成分。
另外,导电柱6可以像本实施例1那样形成多个。导电柱6至少形成于一个表面安装元器件2或3上即可,在一个电子元器件组件11具有多个导电柱6的情况下,除了将表面安装元器件2、3与导电体层5相连接的导电柱6之外,也可以包括将电路基板1与导电体层5直接连接的导电柱6。还可以根据强化屏蔽特性等的要求,在一个表面安装元器件2或3上形成多个导电柱6、6、……。
此外,导电柱6最好是通过堆叠具有流动性的导电材料后使之固化而形成,尤其最好是通过在预定温度下对所堆叠的导电材料进行烧成而得到的烧结金属。在导电柱6是烧结金属的情况下,由于导电柱6本身的强度很高,且对于树脂层4在固化时产生的热量不易变形,因此,能够将树脂层4形成时等情况下引起的导电柱6的破损抑制到最低限度。
另外,导电柱6最好具有从表面安装元器件2、3一侧向导电体层5一侧其截面积逐渐减小的锥形。由此,通过具有截面积随着接近导电体层5而逐渐变小的形状、即前端部侧变细的锥形,从而在形成树脂层4的情况下,尤其是在层叠树脂片时,不会损坏导电柱6,能够在电路基板1上均匀且平坦地形成树脂层4。
此外,关于导电柱6的高度,即从表面安装元器件2、3到导电体层5的长度最好是30~300μm,以确保导电柱6的强度、可靠性等,在导电柱6的截面为圆形的情况下,其直径最好是20~100μm,以应对表面安装元器件2、3的小型化。
图3是表示包含将电路基板1与导电体层5直接进行导电连接的导电柱6时的本发明的实施例1所涉及的电子元器件组件11的结构的剖视图。如图3所示,导电柱6不仅在表面安装元器件2和3的上侧部分将其与导电体层5进行导电连接,而且还将电路基板1与导电体层5直接进行导电连接。
导电柱6是通过在表面安装元器件3的外部电极3b和电路基板1上堆叠具有流动性的导电材料并使之固化,从而形成预定的高度。作为具有流动性的导电材料,使用例如将导电性粉末分散到溶剂中而形成的导电性溶液。基于喷墨法、喷涂法等,从喷嘴的喷射口多次喷出导电性溶液,从而使导电性粉末堆叠、堆积、固化。由此,能够容易地形成多种高度的导电柱6。
此外,在基于喷墨法、喷涂法等形成导电柱6的情况下,通过使导电性溶液中包含的溶剂每隔一定高度挥发,从而可以使导电柱6从底部开始逐步稳定。因而,即使是在导电柱6的高度较高的情况下,也能确保其强度、可靠性等。
由此,由于树脂层4表面的导电体层5通过位于表面安装元器件3上且形成于树脂层4中的导电柱6,与表面安装元器件3进行电连接,因此,能够有效地利用电路基板1表面的空间,能够实现电子元器件组件11的小型化、高密度化。
接下来,参照图4~图8,对实施例1的电子元器件组件11的制造方法进行说明。图4是表示本发明的实施例1所涉及的电子元器件组件11装载有表面安装元器件2、3、3的状态的剖视图。
首先,如图4所示,准备装载表面安装元器件2、3、3的电路基板1。在图4~图8的例子中,使用陶瓷多层基板作为电路基板1。
首先,将预定量的有机粘合剂、有机溶剂等与低温烧结陶瓷材料混合,来调制陶瓷浆料。接着,利用刮刀法等在PET等底膜上涂布陶瓷浆料,并与底膜一起切断成预定的大小,来制作陶瓷生片。然后,用激光器等在陶瓷生片中形成层间连接导体用孔之后,在所形成的层间连接导体用孔中填充将预定量的有机粘合剂、溶剂等与低熔点金属混合而形成的导电性糊料,从而在陶瓷生片的预定部位形成层间连接导体。
通过丝网印刷等印刷同样的将有机粘合剂、溶剂等与低熔点金属混合而形成的导电性糊料,在陶瓷生片上形成面内布线导体,成为预定的电路图案。由此,通过堆叠预定片数的形成了具有预定电路图案的层间连接导体、面内布线导体等的陶瓷生片,来制作未烧成陶瓷层叠体。接着,在预定的温度下对未烧成陶瓷层叠体进行烧成,从而得到在电路基板1上侧的面和下侧的面上有电极焊盘的陶瓷多层基板。之后,根据需要,在表面的电极焊盘等上形成镀膜。
接着,通过丝网印刷等向陶瓷多层基板上侧的面的电极焊盘提供焊锡9,进而在装载了表面安装元器件2、3、3之后,投入回流炉,从而使焊锡9熔化并固化,而将表面安装元器件2、3、3固定到陶瓷多层基板(电路基板)1上侧的面上。然后,根据需要,进行去除焊剂等的清洗处理,从而可以得到由装载了各种表面安装元器件2、3、3的陶瓷多层基板所形成的电路基板1。
作为低温烧结陶瓷材料,可以列举出氧化铝、镁橄榄石、堇青石等的陶瓷粉末;将硼硅酸盐等玻璃与氧化铝、镁橄榄石、堇青石等的陶瓷粉末混合而形成的玻璃复合类材料;使用ZnO-MgO-Al2O3-SiO2类等的结晶化玻璃的结晶化玻璃类材料;以及BaO-Al2O3-SiO2类陶瓷粉末、或Al2O3-Cao-SiO2-MgO-B2O3类陶瓷粉末等的非玻璃类材料。通过使用低温烧结陶瓷材料,可以使用Ag、Cu等低电阻、低熔点的金属作为层间连接导体、面内布线导体等,其结果是,可以在例如1050℃以下的低温下对以Ag、Cu等为主要成分的导体图案和未烧成陶瓷层叠体同时进行烧成。
图5是表示本发明的实施例1所涉及的电子元器件组件11形成了导电柱6的状态的剖视图。如图5所示,在装载于电路基板1上侧的面上的表面安装元器件3上,形成预定高度的导电柱6。更具体而言,通过在表面安装元器件3的外部电极3b上堆叠具有流动性的导电材料16并使之固化,从而形成预定高度的导电柱6。例如,作为具有流动性的导电材料16,使用将导电性粉末分散到溶剂中而形成的导电性溶液,基于喷墨法、喷涂法等,从喷嘴15的喷射口多次喷出上述导电性溶液,从而使导电性粉末堆叠、堆积并固化,由此可以形成预定高度的导电柱6。此外,导电柱6除了通过使用导电性溶液的喷墨法、喷涂法等来形成以外,也可以通过丝网印刷等方法,在预定部位多次反复涂布重叠像导电性糊料那样具有流动性的导电材料16,并使之固化来形成。
图6是表示本发明的实施例1所涉及的电子元器件组件11形成了树脂层4a的状态的剖视图。如图6所示,在电路基板1上设置处于未固化状态的树脂层4a,以覆盖导电柱6及表面安装元器件2、3、3。更详细而言,首先,在形成了预定高度的导电柱6的电路基板1上,通过层叠处于软化状态的树脂片、使液态树脂连续自动地成形、被覆同样的液态树脂等,从而形成处于未固化状态的树脂层4a。这里,最好是在预定温度下加热从而使液态树脂等的粘度降低来提高流动性的状态下,形成树脂层4a。此外,图6中的树脂层4a的厚度H2最好是大于导电柱6的高度H1(即,导电柱6本身的高度加上表面安装元器件3的高度后得到的高度)。
图7是表示本发明的实施例1所涉及的电子元器件组件11将树脂层4a研磨掉预定厚度的状态的剖视图。如图7所示,通过使研磨辊18沿图中箭头方向移动等,将树脂层4a研磨掉预定的厚度,从而可以使树脂层4a的表面变平坦,并且能可靠地使导电柱6的一部分露出到树脂层4a的表面。
此外,如上所述,导电柱6最好是通过在预定温度下对导电材料进行烧成而得到的烧结金属。在导电柱6是烧结金属的情况下,由于导电柱6本身的强度很高,且对于后述的树脂层4a在固化时产生的热量不易变形,因此,能够将破损抑制到最低限度。另外,导电柱6最好具有从表面安装元器件3一侧向导电体层5一侧其截面积逐渐减小的锥形。由此,通过具有截面积随着接近导电体层5而逐渐变小的形状、即前端部侧变细的锥形,从而在形成树脂层4a的情况下,尤其是在层叠树脂片时,不会损坏导电柱6,能够在电路基板1上均匀且平坦地设置树脂层4a。
然后,使处于未固化状态的树脂层4a固化。图8是表示本发明的实施例1所涉及的电子元器件组件11的导电柱6的一部分露出到固化后的树脂层4表面的状态的剖视图。如图8所示,变成导电柱6的一部分露出到固化后的树脂层4表面的状态,并且是导电柱6由树脂层4进行支承、固定的状态。然后,通过丝网印刷、喷涂、涂布机涂布、旋涂等方法,在树脂层4的表面涂布具有流动性的导电材料并使之固化,从而可以形成与导电柱6的露出部分进行电连接的导电体层5(参照图1)。此外,导电体层5可以通过使具有流动性的导电材料固化而形成,也可以通过粘结金属箔来形成。
根据这种电子元器件组件11的制造方法,特别是由于在装载于电路基板1的表面安装元器件2、3、3上形成导电柱6之后,用树脂层4对其进行覆盖,因此,不需要在形成树脂层4之后形成用于形成导电柱6的孔,从而能够避免表面安装元器件2、3、3因激光加工等而受损伤,能够高效地制造可靠性高的电子元器件组件。另外,在形成树脂层4之后形成用于形成导电柱6的孔的情况下,由于用于这种用途的树脂一般是黑色的,因此难以对准孔的位置,但通过在表面安装元器件2、3、3上形成了导电柱6之后形成树脂层4,也能够避免这一问题。
以上,对单个电子元器件组件11说明了电子元器件组件11的制造工序,对于将多个电路基板(子基板)排列成格子状而形成的集合基板(母基板),也能适用同样的工序。
在这种情况下,按照与上述步骤相同的步骤制造陶瓷多层基板的集合基板,在集合基板的分割线上形成分割用的槽之后,按照与上述步骤相同的步骤装载表面安装元器件2、3、3,进而形成导电柱6。按照与上述步骤相同的步骤,形成树脂层4以使导电柱6的一部分露出到该树脂层4的表面之后,在树脂层4中也沿着分割线形成分割用的槽。通过在树脂层4的表面涂布具有流动性的导电材料并使之固化,可以形成与导电柱6的露出部分进行电连接的导电体层5。即,通过控制树脂层4中形成的分割用的槽的深度,可以控制在树脂层4的侧面也形成的导电体层5的宽度。此外,若在树脂层4中形成分割用的槽之前形成导电体层5,则可以仅在树脂层4的上表面形成导电体层5。
由此,关于作为多个电路基板1、1、……的集合体的集合基板,也同样除了在表面安装元器件2、3、3上形成导电柱6以外,不需要附加特别的工序,从而可以制作可实现小型化、高密度化的电子元器件组件11。
接下来,对本发明的其它具体例进行说明。
<实施例2>
图9是表示本发明的实施例2所涉及的电子元器件组件21的结构的剖视图。图9所示的电子元器件组件21包括:装载有表面安装元器件2、3、3的电路基板22;覆盖表面安装元器件2、3、3的树脂层4;以及形成于树脂层4表面的、起到作为天线的功能的导电体层24。而且,在表面安装元器件3上形成有导电柱23,表面安装元器件3与导电体层24通过导电柱23进行导电连接。
更具体而言,表面安装元器件3的外部电极3b与上述实施例1相同,在电路基板22一侧与电路基板22的电极焊盘8相连接,并且在相反侧与导电柱23相连接。即,导电柱23形成在表面安装元器件3的外部电极3b上,导电体层24与表面安装元器件3的外部电极3b通过导电柱6进行电连接。
而且,表面安装元器件3的外部电极3b是与导电体层24相连接的馈电电极,外部电极3b与导电体层24通过导电柱23进行电连接,从而使导电体层24起到作为天线的功能。
<实施例3>
图10是表示本发明的实施例3所涉及的电子元器件组件31的结构的剖视图。图10所示的电子元器件组件31是以两面安装型的电路基板32作为核心基板,该两面安装型的电路基板32在电路基板1上侧的面上装载有表面安装元器件2、3、3,在电路基板1下侧的面上装载有表面安装元器件3、3,并且在电路基板1上侧的面上形成有覆盖表面安装元器件2、3、3的树脂层33,在电路基板1下侧的面上形成有覆盖表面安装元器件3、3、……的树脂层34。在装载于电路基板1上侧的面上的表面安装元器件3上,形成有与上述实施例1相同的导电柱6,表面安装元器件3与导电体层5通过导电柱6相连接。而且,装载于电路基板1下侧的面上的表面安装元器件3的外部电极3b与上述实施例1相同,在电路基板32一侧与电路基板32的电极焊盘8相连接,并且在相反侧与导电柱35相连接。即,导电柱35形成在表面安装元器件3的外部电极3b上,导电体层36与表面安装元器件3的外部电极3b通过导电柱35进行电连接。
而且,装载于电路基板1下侧的面上的表面安装元器件3的外部电极3b是与母板(省略图示)相连接的输入输出端子,外部电极3b与导电体层36通过导电柱35进行电连接,从而使导电体层36起到作为与母板相连接的连接电极的功能。起到作为连接电极的功能的导电体层36在树脂层34的表面排列作为LGA端子。
<实施例4>
图11是表示本发明的实施例4所涉及的电子元器件组件41的结构的剖视图。图11所示的电子元器件组件41包括:装载有表面安装元器件2、3、3的电路基板42;覆盖表面安装元器件2、3、3的树脂层43;以及设置于树脂层43表面的导电体层45。而且,在表面安装元器件2上形成有导电柱44,表面安装元器件2的本体与导电体层45通过导电柱44相连接。
此处,表面安装元器件2是半导体裸芯片、半导体封装等有源元器件,例如是功率放大器之类的具有发热性的表面安装元器件。表面安装元器件2与导电体层45通过导电柱44进行电连接,从而使导电体层45起到作为散热用电极的功能。
此外,在表面安装元器件2的与电路基板42相连接的连接面相反的面上具有处于接地电位的表面电极的情况下,将表面电极与导电体层45通过导电柱44进行电连接,也可以使导电体层45起到作为屏蔽层的功能。
<实施例5>
图12是表示本发明的实施例5所涉及的电子元器件组件51的结构的剖视图。图12所示的电子元器件组件51包括:装载有表面安装元器件3、3、表面安装元器件52的电路基板53;覆盖表面安装元器件3、3、52的树脂层54;以及形成于树脂层54的上表面的导电体层55。而且,在表面安装元器件52上形成有导电柱56,表面安装元器件52与导电体层55通过导电柱56进行电连接。
更具体而言,表面安装元器件52具有以下结构:在基板57上装载有各种表面安装元器件(未图示),基板57上的表面安装元器件被处于接地电位的金属壳58覆盖,表面安装元器件52的金属壳58与导电体层55通过导电柱56进行电连接。因而,导电体层55也处于接地电位,从而起到作为屏蔽层的功能。
此外,本发明并不限于上述实施例1~实施例5,当然只要是在本发明的要点范围内,能够进行种种变形、置换等。
Claims (13)
1.一种电子元器件组件,包括:
至少装载有一个表面安装元器件的电路基板;
覆盖所述表面安装元器件的树脂层;以及
形成于该树脂层表面的导电体层,
其特征在于,
在所述表面安装元器件上至少形成有一个导电柱,所述表面安装元器件与所述导电体层通过所述导电柱进行导电连接。
2.如权利要求1所述的电子元器件组件,其特征在于,
所述导电柱具有从所述表面安装元器件一侧向所述导电体层一侧其截面积逐渐减小的锥形。
3.如权利要求1或2所述的电子元器件组件,其特征在于,
所述导电柱通过堆叠预定厚度的具有流动性的导电材料后使之固化而形成。
4.如权利要求1至3的任一项所述的电子元器件组件,其特征在于,
所述表面安装元器件是在与所述电路基板侧相反一侧的表面也具有外部电极的表面安装元器件,所述导电柱形成为与所述外部电极进行导电连接。
5.如权利要求4所述的电子元器件组件,其特征在于,
处于接地电位的所述外部电极与所述导电体层通过所述导电柱进行导电连接。
6.如权利要求4所述的电子元器件组件,其特征在于,
所述外部电极是与天线相连接的馈电电极,所述外部电极与所述导电体层通过所述导电柱进行导电连接。
7.如权利要求4所述的电子元器件组件,其特征在于,
所述外部电极是与母板相连接的输入输出端子,所述外部电极与所述导电体层通过所述导电柱进行导电连接。
8.如权利要求1至3的任一项所述的电子元器件组件,其特征在于,
所述表面安装元器件是具有发热性的表面安装元器件,所述表面安装元器件与所述导电体层通过所述导电柱进行导电连接。
9.一种电子元器件组件的制造方法,其特征在于,包括:
准备至少装载有一个表面安装元器件的电路基板的工序;
在所述表面安装元器件上形成预定高度的导电柱的工序;
在所述电路基板上设置覆盖所述表面安装元器件的树脂层、并且使所述导电柱的一部分露出到所述树脂层表面的工序;以及
在所述树脂层的表面形成与露出到所述树脂层表面的所述导电柱进行导电连接的导电体层的工序。
10.如权利要求9所述的电子元器件组件的制造方法,其特征在于,
形成所述导电柱,使其具有从所述表面安装元器件一侧向所述导电体层一侧其截面积逐渐减小的锥形。
11.如权利要求9或10所述的电子元器件组件的制造方法,其特征在于,
通过堆叠预定厚度的具有流动性的导电材料后使之固化,形成所述导电柱。
12.如权利要求11所述的电子元器件组件的制造方法,其特征在于,
使用导电性溶液作为所述具有流动性的导电材料,从喷射口多次喷出所述导电性溶液而堆叠。
13.如权利要求9至12所述的电子元器件组件的制造方法,其特征在于,
设置所述树脂层,以覆盖所述导电柱,并研磨所述树脂层,直到所述导电柱的一部分露出到所述树脂层的表面为止。
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US20110013349A1 (en) | 2011-01-20 |
WO2009122835A1 (ja) | 2009-10-08 |
US8315060B2 (en) | 2012-11-20 |
JP5195903B2 (ja) | 2013-05-15 |
JPWO2009122835A1 (ja) | 2011-07-28 |
CN101978490B (zh) | 2012-10-17 |
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