TW200624181A - Coating film forming apparatus and coating film forming method - Google Patents

Coating film forming apparatus and coating film forming method

Info

Publication number
TW200624181A
TW200624181A TW094132807A TW94132807A TW200624181A TW 200624181 A TW200624181 A TW 200624181A TW 094132807 A TW094132807 A TW 094132807A TW 94132807 A TW94132807 A TW 94132807A TW 200624181 A TW200624181 A TW 200624181A
Authority
TW
Taiwan
Prior art keywords
coating film
processing liquid
film forming
nozzle
discharge port
Prior art date
Application number
TW094132807A
Other languages
Chinese (zh)
Other versions
TWI293583B (en
Inventor
Ryusei Tomita
Yoshihiro Kawaguchi
Fumihiko Ikeda
Naoki Fujita
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200624181A publication Critical patent/TW200624181A/en
Application granted granted Critical
Publication of TWI293583B publication Critical patent/TWI293583B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)

Abstract

The coating film formation apparatus 107 has a nozzle 20 which has the discharge port 21 of the shape of a slit prolonged in the width direction of the processed substrate G, a processing liquid supply means 51 to supply processing liquid to the nozzle 20, and a nozzle move means 50 to which the nozzle 20 is moved along the substrate side of the processed substrate G. The coating film formation apparatus 107 carries out coating formation of the film of processing liquid on the surface of the processed substrate G by carrying out discharge of the processing liquid from the discharge port 21 of the nozzle 20. The processing liquid diffusion control means 20d is formed in the right-and-left side of the direction of the discharge port 21 to control a flow of processing liquid.
TW094132807A 2004-10-07 2005-09-22 Coating film forming apparatus and coating film forming method TWI293583B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004295141 2004-10-07
JP2005218221A JP4738085B2 (en) 2004-10-07 2005-07-28 Coating film forming apparatus and coating film forming method

Publications (2)

Publication Number Publication Date
TW200624181A true TW200624181A (en) 2006-07-16
TWI293583B TWI293583B (en) 2008-02-21

Family

ID=36728527

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132807A TWI293583B (en) 2004-10-07 2005-09-22 Coating film forming apparatus and coating film forming method

Country Status (3)

Country Link
JP (1) JP4738085B2 (en)
KR (2) KR20060052081A (en)
TW (1) TWI293583B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452646B (en) * 2007-07-12 2014-09-11 Kondoh Ind Ltd A dry air or a nitrogen gas filling device in a semiconductor wafer storage container, and a wafer electrostatic removing device using the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101309037B1 (en) * 2006-06-23 2013-09-17 엘지디스플레이 주식회사 Slit coater
KR101243087B1 (en) * 2006-09-14 2013-03-13 주식회사 케이씨텍 Slit coater
KR200454943Y1 (en) 2007-08-10 2011-08-05 주식회사 케이씨텍 Slit nozzle
KR101289407B1 (en) * 2011-12-19 2013-07-24 주식회사 나래나노텍 A Device and Method for Preventing Flowing of Low Viscosity Coating Liquid, and Slit Die Having the Same
KR101522611B1 (en) * 2013-10-04 2015-06-25 주식회사 케이씨텍 Substrate coater
WO2018220756A1 (en) * 2017-05-31 2018-12-06 東芝三菱電機産業システム株式会社 Coating head for mist coating and film forming device, and maintenance method therefor
JP2021008970A (en) * 2019-06-28 2021-01-28 株式会社アルバック Freeze dry nozzle, freeze dry device, and granulation method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06170306A (en) * 1992-12-03 1994-06-21 Konica Corp Applicator
JP3645586B2 (en) * 1994-06-08 2005-05-11 大日本スクリーン製造株式会社 Treatment liquid application equipment
JP3245813B2 (en) * 1996-11-27 2002-01-15 東京エレクトロン株式会社 Coating film forming equipment
JP3918106B2 (en) * 1999-12-20 2007-05-23 富士フイルム株式会社 Coating device
JP2002282760A (en) * 2001-03-26 2002-10-02 Dainippon Screen Mfg Co Ltd Liquid supply nozzle and manufacturing method, treatment method and treatment apparatus therefor
JP2003164793A (en) * 2001-09-18 2003-06-10 Matsushita Electric Works Ltd Coating tool and coating method
JP3840238B2 (en) 2004-07-08 2006-11-01 大日本スクリーン製造株式会社 Treatment liquid application equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452646B (en) * 2007-07-12 2014-09-11 Kondoh Ind Ltd A dry air or a nitrogen gas filling device in a semiconductor wafer storage container, and a wafer electrostatic removing device using the same

Also Published As

Publication number Publication date
JP2006135294A (en) 2006-05-25
KR20120103526A (en) 2012-09-19
KR101257660B1 (en) 2013-04-29
TWI293583B (en) 2008-02-21
JP4738085B2 (en) 2011-08-03
KR20060052081A (en) 2006-05-19

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