WO2015144006A1 - 电磁器件安装装置 - Google Patents

电磁器件安装装置 Download PDF

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Publication number
WO2015144006A1
WO2015144006A1 PCT/CN2015/074479 CN2015074479W WO2015144006A1 WO 2015144006 A1 WO2015144006 A1 WO 2015144006A1 CN 2015074479 W CN2015074479 W CN 2015074479W WO 2015144006 A1 WO2015144006 A1 WO 2015144006A1
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WIPO (PCT)
Prior art keywords
electromagnetic device
mounting
platform
semi
package housing
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PCT/CN2015/074479
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English (en)
French (fr)
Inventor
李晖
Original Assignee
特富特科技(深圳)有限公司
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Publication date
Priority claimed from CN201420145323.5U external-priority patent/CN203934278U/zh
Priority claimed from CN201410121212.5A external-priority patent/CN104955319B/zh
Application filed by 特富特科技(深圳)有限公司 filed Critical 特富特科技(深圳)有限公司
Publication of WO2015144006A1 publication Critical patent/WO2015144006A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present disclosure relates to the field of electromagnetic device application design, and in particular to an electromagnetic device mounting device.
  • IP54 IP54 type of protection level in the industry
  • the application of IP54 type of protection level in the industry is to prevent dust accumulation and waterproofing to protect the internal electromagnetic device from damage.
  • IP54 protection class due to the space being sealed and the internal environment temperature is high, the electromagnetic device is difficult to dissipate heat and the cost is high.
  • the user typically places the package housing on the exposed surface of an isolated blade or other type of heat sink, transferring heat from the housing to the heat sink through the thermal grease, and dissipating heat from the heat sink.
  • the entire device requires two parts: a package housing and a heat sink. It also needs to dissipate silicone grease to ensure thermal conduction between the two parts. This not only increases the cost, but also reduces the thermal conductivity.
  • the technical problem to be solved by the present disclosure is to provide an electromagnetic device mounting device, which avoids encapsulating all electromagnetic devices and placing them in a working environment with an IP54 or higher protection level, simplifies the structure, facilitates installation, has good heat dissipation performance, and reduces materials and processing. cost.
  • an electromagnetic device mounting apparatus including:
  • a semi-package housing for mounting an electromagnetic device on the platform
  • a contact surface of the platform and the semi-package housing, and a contact surface of the semi-package housing and the platform each have a plurality of outlet holes.
  • a non-packaged side of the semi-package housing is provided with a fixing plate; and at least one mounting hole for mounting an electromagnetic device is formed between the fixing plate and a bottom surface of the semi-package housing.
  • a plurality of first curved grooves are disposed on a bottom surface of the semi-package housing, and the fixing
  • the plate has a second arcuate recess, wherein the first arcuate recess and the second arcuate recess form the mounting aperture.
  • each of the mounting holes has a plurality of the outlet holes in a region corresponding to the platform and the semi-package housing.
  • the mounting hole is a circular mounting hole.
  • the platform is provided with a sealing groove conforming to the shape of the bottom surface of the semi-package housing, and the semi-package housing is disposed in the sealing groove.
  • the platform further has a first fixing hole.
  • the unpackaged side of the semi-packaged housing has a second fixing hole, and the fixing plate is fixedly connected to the semi-package housing through the second fixing hole.
  • the platform, the semi-package housing and the fixing plate are all made of an aluminum alloy material.
  • the electromagnetic device is semi-packaged in the mounting hole by a thermally conductive epoxy glue or a thermally conductive silicone or polyurethane potting compound.
  • the first fixing hole is a bolt fixing hole.
  • the second fixing hole is a bolt fixing hole.
  • the electromagnetic device mounting device of the embodiment of the present disclosure includes a platform and a semi-package housing disposed on the platform, wherein the contact surface of the platform and the semi-package housing, and the contact surface of the semi-package housing and the platform have a plurality of Outlet holes.
  • the electromagnetic device can be mounted in the half-package housing while the outgoing portion of the electromagnetic device is led out through the outlet hole.
  • the electromagnetic device Under the requirement that the outlet part meets the protection level of IP54 or above, the electromagnetic device can be placed in the heat dissipation air passage space without the protection level of IP54 or above, avoiding the use of heat-dissipating materials such as thermal grease and heat sink, simplifying the structure and making the installation Convenient and greatly reduces material and processing costs.
  • FIG. 1 is a first schematic structural view of an electromagnetic device mounting device of the present disclosure
  • FIG. 2 is a second schematic structural view of an electromagnetic device mounting device of the present disclosure
  • Figure 3 is a plan front elevational view of the electromagnetic device mounting device of the present disclosure
  • Figure 4 is a plan left side view of the electromagnetic device mounting device of the present disclosure.
  • Figure 5 is a top plan view of the electromagnetic device mounting device of the present disclosure.
  • Figure 6 is a schematic view showing the installation of the electromagnetic device mounting device of the present disclosure.
  • Figure 7 is a front elevational view showing the mounting plane of the electromagnetic device mounting device of the present disclosure.
  • Figure 8 is a plan view showing the mounting plane of the electromagnetic device mounting device of the present disclosure.
  • Figure 9 is a left side elevational view of the mounting plane of the electromagnetic device mounting apparatus of the present disclosure.
  • the electromagnetic device mounting device of the embodiment of the present disclosure avoids that the electromagnetic device is completely potted and placed in a working environment with a protection level above IP54, which simplifies the structure, facilitates installation, has good heat dissipation performance, and reduces material and processing costs.
  • the electromagnetic device mounting apparatus of the embodiment of the present disclosure includes: a platform 1; a semi-package housing 2 for mounting an electromagnetic device disposed on the platform 1; A contact surface of the half package case 2 and a contact surface of the half package case 2 and the platform 1 each have a plurality of outlet holes 5.
  • the electromagnetic device may be mounted in the half package housing 2 while the outgoing portion of the electromagnetic device is taken out through the outlet hole 5.
  • the electromagnetic device can be placed in the heat dissipation air passage space without the protection level of IP54 or above, which can avoid the use of heat-dissipating materials such as thermal grease and heat sink, simplifying the structure and making Easy to install and greatly reduce material and processing costs.
  • the unpackaged side of the half-package housing 2 is provided with a fixing plate 3; at least between the fixing plate 3 and the bottom surface of the semi-package housing 2 is formed with an electromagnetic device for mounting A mounting hole.
  • the electromagnetic device can be installed in the mounting hole formed between the fixed plate 3 and the half-package case 2, and fixed by the fixing plate 3, which simplifies the structure, facilitates installation, and reduces the cost of materials and processing. .
  • the electromagnetic device can be semi-packaged in the mounting hole by a thermal conductive epoxy glue or a thermal conductive silicone or a polyurethane potting glue to ensure good thermal conductivity.
  • a plurality of first curved recesses 21 are disposed on a bottom surface of the semi-package housing 2,
  • the fixing plate 3 has a second arcuate groove 31, wherein the first arcuate groove 21 and the second arcuate groove 31 form the mounting hole.
  • the mounting holes formed by the first curved groove 21 and the second curved groove 31 can stably store the electromagnetic device, which simplifies the structure and facilitates the installation.
  • each of the mounting holes has a plurality of the outlet holes 5 in a region corresponding to the platform 1 and the half package housing 2.
  • the electromagnetic device stored in the mounting hole can lead out the outlet portion through the outlet hole 5 of the corresponding area of the platform 1 and the semi-package housing 2, so that the outlet portion works under the protection level of IP54 or higher, and the electromagnetic device can It is placed in the cooling air duct space without the protection level of IP54 or above, so that the heat dissipation performance is good.
  • the mounting hole may be a circular mounting hole.
  • the electromagnetic device can be placed in a circular mounting hole to increase the stability.
  • the platform 1 is provided with a sealing groove 4 conforming to the shape of the bottom surface of the semi-package housing 2, and the semi-package housing 2 is disposed in the sealing groove 4.
  • the outlet portion can be tightly closed when placed in a sealed space, so that the outlet portion satisfies the protection level of IP54 or higher.
  • the platform 1 further has a first fixing hole 11 .
  • the electromagnetic device mounting device of the present disclosure can be fixed in the application environment of the device through the first fixing hole 11 of the platform 1, which can simplify the structure, facilitate the installation, and increase the utility of the device.
  • the unpackaged side of the half-package housing 2 has a second fixing hole 22, and the fixing plate 3 is fixedly connected to the half-package housing 2 through the second fixing hole 22.
  • the fixing plate 3 can be fixedly connected to the semi-package case 2 through the second fixing hole 22, which can simplify the structure and facilitate the disassembly, thereby increasing the utility of the device.
  • first fixing hole 11 and the second fixing hole 22 may each be a bolt fixing hole.
  • the fixing of the device can be realized by bolts, which facilitates disassembly and increases the practicability of the device.
  • the platform 1, the semi-package housing 2 and the fixing plate 3 may be made of an aluminum alloy material.
  • the electromagnetic device mounting apparatus of the embodiment of the present disclosure includes a platform 1 and a semi-package case 2 mounted on the platform 1.
  • the unpackaged side of the half-package case 2 is provided with a fixing plate 3. .
  • Three circular mounting holes for mounting the electromagnetic device are formed between the fixed plate 3 and the bottom surface of the half-package case 2.
  • the bottom surface of the semi-package housing 2 is provided with three first arcuate recesses 21, and the fixing plate has three second arcuate recesses 31, and the first arcuate recesses 21 and the second arcuate recesses 31
  • a mounting hole is formed.
  • Each of the mounting holes has two outlet holes 5 in a region corresponding to the platform 1 and the half package housing 2, respectively.
  • the electromagnetic device can be mounted in the half package case 2 while the outgoing portion of the electromagnetic device is taken out through the outlet hole 5. Under the requirement that the outlet part meets the protection level of IP54 or above, the electromagnetic device can be placed in the heat dissipation air passage space without the protection level of IP54 or above, avoiding the use of heat-dissipating materials such as thermal grease and heat sink, which can simplify the structure. It makes installation easy and greatly reduces the cost of materials and processing.
  • the platform 1 is provided with a sealing groove 4, and by installing a sealing ring in the sealing groove 4, the sealing portion can be more tightly closed when placed in a closed space.
  • the platform 1 further has four first fixing holes 11 .
  • the unpacking side of the half-package housing 2 has two second fixing holes 22 , and the fixing plate 3 is fixedly connected to the half-package housing 2 through the second fixing holes 22 .
  • the first fixing hole 11 and the second fixing hole 22 may both be bolt fixing holes, so that the disassembly is convenient and the utility of the device is increased.
  • FIGS. 6-9 are schematic diagrams showing the installation of an electromagnetic device mounting device according to an embodiment of the present disclosure.
  • the platform 1 is fixedly connected to a sealing device through four bolt fixing holes.
  • the electromagnetic device is mounted in a mounting hole formed by the fixed plate 3 and the half-package case 2, and the outgoing portion of the electromagnetic device is introduced into the sealing device through the outlet hole 5.
  • the electromagnetic device can be placed in the heat dissipation air passage space without the protection level of IP54 or above, and the use of heat-dissipating materials such as thermal grease and heat sink can be avoided.
  • the structure is simplified, the installation is convenient, and the cost of materials and processing is greatly reduced.
  • the electromagnetic device mounting device of the embodiment of the present disclosure avoids that the electromagnetic device is completely potted and placed in a working environment with a protection level above IP54, which simplifies the structure, facilitates installation, has good heat dissipation performance, and reduces the cost of materials and processing.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本公开提供了一种电磁器件安装装置，该电磁器件安装装置包括：一平台；设置于所述平台上的用于安装电磁器件的半封装壳体；所述平台与所述半封装壳体的接触面上，以及所述半封装壳体与所述平台的接触面上均具有多个出线孔。

Description

电磁器件安装装置
相关申请的交叉引用
本申请主张在2014年3月27日在中国提交的中国专利申请号No.201410121212.5和201420145323.5的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及电磁器件应用设计领域，特别涉及一种电磁器件安装装置。
背景技术
一般电磁器件出线部分需要工作在IP54以上的防护等级下，IP54类防护等级在工业中的应用为防止粉尘堆积和防水来保护内部电磁器件不受损害。电磁器件在IP54防护等级工作时，由于空间密闭，内部环境温度较高，电磁器件散热比较困难，成本较高。使用者通常将封装壳体放置在一个被隔离的叶片或其他类型散热器的外露表面，通过散热硅脂将壳体的热传到散热片上，再由散热片将热量散出。在这样的情况下，整个装置需要两个零件：封装壳体和散热器来组成。而且还要散热硅脂来保障两个零件之间的导热。这样不但增加了成本，而且还降低了导热效果。
发明内容
本公开要解决的技术问题是提供一种电磁器件安装装置，避免将电磁器件全部灌封起来放于IP54以上防护等级的工作环境，简化结构，使安装方便，散热性能好，且降低材料和加工成本。
为解决上述技术问题，本公开的实施例提供一种电磁器件安装装置，包括：
一平台；
设置于所述平台上的用于安装电磁器件的半封装壳体；
所述平台与所述半封装壳体的接触面上，以及所述半封装壳体与所述平台的接触面上均具有多个出线孔。
可选地，所述半封装壳体的未封装一面设置有固定板；所述固定板与所述半封装壳体的底面之间形成有用于安装电磁器件的至少一个安装孔。
可选地，所述半封装壳体的底面上设置有多个第一弧形凹槽，所述固定 板具有第二弧形凹槽，其中所述第一弧形凹槽与所述第二弧形凹槽形成所述安装孔。
可选地，每个所述安装孔在所述平台以及所述半封装壳体对应的区域具有多个所述出线孔。
可选地，所述安装孔为圆形安装孔。
可选地，所述平台上设置有一与所述半封装壳体的底面形状一致的密封凹槽，所述半封装壳体设置于所述密封凹槽中。
可选地，所述平台还具有第一固定孔。
可选地，所述半封装壳体的未封装一面上具有第二固定孔，所述固定板通过所述第二固定孔与所述半封装壳体固定连接。
可选地，所述平台、所述半封装壳体及所述固定板均采用铝合金材料制成。
可选地，电磁器件通过导热环氧树脂胶或导热硅胶或聚氨酯灌封胶半封装于安装孔中。
可选地，所述第一固定孔为螺栓固定孔。
可选地，所述第二固定孔为螺栓固定孔。
本公开的上述技术方案的有益效果如下：
本公开实施例的电磁器件安装装置，包括一平台及设置于平台上的半封装壳体，其中平台与半封装壳体的接触面上，以及半封装壳体与平台的接触面上均具有多个出线孔。可以将电磁器件安装于半封装壳体中，同时将电磁器件的出线部分通过出线孔引出。在出线部分满足IP54以上防护等级的要求下，电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，避免了使用导热硅脂和散热片等散热材料，简化了结构，使安装方便，且大大降低了材料和加工成本。
附图说明
图1为本公开电磁器件安装装置的第一结构示意图；
图2为本公开电磁器件安装装置的第二结构示意图；
图3为本公开电磁器件安装装置的平面主视图；
图4为本公开电磁器件安装装置的平面左视图；
图5为本公开电磁器件安装装置的平面俯视图；
图6为本公开电磁器件安装装置的安装示意图；
图7为本公开电磁器件安装装置的安装平面主视图；
图8为本公开电磁器件安装装置的安装平面俯视图；
图9为本公开电磁器件安装装置的安装平面左视图。
具体实施方式
为使本公开要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
本公开实施例的电磁器件安装装置，避免了将电磁器件全部灌封起来放于IP54以上防护等级的工作环境，简化了结构，使安装方便，散热性能好，且降低了材料和加工成本。
如图1-5所示，本公开实施例的电磁器件安装装置，包括：一平台1；设置于所述平台1上的用于安装电磁器件的半封装壳体2；所述平台1与所述半封装壳体2的接触面上，以及所述半封装壳体2与所述平台1的接触面上均具有多个出线孔5。
在本公开一实施例中，可以将电磁器件安装于半封装壳体2中，同时将电磁器件的出线部分通过出线孔5引出。在出线部分满足IP54以上防护等级的要求下，电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，这样可以避免使用导热硅脂和散热片等散热材料，简化了结构，使安装方便，且大大降低了材料和加工成本。
本公开的具体实施例中，所述半封装壳体2的未封装一面设置有固定板3；所述固定板3与所述半封装壳体2的底面之间形成有用于安装电磁器件的至少一个安装孔。
此时，电磁器件可安装于固定板3与半封装壳体2之间形成的安装孔中，并通过固定板3进行固定，这样可以简化结构，使安装方便，且降低了材料和加工的成本。
可选地，电磁器件可通过导热环氧树脂胶或导热硅胶、聚氨酯灌封胶等半封装于安装孔中，从而保证良好的导热性。
可选地，所述半封装壳体2的底面上设置有多个第一弧形凹槽21，所述 固定板3具有第二弧形凹槽31，其中所述第一弧形凹槽21与所述第二弧形凹槽31形成所述安装孔。
此时，第一弧形凹槽21和第二弧形凹槽31形成的安装孔能够稳固存放电磁器件，这样可以简化结构简单，且使安装方便。
可选地，每个所述安装孔在所述平台1以及所述半封装壳体2对应的区域具有多个所述出线孔5。
此时，存放于安装孔中的电磁器件能通过平台1及半封装壳体2对应区域的出线孔5将出线部分引出，从而使出线部分工作在IP54以上防护等级的要求下，而电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，使散热性能良好。
可选地，所述安装孔可以为圆形安装孔。
此时，电磁器件可贴合放置于圆形安装孔中，增加了稳固性。
本公开的具体实施例中，所述平台1上设置有一与所述半封装壳体2的底面形状一致的密封凹槽4，所述半封装壳体2设置于所述密封凹槽4中。
此时，通过在密封凹槽4中安装密封圈，可使出线部分放置于一密闭空间时封闭的更加严密，从而使出线部分满足IP54以上防护等级的要求。
可选地，所述平台1还具有第一固定孔11。
此时，可通过平台1的第一固定孔11将本公开的电磁器件安装装置固定于该装置的应用环境中，这样可以简化结构，使安装方便，且增加了装置的实用性。
可选地，所述半封装壳体2的未封装一面上具有第二固定孔22，所述固定板3通过所述第二固定孔22与所述半封装壳体2固定连接。
此时，固定板3可通过第二固定孔22与半封装壳体2固定连接，这样可以简化结构，且使拆卸方便，增加了装置的实用性。
可选地，所述第一固定孔11及第二固定孔22均可为螺栓固定孔。
此时，可通过螺栓实现装置的固定，使拆卸方便，增加了装置的实用性。
可选地，所述平台1、所述半封装壳体2及所述固定板3均可采用铝合金材料制成。
下面对本公开的具体实施例举例说明如下。
如图1-5所示，本公开实施例的电磁器件安装装置包括一平台1，及安装于平台1上的半封装壳体2，且半封装壳体2的未封装一面设置有固定板3。固定板3与半封装壳体2的底面之间形成有用于安装电磁器件的3个圆形安装孔。其中，半封装壳体2的底面上设置有3个第一弧形凹槽21，固定板具有3个第二弧形凹槽31，第一弧形凹槽21与第二弧形凹槽31形成了安装孔。且每个安装孔在平台1以及半封装壳体2对应的区域分别具有2个出线孔5。可以将电磁器件安装于半封装壳体2中，同时将电磁器件的出线部分通过出线孔5引出。在出线部分满足IP54以上防护等级的要求下，使电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，避免了使用导热硅脂和散热片等散热材料，这样可以简化结构，使安装方便，且大大降低了材料和加工的成本。
其中，平台1上设置有密封凹槽4，通过在密封凹槽4中安装密封圈，可使当出线部分放置于一密闭空间时封闭的更加严密。且平台1还具有4个第一固定孔11，半封装壳体2的未封装一面上具有2个第二固定孔22，固定板3通过第二固定孔22与半封装壳体2固定连接。第一固定孔11和第二固定孔22可均为螺栓固定孔，以使拆卸方便，增加装置的实用性。
如图6-9所示，为本公开实施例的电磁器件安装装置的安装示意图。其中平台1通过4个螺栓固定孔与一密封装置固定连接。电磁器件安装于固定板3与半封装壳体2形成的安装孔中，同时电磁器件的出线部分通过出线孔5引入到密封装置中。此时，在出线部分满足IP54以上防护等级的要求下，使电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，避免了使用导热硅脂和散热片等散热材料，这样可以简化结构，使安装方便，且大大降低了材料和加工的成本。
本公开实施例的电磁器件安装装置，避免了将电磁器件全部灌封起来放于IP54以上防护等级的工作环境，简化了结构，使安装方便，散热性能好，且降低了材料和加工的成本。
以上所述是本公开的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (12)

  1. 一种电磁器件安装装置，包括：
    一平台；
    设置于所述平台上的用于安装电磁器件的半封装壳体；
    所述平台与所述半封装壳体的接触面上，以及所述半封装壳体与所述平台的接触面上均具有多个出线孔。
  2. 根据权利要求1所述的电磁器件安装装置，其中，所述半封装壳体的未封装一面设置有固定板；所述固定板与所述半封装壳体的底面之间形成有用于安装电磁器件的至少一个安装孔。
  3. 根据权利要求2所述的电磁器件安装装置，其中，所述半封装壳体的底面上设置有多个第一弧形凹槽，所述固定板具有第二弧形凹槽，其中所述第一弧形凹槽与所述第二弧形凹槽形成所述安装孔。
  4. 根据权利要求3所述的电磁器件安装装置，其中，每个所述安装孔在所述平台以及所述半封装壳体对应的区域具有多个所述出线孔。
  5. 根据权利要求2所述的电磁器件安装装置，其中，所述安装孔为圆形安装孔。
  6. 根据权利要求1所述的电磁器件安装装置，其中，所述平台上设置有一与所述半封装壳体的底面形状一致的密封凹槽，所述半封装壳体设置于所述密封凹槽中。
  7. 根据权利要求1所述的电磁器件安装装置，其中，所述平台还具有第一固定孔。
  8. 根据权利要求1所述的电磁器件安装装置，其中，所述半封装壳体的未封装一面上具有第二固定孔，所述固定板通过所述第二固定孔与所述半封装壳体固定连接。
  9. 根据权利要求2所述的电磁器件安装装置，其中，所述平台、所述半封装壳体及所述固定板均采用铝合金材料制成。
  10. 根据权利要求2所述的电磁器件安装装置，其中，电磁器件通过导热环氧树脂胶或导热硅胶或聚氨酯灌封胶半封装于安装孔中。
  11. 根据权利要求7所述的电磁器件安装装置，其中，所述第一固定孔为螺栓固定孔。
  12. 根据权利要求8所述的电磁器件安装装置，其中，所述第二固定孔为螺栓固定孔。
PCT/CN2015/074479 2014-03-27 2015-03-18 电磁器件安装装置 WO2015144006A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2519585Y (zh) * 2001-11-03 2002-10-30 富士康(昆山)电脑接插件有限公司 光电传接模组
CN201360387Y (zh) * 2009-01-24 2009-12-09 长沙高新开发区超弦电子科技发展有限公司 一种机车监控显示设备
CN102130266A (zh) * 2010-01-20 2011-07-20 旭丽电子(广州)有限公司 封装结构及发光二极管封装结构
CN203934278U (zh) * 2014-03-27 2014-11-05 特富特科技(深圳)有限公司 一种电磁器件安装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2519585Y (zh) * 2001-11-03 2002-10-30 富士康(昆山)电脑接插件有限公司 光电传接模组
CN201360387Y (zh) * 2009-01-24 2009-12-09 长沙高新开发区超弦电子科技发展有限公司 一种机车监控显示设备
CN102130266A (zh) * 2010-01-20 2011-07-20 旭丽电子(广州)有限公司 封装结构及发光二极管封装结构
CN203934278U (zh) * 2014-03-27 2014-11-05 特富特科技(深圳)有限公司 一种电磁器件安装装置

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