CN1618527A - 基板处理装置、细缝喷嘴、被填充体的液体填充度判定机构及气体混入度判定机构 - Google Patents
基板处理装置、细缝喷嘴、被填充体的液体填充度判定机构及气体混入度判定机构 Download PDFInfo
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- CN1618527A CN1618527A CNA2004100925564A CN200410092556A CN1618527A CN 1618527 A CN1618527 A CN 1618527A CN A2004100925564 A CNA2004100925564 A CN A2004100925564A CN 200410092556 A CN200410092556 A CN 200410092556A CN 1618527 A CN1618527 A CN 1618527A
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- jet nozzle
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- light beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/025—Processes for applying liquids or other fluent materials performed by spraying using gas close to its critical state
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
Description
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003387641A JP4315787B2 (ja) | 2003-11-18 | 2003-11-18 | 基板処理装置、並びに被充填体における液体充填度および気体混入度判定構造 |
JP2003387641 | 2003-11-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1618527A true CN1618527A (zh) | 2005-05-25 |
CN100335182C CN100335182C (zh) | 2007-09-05 |
Family
ID=34694942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100925564A Active CN100335182C (zh) | 2003-11-18 | 2004-11-15 | 基板处理装置以及细缝喷嘴 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4315787B2 (zh) |
KR (1) | KR100641724B1 (zh) |
CN (1) | CN100335182C (zh) |
TW (1) | TWI265831B (zh) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1885164B (zh) * | 2005-06-24 | 2010-04-07 | 友达光电股份有限公司 | 光阻涂布方法及其光阻涂布设备 |
CN101114575B (zh) * | 2006-07-26 | 2010-07-21 | 芝浦机械电子株式会社 | 基板的处理装置 |
CN101463808B (zh) * | 2007-12-21 | 2010-12-08 | 研能科技股份有限公司 | 流体输送装置 |
CN101045228B (zh) * | 2006-03-31 | 2011-06-29 | 东丽株式会社 | 涂布方法以及涂布装置、显示器用部件的制造方法以及制造装置 |
CN101615566B (zh) * | 2008-06-25 | 2012-05-02 | 东京毅力科创株式会社 | 基板处理装置 |
CN1970168B (zh) * | 2005-11-24 | 2012-08-29 | 大日本网目版制造株式会社 | 涂敷装置以及涂敷方法 |
CN103229349A (zh) * | 2010-11-25 | 2013-07-31 | 东京毅力科创株式会社 | 色素吸附装置、色素吸附方法及基板处理装置 |
CN103984213A (zh) * | 2014-04-15 | 2014-08-13 | 清华大学深圳研究生院 | 一种具有均压流道的均匀出流显影喷嘴 |
CN104166318A (zh) * | 2014-09-09 | 2014-11-26 | 清华大学深圳研究生院 | 静压出流显影喷嘴 |
CN104858104A (zh) * | 2014-02-25 | 2015-08-26 | 东京应化工业株式会社 | 喷嘴以及涂敷装置 |
CN112505035A (zh) * | 2019-09-13 | 2021-03-16 | 株式会社斯库林集团 | 喷嘴内部的气液界面的检测方法及衬底处理装置 |
CN114618747A (zh) * | 2020-12-10 | 2022-06-14 | 显示器生产服务株式会社 | 流体喷射装置 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100711354B1 (ko) * | 2005-07-29 | 2007-04-27 | 주식회사 포스코 | 강판의 표면 처리액 도포장치 |
JP5176359B2 (ja) * | 2006-03-31 | 2013-04-03 | 東レ株式会社 | 塗布装置および塗布方法並びにディスプレイ用部材の製造方法および製造装置 |
KR101309037B1 (ko) * | 2006-06-23 | 2013-09-17 | 엘지디스플레이 주식회사 | 슬릿코터 |
KR101374096B1 (ko) * | 2006-06-27 | 2014-03-13 | 엘지디스플레이 주식회사 | 스핀리스 코터 및 이를 이용한 코팅방법 |
JP2008062207A (ja) * | 2006-09-11 | 2008-03-21 | Tokyo Ohka Kogyo Co Ltd | 塗布装置 |
JP4717782B2 (ja) * | 2006-11-13 | 2011-07-06 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5202838B2 (ja) * | 2006-12-12 | 2013-06-05 | 東京応化工業株式会社 | スリットノズル |
JP2009010245A (ja) * | 2007-06-29 | 2009-01-15 | Hoya Corp | マスクブランクの製造方法及び塗布装置 |
JP5278646B2 (ja) * | 2007-11-30 | 2013-09-04 | 凸版印刷株式会社 | スリットコータおよび塗工方法 |
JP5157486B2 (ja) * | 2008-01-30 | 2013-03-06 | 大日本印刷株式会社 | ダイヘッド及びこれを備えたダイコーター |
KR100989928B1 (ko) * | 2008-07-09 | 2010-10-26 | (주)티에스티아이테크 | 유체 토출 장치 및 그의 세정 방법 |
JP2010240550A (ja) * | 2009-04-03 | 2010-10-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP4668330B2 (ja) | 2009-04-16 | 2011-04-13 | シーケーディ株式会社 | 液体吐出装置 |
JP5154510B2 (ja) * | 2009-06-05 | 2013-02-27 | 東京エレクトロン株式会社 | プライミング処理方法及びプライミング処理装置 |
JP5444921B2 (ja) * | 2009-07-31 | 2014-03-19 | カシオ計算機株式会社 | 吐出ノズル、吐出装置及び気泡の除去方法 |
JP5138058B2 (ja) * | 2011-03-07 | 2013-02-06 | 東レ株式会社 | 清掃部材と塗布器の清掃方法及び清掃装置並びにディスプレイ用部材の製造方法 |
KR101621215B1 (ko) * | 2011-12-01 | 2016-05-16 | 다즈모 가부시키가이샤 | 도포장치 및 도포방법 |
JP6055280B2 (ja) | 2012-11-11 | 2016-12-27 | 平田機工株式会社 | 塗布液充填方法 |
JP6264811B2 (ja) * | 2013-09-27 | 2018-01-24 | 日本電気株式会社 | 塗布装置及び塗布方法 |
JP6367075B2 (ja) * | 2014-10-08 | 2018-08-01 | 株式会社ヒラノテクシード | ダイとダイの空気抜き方法 |
JP6385864B2 (ja) * | 2015-03-18 | 2018-09-05 | 株式会社東芝 | ノズルおよび液体供給装置 |
JP6967477B2 (ja) * | 2018-03-22 | 2021-11-17 | 東レ株式会社 | 塗布器、及び塗布器のエア排出方法 |
JP7111568B2 (ja) * | 2018-09-13 | 2022-08-02 | 株式会社Screenホールディングス | 基板処理装置、基板処理方法および基板処理のためのコンピュータプログラム |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100284556B1 (ko) * | 1993-03-25 | 2001-04-02 | 다카시마 히로시 | 도포막 형성방법 및 그를 위한 장치 |
JPH07328510A (ja) * | 1994-06-14 | 1995-12-19 | Dainippon Screen Mfg Co Ltd | 塗布装置及び塗布方法 |
JPH09253556A (ja) * | 1996-03-22 | 1997-09-30 | Toray Ind Inc | 塗布装置および塗布方法並びにカラーフィルタの製造装置および製造方法 |
JP3245813B2 (ja) * | 1996-11-27 | 2002-01-15 | 東京エレクトロン株式会社 | 塗布膜形成装置 |
JP3956425B2 (ja) * | 1997-04-11 | 2007-08-08 | 東レ株式会社 | カラーフィルタ製造用塗布装置及びカラーフィルタの製造方法 |
-
2003
- 2003-11-18 JP JP2003387641A patent/JP4315787B2/ja not_active Expired - Fee Related
-
2004
- 2004-10-12 TW TW093130890A patent/TWI265831B/zh active
- 2004-11-15 CN CNB2004100925564A patent/CN100335182C/zh active Active
- 2004-11-17 KR KR1020040094205A patent/KR100641724B1/ko active IP Right Grant
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1885164B (zh) * | 2005-06-24 | 2010-04-07 | 友达光电股份有限公司 | 光阻涂布方法及其光阻涂布设备 |
CN1970168B (zh) * | 2005-11-24 | 2012-08-29 | 大日本网目版制造株式会社 | 涂敷装置以及涂敷方法 |
CN101045228B (zh) * | 2006-03-31 | 2011-06-29 | 东丽株式会社 | 涂布方法以及涂布装置、显示器用部件的制造方法以及制造装置 |
CN101114575B (zh) * | 2006-07-26 | 2010-07-21 | 芝浦机械电子株式会社 | 基板的处理装置 |
CN101463808B (zh) * | 2007-12-21 | 2010-12-08 | 研能科技股份有限公司 | 流体输送装置 |
CN101615566B (zh) * | 2008-06-25 | 2012-05-02 | 东京毅力科创株式会社 | 基板处理装置 |
CN103229349A (zh) * | 2010-11-25 | 2013-07-31 | 东京毅力科创株式会社 | 色素吸附装置、色素吸附方法及基板处理装置 |
CN104858104A (zh) * | 2014-02-25 | 2015-08-26 | 东京应化工业株式会社 | 喷嘴以及涂敷装置 |
CN104858104B (zh) * | 2014-02-25 | 2018-10-02 | 东京应化工业株式会社 | 喷嘴以及涂敷装置 |
CN103984213A (zh) * | 2014-04-15 | 2014-08-13 | 清华大学深圳研究生院 | 一种具有均压流道的均匀出流显影喷嘴 |
CN103984213B (zh) * | 2014-04-15 | 2017-05-31 | 清华大学深圳研究生院 | 一种具有均压流道的均匀出流显影喷嘴 |
CN104166318A (zh) * | 2014-09-09 | 2014-11-26 | 清华大学深圳研究生院 | 静压出流显影喷嘴 |
CN112505035A (zh) * | 2019-09-13 | 2021-03-16 | 株式会社斯库林集团 | 喷嘴内部的气液界面的检测方法及衬底处理装置 |
CN114618747A (zh) * | 2020-12-10 | 2022-06-14 | 显示器生产服务株式会社 | 流体喷射装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4315787B2 (ja) | 2009-08-19 |
KR20050048507A (ko) | 2005-05-24 |
TW200526329A (en) | 2005-08-16 |
TWI265831B (en) | 2006-11-11 |
CN100335182C (zh) | 2007-09-05 |
KR100641724B1 (ko) | 2006-11-10 |
JP2005144376A (ja) | 2005-06-09 |
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Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
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Address after: Kyoto Japan Patentee after: Skilling Group Address before: Kyoto Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |