CN101246938A - 用于固态发光器件的基于导线架的包装件以及形成该包装件的方法 - Google Patents

用于固态发光器件的基于导线架的包装件以及形成该包装件的方法 Download PDF

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Publication number
CN101246938A
CN101246938A CNA2008100038323A CN200810003832A CN101246938A CN 101246938 A CN101246938 A CN 101246938A CN A2008100038323 A CNA2008100038323 A CN A2008100038323A CN 200810003832 A CN200810003832 A CN 200810003832A CN 101246938 A CN101246938 A CN 101246938A
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region
lead frame
package
reflective cup
package body
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CNA2008100038323A
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Chinese (zh)
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骆万保
N·W·小梅登多普
E·塔萨
B·凯勒
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Wolfspeed Inc
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Cree Research Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
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    • H01L2224/49171—Fan-out arrangements
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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CNA2008100038323A 2007-01-24 2008-01-24 用于固态发光器件的基于导线架的包装件以及形成该包装件的方法 Pending CN101246938A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/657,347 US8044418B2 (en) 2006-07-13 2007-01-24 Leadframe-based packages for solid state light emitting devices
US11/657347 2007-01-24

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CN101246938A true CN101246938A (zh) 2008-08-20

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US (2) US8044418B2 (enExample)
JP (2) JP5215678B2 (enExample)
CN (1) CN101246938A (enExample)
DE (1) DE102008004443A1 (enExample)

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CN102185084A (zh) * 2011-04-26 2011-09-14 深圳市天电光电科技有限公司 Led封装支架及其单体、led封装结构
CN102257646A (zh) * 2008-12-19 2011-11-23 三星Led株式会社 发光器件封装、背光单元、显示器件和发光器件
CN102318091A (zh) * 2009-03-10 2012-01-11 株式会社纳沛斯Led Led引线框封装、使用led引线框封装的led封装及制造led封装的方法
CN102738373A (zh) * 2011-04-11 2012-10-17 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
WO2013075309A1 (en) * 2011-11-24 2013-05-30 Cree Huizhou Solid State Lighting Company Limited Water resistant led devices and led display including the same
CN103311402A (zh) * 2012-03-16 2013-09-18 日月光半导体制造股份有限公司 发光二极管封装以及承载板
CN103367619A (zh) * 2012-03-30 2013-10-23 光宝电子(广州)有限公司 金属支架结构及发光二极管结构
CN105679728A (zh) * 2014-12-03 2016-06-15 瑞萨电子株式会社 半导体装置
CN107808867A (zh) * 2016-09-09 2018-03-16 德克萨斯仪器股份有限公司 用于半导体装置封装的可点焊引线

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JP5043554B2 (ja) * 2007-08-07 2012-10-10 スタンレー電気株式会社 半導体発光装置
KR101365621B1 (ko) 2007-09-04 2014-02-24 서울반도체 주식회사 열 방출 슬러그들을 갖는 발광 다이오드 패키지
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JP2009278012A (ja) * 2008-05-16 2009-11-26 Meio Kasei:Kk Ｌｅｄ装置用パッケージ
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JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
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KR100888236B1 (ko) * 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
US20100127288A1 (en) * 2008-11-25 2010-05-27 Visera Technologies Company Limited Light-emitting diode devices and methods for fabricating the same
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DE102009032253B4 (de) 2009-07-08 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil
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CN102024882A (zh) * 2009-09-14 2011-04-20 展晶科技(深圳)有限公司 发光二极管装置及其制造方法
TWI408310B (zh) * 2009-09-29 2013-09-11 Liang Meng Plastic Share Co Ltd 照明裝置及其製造方法
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