TWI265831B - Substrate processing apparatus, slit nozzle, structure for determining degree of liquid filling in body to be filled, and structure for determining degree of air mixed in body to be filled - Google Patents

Substrate processing apparatus, slit nozzle, structure for determining degree of liquid filling in body to be filled, and structure for determining degree of air mixed in body to be filled

Info

Publication number
TWI265831B
TWI265831B TW093130890A TW93130890A TWI265831B TW I265831 B TWI265831 B TW I265831B TW 093130890 A TW093130890 A TW 093130890A TW 93130890 A TW93130890 A TW 93130890A TW I265831 B TWI265831 B TW I265831B
Authority
TW
Taiwan
Prior art keywords
filled
determining degree
resist liquid
air
slit nozzle
Prior art date
Application number
TW093130890A
Other languages
English (en)
Other versions
TW200526329A (en
Inventor
Yoshinori Takagi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200526329A publication Critical patent/TW200526329A/zh
Application granted granted Critical
Publication of TWI265831B publication Critical patent/TWI265831B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/025—Processes for applying liquids or other fluent materials performed by spraying using gas close to its critical state
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
TW093130890A 2003-11-18 2004-10-12 Substrate processing apparatus, slit nozzle, structure for determining degree of liquid filling in body to be filled, and structure for determining degree of air mixed in body to be filled TWI265831B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003387641A JP4315787B2 (ja) 2003-11-18 2003-11-18 基板処理装置、並びに被充填体における液体充填度および気体混入度判定構造

Publications (2)

Publication Number Publication Date
TW200526329A TW200526329A (en) 2005-08-16
TWI265831B true TWI265831B (en) 2006-11-11

Family

ID=34694942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130890A TWI265831B (en) 2003-11-18 2004-10-12 Substrate processing apparatus, slit nozzle, structure for determining degree of liquid filling in body to be filled, and structure for determining degree of air mixed in body to be filled

Country Status (4)

Country Link
JP (1) JP4315787B2 (zh)
KR (1) KR100641724B1 (zh)
CN (1) CN100335182C (zh)
TW (1) TWI265831B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399822B (zh) * 2009-04-03 2013-06-21 Dainippon Screen Mfg 基板處理裝置
TWI478774B (zh) * 2009-06-05 2015-04-01 Tokyo Electron Ltd 預塗處理方法及預塗處理裝置

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1885164B (zh) * 2005-06-24 2010-04-07 友达光电股份有限公司 光阻涂布方法及其光阻涂布设备
KR100711354B1 (ko) * 2005-07-29 2007-04-27 주식회사 포스코 강판의 표면 처리액 도포장치
JP2007144240A (ja) * 2005-11-24 2007-06-14 Dainippon Screen Mfg Co Ltd 塗布装置および塗布方法
JP5176359B2 (ja) * 2006-03-31 2013-04-03 東レ株式会社 塗布装置および塗布方法並びにディスプレイ用部材の製造方法および製造装置
TWI561312B (en) * 2006-03-31 2016-12-11 Toray Industries Coating method, coating device and manufacturing method and manufacturing device for components of a display
KR101309037B1 (ko) * 2006-06-23 2013-09-17 엘지디스플레이 주식회사 슬릿코터
KR101374096B1 (ko) * 2006-06-27 2014-03-13 엘지디스플레이 주식회사 스핀리스 코터 및 이를 이용한 코팅방법
JP5060835B2 (ja) * 2006-07-26 2012-10-31 芝浦メカトロニクス株式会社 基板の処理装置
JP2008062207A (ja) * 2006-09-11 2008-03-21 Tokyo Ohka Kogyo Co Ltd 塗布装置
JP4717782B2 (ja) * 2006-11-13 2011-07-06 大日本スクリーン製造株式会社 基板処理装置
JP5202838B2 (ja) * 2006-12-12 2013-06-05 東京応化工業株式会社 スリットノズル
JP2009010245A (ja) * 2007-06-29 2009-01-15 Hoya Corp マスクブランクの製造方法及び塗布装置
JP5278646B2 (ja) * 2007-11-30 2013-09-04 凸版印刷株式会社 スリットコータおよび塗工方法
CN101463808B (zh) * 2007-12-21 2010-12-08 研能科技股份有限公司 流体输送装置
JP5157486B2 (ja) * 2008-01-30 2013-03-06 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
JP5006274B2 (ja) * 2008-06-25 2012-08-22 東京エレクトロン株式会社 基板処理装置
KR100989928B1 (ko) * 2008-07-09 2010-10-26 (주)티에스티아이테크 유체 토출 장치 및 그의 세정 방법
JP4668330B2 (ja) 2009-04-16 2011-04-13 シーケーディ株式会社 液体吐出装置
JP5444921B2 (ja) * 2009-07-31 2014-03-19 カシオ計算機株式会社 吐出ノズル、吐出装置及び気泡の除去方法
JP5584653B2 (ja) * 2010-11-25 2014-09-03 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5138058B2 (ja) * 2011-03-07 2013-02-06 東レ株式会社 清掃部材と塗布器の清掃方法及び清掃装置並びにディスプレイ用部材の製造方法
KR101621215B1 (ko) * 2011-12-01 2016-05-16 다즈모 가부시키가이샤 도포장치 및 도포방법
JP6055280B2 (ja) 2012-11-11 2016-12-27 平田機工株式会社 塗布液充填方法
JP6264811B2 (ja) * 2013-09-27 2018-01-24 日本電気株式会社 塗布装置及び塗布方法
JP6196916B2 (ja) * 2014-02-25 2017-09-13 東京応化工業株式会社 ノズルおよび塗布装置
CN103984213B (zh) * 2014-04-15 2017-05-31 清华大学深圳研究生院 一种具有均压流道的均匀出流显影喷嘴
CN104166318A (zh) * 2014-09-09 2014-11-26 清华大学深圳研究生院 静压出流显影喷嘴
JP6367075B2 (ja) * 2014-10-08 2018-08-01 株式会社ヒラノテクシード ダイとダイの空気抜き方法
JP6385864B2 (ja) * 2015-03-18 2018-09-05 株式会社東芝 ノズルおよび液体供給装置
JP6967477B2 (ja) * 2018-03-22 2021-11-17 東レ株式会社 塗布器、及び塗布器のエア排出方法
JP7111568B2 (ja) * 2018-09-13 2022-08-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法および基板処理のためのコンピュータプログラム
JP7352419B2 (ja) * 2019-09-13 2023-09-28 株式会社Ｓｃｒｅｅｎホールディングス ノズル内部における気液界面の検出方法および基板処理装置
CN114618747A (zh) * 2020-12-10 2022-06-14 显示器生产服务株式会社 流体喷射装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658615A (en) * 1993-03-25 1997-08-19 Tokyo Electron Limited Method of forming coating film and apparatus therefor
JPH07328510A (ja) * 1994-06-14 1995-12-19 Dainippon Screen Mfg Co Ltd 塗布装置及び塗布方法
JPH09253556A (ja) * 1996-03-22 1997-09-30 Toray Ind Inc 塗布装置および塗布方法並びにカラーフィルタの製造装置および製造方法
JP3245813B2 (ja) * 1996-11-27 2002-01-15 東京エレクトロン株式会社 塗布膜形成装置
JP3956425B2 (ja) * 1997-04-11 2007-08-08 東レ株式会社 カラーフィルタ製造用塗布装置及びカラーフィルタの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399822B (zh) * 2009-04-03 2013-06-21 Dainippon Screen Mfg 基板處理裝置
TWI478774B (zh) * 2009-06-05 2015-04-01 Tokyo Electron Ltd 預塗處理方法及預塗處理裝置

Also Published As

Publication number Publication date
JP2005144376A (ja) 2005-06-09
TW200526329A (en) 2005-08-16
JP4315787B2 (ja) 2009-08-19
KR20050048507A (ko) 2005-05-24
KR100641724B1 (ko) 2006-11-10
CN1618527A (zh) 2005-05-25
CN100335182C (zh) 2007-09-05

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