CN101354511B - 液晶显示装置及电子设备 - Google Patents

液晶显示装置及电子设备 Download PDF

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Publication number
CN101354511B
CN101354511B CN2008101301369A CN200810130136A CN101354511B CN 101354511 B CN101354511 B CN 101354511B CN 2008101301369 A CN2008101301369 A CN 2008101301369A CN 200810130136 A CN200810130136 A CN 200810130136A CN 101354511 B CN101354511 B CN 101354511B
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liquid crystal
transistor
substrate
semiconductor layer
layer
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Expired - Fee Related
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Chinese (zh)
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CN101354511A (zh
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黑川义元
池田隆之
长多刚
井上卓之
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136227Through-hole connection of the pixel electrode to the active element through an insulation layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6732Bottom-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6746Amorphous silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/133707Structures for producing distorted electric fields, e.g. bumps, protrusions, recesses, slits in pixel electrodes
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/40Arrangements for improving the aperture ratio
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739Conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN2008101301369A 2007-07-27 2008-07-25 液晶显示装置及电子设备 Expired - Fee Related CN101354511B (zh)

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JP2007196489 2007-07-27
JP2007-196489 2007-07-27
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CN101354511B true CN101354511B (zh) 2013-01-02

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US (1) US8330887B2 (OSRAM)
JP (11) JP2009055008A (OSRAM)
KR (1) KR101568121B1 (OSRAM)
CN (1) CN101354511B (OSRAM)
TW (1) TWI470330B (OSRAM)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009071289A (ja) 2007-08-17 2009-04-02 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US8101444B2 (en) 2007-08-17 2012-01-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
TWI521712B (zh) * 2007-12-03 2016-02-11 半導體能源研究所股份有限公司 薄膜電晶體,包括該薄膜電晶體的顯示裝置,和其製造方法
JP5376826B2 (ja) * 2008-04-04 2013-12-25 富士フイルム株式会社 半導体装置,半導体装置の製造方法及び表示装置
CN101866082B (zh) * 2009-04-15 2012-05-23 瀚宇彩晶股份有限公司 液晶显示器的像素结构及其形成方法
KR102012160B1 (ko) 2009-05-02 2019-08-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 패널
EP2478563B1 (en) * 2009-09-16 2021-04-07 Semiconductor Energy Laboratory Co, Ltd. Method for manufacturing a samesemiconductor device
KR20170130641A (ko) 2009-10-21 2017-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정 표시 장치 및 그 액정 표시 장치를 구비하는 전자기기
JP5601821B2 (ja) * 2009-11-11 2014-10-08 三菱電機株式会社 薄膜トランジスタおよびその製造方法
US8879010B2 (en) 2010-01-24 2014-11-04 Semiconductor Energy Laboratory Co., Ltd. Display device
KR101805378B1 (ko) 2010-01-24 2017-12-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치와 이의 제조 방법
KR102070537B1 (ko) 2010-02-18 2020-01-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 장치
KR101084273B1 (ko) * 2010-03-03 2011-11-16 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
JP2011253921A (ja) * 2010-06-02 2011-12-15 Mitsubishi Electric Corp アクティブマトリックス基板及び液晶装置
KR101932576B1 (ko) 2010-09-13 2018-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
JP5564473B2 (ja) * 2011-08-05 2014-07-30 株式会社ジャパンディスプレイ 液晶表示装置
JP6199583B2 (ja) 2012-04-27 2017-09-20 株式会社半導体エネルギー研究所 半導体装置
US8860022B2 (en) 2012-04-27 2014-10-14 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US8907385B2 (en) * 2012-12-27 2014-12-09 Taiwan Semiconductor Manufacturing Company, Ltd. Surface treatment for BSI image sensors
CN103760721A (zh) * 2014-01-08 2014-04-30 北京京东方光电科技有限公司 薄膜晶体管阵列基板及其制备方法、显示装置
CN103969875B (zh) * 2014-05-04 2016-06-29 京东方科技集团股份有限公司 显示基板及其制作方法、掩膜板、掩膜板组
WO2015181679A1 (en) * 2014-05-27 2015-12-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN104091810A (zh) * 2014-06-30 2014-10-08 京东方科技集团股份有限公司 阵列基板及其制作方法、显示装置
CN104241345B (zh) 2014-07-31 2017-11-28 京东方科技集团股份有限公司 铝电极、形成铝电极的方法及其电子设备
JP6393937B2 (ja) * 2014-09-05 2018-09-26 Dic株式会社 薄膜トランジスタの製造方法、薄膜トランジスタ及びトランジスタアレイ
TWI608599B (zh) * 2016-03-02 2017-12-11 Innolux Corp 顯示面板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1873933A (zh) * 2005-06-02 2006-12-06 株式会社半导体能源研究所 半导体器件及其制造方法

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122123A (en) * 1980-03-03 1981-09-25 Shunpei Yamazaki Semiamorphous semiconductor
US5091334A (en) * 1980-03-03 1992-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JPS6098680A (ja) 1983-11-04 1985-06-01 Seiko Instr & Electronics Ltd 電界効果型薄膜トランジスタ
JPS6187371A (ja) 1984-10-05 1986-05-02 Hitachi Ltd 薄膜半導体装置
JPS61138285A (ja) * 1984-12-10 1986-06-25 ホシデン株式会社 液晶表示素子
US5084777A (en) * 1989-11-14 1992-01-28 Greyhawk Systems, Inc. Light addressed liquid crystal light valve incorporating electrically insulating light blocking material of a-SiGe:H
JPH03278480A (ja) * 1990-03-27 1991-12-10 Canon Inc 薄膜半導体装置
JPH0480722A (ja) * 1990-07-23 1992-03-13 Hitachi Ltd アクテイブマトリックス液晶表示装置
EP0473988A1 (en) 1990-08-29 1992-03-11 International Business Machines Corporation Method of fabricating a thin film transistor having amorphous/polycrystalline semiconductor channel region
JP2791422B2 (ja) 1990-12-25 1998-08-27 株式会社 半導体エネルギー研究所 電気光学装置およびその作製方法
US5849601A (en) * 1990-12-25 1998-12-15 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
US7115902B1 (en) * 1990-11-20 2006-10-03 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
US7098479B1 (en) * 1990-12-25 2006-08-29 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
US7576360B2 (en) * 1990-12-25 2009-08-18 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device which comprises thin film transistors and method for manufacturing the same
EP0499979A3 (en) * 1991-02-16 1993-06-09 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
JP3255942B2 (ja) * 1991-06-19 2002-02-12 株式会社半導体エネルギー研究所 逆スタガ薄膜トランジスタの作製方法
TW222345B (en) * 1992-02-25 1994-04-11 Semicondustor Energy Res Co Ltd Semiconductor and its manufacturing method
JPH06326314A (ja) * 1993-05-12 1994-11-25 Hitachi Ltd 薄膜トランジスタおよびその製造方法
JPH07142405A (ja) * 1993-11-19 1995-06-02 Sanyo Electric Co Ltd 多結晶半導体膜およびその成膜方法
JPH0888397A (ja) * 1994-09-16 1996-04-02 Casio Comput Co Ltd 光電変換素子
JPH08201853A (ja) * 1994-11-24 1996-08-09 Toshiba Electron Eng Corp 電極基板および平面表示装置
TW303526B (OSRAM) * 1994-12-27 1997-04-21 Matsushita Electric Industrial Co Ltd
JP2661594B2 (ja) * 1995-05-25 1997-10-08 日本電気株式会社 薄膜トランジスタおよびその製造方法
JPH0982978A (ja) * 1995-09-20 1997-03-28 Hitachi Ltd 半導体装置及びこれを用いた液晶表示装置
JP2762968B2 (ja) * 1995-09-28 1998-06-11 日本電気株式会社 電界効果型薄膜トランジスタの製造方法
KR100386203B1 (ko) * 1996-02-29 2003-12-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 전기광학장치및그제조방법
JP3904646B2 (ja) 1996-02-29 2007-04-11 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JPH112836A (ja) * 1997-06-10 1999-01-06 Hitachi Ltd アクティブマトリクス液晶表示装置
KR100257158B1 (ko) 1997-06-30 2000-05-15 김영환 박막 트랜지스터 및 그의 제조 방법
KR100477130B1 (ko) * 1997-09-25 2005-08-29 삼성전자주식회사 평면구동방식액정표시장치의박막트랜지스터기판및제조방법
EP1037093A1 (en) 1997-11-28 2000-09-20 Matsushita Electric Industrial Co., Ltd. Reflection-type display device and image device using reflection-type display device
US6486933B1 (en) * 1998-03-12 2002-11-26 Samsung Electronics Co., Ltd. Liquid crystal display with preventing vertical cross-talk having overlapping data lines
DE19836269C1 (de) * 1998-08-11 1999-08-26 Abg Allg Baumaschinen Gmbh Straßenfertiger
EP1083590A4 (en) * 1999-03-05 2002-09-18 Seiko Epson Corp PROCESS FOR PRODUCING A SEMICONDUCTOR AND THIN FILM DEVICE
JP2001077366A (ja) * 1999-08-20 2001-03-23 Internatl Business Mach Corp <Ibm> 薄膜トランジスタ、液晶表示装置、及び薄膜トランジスタの製造方法
JP2001092379A (ja) * 1999-09-27 2001-04-06 Nec Corp アクティブマトリックス基板及びその製造方法
JP3819651B2 (ja) * 1999-10-20 2006-09-13 株式会社日立製作所 アクティブ・マトリクス型液晶表示装置
JP3538088B2 (ja) 1999-10-25 2004-06-14 Nec液晶テクノロジー株式会社 薄膜トランジスタおよびその製造方法
KR100493869B1 (ko) * 1999-12-16 2005-06-10 엘지.필립스 엘시디 주식회사 횡전계 방식의 액정표시장치 및 그 제조방법
JP3687452B2 (ja) * 1999-12-27 2005-08-24 株式会社日立製作所 液晶表示装置
JP2001318627A (ja) * 2000-02-29 2001-11-16 Semiconductor Energy Lab Co Ltd 発光装置
JP2001311963A (ja) * 2000-04-27 2001-11-09 Toshiba Corp 液晶表示装置および液晶表示装置の製造方法
KR100709704B1 (ko) * 2000-05-12 2007-04-19 삼성전자주식회사 액정 표시 장치용 박막 트랜지스터 기판 및 그 제조 방법
JP2001343669A (ja) * 2000-06-02 2001-12-14 Hitachi Ltd 液晶表示装置
JP4290349B2 (ja) * 2000-06-12 2009-07-01 セイコーエプソン株式会社 半導体装置の製造方法
US6879110B2 (en) * 2000-07-27 2005-04-12 Semiconductor Energy Laboratory Co., Ltd. Method of driving display device
JP3554977B2 (ja) * 2000-09-27 2004-08-18 松下電器産業株式会社 液晶表示装置
JP3914753B2 (ja) * 2000-11-30 2007-05-16 Nec液晶テクノロジー株式会社 アクティブマトリクス型液晶表示装置およびスイッチング素子
JP2002246605A (ja) 2001-02-20 2002-08-30 Matsushita Electric Ind Co Ltd 液晶表示用薄膜トランジスタの製造方法
TW541584B (en) * 2001-06-01 2003-07-11 Semiconductor Energy Lab Semiconductor film, semiconductor device and method for manufacturing same
JP5072157B2 (ja) * 2001-09-27 2012-11-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2003243668A (ja) * 2001-12-12 2003-08-29 Seiko Epson Corp 電気光学装置、液晶装置ならびに投射型表示装置
JP4004835B2 (ja) * 2002-04-02 2007-11-07 株式会社アドバンスト・ディスプレイ 薄膜トランジスタアレイ基板の製造方法
KR100872494B1 (ko) * 2002-12-31 2008-12-05 엘지디스플레이 주식회사 액정 표시 장치용 어레이 기판의 제조 방법
TW577176B (en) * 2003-03-31 2004-02-21 Ind Tech Res Inst Structure of thin-film transistor, and the manufacturing method thereof
TW586237B (en) * 2003-05-09 2004-05-01 Au Optronics Corp Structure of a low temperature polysilicon thin film transistor
KR101085150B1 (ko) * 2003-06-28 2011-11-18 엘지디스플레이 주식회사 횡전계 방식의 액정표시장치 및 그의 제조방법
TWI399580B (zh) * 2003-07-14 2013-06-21 半導體能源研究所股份有限公司 半導體裝置及顯示裝置
JP4748954B2 (ja) 2003-07-14 2011-08-17 株式会社半導体エネルギー研究所 液晶表示装置
TWI336921B (en) * 2003-07-18 2011-02-01 Semiconductor Energy Lab Method for manufacturing semiconductor device
JP4554292B2 (ja) * 2003-07-18 2010-09-29 株式会社半導体エネルギー研究所 薄膜トランジスタの作製方法
JP4507540B2 (ja) * 2003-09-12 2010-07-21 カシオ計算機株式会社 薄膜トランジスタ
CN1886770B (zh) * 2003-11-28 2011-02-09 日本瑞翁株式会社 薄膜晶体管集成电路装置、有源矩阵显示装置及其制造方法
JP2005167051A (ja) 2003-12-04 2005-06-23 Sony Corp 薄膜トランジスタおよび薄膜トランジスタの製造方法
KR101004508B1 (ko) * 2003-12-23 2010-12-31 엘지디스플레이 주식회사 횡전계방식 액정 표시 장치용 어레이 기판 및 그 제조 방법
KR100982122B1 (ko) * 2003-12-30 2010-09-14 엘지디스플레이 주식회사 수평 전계 인가형 박막 트랜지스터 기판의 불량 화소암점화 방법
JP2005286320A (ja) * 2004-03-04 2005-10-13 Semiconductor Energy Lab Co Ltd パターン形成方法、薄膜トランジスタ、表示装置及びそれらの作製方法、並びにテレビジョン装置
TWI255399B (en) * 2004-06-18 2006-05-21 Integrated Circuit Solution In Input buffer circuit for transforming TTL into CMOS and for reducing the consumed powe
TWI252587B (en) * 2004-12-14 2006-04-01 Quanta Display Inc Method for manufacturing a pixel electrode contact of a thin-film transistors liquid crystal display
KR20060124998A (ko) * 2005-06-01 2006-12-06 엘지.필립스 엘시디 주식회사 횡전계 방식 액정표시장치
JP4577114B2 (ja) 2005-06-23 2010-11-10 ソニー株式会社 薄膜トランジスタの製造方法および表示装置の製造方法
KR101137840B1 (ko) * 2005-06-23 2012-04-20 엘지디스플레이 주식회사 횡전계방식 액정표시소자
KR101147118B1 (ko) * 2005-06-30 2012-05-25 엘지디스플레이 주식회사 미세 패턴 형성 방법과 그를 이용한 액정 표시 장치의 제조 방법
JP2007035964A (ja) 2005-07-27 2007-02-08 Sony Corp 薄膜トランジスタとその製造方法、及び表示装置
KR101157954B1 (ko) * 2005-09-28 2012-06-22 엘지디스플레이 주식회사 액정 표시 장치 및 이의 제조 방법
US8212953B2 (en) * 2005-12-26 2012-07-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR101180718B1 (ko) * 2005-12-29 2012-09-07 엘지디스플레이 주식회사 횡전계형 액정표시장치용 어레이 기판 및 그 제조 방법
KR101184068B1 (ko) * 2005-12-30 2012-09-19 엘지디스플레이 주식회사 액정 표시 장치용 어레이 기판 및 그의 제조 방법
US8629490B2 (en) * 2006-03-31 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Nonvolatile semiconductor storage device with floating gate electrode and control gate electrode
TWI299213B (en) * 2006-05-05 2008-07-21 Prime View Int Co Ltd Muti-channel thin film transistor
US8974918B2 (en) * 2006-07-04 2015-03-10 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
TWI311337B (en) * 2006-10-02 2009-06-21 Au Optronics Corporatio Multi-domain vertical alignment pixel structure and fabrication method thereof
US8022466B2 (en) * 2006-10-27 2011-09-20 Macronix International Co., Ltd. Non-volatile memory cells having a polysilicon-containing, multi-layer insulating structure, memory arrays including the same and methods of operating the same
JP4420032B2 (ja) * 2007-01-31 2010-02-24 ソニー株式会社 薄膜半導体装置の製造方法
JP5364293B2 (ja) * 2007-06-01 2013-12-11 株式会社半導体エネルギー研究所 表示装置の作製方法およびプラズマcvd装置
JP5331389B2 (ja) * 2007-06-15 2013-10-30 株式会社半導体エネルギー研究所 表示装置の作製方法
US8921858B2 (en) 2007-06-29 2014-12-30 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US9176353B2 (en) * 2007-06-29 2015-11-03 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
US8334537B2 (en) * 2007-07-06 2012-12-18 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US7998800B2 (en) * 2007-07-06 2011-08-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7738050B2 (en) * 2007-07-06 2010-06-15 Semiconductor Energy Laboratory Co., Ltd Liquid crystal display device
JP2009049384A (ja) * 2007-07-20 2009-03-05 Semiconductor Energy Lab Co Ltd 発光装置
TWI456663B (zh) * 2007-07-20 2014-10-11 Semiconductor Energy Lab 顯示裝置之製造方法
TWI464510B (zh) * 2007-07-20 2014-12-11 Semiconductor Energy Lab 液晶顯示裝置
US7897971B2 (en) * 2007-07-26 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Display device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1873933A (zh) * 2005-06-02 2006-12-06 株式会社半导体能源研究所 半导体器件及其制造方法

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