CN100335182C - 基板处理装置以及细缝喷嘴 - Google Patents

基板处理装置以及细缝喷嘴 Download PDF

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Publication number
CN100335182C
CN100335182C CNB2004100925564A CN200410092556A CN100335182C CN 100335182 C CN100335182 C CN 100335182C CN B2004100925564 A CNB2004100925564 A CN B2004100925564A CN 200410092556 A CN200410092556 A CN 200410092556A CN 100335182 C CN100335182 C CN 100335182C
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CN
China
Prior art keywords
mentioned
jet nozzle
slit jet
collector
resist liquid
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Active
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CNB2004100925564A
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English (en)
Chinese (zh)
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CN1618527A (zh
Inventor
高木善则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Skilling Group
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
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Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of CN1618527A publication Critical patent/CN1618527A/zh
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Publication of CN100335182C publication Critical patent/CN100335182C/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/025—Processes for applying liquids or other fluent materials performed by spraying using gas close to its critical state
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
CNB2004100925564A 2003-11-18 2004-11-15 基板处理装置以及细缝喷嘴 Active CN100335182C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003387641 2003-11-18
JP2003387641A JP4315787B2 (ja) 2003-11-18 2003-11-18 基板処理装置、並びに被充填体における液体充填度および気体混入度判定構造

Publications (2)

Publication Number Publication Date
CN1618527A CN1618527A (zh) 2005-05-25
CN100335182C true CN100335182C (zh) 2007-09-05

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ID=34694942

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100925564A Active CN100335182C (zh) 2003-11-18 2004-11-15 基板处理装置以及细缝喷嘴

Country Status (4)

Country Link
JP (1) JP4315787B2 (ko)
KR (1) KR100641724B1 (ko)
CN (1) CN100335182C (ko)
TW (1) TWI265831B (ko)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1885164B (zh) * 2005-06-24 2010-04-07 友达光电股份有限公司 光阻涂布方法及其光阻涂布设备
KR100711354B1 (ko) * 2005-07-29 2007-04-27 주식회사 포스코 강판의 표면 처리액 도포장치
JP2007144240A (ja) * 2005-11-24 2007-06-14 Dainippon Screen Mfg Co Ltd 塗布装置および塗布方法
TWI561312B (en) * 2006-03-31 2016-12-11 Toray Industries Coating method, coating device and manufacturing method and manufacturing device for components of a display
JP5176359B2 (ja) * 2006-03-31 2013-04-03 東レ株式会社 塗布装置および塗布方法並びにディスプレイ用部材の製造方法および製造装置
KR101309037B1 (ko) * 2006-06-23 2013-09-17 엘지디스플레이 주식회사 슬릿코터
KR101374096B1 (ko) * 2006-06-27 2014-03-13 엘지디스플레이 주식회사 스핀리스 코터 및 이를 이용한 코팅방법
JP5060835B2 (ja) * 2006-07-26 2012-10-31 芝浦メカトロニクス株式会社 基板の処理装置
JP2008062207A (ja) * 2006-09-11 2008-03-21 Tokyo Ohka Kogyo Co Ltd 塗布装置
JP4717782B2 (ja) * 2006-11-13 2011-07-06 大日本スクリーン製造株式会社 基板処理装置
JP5202838B2 (ja) * 2006-12-12 2013-06-05 東京応化工業株式会社 スリットノズル
JP2009010245A (ja) * 2007-06-29 2009-01-15 Hoya Corp マスクブランクの製造方法及び塗布装置
JP5278646B2 (ja) * 2007-11-30 2013-09-04 凸版印刷株式会社 スリットコータおよび塗工方法
CN101463808B (zh) * 2007-12-21 2010-12-08 研能科技股份有限公司 流体输送装置
JP5157486B2 (ja) * 2008-01-30 2013-03-06 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
JP5006274B2 (ja) * 2008-06-25 2012-08-22 東京エレクトロン株式会社 基板処理装置
KR100989928B1 (ko) * 2008-07-09 2010-10-26 (주)티에스티아이테크 유체 토출 장치 및 그의 세정 방법
JP2010240550A (ja) * 2009-04-03 2010-10-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4668330B2 (ja) 2009-04-16 2011-04-13 シーケーディ株式会社 液体吐出装置
JP5154510B2 (ja) * 2009-06-05 2013-02-27 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
JP5444921B2 (ja) * 2009-07-31 2014-03-19 カシオ計算機株式会社 吐出ノズル、吐出装置及び気泡の除去方法
JP5584653B2 (ja) * 2010-11-25 2014-09-03 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5138058B2 (ja) * 2011-03-07 2013-02-06 東レ株式会社 清掃部材と塗布器の清掃方法及び清掃装置並びにディスプレイ用部材の製造方法
US10046356B2 (en) * 2011-12-01 2018-08-14 Tazmo Co., Ltd. Coating apparatus and coating method
JP6055280B2 (ja) 2012-11-11 2016-12-27 平田機工株式会社 塗布液充填方法
JP6264811B2 (ja) * 2013-09-27 2018-01-24 日本電気株式会社 塗布装置及び塗布方法
JP6196916B2 (ja) * 2014-02-25 2017-09-13 東京応化工業株式会社 ノズルおよび塗布装置
CN103984213B (zh) * 2014-04-15 2017-05-31 清华大学深圳研究生院 一种具有均压流道的均匀出流显影喷嘴
CN104166318A (zh) * 2014-09-09 2014-11-26 清华大学深圳研究生院 静压出流显影喷嘴
JP6367075B2 (ja) * 2014-10-08 2018-08-01 株式会社ヒラノテクシード ダイとダイの空気抜き方法
JP6385864B2 (ja) * 2015-03-18 2018-09-05 株式会社東芝 ノズルおよび液体供給装置
JP6967477B2 (ja) * 2018-03-22 2021-11-17 東レ株式会社 塗布器、及び塗布器のエア排出方法
JP7111568B2 (ja) * 2018-09-13 2022-08-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法および基板処理のためのコンピュータプログラム
JP7352419B2 (ja) * 2019-09-13 2023-09-28 株式会社Ｓｃｒｅｅｎホールディングス ノズル内部における気液界面の検出方法および基板処理装置
CN114618747A (zh) * 2020-12-10 2022-06-14 显示器生产服务株式会社 流体喷射装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1102505A (zh) * 1993-03-25 1995-05-10 东京电子株式会社 形成涂膜的方法和装置
JPH07328510A (ja) * 1994-06-14 1995-12-19 Dainippon Screen Mfg Co Ltd 塗布装置及び塗布方法
JPH09253556A (ja) * 1996-03-22 1997-09-30 Toray Ind Inc 塗布装置および塗布方法並びにカラーフィルタの製造装置および製造方法
JPH10286507A (ja) * 1997-04-11 1998-10-27 Toray Ind Inc 塗布装置及び塗布方法並びにカラーフィルタの製造装置及び製造方法
US5976256A (en) * 1996-11-27 1999-11-02 Tokyo Electron Limited Film coating apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1102505A (zh) * 1993-03-25 1995-05-10 东京电子株式会社 形成涂膜的方法和装置
JPH07328510A (ja) * 1994-06-14 1995-12-19 Dainippon Screen Mfg Co Ltd 塗布装置及び塗布方法
JPH09253556A (ja) * 1996-03-22 1997-09-30 Toray Ind Inc 塗布装置および塗布方法並びにカラーフィルタの製造装置および製造方法
US5976256A (en) * 1996-11-27 1999-11-02 Tokyo Electron Limited Film coating apparatus
JPH10286507A (ja) * 1997-04-11 1998-10-27 Toray Ind Inc 塗布装置及び塗布方法並びにカラーフィルタの製造装置及び製造方法

Also Published As

Publication number Publication date
JP2005144376A (ja) 2005-06-09
JP4315787B2 (ja) 2009-08-19
KR20050048507A (ko) 2005-05-24
TWI265831B (en) 2006-11-11
TW200526329A (en) 2005-08-16
CN1618527A (zh) 2005-05-25
KR100641724B1 (ko) 2006-11-10

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: DAINIPPON SCREEN MFG. CO., LTD.

Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD.

Owner name: SCREEN GROUP CO., LTD.

Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Kyoto Japan

Patentee after: Skilling Group

Address before: Kyoto Japan

Patentee before: DAINIPPON SCREEN MFG Co.,Ltd.

Address after: Kyoto Japan

Patentee after: DAINIPPON SCREEN MFG Co.,Ltd.

Address before: Kyoto Japan

Patentee before: Dainippon Screen Mfg. Co.,Ltd.