CN102751426B - 封装结构及发光二极管封装结构 - Google Patents
封装结构及发光二极管封装结构 Download PDFInfo
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- CN102751426B CN102751426B CN201210268781.3A CN201210268781A CN102751426B CN 102751426 B CN102751426 B CN 102751426B CN 201210268781 A CN201210268781 A CN 201210268781A CN 102751426 B CN102751426 B CN 102751426B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210268781.3A CN102751426B (zh) | 2010-01-20 | 2010-01-20 | 封装结构及发光二极管封装结构 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010100007892A CN102130266B (zh) | 2010-01-20 | 2010-01-20 | 封装结构及发光二极管封装结构 |
CN201210268781.3A CN102751426B (zh) | 2010-01-20 | 2010-01-20 | 封装结构及发光二极管封装结构 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010100007892A Division CN102130266B (zh) | 2010-01-20 | 2010-01-20 | 封装结构及发光二极管封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102751426A CN102751426A (zh) | 2012-10-24 |
CN102751426B true CN102751426B (zh) | 2015-08-12 |
Family
ID=43798492
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210268781.3A Active CN102751426B (zh) | 2010-01-20 | 2010-01-20 | 封装结构及发光二极管封装结构 |
CN2010100007892A Active CN102130266B (zh) | 2010-01-20 | 2010-01-20 | 封装结构及发光二极管封装结构 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010100007892A Active CN102130266B (zh) | 2010-01-20 | 2010-01-20 | 封装结构及发光二极管封装结构 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8729681B2 (zh) |
EP (1) | EP2348550B1 (zh) |
KR (1) | KR101206059B1 (zh) |
CN (2) | CN102751426B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM400099U (en) * | 2010-09-27 | 2011-03-11 | Silitek Electronic Guangzhou | Lead frame, package structure and lighting device thereof |
CN102683552A (zh) * | 2012-05-04 | 2012-09-19 | 佛山市蓝箭电子有限公司 | 一种具有防水功能的表面贴装led及其支架 |
US8884413B2 (en) * | 2012-08-31 | 2014-11-11 | Freescale Semiconductor, Inc. | Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture |
CN104282823A (zh) * | 2013-07-12 | 2015-01-14 | 光宝科技股份有限公司 | 发光二极管封装结构 |
US9515241B2 (en) * | 2013-07-12 | 2016-12-06 | Lite-On Opto Technology (Changzhou) Co., Ltd. | LED structure, metallic frame of LED structure, and carrier module |
CN104282821B (zh) * | 2013-07-12 | 2017-03-29 | 光宝光电(常州)有限公司 | 发光二极管结构、发光二极管结构金属支架及承载座模块 |
CN104955319B (zh) * | 2014-03-27 | 2017-12-22 | 特富特科技(深圳)有限公司 | 一种电磁器件安装装置 |
WO2015144006A1 (zh) * | 2014-03-27 | 2015-10-01 | 特富特科技(深圳)有限公司 | 电磁器件安装装置 |
TWI553264B (zh) * | 2014-05-23 | 2016-10-11 | 億光電子工業股份有限公司 | 承載支架及其製造方法以及從該承載支架所製得之發光裝置及其製造方法 |
CN104505452A (zh) * | 2014-11-14 | 2015-04-08 | 浙江英特来光电科技有限公司 | 一种回流焊式led灯丝 |
CN108933185B (zh) * | 2017-05-26 | 2021-01-05 | 黄国益 | 支撑结构、使用其的发光装置以及其加工方法 |
Citations (3)
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CN101127350A (zh) * | 2006-08-16 | 2008-02-20 | 华刚光电零件有限公司 | 用于安装电子元件的装置、系统和方法 |
CN101420007A (zh) * | 2008-10-23 | 2009-04-29 | 旭丽电子(广州)有限公司 | 一种led晶片的封装结构和封装方法 |
CN101626050A (zh) * | 2008-07-07 | 2010-01-13 | 光宝科技股份有限公司 | 发光二极管封装装置、散热基座与电极支架组合及其方法 |
Family Cites Families (20)
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US4862246A (en) * | 1984-09-26 | 1989-08-29 | Hitachi, Ltd. | Semiconductor device lead frame with etched through holes |
JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
US6794738B2 (en) * | 2002-09-23 | 2004-09-21 | Texas Instruments Incorporated | Leadframe-to-plastic lock for IC package |
US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
JP4645071B2 (ja) * | 2003-06-20 | 2011-03-09 | 日亜化学工業株式会社 | パッケージ成型体およびそれを用いた半導体装置 |
TWI257693B (en) * | 2003-08-25 | 2006-07-01 | Advanced Semiconductor Eng | Leadless package |
US7759775B2 (en) * | 2004-07-20 | 2010-07-20 | Alpha And Omega Semiconductor Incorporated | High current semiconductor power device SOIC package |
TWI237408B (en) * | 2004-09-03 | 2005-08-01 | Lustrous Technology Ltd | Light emitting diode (LED) packaging |
JP2006179760A (ja) * | 2004-12-24 | 2006-07-06 | Yamaha Corp | 半導体パッケージ、および、これに使用するリードフレーム |
US8669572B2 (en) * | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
JP4830768B2 (ja) * | 2006-05-10 | 2011-12-07 | 日亜化学工業株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
TWM303325U (en) * | 2006-07-13 | 2006-12-21 | Everlight Electronics Co Ltd | Light emitting diode package |
US8044418B2 (en) * | 2006-07-13 | 2011-10-25 | Cree, Inc. | Leadframe-based packages for solid state light emitting devices |
TW200834968A (en) * | 2007-02-13 | 2008-08-16 | Harvatek Corp | Method of making light-emitting diode structure with high heat dissipation effect and structure made thereby |
US20080246397A1 (en) * | 2007-04-04 | 2008-10-09 | Bily Wang | Manufacturing method of white light led and structure thereof |
US7622795B2 (en) * | 2007-05-15 | 2009-11-24 | Nichepac Technology Inc. | Light emitting diode package |
KR100867568B1 (ko) | 2007-05-18 | 2008-11-10 | 서울반도체 주식회사 | 방열형 led 패키지 |
TWI352439B (en) * | 2007-09-21 | 2011-11-11 | Lite On Technology Corp | Light emitting diode packaging device, heat-dissip |
JP2009094282A (ja) * | 2007-10-09 | 2009-04-30 | Cosmo Electronics Corp | ハイパワー発光ダイオード構造 |
JP2010062365A (ja) * | 2008-09-04 | 2010-03-18 | Hitachi Ltd | 半導体装置およびその製造方法 |
-
2010
- 2010-01-20 CN CN201210268781.3A patent/CN102751426B/zh active Active
- 2010-01-20 CN CN2010100007892A patent/CN102130266B/zh active Active
- 2010-09-24 US US12/889,875 patent/US8729681B2/en active Active
- 2010-10-19 KR KR1020100101981A patent/KR101206059B1/ko active IP Right Grant
- 2010-10-20 EP EP10188196.9A patent/EP2348550B1/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101127350A (zh) * | 2006-08-16 | 2008-02-20 | 华刚光电零件有限公司 | 用于安装电子元件的装置、系统和方法 |
CN101626050A (zh) * | 2008-07-07 | 2010-01-13 | 光宝科技股份有限公司 | 发光二极管封装装置、散热基座与电极支架组合及其方法 |
CN101420007A (zh) * | 2008-10-23 | 2009-04-29 | 旭丽电子(广州)有限公司 | 一种led晶片的封装结构和封装方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2348550B1 (en) | 2015-09-09 |
CN102751426A (zh) | 2012-10-24 |
US20110175134A1 (en) | 2011-07-21 |
EP2348550A3 (en) | 2011-10-26 |
KR20110085854A (ko) | 2011-07-27 |
KR101206059B1 (ko) | 2012-12-03 |
CN102130266B (zh) | 2013-08-28 |
EP2348550A2 (en) | 2011-07-27 |
US8729681B2 (en) | 2014-05-20 |
CN102130266A (zh) | 2011-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Applicant after: Lite-On Electronic (Guangzhou) Co., Ltd. Applicant after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Applicant before: Xuli Electronics (Guangzhou) Co., Ltd. Applicant before: Lite-On Technology Corporation |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. TO: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170406 Address after: Wujin, Changzhou province high tech Industrial Development Zone, 88 Yang Lake Road, No. Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Patentee before: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |
|
TR01 | Transfer of patent right |