ATE359600T1 - Verfahren und vorrichtung zur vermeidung von kreuz-kontamination zwischen flüssigkeitsdüsen inoberflächennähe - Google Patents
Verfahren und vorrichtung zur vermeidung von kreuz-kontamination zwischen flüssigkeitsdüsen inoberflächennäheInfo
- Publication number
- ATE359600T1 ATE359600T1 AT02800444T AT02800444T ATE359600T1 AT E359600 T1 ATE359600 T1 AT E359600T1 AT 02800444 T AT02800444 T AT 02800444T AT 02800444 T AT02800444 T AT 02800444T AT E359600 T1 ATE359600 T1 AT E359600T1
- Authority
- AT
- Austria
- Prior art keywords
- nozzle
- gas
- wafer substrate
- manifold
- processing fluids
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/14—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
- B05B12/1472—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet separate supply lines supplying different materials to separate outlets of the spraying apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Nozzles (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Continuous Casting (AREA)
- Coating Apparatus (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32705501P | 2001-10-03 | 2001-10-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE359600T1 true ATE359600T1 (de) | 2007-05-15 |
Family
ID=23274939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02800444T ATE359600T1 (de) | 2001-10-03 | 2002-10-03 | Verfahren und vorrichtung zur vermeidung von kreuz-kontamination zwischen flüssigkeitsdüsen inoberflächennähe |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1440459B8 (de) |
JP (1) | JP4414758B2 (de) |
KR (1) | KR100814452B1 (de) |
CN (2) | CN100349254C (de) |
AT (1) | ATE359600T1 (de) |
AU (1) | AU2002334796A1 (de) |
DE (1) | DE60219503T2 (de) |
WO (1) | WO2003030228A2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8544483B2 (en) * | 2005-04-01 | 2013-10-01 | Tel Fsi, Inc. | Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids |
US7766566B2 (en) * | 2005-08-03 | 2010-08-03 | Tokyo Electron Limited | Developing treatment apparatus and developing treatment method |
CN101484974B (zh) | 2006-07-07 | 2013-11-06 | Fsi国际公司 | 用于处理微电子工件的设备和方法以及遮挡结构 |
JP5002450B2 (ja) * | 2007-12-28 | 2012-08-15 | 株式会社キーエンス | 除電器及びこれに組み込まれる放電電極ユニット |
JP5705723B2 (ja) | 2008-05-09 | 2015-04-22 | テル エフエスアイ インコーポレイテッド | 操作において開モードと閉モードとの切り替えを簡単に行う加工チェンバ設計を用いてマイクロ電子加工品を加工するための道具および方法 |
TW201030178A (en) * | 2008-10-10 | 2010-08-16 | Alta Devices Inc | Concentric showerhead for vapor deposition |
US20100117254A1 (en) * | 2008-11-07 | 2010-05-13 | Palo Alto Research Center Incorporated | Micro-Extrusion System With Airjet Assisted Bead Deflection |
US8704086B2 (en) | 2008-11-07 | 2014-04-22 | Solarworld Innovations Gmbh | Solar cell with structured gridline endpoints vertices |
KR101041872B1 (ko) * | 2008-11-26 | 2011-06-16 | 세메스 주식회사 | 노즐 및 이를 이용한 기판 처리 장치 및 방법 |
JP6116593B2 (ja) * | 2012-02-08 | 2017-04-19 | エーエスエムエル ネザーランズ ビー.ブイ. | 放射源及びリソグラフィ装置 |
US10720343B2 (en) * | 2016-05-31 | 2020-07-21 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
CN106442306B (zh) * | 2016-10-19 | 2023-09-01 | 辽宁石油化工大学 | 一种能实现不同溶解氧含量条件下的电化学腐蚀测试装置及方法 |
CN107297303A (zh) * | 2017-07-30 | 2017-10-27 | 合肥杰代机电科技有限公司 | 一种能够整齐排列二极管的二极管上胶机 |
JP7166089B2 (ja) * | 2018-06-29 | 2022-11-07 | 東京エレクトロン株式会社 | 基板処理装置、基板処理システムおよび基板処理方法 |
US11498036B2 (en) | 2019-03-26 | 2022-11-15 | Flow Control LLC | Gas liquid absorption device (GLAD) with replaceable gas orifice fittings and sensors |
CZ2019386A3 (cs) * | 2019-06-18 | 2020-08-19 | MODIA, s.r.o. | Tryskový nástavec pro omítací stroje |
CN110328109A (zh) * | 2019-07-31 | 2019-10-15 | 广州达森灯光股份有限公司 | 一种与通用点胶机搭配使用的点胶夹具 |
CN111451010A (zh) * | 2020-04-07 | 2020-07-28 | 芯米(厦门)半导体设备有限公司 | 用于半导体制造工艺的喷嘴机构 |
CN114405763B (zh) * | 2022-02-10 | 2022-11-22 | 深圳市飞翼科技有限公司 | 一种触摸屏生产用点胶机及点胶方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4613561A (en) * | 1984-10-17 | 1986-09-23 | James Marvin Lewis | Method of high contrast positive O-quinone diazide photoresist developing using pretreatment solution |
DE69612656T2 (de) * | 1995-01-20 | 2001-10-18 | Clariant Finance Bvi Ltd | Verfahren zur entwicklung eines positiv arbeitenden fotoresists und entwicklungszusammensetzungen dafür |
JP3113212B2 (ja) | 1996-05-09 | 2000-11-27 | 富士通株式会社 | プラズマディスプレイパネルの蛍光体層形成装置および蛍光体塗布方法 |
US5885358A (en) * | 1996-07-09 | 1999-03-23 | Applied Materials, Inc. | Gas injection slit nozzle for a plasma process reactor |
US5763006A (en) * | 1996-10-04 | 1998-06-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for automatic purge of HMDS vapor piping |
JP3185753B2 (ja) * | 1998-05-22 | 2001-07-11 | 日本電気株式会社 | 半導体装置の製造方法 |
US6248171B1 (en) * | 1998-09-17 | 2001-06-19 | Silicon Valley Group, Inc. | Yield and line width performance for liquid polymers and other materials |
JP4365920B2 (ja) * | 1999-02-02 | 2009-11-18 | キヤノン株式会社 | 分離方法及び半導体基板の製造方法 |
-
2002
- 2002-10-03 KR KR1020047004991A patent/KR100814452B1/ko active IP Right Grant
- 2002-10-03 JP JP2003533328A patent/JP4414758B2/ja not_active Expired - Lifetime
- 2002-10-03 WO PCT/US2002/031459 patent/WO2003030228A2/en active IP Right Grant
- 2002-10-03 CN CNB02823989XA patent/CN100349254C/zh not_active Expired - Lifetime
- 2002-10-03 DE DE60219503T patent/DE60219503T2/de not_active Expired - Lifetime
- 2002-10-03 CN CN2007101624303A patent/CN101251719B/zh not_active Expired - Lifetime
- 2002-10-03 AT AT02800444T patent/ATE359600T1/de not_active IP Right Cessation
- 2002-10-03 EP EP02800444A patent/EP1440459B8/de not_active Expired - Lifetime
- 2002-10-03 AU AU2002334796A patent/AU2002334796A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU2002334796A1 (en) | 2003-04-14 |
CN1605112A (zh) | 2005-04-06 |
KR100814452B1 (ko) | 2008-03-17 |
JP4414758B2 (ja) | 2010-02-10 |
CN101251719A (zh) | 2008-08-27 |
EP1440459A2 (de) | 2004-07-28 |
CN100349254C (zh) | 2007-11-14 |
WO2003030228A2 (en) | 2003-04-10 |
WO2003030228A3 (en) | 2003-07-17 |
EP1440459B8 (de) | 2007-05-30 |
DE60219503T2 (de) | 2008-01-10 |
KR20040049318A (ko) | 2004-06-11 |
DE60219503D1 (de) | 2007-05-24 |
CN101251719B (zh) | 2012-03-21 |
JP2005505919A (ja) | 2005-02-24 |
EP1440459B1 (de) | 2007-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |