WO2018000906A1 - 一种芯片散热结构及机顶盒 - Google Patents

一种芯片散热结构及机顶盒 Download PDF

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Publication number
WO2018000906A1
WO2018000906A1 PCT/CN2017/080426 CN2017080426W WO2018000906A1 WO 2018000906 A1 WO2018000906 A1 WO 2018000906A1 CN 2017080426 W CN2017080426 W CN 2017080426W WO 2018000906 A1 WO2018000906 A1 WO 2018000906A1
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Prior art keywords
heat dissipation
chip
heat
dissipation structure
dissipating
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PCT/CN2017/080426
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English (en)
French (fr)
Inventor
周俊杰
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深圳市九洲电器有限公司
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Publication of WO2018000906A1 publication Critical patent/WO2018000906A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Definitions

  • the present invention relates to a heat dissipation structure, and more particularly to a chip heat dissipation structure and a set top box.
  • the existing heat dissipation design of the set top box chip is mainly through three ways of air convection, conduction and heat radiation, and the heat is increased by increasing the number of heat dissipation holes of the set top box, internally configuring the fan, increasing the heat sink or increasing the heat equalizing plate.
  • the area is realized.
  • increasing the number of vents and built-in fans will greatly affect the appearance of the set-top box, poor waterproof and dustproof effects, and increase the size of the set-top box.
  • the increase in the size of the set-top box will increase the complexity of the installation. Degrees, transportation problems and EMI problems (electromagnetic interference problems), these are disadvantageous to the set-top box, and can not be well cooled, nor can the chip be well protected.
  • the present invention provides a chip heat dissipation structure, comprising a back-type silicone sheet, a silicone grease, a heat-dissipating aluminum block, and a heat-dissipating aluminum plate; the back-type silicone sheet is bonded on the chip, and the thickness is greater than the height of the protrusion of the wafer and the middle ⁇ having a square mouth capable of accommodating a chip wafer, the silicone grease is applied to a square mouth of the return type silicone sheet to form a sealing cavity for sealing protection of the wafer, and one side of the heat dissipating aluminum block is used for pressing the back a silicon dioxide sheet, the other side is stamped and riveted to the bottom surface of the heat dissipation aluminum plate, and the heat dissipation aluminum plate is connected to the PCB board where the chip is located by screws, and the heat dissipation structure of the chip is fixedly mounted on the PCB board, and the heat dissipation aluminum block is pressed on one side.
  • the heat dissipating aluminum block is a square aluminum block whose upper and lower sides are flat.
  • the bottom surface of the heat dissipation aluminum plate is mounted with a plurality of screw posts; the screw posts are connected to the heat dissipation aluminum plate by riveting, and the height is greater than the height of the heat dissipation aluminum block.
  • the heat dissipating aluminum plate is provided with a plurality of grooves; the grooves are elongated and alternately horizontally vertically.
  • said heat sink aluminum plate is bent to form the bent sheet edge.
  • a set top box provided by the present invention includes a chip heat dissipation structure, and the chip heat dissipation structure is the above chip heat dissipation structure.
  • the heat dissipation structure and the set top box of the invention adopt a back-type silicone sheet with a certain thickness and a compression ratio, which can not only provide protection support, but also cooperate with a silicone grease having high thermal conductivity to form a sealed cavity, which effectively functions. Protect exposed wafers and good heat transfer.
  • the heat-dissipating aluminum block is pressed against the back-shaped silicone sheet, and the other side is stamped and riveted on the heat-dissipating aluminum plate to avoid gaps, which can effectively conduct heat and improve the heat-dissipating effect, thereby effectively dissipating the chip and effectively protecting the wafer, and the installation is simple. Convenient.
  • FIG. 1 is a schematic structural view of a chip heat dissipation structure in an embodiment
  • FIG. 2 is a schematic structural view of a return type silicone sheet in an embodiment
  • FIG. 3 is a schematic view showing the structure of an aluminum block and an aluminum plate in one embodiment.
  • FIG. 1 is a schematic structural view of a heat dissipation structure of a chip in an embodiment
  • FIG. 2 is a schematic structural view of a silicon back sheet in one embodiment
  • FIG. 3 is a schematic structural view of an aluminum block and an aluminum plate in an embodiment.
  • the heat dissipation structure of the chip comprises a return type silicone sheet 100, a silicone grease 200, a heat dissipating aluminum block 300, and a heat dissipating aluminum plate 400.
  • the return type silicone sheet 100 is bonded to the chip with a thickness greater than the bump height of the wafer and a square port 110 capable of accommodating the chip wafer.
  • Silicone grease 200 is applied to the square port 110 of the back-type silicone sheet 100 to form a sealed cavity to seal the wafer.
  • the heat-dissipating aluminum block 300 is used for pressing the back-type silicone sheet 100, and the other side is stamped and riveted to the bottom surface of the heat-dissipating aluminum plate 400.
  • the heat dissipating aluminum plate 400 is connected to the PCB board 500 where the chip is located by screws, and the heat dissipating structure of the chip is fixedly mounted on the PCB board 500, and the heat dissipating aluminum block 300 is pressed against the silicon film 100.
  • the heat dissipation structure of the chip adopts a back-type silicone sheet 100 having a certain thickness and a compression ratio, which can not only provide protection support, but also cooperate with a silicone grease 200 having high thermal conductivity to form a sealed cavity, thereby effectively protecting the exposed crystal. Round and good heat transfer.
  • the heat-dissipating aluminum block 300 is used to press the back-shaped silicone sheet 100, and the other side is stamped and riveted on the heat-dissipating aluminum plate 400 to avoid gaps, which can effectively conduct heat and improve the heat-dissipating effect, thereby effectively dissipating the chip and effectively performing the wafer. protection.
  • the back-type silicone sheet 100 material has high insulation and high breakdown voltage, and has a V-0 grade fire resistance. It has a set compression ratio, a wide temperature range, and a long service life.
  • the upper and lower surfaces of the back-type silicone sheet 100 are each attached with a film, and the film is removed after use.
  • the thickness of the back-type silicone sheet 100 can be calculated and adjusted according to the height of the wafer protrusion, the thickness of the applied silicone grease 200, the gap spacing between the wafer and the heat-dissipating aluminum block 300, and the amount of compression, and is common with the silicone grease 200 and the heat-dissipating aluminum block 300. Forming a sealed cavity with both protection of the chip wafer and good thermal conductivity, effectively protecting the exposed wafer and good heat dissipation.
  • Silicone grease 200 uses a thermal grease having a high thermal conductivity of 3.0 or more, which has low thermal resistance and volatility, a wide temperature range, and non-flammability. Together with the back-type silicone sheet 100, the sealing cavity is formed, and the material itself does not contain the siloxane component, which is good for the device with HDD (hard disk), and avoids the failure of the HDD after using a certain time.
  • the heat dissipating aluminum block 300 is a square aluminum block whose upper and lower sides are flat. One side (bottom surface) is pressed against the return type silicone sheet 100, and the length and width of the heat dissipating aluminum block 300 can be determined according to the size of the chip, and the contact area with the chip is larger than the chip size (larger point). The other side (top surface) is stamped and riveted on the heat dissipation aluminum plate 400, so that The two can be approximated as one piece, which is the same device, avoiding the influence of the gap on the heat transfer effect.
  • the heat dissipation aluminum plate 400 is connected to the PCB board 500 where the chip is placed by screws.
  • a plurality of screw posts 410 are mounted on the bottom surface of the heat dissipation aluminum plate 400.
  • the screw post 410 is connected to the heat dissipating aluminum plate 400 by riveting to form an integral body.
  • the height of the screw post 410 is greater than the height of the heat dissipating aluminum block 300, and space is reserved for the placement of the wafer bumps, the grease 200, and the return type silicone sheet 100.
  • the screw post 410 is aligned with the screw through hole on the PCB board 500 of the chip, and is fixed on the PCB board 500 by screws.
  • the heat dissipation structure is stably mounted on the PCB board 500, and the installation and disassembly are convenient, and the probability of chip damage is reduced. And it is conducive to transportation and vibration drop test, better to protect the chip.
  • the number of screw posts 410 can be three.
  • a plurality of trenches 420 are disposed on the heat dissipation aluminum plate 400.
  • the trenches 420 are elongated and alternately horizontally arranged to prevent EMI from being caused by the entire heat-dissipating aluminum plate 400 as an antenna.
  • the edge of the heat dissipation aluminum plate 400 is bent to form a bent piece 430.
  • the heat dissipation structure may further include a PCB board 500, and the PCB board 5
  • 00 is 2 ounces of inner copper thickness. With 2 ounces of inner copper thick PCB board 500, the heat transfer of each heat chip is greatly diffused. In order to reduce the influence of heat dissipation of other chips around the chip, the inner layer of the PCB 500 between the chip and the surrounding chip is copper (the copper layer of the second layer) is isolated to effectively isolate the conduction of heat from the surrounding chip.
  • the chip heat dissipation structure, the return type silicone sheet 100 is placed on the chip, the wafer is located in the square mouth 110, the silicone grease 200 is applied, and the heat dissipation aluminum block 300 is pressed on the return type silicone sheet 100, and the screw is
  • the heat dissipation aluminum plate 400 is fixed on the PCB board 500, that is, the assembly is completed.
  • the back-type silicone sheet 100 having a certain thickness and compression ratio can be used for protection support, and is combined with a silicone grease 200 having high thermal conductivity to form a sealed cavity, thereby effectively protecting the exposed wafer and good transmission. Thermal effect.
  • the heat-dissipating aluminum block 300 is used to press the back-shaped silicone sheet 100, and the other side is stamped and riveted on the heat-dissipating aluminum plate 400 to avoid gaps, which can effectively conduct heat and improve the heat-dissipating effect, thereby effectively dissipating the chip and effectively performing the wafer. Protection, installation is simple and convenient.
  • the present invention also provides a set top box, the set top box includes a chip heat dissipation structure, and the chip heat dissipation structure is the above chip heat dissipation structure.
  • the heat dissipation structure and the set top box of the invention adopt a back-type silicone sheet with a certain thickness and a compression ratio, which can not only provide protection support, but also cooperate with a silicone grease having high thermal conductivity to form a sealed cavity, effectively functioning Protect exposed wafers and good heat transfer.
  • the heat-dissipating aluminum block is pressed against the back-shaped silicone sheet, and the other side is stamped and riveted on the heat-dissipating aluminum plate to avoid gaps, which can effectively conduct heat and improve the heat-dissipating effect, thereby effectively dissipating the chip and effectively protecting the wafer, and the installation is simple. Convenient.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract

一种芯片散热结构及机顶盒，包括回型硅胶片（100）、硅脂（200）、散热铝块（300）以及散热铝板（400）；采用具备一定厚度和压缩比的回型硅胶片，既可以进行保护支撑，同时又与具有高导热的硅脂配合形成一个密封腔，有效的起到保护裸露的晶圆和良好的传热效果。采用散热铝块一面紧压回型硅胶片，另一面冲压铆接在散热铝板上避免缝隙，能够有效对热量进行传导，提高散热效果，从而对芯片进行有效散热和对晶圆进行有效保护，安装简单便捷。

Description

一种芯片散热结构及机顶盒 技术领域
[0001] 本发明涉及散热结构， 尤其涉及一种芯片散热结构及机顶盒。
背景技术
[0002] 随着 IC集成度和工艺的不断升级， 机顶盒上芯片的集成功能也越来越强大， 芯 片产生的热量也越来越大。 基于对机顶盒的体验、 性能及寿命的要求， 散热和 芯片的晶圆凸起所带来的芯片保护问题也倍加受到关注。
[0003] 现有的机顶盒芯片散热设计， 主要是通过空气对流、 传导及热辐射三种方式， 大都通过增加机顶盒散热孔数量、 内部配置风扇、 加大散热器或者增加均热板 方式增大散热面积来实现。 但是， 增加散热孔数量和内置风扇， 会很大程度上 影响机顶盒外观、 防水防尘效果差和增大机顶盒的尺寸； 而通过加大散热器和 增加均热板的方式， 会增加安装的复杂度、 带来运输问题和 EMI问题 （电磁干扰 问题） ， 这些都给机顶盒带来不利， 且不能很好的进行散热， 也无法对芯片进 行很好的保护。
技术问题
[0004] 有鉴于此， 有必要针对上述芯片散热设计给机顶盒带来不利、 不能对芯片进行 很好保护的问题， 提供一种芯片散热结构及机顶盒。
问题的解决方案
技术解决方案
[0005] 本发明提供的一种芯片散热结构， 包括回型硅胶片、 硅脂、 散热铝块以及散热 铝板； 所述回型硅胶片粘接在芯片上， 厚度大于晶圆凸起高度且中间幵有能够 容纳芯片晶圆的方口， 所述硅脂涂抹在所述回型硅胶片的方口中， 形成密封腔 对晶圆进行密封保护， 所述散热铝块一面用于紧压所述回型硅胶片， 另一面冲 压铆接到所述散热铝板底面， 所述散热铝板通过螺钉与芯片所在 PCB板连接， 将 芯片散热结构固定安装在 PCB板上， 并使所述散热铝块一面压紧所述回型硅胶片 [0006] 在其中的一个实施方式中， 所述硅脂采用高导热系数 3.0及以上的导热硅脂。
[0007] 在其中的一个实施方式中， 所述散热铝块为上下两面平整的方形铝块。
[0008] 在其中的一个实施方式中， 所述散热铝板底面安装有多个螺丝柱； 所述螺丝柱 通过铆接方式连接在所述散热铝板上， 且高度大于所述散热铝块的高度。
[0009] 在其中的一个实施方式中， 所述散热铝板上幵设有多个沟槽； 所述沟槽为长条 形， 且水平竖直交替分布。
[0010] 在其中的一个实施方式中 : 所述散热铝板边缘弯折形成弯折片。
[0011] 在其中的一个实施方式中 : 芯片所在 PCB板为 2盎司的内层铜厚。
[0012] 在其中的一个实施方式中 : 芯片与周围芯片之间的 PCB板内层铺铜形成有隔离
[0013] 本发明提供的一种机顶盒， 包括有芯片散热结构， 所述芯片散热结构为上述的 芯片散热结构。
发明的有益效果
有益效果
[0014] 本发明芯片散热结构及机顶盒， 采用具备一定厚度和压缩比的回型硅胶片， 既 可以进行保护支撑， 同吋又与具有高导热的硅脂配合形成一个密封腔， 有效的 起到保护裸露的晶圆和良好的传热效果。 采用散热铝块一面紧压回形硅胶片， 另一面冲压铆接在散热铝板上避免缝隙， 能够有效对热量进行传导， 提高散热 效果， 从而对芯片进行有效散热和对晶圆进行有效保护， 安装简单便捷。
对附图的简要说明
附图说明
[0015] 图 1是一个实施例中的芯片散热结构的结构示意图；
[0016] 图 2是一个实施例中的回型硅胶片的结构示意图；
[0017] 图 3是一个实施例中的铝块及铝板结构示意图。
本发明的实施方式
[0018] 为了使本发明的目的、 技术方案及优点更加清楚明白， 以下结合附图及实施例 ， 对本发明进行进一步详细说明。 应当理解， 此处所描述的具体实施例仅用以 解释本发明， 并不用于限定本发明。
[0019] 图 1是一个实施例中的芯片散热结构的结构示意图； 图 2是一个实施例中的回型 硅胶片的结构示意图； 图 3是一个实施例中的铝块及铝板结构示意图。 结合图 1 至图 3， 该芯片散热结构包括回型硅胶片 100、 硅脂 200、 散热铝块 300以及散热 铝板 400。 回型硅胶片 100粘接在芯片上， 厚度大于晶圆凸起高度且中间幵有能 够容纳芯片晶圆的方口 110。 硅脂 200涂抹在回型硅胶片 100的方口 110中， 形成 密封腔对晶圆进行密封保护。 散热铝块 300—面用于紧压回型硅胶片 100， 另一 面冲压铆接到散热铝板 400底面。 散热铝板 400通过螺钉与芯片所在 PCB板 500连 接， 将芯片散热结构固定安装在 PCB板 500上， 并使散热铝块 300—面压紧回型硅 胶片 100。 该芯片散热结构， 采用具备一定厚度和压缩比的回型硅胶片 100， 既 可以进行保护支撑， 同吋又与具有高导热的硅脂 200配合形成一个密封腔， 有效 的起到保护裸露的晶圆和良好的传热效果。 采用散热铝块 300—面紧压回形硅胶 片 100， 另一面冲压铆接在散热铝板 400上避免缝隙， 能够有效对热量进行传导 ， 提高散热效果， 从而对芯片进行有效散热和对晶圆进行有效保护。
[0020] 在该实施例中， 回型硅胶片 100材料具备高绝缘性和高击穿电压、 V-0级防火性 育^ 具备设定的压缩比， 宽耐温范围和长使用寿命。 回型硅胶片 100的上下面初 始都各自附膜， 在使用吋去掉附膜。 回型硅胶片 100的厚度可根据晶圆凸起高度 、 涂抹的硅脂 200厚度、 晶圆与散热铝块 300的空隙间距和压缩量的来计算调整 ， 与硅脂 200、 散热铝块 300共同形成一个具备既保护芯片晶圆又起到良好导热 功能的密封腔， 有效的起到保护裸露晶圆和良好的散热效果。
[0021] 硅脂 200采用高导热系数 3.0及以上的导热硅脂， 具备较低的热阻和挥发性、 宽 温度范围及不可燃性。 与回型硅胶片 100共同形成密封腔， 且材料本身不含有硅 氧烷成分， 很好的满足整机带 HDD (硬盘） 的设备， 避免 HDD在使用一定吋间 后出现故障。
[0022] 散热铝块 300为上下两面平整的方形铝块。 一面 （底面） 紧压在回型硅胶片 100 上， 散热铝块 300的长宽尺寸可以根据芯片的大小而定， 与芯片的接触面积大于 芯片尺寸 （大一点即可） 。 另一面 （顶面） 冲压再铆接在散热铝板 400上， 使得 两者可以近似考虑为一体成型， 为同一器件， 避免缝隙影响传热效果。
[0023] 散热铝板 400通过螺钉与芯片所在 PCB板 500连接。 散热铝板 400底面安装有多 个螺丝柱 410。 螺丝柱 410通过铆接方式连接在散热铝板 400上， 形成一体。 螺丝 柱 410高度大于散热铝块 300的高度， 为晶圆凸起、 硅脂 200以及回型硅胶片 100 的放置预留空间。 螺丝柱 410对准芯片所在 PCB板 500上的螺丝过孔， 通过螺丝固 定在 PCB板 500上， 稳固的将散热结构安装在 PCB板 500上， 安装和拆卸都很方便 ， 减少芯片被损坏的概率， 且利于运输和振动跌落试验， 更好的起到了保护芯 片的作用。 螺丝柱 410的数量可以为 3个。
[0024] 为避免造成潜在的 EMI问题， 散热铝板 400上幵设有多个沟槽 420。 沟槽 420为 长条形， 且水平竖直交替分布， 防止整块散热铝板 400作为天线而造成 EMI问题
[0025] 为进一步增大散热铝板 400的散热面积， 散热铝板 400边缘弯折形成弯折片 430
， 增大散热铝板 400的散热面积。
[0026] 此外， 为更好的对芯片进行散热， 该散热结构还可以包括 PCB板 500， PCB板 5
00为 2盎司的内层铜厚。 采用 2盎司内层铜厚的 PCB板 500， 极大地扩散了各发热 芯片的热量传递。 为减少芯片周围其他芯片散热造成的影响， 芯片与周围芯片 之间的 PCB板 500内层铺铜 （第二层地层的铺铜） 形成有隔离， 有效隔离周围芯 片热量的传导。
[0027] 该芯片散热结构， 将回型硅胶片 100放置在芯片上， 晶圆位于方口 110中， 涂抹 硅脂 200， 将散热铝块 300压紧在回型硅胶片 100上， 通过螺丝将散热铝板 400固 定在 PCB板 500上， 即完成组装。 采用具备一定厚度和压缩比的回型硅胶片 100， 既可以进行保护支撑， 同吋又与具有高导热的硅脂 200配合形成一个密封腔， 有 效的起到保护裸露的晶圆和良好的传热效果。 采用散热铝块 300—面紧压回形硅 胶片 100， 另一面冲压铆接在散热铝板 400上避免缝隙， 能够有效对热量进行传 导， 提高散热效果， 从而对芯片进行有效散热和对晶圆进行有效保护， 安装简 单便捷。
[0028] 同吋本发明还提供一种机顶盒， 机顶盒包括有芯片散热结构， 芯片散热结构为 上述的芯片散热结构。 [0029] 本发明芯片散热结构及机顶盒， 采用具备一定厚度和压缩比的回型硅胶片， 既 可以进行保护支撑， 同吋又与具有高导热的硅脂配合形成一个密封腔， 有效的 起到保护裸露的晶圆和良好的传热效果。 采用散热铝块一面紧压回形硅胶片， 另一面冲压铆接在散热铝板上避免缝隙， 能够有效对热量进行传导， 提高散热 效果， 从而对芯片进行有效散热和对晶圆进行有效保护， 安装简单便捷。
[0030] 以上仅为本发明的较佳实施例而已， 并不用以限制本发明， 凡在本发明的精神 和原则之内所作的任何修改、 等同替换和改进等， 均应包含在本发明的保护范 围之内。

Claims

权利要求书
[权利要求 1] 一种芯片散热结构， 其特征在于， 包括回型硅胶片、 硅脂、 散热铝块 以及散热铝板； 所述回型硅胶片粘接在芯片上， 厚度大于晶圆凸起高 度且中间幵有能够容纳芯片晶圆的方口， 所述硅脂涂抹在所述回型石 j 胶片的方口中， 形成密封腔对晶圆进行密封保护， 所述散热铝块一面 用于紧压所述回型硅胶片， 另一面冲压铆接到所述散热铝板底面， 所 述散热铝板通过螺钉与芯片所在 PCB板连接， 将芯片散热结构固定安 装在 PCB板上， 并使所述散热铝块一面压紧所述回型硅胶片。
[权利要求 2] 根据权利要求 1所述的芯片散热结构， 其特征在于， 所述硅脂采用高 导热系数 3.0及以上的导热硅脂。
[权利要求 3] 根据权利要求 2所述的芯片散热结构， 其特征在于， 所述散热铝块为 上下两面平整的方形铝块。
[权利要求 4] 根据权利要求 3所述的芯片散热结构， 其特征在于， 所述散热铝板底 面安装有多个螺丝柱； 所述螺丝柱通过铆接方式连接在所述散热铝板 上， 且高度大于所述散热铝块的高度。
[权利要求 5] 根据权利要求 4所述的芯片散热结构， 其特征在于， 所述散热铝板上 幵设有多个沟槽； 所述沟槽为长条形， 且水平竖直交替分布。
[权利要求 6] 根据权利要求 5所述的芯片散热结构， 其特征在于， 所述散热铝板边 缘弯折形成弯折片。
[权利要求 7] 根据权利要求 1所述的芯片散热结构， 其特征在于， 芯片所在 PCB板 为 2盎司的内层铜厚。
[权利要求 8] 根据权利要求 7所述的芯片散热结构， 其特征在于， 芯片与周围芯片 之间的 PCB板内层铺铜形成有隔离。
[权利要求 9] 一种机顶盒， 包括有芯片散热结构， 其特征在于， 所述芯片散热结构 为上述权利要求 1至 9任一所述的芯片散热结构。
PCT/CN2017/080426 2016-06-29 2017-04-13 一种芯片散热结构及机顶盒 WO2018000906A1 (zh)

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