CN100546793C - 用于确定晶面相对于晶体表面定向的设备和方法 - Google Patents

用于确定晶面相对于晶体表面定向的设备和方法 Download PDF

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Publication number
CN100546793C
CN100546793C CNB2005100916038A CN200510091603A CN100546793C CN 100546793 C CN100546793 C CN 100546793C CN B2005100916038 A CNB2005100916038 A CN B2005100916038A CN 200510091603 A CN200510091603 A CN 200510091603A CN 100546793 C CN100546793 C CN 100546793C
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crystal
single crystal
angle
orientation
plane
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Chinese (zh)
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CN1736681A (zh
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拉尔夫·哈默
拉尔夫·格鲁茨恩斯凯
安德烈·科莱因韦希特
蒂洛·弗拉德
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Freiberger Compound Materials GmbH
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Freiberger Compound Materials GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20008—Constructional details of analysers, e.g. characterised by X-ray source, detector or optical system; Accessories therefor; Preparing specimens therefor
    • G01N23/20016—Goniometers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
CNB2005100916038A 2001-06-13 2002-06-11 用于确定晶面相对于晶体表面定向的设备和方法 Expired - Lifetime CN100546793C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10128630A DE10128630A1 (de) 2001-06-13 2001-06-13 Vorrichtung und Verfahren zur Bestimmung der Orientierung einer kristallografischen Ebene relativ zu einer Kristalloberfläche sowie Vorrichtung und Verfahren zum Trennen eines Einkristalls in einer Trennmaschine
DE10128630.9 2001-06-13

Related Parent Applications (1)

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CNB028118340A Division CN100569475C (zh) 2001-06-13 2002-06-11 用于在切割机内切割单晶体的方法和设备

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CN1736681A CN1736681A (zh) 2006-02-22
CN100546793C true CN100546793C (zh) 2009-10-07

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CNB028118340A Expired - Lifetime CN100569475C (zh) 2001-06-13 2002-06-11 用于在切割机内切割单晶体的方法和设备

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US (1) US6923171B2 (enExample)
EP (2) EP1568457B1 (enExample)
JP (2) JP4716652B2 (enExample)
CN (2) CN100546793C (enExample)
AT (1) ATE369956T1 (enExample)
CZ (1) CZ304828B6 (enExample)
DE (3) DE10128630A1 (enExample)
RU (1) RU2296671C2 (enExample)
SK (1) SK286829B6 (enExample)
TW (1) TWI224670B (enExample)
WO (1) WO2002100619A1 (enExample)

Cited By (1)

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CN101733848B (zh) * 2009-12-29 2012-01-18 西北工业大学 定向切割晶体任意晶面的简便方法

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CN101486231B (zh) * 2009-01-22 2011-12-07 四川大学 黄铜矿类负单轴晶体制备红外非线性光学元件的定向切割方法
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CN104985709B (zh) * 2015-06-16 2017-01-11 浙江海纳半导体有限公司 调整单晶棒晶向的方法及测量方法
JP6610026B2 (ja) * 2015-06-23 2019-11-27 三星ダイヤモンド工業株式会社 スクライブ装置
JP6272801B2 (ja) * 2015-07-27 2018-01-31 信越半導体株式会社 ワークホルダー及びワークの切断方法
JP6349290B2 (ja) * 2015-09-03 2018-06-27 信越半導体株式会社 単結晶ウェーハの表裏判定方法
CN105269696B (zh) * 2015-10-30 2017-04-05 江苏吉星新材料有限公司 一种蓝宝石晶体的复合定向方法
WO2017091945A1 (en) * 2015-11-30 2017-06-08 Rhodia Operations Wafering process for water based slurries
CN105842263A (zh) * 2016-03-18 2016-08-10 中锗科技有限公司 一种偏晶向太阳能锗单晶定向仪及其检测方法
JP6690983B2 (ja) * 2016-04-11 2020-04-28 株式会社ディスコ ウエーハ生成方法及び実第２のオリエンテーションフラット検出方法
JP6222393B1 (ja) * 2017-03-21 2017-11-01 信越半導体株式会社 インゴットの切断方法
CN108312370B (zh) * 2017-12-20 2020-05-01 天通控股股份有限公司 一种基于水平传感器定位晶体的定向加工方法
JP6923067B2 (ja) * 2018-02-27 2021-08-18 株式会社Sumco 半導体単結晶インゴットのスライス方法
CN108621316B (zh) * 2018-05-03 2020-02-18 大连理工大学 一种易潮解光学晶体的水溶解辅助精密高效切割方法
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JP7148437B2 (ja) * 2019-03-01 2022-10-05 信越半導体株式会社 ワークの切断加工方法及びワークの切断加工装置
US11921061B2 (en) * 2019-08-30 2024-03-05 National Institute Of Advanced Industrial Science And Technology Orientation degree distribution calculation method, orientation degree distribution analyzer, and orientation degree distribution analysis program
US12468072B2 (en) * 2020-03-05 2025-11-11 Xinmei Fontana Holding (Hong Kong) Limited Optical film and micro LED display comprising thereof
CN111745305B (zh) * 2020-05-23 2022-03-04 山东大学 一种实现金刚石单晶衬底表面取向的方法
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ATE369956T1 (de) 2007-09-15
SK14932003A3 (sk) 2004-06-08
DE10128630A1 (de) 2003-01-02
JP4716652B2 (ja) 2011-07-06
EP1568457A1 (de) 2005-08-31
EP1568457B1 (de) 2007-08-22
DE50210785D1 (de) 2007-10-04
EP1399306A1 (de) 2004-03-24
RU2004100543A (ru) 2005-06-10
TWI224670B (en) 2004-12-01
CN100569475C (zh) 2009-12-16
RU2296671C2 (ru) 2007-04-10
CN1736681A (zh) 2006-02-22
EP1399306B1 (de) 2007-08-15
US6923171B2 (en) 2005-08-02
SK286829B6 (sk) 2009-06-05
DE50210714D1 (de) 2007-09-27
JP2011003929A (ja) 2011-01-06
US20040168682A1 (en) 2004-09-02
CZ304828B6 (cs) 2014-11-26
JP2004533347A (ja) 2004-11-04
WO2002100619A1 (de) 2002-12-19
CN1529647A (zh) 2004-09-15
JP5357122B2 (ja) 2013-12-04
CZ20033395A3 (cs) 2004-05-12

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