DE60219503D1 - Verfahren und vorrichtung zur vermeidung von kreuz-kontamination zwischen flüssigkeitsdüsen inoberflächennähe - Google Patents

Verfahren und vorrichtung zur vermeidung von kreuz-kontamination zwischen flüssigkeitsdüsen inoberflächennähe

Info

Publication number
DE60219503D1
DE60219503D1 DE60219503T DE60219503T DE60219503D1 DE 60219503 D1 DE60219503 D1 DE 60219503D1 DE 60219503 T DE60219503 T DE 60219503T DE 60219503 T DE60219503 T DE 60219503T DE 60219503 D1 DE60219503 D1 DE 60219503D1
Authority
DE
Germany
Prior art keywords
nozzle
gas
wafer substrate
manifold
processing fluids
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60219503T
Other languages
English (en)
Other versions
DE60219503T2 (de
Inventor
Andrew Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML US Inc
Original Assignee
ASML US Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML US Inc filed Critical ASML US Inc
Publication of DE60219503D1 publication Critical patent/DE60219503D1/de
Application granted granted Critical
Publication of DE60219503T2 publication Critical patent/DE60219503T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/14—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
    • B05B12/1472—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet separate supply lines supplying different materials to separate outlets of the spraying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Nozzles (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Continuous Casting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
DE60219503T 2001-10-03 2002-10-03 Verfahren und vorrichtung zur vermeidung von kreuz-kontamination zwischen flüssigkeitsdüsen inoberflächennähe Expired - Lifetime DE60219503T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32705501P 2001-10-03 2001-10-03
US327055P 2001-10-03
PCT/US2002/031459 WO2003030228A2 (en) 2001-10-03 2002-10-03 Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface

Publications (2)

Publication Number Publication Date
DE60219503D1 true DE60219503D1 (de) 2007-05-24
DE60219503T2 DE60219503T2 (de) 2008-01-10

Family

ID=23274939

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60219503T Expired - Lifetime DE60219503T2 (de) 2001-10-03 2002-10-03 Verfahren und vorrichtung zur vermeidung von kreuz-kontamination zwischen flüssigkeitsdüsen inoberflächennähe

Country Status (8)

Country Link
EP (1) EP1440459B8 (de)
JP (1) JP4414758B2 (de)
KR (1) KR100814452B1 (de)
CN (2) CN101251719B (de)
AT (1) ATE359600T1 (de)
AU (1) AU2002334796A1 (de)
DE (1) DE60219503T2 (de)
WO (1) WO2003030228A2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101255048B1 (ko) * 2005-04-01 2013-04-16 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치
US7766566B2 (en) * 2005-08-03 2010-08-03 Tokyo Electron Limited Developing treatment apparatus and developing treatment method
CN101484974B (zh) 2006-07-07 2013-11-06 Fsi国际公司 用于处理微电子工件的设备和方法以及遮挡结构
JP5002450B2 (ja) * 2007-12-28 2012-08-15 株式会社キーエンス 除電器及びこれに組み込まれる放電電極ユニット
JP5705723B2 (ja) 2008-05-09 2015-04-22 テル エフエスアイ インコーポレイテッド 操作において開モードと閉モードとの切り替えを簡単に行う加工チェンバ設計を用いてマイクロ電子加工品を加工するための道具および方法
EP2359392A2 (de) * 2008-10-10 2011-08-24 Alta Devices, Inc. Konzentrischer duschkopf zur dampfabscheidung
US8704086B2 (en) 2008-11-07 2014-04-22 Solarworld Innovations Gmbh Solar cell with structured gridline endpoints vertices
US20100117254A1 (en) * 2008-11-07 2010-05-13 Palo Alto Research Center Incorporated Micro-Extrusion System With Airjet Assisted Bead Deflection
KR101041872B1 (ko) * 2008-11-26 2011-06-16 세메스 주식회사 노즐 및 이를 이용한 기판 처리 장치 및 방법
JP6116593B2 (ja) * 2012-02-08 2017-04-19 エーエスエムエル ネザーランズ ビー．ブイ． 放射源及びリソグラフィ装置
US10720343B2 (en) * 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
CN106442306B (zh) * 2016-10-19 2023-09-01 辽宁石油化工大学 一种能实现不同溶解氧含量条件下的电化学腐蚀测试装置及方法
CN107297303A (zh) * 2017-07-30 2017-10-27 合肥杰代机电科技有限公司 一种能够整齐排列二极管的二极管上胶机
JP7166089B2 (ja) * 2018-06-29 2022-11-07 東京エレクトロン株式会社 基板処理装置、基板処理システムおよび基板処理方法
US11498036B2 (en) 2019-03-26 2022-11-15 Flow Control LLC Gas liquid absorption device (GLAD) with replaceable gas orifice fittings and sensors
CZ2019386A3 (cs) 2019-06-18 2020-08-19 MODIA, s.r.o. Tryskový nástavec pro omítací stroje
CN110328109A (zh) * 2019-07-31 2019-10-15 广州达森灯光股份有限公司 一种与通用点胶机搭配使用的点胶夹具
CN111451010A (zh) * 2020-04-07 2020-07-28 芯米(厦门)半导体设备有限公司 用于半导体制造工艺的喷嘴机构
CN114405763B (zh) * 2022-02-10 2022-11-22 深圳市飞翼科技有限公司 一种触摸屏生产用点胶机及点胶方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613561A (en) * 1984-10-17 1986-09-23 James Marvin Lewis Method of high contrast positive O-quinone diazide photoresist developing using pretreatment solution
JP3578462B2 (ja) * 1995-01-20 2004-10-20 ヘキスト・セラニーズ・コーポレイション ポジ型フォトレジストの現像方法およびそのための組成物
JP3113212B2 (ja) 1996-05-09 2000-11-27 富士通株式会社 プラズマディスプレイパネルの蛍光体層形成装置および蛍光体塗布方法
US5885358A (en) * 1996-07-09 1999-03-23 Applied Materials, Inc. Gas injection slit nozzle for a plasma process reactor
US5763006A (en) * 1996-10-04 1998-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for automatic purge of HMDS vapor piping
JP3185753B2 (ja) * 1998-05-22 2001-07-11 日本電気株式会社 半導体装置の製造方法
US6248171B1 (en) * 1998-09-17 2001-06-19 Silicon Valley Group, Inc. Yield and line width performance for liquid polymers and other materials
JP4365920B2 (ja) * 1999-02-02 2009-11-18 キヤノン株式会社 分離方法及び半導体基板の製造方法

Also Published As

Publication number Publication date
KR100814452B1 (ko) 2008-03-17
CN100349254C (zh) 2007-11-14
AU2002334796A1 (en) 2003-04-14
CN1605112A (zh) 2005-04-06
DE60219503T2 (de) 2008-01-10
JP2005505919A (ja) 2005-02-24
KR20040049318A (ko) 2004-06-11
CN101251719A (zh) 2008-08-27
EP1440459B1 (de) 2007-04-11
EP1440459B8 (de) 2007-05-30
CN101251719B (zh) 2012-03-21
WO2003030228A2 (en) 2003-04-10
JP4414758B2 (ja) 2010-02-10
ATE359600T1 (de) 2007-05-15
WO2003030228A3 (en) 2003-07-17
EP1440459A2 (de) 2004-07-28

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: ASML US, INC., SAN JOSE, CALIF., US

8364 No opposition during term of opposition