CN100335182C - Base plate treater and slit jet nozzle - Google Patents

Base plate treater and slit jet nozzle Download PDF

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Publication number
CN100335182C
CN100335182C CN 200410092556 CN200410092556A CN100335182C CN 100335182 C CN100335182 C CN 100335182C CN 200410092556 CN200410092556 CN 200410092556 CN 200410092556 A CN200410092556 A CN 200410092556A CN 100335182 C CN100335182 C CN 100335182C
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slit nozzle
slit
predetermined
liquid
nozzle
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CN 200410092556
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CN1618527A (en
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高木善则
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大日本网目版制造株式会社
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Abstract

本发明提供一种可简单而且确实地排去集管的空气、并且不产生涂敷不均的细缝喷嘴和具有该细缝喷嘴的涂敷处理装置。 The present invention provides a simple and surely discharge the air to the manifold, and no coating unevenness and coating nozzle slit of the slit processing apparatus having a nozzle. 细缝喷嘴(41)在两侧端部具有抗蚀剂液的供给口(46a、46b),集管(45)的上面(45a)在排气孔(47)的端部(47a)与供给口(46a、46b)之间具有倾斜。 The supply port (46a, 46b) of the nozzle slit (41) having a resist solution on both side portions, (45a) above an end portion of the header (45) in the vent (47) (47a) supplied with between the port has an inclined (46a, 46b). 根据该形状,混入到填充了的抗蚀剂液中的气泡容易从排气孔(47)排出。 Easily discharged from the exhaust hole (47) in accordance with the shape of the air bubbles mixed into the filled liquid resist. 另外,抗蚀剂液从供给口(46a、46b)侧流动到排气孔(47),所以不产生抗蚀剂液的不滞留,可在短时间内确实地进行填充时的排气。 Further, the resist solution supply port (46a, 46b) to the discharge side flow hole (47) is not generated in the resist solution is not retained, the exhaust gas can be reliably performed in a short time of filling. 另外,在涂敷处理时,因为抗蚀剂液的粘度不产生局部差异,所以可形成均匀的涂敷膜。 Further, when the coating process, since the viscosity of the resist solution does not produce local differences, it is possible to form a uniform coating film.

Description

基板处理装置以及细缝喷嘴 The substrate processing apparatus and a slit nozzle

技术领域 FIELD

本发明涉及一种对液晶用玻璃基板、半导体晶片、薄膜液晶用挠性基板、光掩模用基板、滤色片用基板等各种基板进行主要在其表面上涂敷处理液的涂敷处理的基板处理装置。 The present invention relates to a liquid crystal glass substrate, a semiconductor wafer, the flexible substrate film for liquid crystal, photomask primary coating process of coating the treatment liquid on its surface with the substrate, the color filter substrate or the like with various substrates the substrate processing apparatus.

背景技术 Background technique

作为在液晶用玻璃基板、半导体晶片、薄膜液晶用挠性基板、光掩模用基板、滤色片用基板等各种基板的表面上涂敷光致抗蚀剂等处理液的涂敷处理装置,已知使用具有细缝状的排出部的细缝喷嘴进行细缝涂敷的细缝涂敷机、一旦实施了细缝涂敷后进行旋转涂敷的细缝和旋转涂敷机。 As a liquid crystal glass substrate, a semiconductor wafer, a liquid crystal film with a flexible substrate, applying a photomask substrate processing apparatus, the color filter is applied on the surface of various substrates and other substrates photoresist processing liquid known to use a slit coater having a slit-shaped slit nozzle discharge slit portion is coated by spin coating and a slit spin coater, once a slit coating embodiment.

在这样的涂敷处理装置的细缝喷嘴中,气体(主要为空气)有可能作为气泡等混入到光致抗蚀剂等处理液的内部。 In the slit nozzle coating process such apparatus, the gas (mainly air) may be used as internal air bubbles mixed into the photoresist process solution. 空气混入例如存在如下那样的情况。 For example, as follows aeration presence.

·由于喷嘴内部的压力变动或阀开闭时的压力变动而由抗蚀剂本身产生的情况;·在涂敷结束时在使膜厚一定化的吸回处理中从喷嘴前端混入的情况;·装置初始设立时将抗蚀剂填充到喷嘴内部的情况。 · The pressure fluctuation inside the nozzle valve opening or closing the pressure fluctuation generated by the case where the resist itself; * At the end of the film thickness of the coating in the situation of a certain process sucked back from the end of the nozzle is mixed; - when initially setting up the apparatus to resist the internal filling nozzle.

而空气的混入导致以下那样的问题发生。 The incorporation of air leads to the following problems occur.

·空气与抗蚀剂反应,在喷嘴内形成凝胶状物质,从而不能从细缝均匀地排出,发生条状的涂敷不均;·由于空气混入使涂敷开始时的排出流量发生一阶延时,涂敷开始时的膜厚不稳定;·由于空气混入而在涂敷结束时,相反发生抗蚀剂排出停止的延迟,膜厚变得不稳定;·由于空气混入使喷嘴内部的抗蚀剂动压力分布变化,产生放射状的不均。 · Resist reaction with air, gel-like substance is formed in the nozzle, and thus can not be uniformly discharged from the slit, the occurrence of coating unevenness strip; - since the flow rate of air into the discharge begins to occur during a coating step delay, instability of thickness of the coating start; - since air is mixed in the end of the coating, the opposite occurs resist delay in stopping the discharge, the film thickness becomes unstable; - since the air is mixed inside the nozzle so that the anti- corrosion inhibitors dynamic pressure distribution changes, the radial unevenness.

为了避免这些问题,需要准确而且迅速地进行喷嘴内部的排气。 To avoid these problems, it is necessary to accurately and quickly perform the exhaust gas inside the nozzle. 以这样准确而且迅速的排气为目的的技术已为公知(例如参照专利文献1和专利文献2)。 In such accurate and rapid technique for the purpose of exhaust gas, it is well known (e.g. see Patent Document 1 and Patent Document 2).

另外,在涂敷处理装置中,由于在细缝喷嘴的内部局部产生抗蚀剂的滞留,从而使细缝喷嘴内部的抗蚀剂流动性变差,根据不同的所使用的抗蚀剂的种类,可能会发生放射状的涂敷不均。 Further, in the coating process apparatus, since a resist is locally retained inside the slit nozzle, so that the interior of the slit nozzle resist flow variation, according to the type of the resist to be used in different coating may occur radial uneven. 这就缩小了在涂敷处理装置中可使用的抗蚀剂的种类和粘度的选择范围(抗蚀剂范围)。 This reduces the choice of type and viscosity of the resist in the coating apparatus may be used in the processing (resist range). 为了避免这一点,在时常使细缝喷嘴内部的抗蚀剂流动的同时进行涂敷的技术已为公知(例如参照专利文献3)。 To avoid this, technology is often applied in the interior of the resist flowing while the slit nozzle, is well known (e.g., refer to Patent Document 3). 或者,使涂敷层的厚度均匀化的技术也已为公知(例如参照专利文献4或专利文献5)。 Alternatively, the thickness of the coating layer uniform in the art also are well known (e.g., refer to Patent Document 4 or Patent Document 5).

专利文献1为日本专利特开平7-328510号公报,专利文献2为日本专利特开平9-253556号公报,专利文献3为日本专利特开平10-286507号公报,专利文献4为日本专利特开平8-182955号公报,专利文献5为日本专利特开2003-33715号公报。 Patent Document 1 Japanese Patent Laid-Open Publication No. 7-328510, Patent Document 2 Japanese Patent Laid-Open Publication No. 9-253556, Patent Document 3 Japanese Patent Laid-Open Publication No. 10-286507, Patent Document 4 Japanese Patent Laid-Open Publication No. 8-182955, Patent Document 5 Japanese Patent Laid-open Publication No. 2003-33715.

在记载于专利文献1和专利文献2中的细缝涂敷机中,采用通过使细缝喷嘴朝上排出抗蚀剂从而排走细缝喷嘴内部的空气的方法。 In the slit coater described in Patent Document 2 and Patent Document 1, the method employed by the slit nozzle so as to resist the upward discharge of air discharged inside the slit nozzle. 然而,该方法存在以下那样的问题。 However, there is such a problem with this method.

·由于使细缝喷嘴反转进行排气,所以细缝喷嘴安装部的结构变得复杂;·由于不能获得空气排完后的细缝喷嘴主体与基板面的定位的再现性,所以需要细缝喷嘴调整用的原点恢复动作;·即使在微小体积的空气混入到细缝喷嘴内部的情况下,也需要使细缝喷嘴反转,排出与细缝喷嘴内部的整体体积相当的抗蚀剂,非常麻烦;·由于在使细缝喷嘴朝上的状态下排出抗蚀剂而实施排气,所以发生将排出的抗蚀剂擦去的作业,该作业非常困难,不能很干净地擦去抗蚀剂,所以装置受到污染;·由于未设置检测细缝喷嘴内部的空气是否完全排出的检测装置,所以为了充分排气而需要排出超出必要的抗蚀剂。 · Since the exhaust reverse slit nozzle, the structure of mounting the nozzle slit portion becomes complicated; * can not be obtained due to the reproducibility of the air discharge slits positioned after the nozzle body and substrate surface, it is necessary to slit nozzle used to adjust the origin recovery operation; - even tiny volume of air mixed into the internal nozzle slit, the slit nozzle is also necessary to reverse, and the entire volume inside the discharge slit nozzle corresponding to resist very trouble; - since the discharge so that the resist in a state facing the slit nozzle exhaust embodiment, the resist is discharged wipe job occurs, the operation is very difficult, not very cleanly wiped off resist , the device contamination; - since the detection means detects whether the air inside the slit nozzle is not provided completely discharged, so that the exhaust gas is required in order to sufficiently resist discharged than necessary.

另外,记载于专利文献3的装置具有使内部的容积等最佳化的细缝模具,在1次的涂敷中将所供给的抗蚀剂全部用完。 Further, in the apparatus disclosed in Patent Document 3 has a volume inside the like optimized slit die 1 in the resist coating supplied fully utilized. 然而,该装置也存在以下那样的问题。 However, this means there are the following problems.

·需要相应于作为目标的涂敷膜厚和所使用的抗蚀剂的固体成分浓度制作细缝模具,由1个细缝模具不能对应各种的涂敷膜厚。 * Corresponding to the required thickness of the solid content of the coating and the resist to be used as a target making slit die, the slit die 1 can correspond to a variety of coating film thickness.

另外,记载于专利文献3~专利文献5中的发明不是以解决相对空气混入的上述那样的问题为目的。 Further, the invention described in Patent Document 3 to Patent Document 5 not to solve the above-mentioned problem for the purpose of opposing the aeration.

发明内容 SUMMARY

本发明就是鉴于上述问题而作出的,其目的在于提供一种可简便而且确实地排走细缝喷嘴内部的气体并且不产生涂敷不均的细缝喷嘴和具有该细缝喷嘴的涂敷处理装置。 The present invention is made in view of the above problems, and an object thereof is to provide an easy and surely gas discharged inside the slit nozzle coating unevenness and no slit nozzle having the slit nozzle coating process device.

为了解决上述问题,本发明所述的一种基板处理装置,具有:保持基板的保持台;排出规定的处理液的细缝喷嘴;使上述细缝喷嘴在沿着上述基板的表面的大致水平方向上移动的移动机构;将上述规定的处理液从规定的处理液供给源供给到上述细缝喷嘴的处理液供给机构,通过使上述细缝喷嘴在上述大致水平方向上移动,使上述细缝喷嘴扫描上述基板的表面,同时使填充于上述细缝喷嘴的内部的上述规定的处理液排出,从而将上述规定的处理液涂敷到基板上,其中,在上述细缝喷嘴中,与上述处理液供给机构连接、将上述规定的处理液供给到上述细缝喷嘴的集管的供给口设置于上述集管的纵向方向的两侧端部中至少一个的侧端部,将存在于上述细缝喷嘴内部的流体排出到上述细缝喷嘴的外部的排出口设置于上述集管的上端部,上述排出口设置在比 To solve the above problems, a substrate processing apparatus according to the present invention, comprising: a holding table for holding a substrate; slit nozzle discharging a predetermined processing liquid; so that the nozzle slit along a substantially horizontal direction of the substrate surface a moving mechanism moving; the predetermined treatment liquid is supplied from the processing liquid supply source to a predetermined process liquid supply mechanism described above slit nozzle, so that the slit nozzle by the movement in said substantially horizontal direction, so that the slit nozzle scanning the surface of the substrate, while the predetermined treatment liquid filled in the inside of the discharge slit nozzle, whereby the treatment liquid is applied onto the predetermined substrate, wherein, in the above-described slit nozzle, the above-described treatment liquid supply means connected to both ends, the predetermined processing liquid supplied to the supply port slit nozzle header is provided to the longitudinal direction of the manifold-side end portion of at least one, will be present to the slit nozzle fluid inside is discharged to the outside of the upper end portion of the discharge outlet of the slit nozzle is provided in the header, the outlet is provided than 述供给口高的位置。 Said high supply port position.

本发明所述的基板处理装置,其中,上述供给口设置于上述集管的纵向方向的两侧端部中的第1侧端部,上述排出口设置于上述集管的纵向方向的两侧端部中的第2侧端部。 A first side end portion of both ends of the substrate processing apparatus according to the present invention, wherein the supply port is provided in the longitudinal direction of said header, said outlet disposed in the longitudinal direction of the both side ends of the header the second side portion of the end portion.

本发明所述的基板处理装置,其中,上述至少1个供给口为分别设置于上述集管的纵向方向的两侧端部的第1和第2供给口。 First and second supply ports both ends of a substrate processing apparatus according to the present invention, wherein the at least one supply port are arranged in the longitudinal direction of said collector tube.

本发明所述的基板处理装置,其中,上述排出口设置于连接上述第1与第2供给口的区间的大致中央位置。 The substrate processing apparatus according to the present invention, wherein the discharge outlet is provided at a substantially central position connecting the first section and the second feed port.

本发明所述的基板处理装置,其中,上述集管的上面从上述供给口朝向上述排出口倾斜。 The substrate processing apparatus according to the present invention, wherein the inclined upper surface of the collector tube from the outlet toward the supply port.

本发明所述的基板处理装置,其中,上述集管从下面到上面的高度从上述供给口侧越往上述排出口侧越大。 The substrate processing apparatus according to the present invention, wherein the header from below to above the greater the height from the supply port side toward the outlet side.

本发明所述的基板处理装置,其中,上述集管的截面积从上述供给口侧越往上述排出口侧越大。 The substrate processing apparatus according to the present invention, wherein the cross-sectional area of ​​the manifold from the supply of the larger opening side toward the outlet side.

本发明所述的基板处理装置,其中,上述流体为存在于上述细缝喷嘴内部的气体和混入了气体的上述处理液。 The substrate processing apparatus according to the present invention, wherein the fluid is a gas present in the interior of the slit nozzle and the mixed gas of the treatment solution.

本发明所述的基板处理装置,其中,具有:连接于上述排出口的排出路径;配置于上述排出路径的中途、检测上述排出路径内的处理液的填充状态的检测装置。 The substrate processing apparatus according to the present invention, wherein: a discharge path connected to the discharge outlet; arranged in the middle of the discharge path, detection means for detecting the filling state of the treatment liquid in the discharge path.

本发明所述的基板处理装置,其中,还具有判定相对于上述细缝喷嘴的上述规定的处理液的填充度的判定装置,上述排出路径具有光学上透明的、弯曲成U字形的弯曲部分,上述弯曲部分朝向上侧,上述检测装置配置在上述弯曲部分的附近,对上述弯曲部分的规定位置发出第1光束,同时接收伴随着上述第1光束的照射而从上述规定位置获得的第2光束,上述判定装置根据由上述检测装置接收到的上述第2光束的光强度的变动判定上述填充度。 The substrate processing apparatus according to the present invention, wherein further comprising determining the degree of filling of the treatment liquid is determined with respect to the predetermined slit nozzle means, the discharge path has an optically transparent, a bent portion bent into a U-shape, the curved portion toward the upper side, the detecting means disposed in the vicinity of the curved portion, emits a first light beam to a predetermined position of the bent portion while receiving accompanied by irradiating the first light beam and second light beam obtained from said predetermined position the determining device determines the filling level based on changes in light intensity of the second light beam received by said detecting means.

本发明所述的基板处理装置,其中,具有:连接于上述排出口的排出路径;配置于上述排出路径的中途、检测上述排出路径内的处理液的气体混入状态的检测装置。 The substrate processing apparatus according to the present invention, wherein: a discharge path connected to the discharge outlet; arranged in the middle of the discharge path, the detection of the gas-treating solution is mixed in the discharge path state detection means.

本发明所述的基板处理装置,其中,还具有判定装置,其判定气体对相对于上述细缝喷嘴的上述规定的处理液的混入,上述排出路径具有光学上透明的、弯曲成U字形的弯曲部分,上述弯曲部分朝向上侧,上述检测装置配置在上述弯曲部分的附近,对上述弯曲部分的规定位置发出第1光束,同时接收伴随着上述第1光束的照射而从上述规定位置获得的第2光束,上述判定装置根据由上述检测装置接收到的上述第2光束的光强度的变动判定上述气体的混入。 The substrate processing apparatus according to the present invention, wherein further comprising determining means for determining the predetermined mixed gas with respect to the slit nozzle of the processing liquid, the discharge path having optically transparent, bent in a U-shaped bend the first portion, said curved portion toward the upper side, the detecting means disposed in the vicinity of the curved portion, emits a first light beam to a predetermined position of the bent portion while receiving accompanied by irradiating the first light beam and the position obtained from said predetermined beam 2, the determining means determines that the gas is mixed according to the variation of the light intensity of the second light beam received by said detecting means.

本发明所述的基板处理装置,其中,上述处理液供给机构可选择地供给上述规定的处理液、和从规定的清洗液供给源获得的清洗上述细缝喷嘴的内部的清洗液。 Processing liquid substrate processing apparatus according to the present invention, wherein the process liquid supply means selectively supply the predetermined, and washing the inside of the cleaning liquid nozzle slit obtained from a predetermined cleaning liquid supply source.

本发明所述的基板处理装置,其中,上述处理液供给机构可在用清洗上述细缝喷嘴内部的清洗液置换上述规定的处理液后供给上述清洗液。 The substrate processing apparatus according to the present invention, wherein the process liquid supply mechanism may be slit by washing the inside of the cleaning liquid nozzle replacing the predetermined process liquid is supplied after the cleaning liquid.

本发明所述的一种细缝喷嘴,由规定的移动机构移动而扫描被处理体的表面,同时排出由规定的处理液供给机构供给的规定的处理液,从而对上述被处理体提供上述规定的处理液,其中,连接于上述处理液供给机构、将上述规定的处理液供给到上述细缝喷嘴的集管的供给口设置于上述集管的纵向方向的两侧端部中至少一个的侧端部,将存在于上述细缝喷嘴内部的流体排出到上述细缝喷嘴的外部的排出口设置于上述集管的上端部,上述排出口设置在比上述供给口高的位置。 One kind of slit nozzle according to the present invention, by a predetermined moving mechanism and the scanned surface thereof to be treated, a predetermined process liquid while discharging a process liquid supply mechanism supplying predetermined, thereby providing the predetermined material to be processed on the above-described both end portions of the processing solution, wherein the supply port is connected to the header processing liquid supplying means, the predetermined processing liquid supplied to the slit nozzle disposed in the longitudinal direction of the header of the at least one side end, the fluid present in the interior of the nozzle discharge slit to the upper end portion of the outer outlet of said discharge slits is provided in the nozzle header, the outlet is provided higher than the supply position of the mouth.

本发明所述的细缝喷嘴,其中,上述供给口设置于上述集管的纵向方向的两侧端部中的第1侧端部,上述排出口设置于上述集管的纵向方向的两侧端部中的第2侧端部。 A first side end portion of both ends of the slit nozzle according to the present invention, wherein the supply port is provided in the longitudinal direction of said header, said outlet disposed in the longitudinal direction of the both side ends of the header the second side portion of the end portion.

本发明所述的细缝喷嘴,其中,上述至少1个供给口为分别设置于上述集管的纵向方向的两侧端部的第1和第2供给口。 First and second supply ports of both ends of the slit nozzle according to the present invention, wherein the at least one supply port are arranged in the longitudinal direction of said collector tube.

本发明所述的细缝喷嘴,其中,上述排出口设置于连接上述第1与第2供给口的区间的大致中央位置。 Slit nozzle according to the present invention, wherein the discharge outlet is provided at a substantially central position for connecting the first section and the second supply port.

本发明所述的细缝喷嘴,其中,上述集管的上面从上述供给口朝向上述排出口倾斜。 Slit nozzle according to the present invention, wherein the inclined upper surface of the collector tube from the outlet toward the supply port.

本发明所述的细缝喷嘴,其中,上述集管从下面到上面的高度从上述供给口侧越往上述排出口侧越大。 Slit nozzle according to the present invention, wherein the header from below to above the greater the height from the supply port side toward the outlet side.

本发明所述的细缝喷嘴,其中,上述集管的截面积从上述供给口侧越往上述排出口侧越大。 Slit nozzle according to the present invention, wherein the cross-sectional area of ​​the manifold from the supply of the larger opening side toward the outlet side.

本发明所述的细缝喷嘴,其中,上述流体为存在于上述细缝喷嘴内部的气体和混入了气体的上述处理液。 Slit nozzle according to the present invention, wherein the fluid is a gas present in the interior of the slit nozzle and the mixed gas of the treatment solution.

本发明所述的一种被填充体的液体填充度判定机构,用于判定被填充体中的规定的液体的填充度,该被填充体通过由规定的供给装置供给上述规定的液体而填充上述规定的液体,其中,具有:排出口,将上述被填充体内部的气体和填充物排出到上述被填充体的外部;排出路径,连接于上述排出口,具有光学上透明的、弯曲成U字形的弯曲部分,上述弯曲部分朝向上侧;检测装置,配置于上述弯曲部分的附近,对上述弯曲部分的规定位置发出第1光束,同时接收伴随着上述第1光束的照射而从上述规定位置获得的第2光束;判定装置,根据由上述检测装置接收到的上述第2光束的光强度的变动判定相对于上述被填充体的上述规定的液体的填充度。 Degree of filling of the liquid according to the present invention is one kind of filler determination means for determining the predetermined degree of filling of the liquid filled body, which is filled with the filler and the liquid supply by the supply means by a predetermined in the predetermined predetermined liquid, wherein: a discharge port to discharge of inside of the filler gas and the filling to the outside of the above is filled body; discharge path connected to the discharge port, having a transparent optically, bent in a U-shape curved portion, the curved portion toward the upper side; detecting means disposed in the vicinity of the bent portion, a predetermined position of the curved portion of the emitted first light beam, while receiver accompanied irradiating the first light beam obtained from said predetermined position a second light beam; determining means determines the degree of filling with respect to the body is filled with the predetermined liquid based on changes in light intensity of the second light beam received by said detecting means.

本发明所述的一种被填充体的气体混入度判定机构,用于判定气体相对于被填充体中所填充的规定的液体的混入度,该被填充体通过由规定的供给装置供给上述规定的液体而填充上述规定的液体,其中,具有:排出口,将上述被填充体内部的气体和填充物排出到上述被填充体的外部;排出路径,连接于上述排出口,具有光学上透明的、弯曲成U字形的弯曲部分,上述弯曲部分朝向上侧;检测装置,配置于上述弯曲部分的附近,对上述弯曲部分的规定位置发出第1光束,同时接收伴随着上述第1光束的照射而从上述规定位置获得的第2光束;判定装置,根据由上述检测装置接收到的上述第2光束的光强度的变动判定气体相对于上述规定的液体的混入度。 The present invention is one of the determining means of the gas-filled body is incorporated, mixing of the gas with respect to the filler filled in the liquid for a predetermined determination which is supplied from the supply means through the predetermined filler predetermined liquid and filled with the predetermined liquid, which has: a discharge port, the above discharged inside the filler gas and the filling to the outside of the above is filled body; discharge path connected to the discharge port, having a transparent optically bent into a curved portion of the U-shape, the bent portion toward the upper side; detecting means disposed in the vicinity of the bent portion, a predetermined position of the curved portion of the emitted first light beam, while receiver along with the irradiation of the first light beam and second light beam obtained from said predetermined position; determining means determines the degree of mixing gas to liquid according to the predetermined variation of the light intensity of the second light beam received by said detecting means.

根据本发明,从集管的纵向方向的侧端部供给处理液,同时从上端部排出气体和混入了气体的处理液,所以即使没有使细缝喷嘴反转的机构,也可确实地除去气体。 According to the present invention, from a side end portion of the longitudinal direction of the processing liquid supplied to the manifold, while exhaust gas from the upper portion of the treatment liquid and the mixed gas, so that even if the slit nozzle without inverting mechanism, the gas can be reliably removed .

特别是根据本发明,抗蚀剂液在集管的整体中流动,所以在细缝喷嘴的内部不产生所供给的处理液滞留的部位,可在短时间内确实地将处理液填充到细缝喷嘴中。 In particular, according to the present invention, the overall flow of the resist solution in the header, so that no process liquid supplied inside the retention portion of the slit nozzle can be reliably in a short time the treatment liquid is filled into the slit nozzle.

特别是根据本发明,可从集管的纵向方向的两侧端部供给处理液,并可从相同方向的中央部排出气体和混入了气体的处理液,所以可进一步提高细缝喷嘴内部的处理液的流动性。 In particular, according to the present invention, it can be, and the gas is discharged from the central portion in the same direction from both ends of the longitudinal direction of the processing liquid supplied to the header and the treatment liquid mixed with gas, it is possible to improve the processing inside the slit nozzle fluid mobility. 另外,也可交替地使用各供给口而供给处理液,所以可相应于处理液的性质和处理状况选择使用的供给口。 Further, use may be alternately supplied to the respective supply ports and the treatment liquid, it may correspond to the liquid handling properties and processing conditions of the supply port selected for use.

特别是根据本发明,集管具有即使在填充的处理液中混入有气体的情况下也容易将该气体引导至排出口的形状,所以可容易地将上述气体排出到细缝喷嘴外。 In particular, according to the present invention, the manifold has a shape even when a gas is mixed in the processing solution filled in the gas can be easily guided to the discharge port, it is possible to easily discharge the gas to the outer slit nozzle.

特别是根据本发明,供给到细缝喷嘴的规定的处理液依次从排出口到排出路径的处理液的填充度或气体的混入状态得到检测,所以不仅在涂敷处理之前的处理液的填充时,而且在涂敷处理动作中也可确实地对其进行检测。 Especially when mixed state according to the present invention, the slit nozzle is supplied to a predetermined treatment liquid discharge path sequentially from the gas discharge opening or the degree of filling of the treatment liquid be detected, not only the filling of the treatment liquid before the coating process , in the coating process and operation may be surely detected.

特别是根据本发明,供给到细缝喷嘴的规定的处理液依次从排出口排出到排出路径,另外,在弯曲部分的处理液的填充度或气体的混入的有无与第2光束的光强度之间存在相关性,利用这两点,判定处理液的填充度或气体的混入,从而由简单的构成不仅在涂敷处理之前的处理液的填充时,在涂敷处理动作中也可确实地判断处理液是否填充于细缝喷嘴中,或气体是否混入到处理液中。 In particular, according to the present invention, a predetermined slit is supplied to the treatment liquid nozzle sequentially discharged from the discharge port to the discharge path, further, the light intensity in the presence or absence of the second mixed beam, or the degree of filling of the treatment liquid gas curved portion There is a correlation between these two points utilizing, determines the degree of filling or gas mixed with the treatment liquid, the treatment liquid to fill a simple configuration not only before the coating process, the coating process can be surely operation determining whether a treatment liquid filled in a slit nozzle, or whether the gas is mixed into the process liquid.

特别是根据本发明,不拆卸细缝喷嘴即可清洗细缝喷嘴内部。 In particular, according to the present invention, the slit nozzle can be cleaned without disassembling the interior of the nozzle slit. 另外,在细缝喷嘴的内部,当清洗液从细缝喷嘴的纵向方向的两侧端部朝中央部供给的情况下,可由少量的清洗液确实地清洗细缝喷嘴内部。 Further, in the interior of the nozzle slit, the case where both ends of the longitudinal direction of the cleaning liquid from the slit nozzle supplied toward the center portion, a small amount of cleaning fluid can be reliably internal slit nozzle.

根据本发明,供给到被填充体的规定的液体依次从排出口排出到排出路径,另外,在弯曲部分的规定的液体的填充度或气体混入的有无与第2光束的光强度之间存在相关性,利用这两点,判定被填充体中的该液体的填充度或气体的混入,从而由简单的构成可确实地判断液体是否填充到被填充体中,或气体是否混入到该液体中。 According to the present invention, the liquid is supplied to the body is filled with a predetermined order is discharged from the discharge port to the discharge path, further, the presence or absence of mixing between the second light intensity of the beam and the degree of filling in a liquid or a gas of a predetermined curved portion correlation using these two points, is determined by the degree of filling or mixed gas filled body of the liquid, which can surely judge whether a simple configuration whether the liquid is filled into the filler, or mixed gas to the liquid .

附图说明 BRIEF DESCRIPTION

图1为示出第1实施形式的基板处理装置1的立体图;图2为示出基板处理装置1的主体2的侧截面和抗蚀剂液的涂敷动作的主要构成要素的视图;图3为示意地示出细缝喷嘴41和将抗蚀剂液供给到该细缝喷嘴41的供给机构9的视图;图4为示出图3中细缝喷嘴41的AA′剖视图;图5A~图5C为说明传感部94的视图;图6为供给抗蚀剂液的过程中的细缝喷嘴41的平行于纵向方向的截面示意图;图7为供给抗蚀剂液的过程中的细缝喷嘴41的AA′截面(图3)的示意图;图8为气泡混入到抗蚀剂液中的情况的细缝喷嘴41的平行于纵向方向的截面的示意图;图9为气泡混入到抗蚀剂液中的情况的细缝喷嘴41的AA′截面(图3)的示意图;图10为示意地示出第2实施形式的细缝喷嘴41和供给机构9的视图;图11为示意地示出第3实施形式的细缝喷嘴141和供给机构190的视图;图12A~图12C为示出集管的形状的 FIG. 1 is a perspective view illustrating a first embodiment of the substrate processing apparatus; FIG. 2 is a view illustrating main components of the coating operation side sectional resist solution and the substrate processing apparatus 1 main body 2; FIG. 3 is a view schematically illustrating a slit nozzle 41 and the resist solution supply means for supplying to the nozzle 41 of the sipe 9; FIG. 4 is a diagram showing the slit nozzle 41 AA 'cross-sectional view 3; FIGS. 5A ~ FIG. 5C is a view illustrating a sensing portion 94; FIG. 6 is a schematic cross-sectional process of supplying the resist solution nozzle slit 41 is parallel to the longitudinal direction; FIG. 7 is a process of supplying a slit nozzle in the resist solution FIG 8 is a schematic sectional view of a case where air bubbles are mixed in the resist solution nozzle slit 41 is parallel to the longitudinal direction;; schematic AA 'cross section (FIG. 3) FIG. 9 is 41 to resist liquid air bubbles are mixed schematic AA 'cross section (FIG. 3) in the case of the slit nozzle 41; FIG. 10 is a view schematically illustrating a second embodiment of the slit nozzle 41 and the supply mechanism 9; FIG. 11 is a view schematically showing a first 3 embodiment of view of the slit nozzle 141 and supply mechanism 190; FIG. 12A ~ FIG. 12C is a diagram illustrating the shape of the manifold 变形例的视图;图13为示出填充度和气体混入度的检测的变形例的视图。 View showing a modification; FIG. 13 is a view showing a modification degree of filling and the degree of mixing of the gas detected.

具体实施方式 detailed description

(第1实施形式)(整体构成)图1为示出本发明第1实施形式的基板处理装置1的立体图。 (First embodiment) (Overall configuration) FIG. 1 is a diagram illustrating a first embodiment of the present invention is a substrate processing apparatus 1 is a perspective view of FIG. 图2为示出基板处理装置1的主体2的侧截面的同时、示出抗蚀剂液的涂敷动作的主要构成要素的视图。 While FIG. 2 is a diagram illustrating a substrate processing apparatus 1 main body 2 side cross section view illustrating main components of the resist solution is applied to the operation.

基板处理装置1大体分成主体2和控制系统6,将用于制造液晶显示装置的画面面板的方形玻璃基板作为被处理基板(以下简单地称为“基板”)90,在选择地蚀刻形成于基板90的表面的电极层等的过程中,作为在基板90的表面涂敷作为处理液的抗蚀剂液的涂敷处理装置而构成。 The substrate processing apparatus 1 is generally divided into a main body 2 and a control system 6, for manufacturing a liquid crystal display screen of a square glass panel of the device substrate as a substrate to be processed (hereinafter simply referred to as "substrate") 90, formed on the selectively etched substrate process electrode layer 90 and the like surface, as applied to the surface of the substrate 90 as a resist solution coating process means to constitute the treatment liquid. 因此,在该实施形式中,细缝喷嘴41排出抗蚀剂液。 Thus, in this embodiment, the slit nozzle 41 discharging the resist solution. 基板处理装置1也可作为下述这样的装置而变形利用,即不仅仅在液晶显示装置用的玻璃基板上,一般在平板显示器用的各种基板上涂敷处理液(药液)。 The substrate processing apparatus 1 may be a device such as described below using deformed, i.e. not only on a glass substrate of the liquid crystal display device, a general coating process liquid (chemical liquid) on various substrates used in flat panel displays.

主体2具有台3,该台3具有用于载置、保持基板90的保持台的作用,同时还具有所附属的各机构的基台的作用。 Station 3 has a body 2, which has a placing table 3, holding action of the substrate holding table 90, but also has a function of base of bodies attached. 台3为长方体形,例如由石材一体制成,其上面(保持面30)和侧面加工成平坦面。 3 is a rectangular parallelepiped-shaped table, for example made of stone integrally thereon (retaining surface 30) and the side surface is processed into a flat surface.

台3的上表面为水平面,成为基板90的保持面30。 Upper surface of the table 3 is a horizontal plane, it becomes a holding surface 30 of the substrate 90. 在保持面30上分布着图中未示出的多个真空吸附口,在基板处理装置1中对基板90进行处理的期间,通过吸附基板90,从而将基板90保持在规定的水平位置。 During the distribution of a plurality of vacuum suction ports not shown in the drawing on the holding surface 30 of the substrate 90 is processed in the substrate processing apparatus 1, by adsorbing the substrate 90, so that the substrate 90 held in a horizontal position predetermined. 另外,在保持面30上隔开适当的间隔而设置通过图中未示出的驱动装置可上下自由升降的多个升降销LP。 Further, the holding surface 30 at an appropriate distance and a plurality of lift pins disposed through the LP drive means, not shown in FIG be vertically raised and lowered. 升降销LP是在取下基板90时用于抬起基板90。 LP is the lift pins 90 for lifting the substrate to remove the substrate 90.

在保持面30中的夹住基板90的保持区域(保持基板90的区域)的两端部固定设置有大致与水平方向平行而延伸的1对行进轨31。 Sandwiching the substrate holding region 30 of the holding surface 90 (holding region of the substrate 90) fixed to both end portions is provided substantially parallel to the horizontal direction and extending in the traveling rail 1 31. 行进轨31与固定设置于架桥结构4的两端部的最下方的图中未示出的支承块一起构成对架桥结构4的移动进行导向(将移动方向限定在规定的方向)、将架桥结构4支承在保持面30的上方的线性导向构件。 Traveling rail fixed to the support block of FIG lowermost ends of the bridge structure portion 4 (not shown) together form 31 (in the direction defined predetermined moving direction) of the moving bridge structure 4 for guiding the bridge structure 4 supported by the linear guide member above the holding surface 30.

在台3的上方设置从该台3的两侧部分大致水平地架设的架桥结构4。 Set bridge structure erected from the side portions of the table 3 substantially horizontally above the table 3 4. 架桥结构4主要由例如以碳纤维加强树脂为骨料的喷嘴支承部40和支承其两端的升降机构43、44构成。 4 bridge structure mainly composed of a resin such as enhanced aggregate as a carbon fiber and the nozzle support portion 40 supporting the lifting mechanism 43, 44 constituting both ends thereof.

在喷嘴支承部40安装有细缝喷嘴41和间隙传感器42。 The nozzle support portion 40 is attached to the slit nozzle 41 and the gap sensor 42.

在图1中,在Y方向具有纵向方向的细缝喷嘴41上连接供给机构9(图2),该供给机构9包含在图1中未图示出的将抗蚀剂液供给到细缝喷嘴41的配管和抗蚀剂用泵等。 In FIG 1, having a longitudinal direction in the Y-direction slit nozzle 41 is connected to the supply means 9 (FIG. 2), the supply means 9 (not shown) comprising a resist solution is supplied to the slit nozzle 1 in FIG. a pipe 41 with a pump or the like and the resist. 在对基板90的表面进行扫描的同时,将由抗蚀剂用泵供给的抗蚀剂液排出到基板90的表面的规定的区域(以下称“抗蚀剂涂敷区域”),从而细缝喷嘴41将抗蚀剂液涂敷到基板90上。 While scanning the surface of the substrate 90, the resist by the resist solution discharge pump is supplied to the predetermined area of ​​the surface of the substrate 90 (hereinafter referred to as "resist coating regions"), so that the nozzle slit 41 the resist solution is coated onto the substrate 90. 其中,抗蚀剂涂敷区域为在基板90的表面中要涂敷抗蚀剂液的区域,通常为从基板90的整个面积中除去沿端缘的规定宽度的区域的区域。 Wherein the region is a region of the resist coating on the surface of substrate 90 to be coated with a resist solution, typically along a predetermined region removed from the end edge of the width of the entire area of ​​the substrate 90 in the region. 关于细缝喷嘴41和供给机构9在后面详细说明。 About slit nozzle 41 and a supply mechanism 9 described in detail later.

间隙传感器42在细缝喷嘴41的附近,安装于喷嘴支承部40,测定与下方的存在物(例如基板90的表面或抗蚀剂膜的表面)之间的高低差(间隙),将测定结果传递到控制系统6。 Height difference (gap) between the gap sensor 42 in the vicinity of the slit nozzle 41, is attached to the nozzle support portion 40, measured in the presence of (e.g. surface or the surface of the resist film substrate 90) beneath the measurement result 6 is transmitted to the control system. 这样,控制系统6根据间隙传感器42的测定结果可控制上述存在物与细缝喷嘴41之间的距离。 Thus, the above-described control system 6 may control the existence and the distance between the slit nozzles 41 from the measurement results of the gap sensor 42.

升降机构43、44分别位于细缝喷嘴41的两侧,通过喷嘴支承部40与细缝喷嘴41连接。 Lifting mechanism 43, 44 are located on both sides of the slit nozzle 41, 40 is connected to the nozzle 41 through a slit nozzle support portion. 升降机构43、44主要由AC伺服电机43a、44a和图中未示出的滚珠丝杠构成,根据来自控制系统6的控制信号生成架桥结构4的升降驱动力。 Lift mechanism 43 is mainly composed of AC servo motors 43a, 44a and a ball screw (not shown) in the configuration, according to the elevator drive force generator 4 of the bridge structure 6 from the control system signal. 这样,升降机构43、44并进地使细缝喷嘴41升降。 Thus, the lifting mechanism 43, 44 and thus to make the slit nozzle 41 down. 另外,升降机构43、44也用于调整细缝喷嘴41在YZ平面内的姿态。 The lift mechanism 43, 44 is also used to adjust the posture of the slit nozzle 41 in the YZ plane.

在架桥结构4的两端部,沿台3的两侧的缘侧分别固定设置分别具有定子50a和动子50b以及定子51a和动子51b的1对AC无铁心线性电机(以下简称为“线性电机”)50、51。 In both end portions of the bridge structure 4, along both side edges of the table 3 are respectively provided with a stator fixed to the mover 50a and 50b and a stator 51a and 51b mover 1 the AC coreless linear motor (hereinafter referred to as " linear motor ") 50, 51. 另外,在架桥结构4的两端部分别固定设置分别具有标尺部和检测件的线性编码器52、53,线性编码器52、53检测线性电机50、51的位置。 Further, both end portions are fixed to the bridge structure 4 is provided with a linear encoder scale member and the detection portion 52, 53, 52, 53 linear encoder detects the position of the linear motor 50, 51, respectively. 这些线性电机50、51和线性编码器52、53主要构成由行进轨31引导架桥结构4并使其在行进轨31上移动的行进机构5。 These linear motors 50, 51, 52 and 53 and the linear encoder 31 is mainly composed of the traveling guide rail 4 and the bridge structure 5 is moved so that the traveling mechanism in the traveling rail 31. 即,行进机构5具有在沿基板90的表面的大致水平方向上使架桥结构移动的移动机构的作用。 That is, the traveling mechanism moving mechanism 5 has the effect that the bridge structure to move in a substantially horizontal direction along the surface of substrate 90. 根据来自线性编码器52、53的检测结果,控制系统6控制线性电机50的动作,从而控制台3上的架桥结构4的移动、即由细缝喷嘴41进行的基板90的扫描。 The detection result from the linear encoder 52 and 53, the control system 6 controls the operation of the linear motor 50, thereby moving the scanning board 90 on the bridge structure 4 of the console 3, i.e. by the slit nozzle 41.

在主体2的保持面30中,在保持区域的(-X)方向侧设置开口32。 In the holding surface 30 of the body 2, the holding area (-X) direction side of the opening 32 is provided. 开口32与细缝喷嘴41同样在Y轴方向上具有纵向方向,而且该纵向方向长度与细缝喷嘴41的纵向方向长度大致相同。 Opening 32 and the slit nozzle 41 having the same longitudinal direction in the Y-axis direction, and the direction of the longitudinal length of the sipe longitudinal direction of the nozzle 41 is substantially the same length. 另外,在开口32的下方的主体2内部设置有待机罐PT、喷嘴清洗机构7、预涂敷机构13。 Further, inside the main body 2 below the opening 32 is provided with a standby tank PT, nozzle cleaning mechanism 7, pre-coating means 13. 它们都在将抗蚀剂液涂敷到基板90之前进行的抗蚀剂液供给处理、排气处理、或预排出处理等预备处理时使用。 Resist liquid supply process in which a resist solution is applied to the substrate 90 before using the exhaust gas treatment, discharge treatment or pre-treatment preparation.

待机罐PT作为细缝喷嘴41不进行扫描处理待机时的待机场所而设置。 PT can stand as a slit nozzle 41 is not performed during the scanning process standby place standby provided. 待机罐PT在后述的抗蚀剂液的填充动作等中起到从细缝喷嘴41滴下的抗蚀剂液等的收容盘的作用,可适当地废弃、回收滞留物。 PT can play a role standby accommodating tray from the slit nozzle 41 is dropped resist solution and the like, may be appropriately discarded, the retentate recovered in the filling operation of the resist solution described later, and the like. 细缝喷嘴41在收到规定的扫描指示之前,在下降到待机罐PT的正上方的状态下待机。 Slit nozzle 41 scan instruction is received before a predetermined standby at the standby tank drops to just above the PT state. 以后,将细缝喷嘴41处于待机罐PT正上方的情况称为细缝喷嘴41“处于待机位置”等。 Later, the slit nozzle 41 is directly above the standby tank PT slit nozzle 41 is referred to as "standby position" and the like. 将抗蚀剂液供给到细缝喷嘴的处理也在待机位置进行。 Treatment to the resist solution supply nozzles are slit standby position.

喷嘴清洗机构7在细缝喷嘴41处于待机位置时,通过驱动机构71沿细缝喷嘴41的纵向方向(在图2中为纸面垂直方向)可移动地设置。 When the nozzle cleaning mechanism 7 in the slit nozzle 41 is in the standby position, the driving mechanism 71 is movably disposed along the longitudinal direction of the slit nozzle 41 (in a direction perpendicular to the sheet of FIG. 2). 由对应于细缝喷嘴41的形状而在中央具有大致V字形的切口的刮板72刮取附着于细缝喷嘴41的抗蚀剂液,同时,通过由图中未示出的溶液供给机构供给的规定的溶剂清洗细缝喷嘴41下端的细缝41b的附近。 A blade having a substantially V-shaped notch in the center of a shape corresponding to the slit nozzle 41 is attached to the slit 72 scrape off the resist solution nozzle 41, and simultaneously, is supplied through the solution supply means is not shown in FIG. nearby solvent washing predetermined slit nozzle 41 of the lower end of the slit 41b.

预涂敷机构13为如下这样的机构:为了除去附着于细缝41b的部分的抗蚀剂液,在进行正式涂敷之前进行涂敷少量的抗蚀剂液的预涂敷。 Pre-coating means 13 such as the following mechanism: In order to remove the resist solution attached to the slit portion 41b, the coated amount of pre-coating the resist solution is applied prior to formal. 预涂敷在即将对基板等进行实际的涂敷处理(以后称“正式涂敷处理”)之前进行。 Pre-coated substrates were taken immediately before the actual coating process, etc. (hereinafter "the official coating process"). 进行预涂敷时,预涂敷机构13在细缝喷嘴41处于预涂敷机构13的正上方位置(以下称“预涂敷位置”)的状态下,通过驱动机构15使截面呈正多边形(在图2中为正八边形)的多边柱状的排出辊14以该正多边形的中心14a为转动轴转动,同时与该转动动作同步而对与该正多边形的各边相当的被涂敷面14s从细缝喷嘴41排出少量的抗蚀剂液。 When a state pre-coating, pre-coating nozzle means 13 in the slit 41 in the position just above (hereinafter referred to as "pre-coat position") precoated mechanism 13 by the driving mechanism 15 so that a regular polygonal cross section (in Figure 2 is a regular octagon) of polygonal column discharge roller 14 to the center of the regular polygon is a rotational shaft 14a, simultaneously with the rotation of the operation is in synchronization with the coated surface corresponding to each side of the regular polygon from 14s slit nozzles 41 emit a small amount of resist solution. 这与用细缝喷嘴41对该被涂敷面14s相对地进行扫描,同时将抗蚀剂液涂敷到被涂敷面的处理相当。 This slit nozzle is coated with the surface 14s of the scan relative to each other 41, while the resist solution is applied to the coated surface is treated fairly. 通过在正式涂敷处理之前进行预涂敷,从而效率良好地去除附着于细缝喷嘴41的抗蚀剂液,所以,在正式涂敷处理中,可防止附着于细缝喷嘴41的抗蚀剂液引起的膜厚的不均匀(凸条状的隆起等)。 By pre-coating process is applied before the official to efficiently remove the resist solution attached to the slit nozzle 41, therefore, in the coating process formally prevented from adhering to the resist slit nozzle 41 caused by uneven thickness of the liquid (like a convex stripe ridge).

涂敷于被涂敷面14s的抗蚀剂液在预涂敷结束、进行正式涂敷处理的期间,由比被涂敷面14s硬度低的材质、具体地说由树脂或橡胶等形成的排出辊刮板16刮取下。 Applied to the surface 14s of the resist solution is applied in the pre-application end, during the coating process formal, the discharge roller is applied from the surface 14s than the low hardness material, in particular formed of resin or rubber scraper 16 scraping down. 被涂敷面14s还由充满了规定的溶剂的排出罐17清洗。 Coated surface was further cleaned with 14s drain tank 17 is filled with a predetermined solvent.

控制系统6在内部具有根据程序处理各种数据的运算部60和保存程序和各种数据的存储部61。 The control system 6 having various data processing based on a program storage unit 61 and computing unit 60 stores programs and various data therein. 另外,在前面具有操作者对基板处理装置1输入必要的指示的操作部62和显示各种数据的显示部63。 Further, a display unit 63 on the front substrate processing apparatus operator input operation unit 62 the necessary instructions and display various data.

控制系统6在图1中,通过由图中未示出的电缆电连接到附属于主体2的各机构。 The control system 6 in FIG. 1, is connected to each of the units attached to the main body 2 via a cable from the electrical not shown in FIG. 控制系统6根据来自操作部62的输入信号和来自间隙传感器42和其它图中未示出的各种传感器等的信号,控制升降机构43、44的升降动作、行进机构5的行走动作、供给机构9的抗蚀剂液的供给动作、及后述的附属于喷嘴清洗机构7和预涂敷机构13的各驱动机构、各转动机构和各阀等的动作。 The control system in accordance with a signal input signal 6 from the operation portion 62 and 42 and the various sensors (not shown) from the gap sensors like the other figures, the vertical movement controls the lift mechanism 43 and 44, the walking motion of the traveling mechanism 5, supply means resist solution supply operation. 9, described later, and attached to the nozzle 7 and the operation of each of the drive mechanisms precoated mechanism 13, rotation of each of the valve bodies and the like of the cleaning mechanism.

具体地说,暂时存储数据的RAM、读取专用的ROM、及磁盘装置等相当于存储部61。 Specifically, for temporarily storing data RAM, read-only ROM, a magnetic disk device and the like corresponding to the storage unit 61. 或者,也可为可移动的磁光盘和存储卡等存储媒体及其读取装置等。 Alternatively, it may be a removable memory card and the magneto-optical recording medium and a reading device or the like. 另外,按钮和开关类(包含键盘、鼠标等)相当于操作部62。 Further, buttons and switches (including a keyboard, a mouse, etc.) corresponding to the operation portion 62. 或者,也可是如触摸屏显示器那样兼有显示部63的功能的装置。 Alternatively, but also as a touch screen display device such as a display unit 63 functions both. 对于显示部63,液晶显示器和各种灯等与其相当。 For the display unit 63, a liquid crystal display, and various lamps and the like equivalent thereto.

(细缝喷嘴和供给机构)图3为示意地示出细缝喷嘴41和将抗蚀剂液供给到细缝喷嘴41的供给机构9的视图。 (Slit nozzle and a supply means) 3 is a schematic view illustrating a slit 41 and a supply means supplying the resist liquid to the slit nozzle 41 of the nozzle 9. 在图3中,细缝喷嘴41作为平行于其纵向方向的截面图而示出。 In Figure 3, the slit nozzle 41 as a sectional view parallel to its longitudinal direction is shown. 另外,图4为示出细缝喷嘴41的图3的AA′截面(与图1的ZX面平行的面)的视图。 Further, FIG. 4 is a diagram illustrating a slit nozzle AA 'cross-sectional view (parallel to the ZX plane surface of FIG. 1) 41 of FIG. 3.

如图4所示,细缝喷嘴41的下侧大致一半的在与纵向方向垂直的面内的截面呈朝下方变细的大致V字形的外观形状。 4, the lower side of the cross section of substantially half the slit nozzle 41 in the plane perpendicular to the longitudinal direction was downward tapering external shape substantially V-shaped. 如图3和图4所示,在细缝喷嘴41内部,横贯纵向方向两侧端部间而且在截面中央部的偏上方设置有暂时储存用于涂敷到基板的抗蚀剂液的集管45(在图4中用斜线示出截面)。 3 and 4, inside the slit nozzle 41, between both end portions in the longitudinal direction and is provided with a traverse temporarily stored for applying a resist solution to a substrate bias header above the central portion of the cross section 45 (hatched in FIG. 4 shows a cross-section). 另外,还在细缝喷嘴41的内部设置从集管45的上端部直到细缝喷嘴41的上端部的排气孔47。 In addition, also provided inside the slit nozzle 41 from the upper end portion of the header 45 until the slit nozzle hole 4741 of the upper end of the discharge portion. 排气孔47具有从集管45排出空气和(主要是混入了空气的)抗蚀剂液的排出口的作用。 Vent hole 47 has the effect of the resist solution discharge port is discharged from the manifold 45 and air (primary air are mixed). 排气孔47优选设在供给口46a、46b与排气孔47的在细缝喷嘴41的纵向方向的距离最小值为最大的位置。 Vent hole 47 is preferably provided on the supply port 46a, 46b and the minimum distance from the vent hole 47 in the longitudinal direction of the slit nozzle 41 is maximum. 具体地说,优选设置在距供给口46a、46b的任一个都尽可能远的位置。 Specifically, preferably from a supply port disposed at any 46a, 46b are in a position as far as possible. 在本实施形式中,设在细缝喷嘴41的纵向方向的中央部。 In the present embodiment, located in the central portion of the longitudinal direction of the slit nozzle 41.

另外,在集管45的两侧端部设置有用于将抗蚀剂液供给到集管45的供给口46a、46b。 Further, both side ends of the header 45 is provided for supplying the resist solution to the supply port 45 of the manifold 46a, 46b. 另外,在集管45的最下部与相当于大致V字形的顶点部分的细缝喷嘴41的前端(最下端)之间同样横跨细缝喷嘴41的两侧端部间设置有一定间隔的缝隙41a。 Further, between the lowermost distal end (lowermost end) of the manifold 45 corresponding to the apex portion of the substantially V-shaped slit nozzle 41 and also spans the slit between both end portions is provided with a nozzle 41 spaced slits 41a. 缝隙41a的间隔优选在50μm~250μm左右。 Spaced slits 41a is preferably about 50μm ~ 250μm. 缝隙41a的最下端成为用于排出抗蚀剂液的细缝41b。 Lowermost slit 41a becomes a slit for discharging the resist solution 41b. 供给到集管45的抗蚀剂液通过下述的供给机构9的作用而施加规定的排出压力时,经过缝隙41a从细缝41b排出,涂敷到基板90。 Is supplied to the discharge pressure of the resist solution is applied to the header 45 by the action of a predetermined supply mechanism 9 described later, through the slit 41a is discharged from the slit 41b, is applied to the substrate 90.

如图4所示,集管45在AA′截面从排气孔47侧朝缝隙41a侧具有倾斜地设置。 4, the manifold 45 in AA 'cross-section from the side of the vent hole 47 having a slit 41a is provided obliquely toward the side. 另外,如图3所示,排气孔47的集管45侧的端部47a处于比供给口46a、46b高的位置。 Further, as shown in Figure 3, the end portion 45 side of the vent hole 47 in the header 47a, 46b a position higher than the supply port 46a. 即,集管45沿纵向方向使其上面45a在排气孔47的端部47a与供给口46a和46b之间具有倾斜地形成。 That is, the header 45 in the longitudinal direction of the upper end 47 45a 47a is formed between the supply port 46a and 46b and having a vent in it obliquely. 另一方面,集管45的下面45b保持与细缝喷嘴41的上下侧端大致平行而形成,所以集管45沿纵向方向从供给口46a、46b侧朝中央部侧逐渐增大上下面间的间隔h地设置。 Below the other hand, the header 45b of holder 45 is formed substantially parallel to the upper and lower side ends of the slit nozzle 41, the manifold 45 in the longitudinal direction from the supply port 46a, 46b toward the center portion side is gradually increased on the side between the following h intervals provided. 或者,截面积逐渐增大地设置。 Alternatively, the sectional area gradually increases provided.

如图3所示,供给机构9主要具有储存抗蚀剂液R的抗蚀剂液供给源91、用于从抗蚀剂液供给源91将抗蚀剂液R供给到细缝喷嘴41的抗蚀剂液供给路径L1、及用于除去混入到细缝喷嘴41内的抗蚀剂液的空气的排气路径L2。 3, the main supply mechanism 9 having a resist solution supply source 91 storing the resist solution R for anti resist solution 91 is supplied from a liquid supply source R resist nozzle 41 into the slit corrosion inhibitors exhaust path fluid supply path L1, and for removing air mixed into the slit 41 of the resist solution nozzle L2. 排气路径L2具有排出空气和(主要是混入了空气的)抗蚀剂液的排出路径的作用。 L2 exhaust passage and the exhaust air has the effect of (mostly mixed with air) discharging path of the resist solution.

在抗蚀剂液供给路径L1具有从抗蚀剂液供给源91侧依次通过规定的配管连接的阀V2、供给泵92、阀V3、压力计93。 V2 L1 having a valve from a liquid supply source side, the resist 91 by the predetermined resist solution supply path connecting pipe, a feed pump 92, valve V3, a pressure gauge 93. 储存于抗蚀剂液供给源91中的抗蚀剂液R由压缩空气加压供给。 R stored in the resist solution in the resist solution supply source 91 by the agent supplying pressurized air. 或者,由供给泵92吸引上储存于抗蚀剂液供给源91中的抗蚀剂液R而定量地送液。 Alternatively, the suction pump 92 is supplied to the resist solution stored in R 91 and the resist solution supply source agent liquid feeding quantitatively. 压力计93用于监视抗蚀剂液的供给压力。 93 pressure gauge for monitoring the pressure of the resist solution supply.

另外,抗蚀剂液供给路径L1在压力计93与细缝喷嘴41间分支成2支,分支供给路径L1a和L1b分别在细缝喷嘴41的纵向方向两侧端部分别与供给口46a、46b连接。 Further, the resist solution supply path L1 slit nozzle 93 and the pressure gauge 41 into two branches, the branch supply path L1a and L1b, respectively, the supply port 46a and the other end of the longitudinal direction on both sides of the slit nozzle 41 portion, 46b connection. 即,本实施形式的细缝喷嘴41成为从纵向方向的侧端部侧供给抗蚀剂液的状态。 That is, the present form of embodiment of the nozzle slit 41 in a state supplying the resist solution from a side end portion of the longitudinal direction side. 另外,在分支供给路径L1a和L1b分别具有阀V4和阀V5。 Further, in the branch supply path L1a and L1b, respectively, the valve having a valve V4 and V5.

阀V2~V5都是通过控制系统6控制开闭操作的电磁阀。 6 are valves V2 ~ V5 controlling opening and closing operations of the solenoid valves by the control system.

另外,排气路径L2在细缝喷嘴41的上面侧具有的排气孔47连接规定的配管。 Further, an exhaust path L2 has a slit nozzle 41 at the upper side of the vent pipe 47 connected to a predetermined. 在排气路径L2的中途具有排气阀V1。 In the middle of the exhaust path L2 having the discharge valve V1. 排气阀V1也是通过控制系统6控制开闭操作的电磁阀。 Exhaust valve control solenoid valve V1 is opened and closed by the control system 6. 另外,设置细缝喷嘴41与排气阀V1之间的传感部94。 Further, the sensing portion is provided between the slit nozzle 41 and the exhaust valves V1 94. 图5A~图5C为说明传感部94的视图。 5C is a view illustrating a sensing portion 94 in FIG. 5A ~ FIG. 如图5A所示,在传感部94,来自排气孔47的配管96弯曲成U字形,弯曲部分成为上端部,在其正上方设置空气传感器95。 5A, the sensor unit 94 from exhaust hole 47 a pipe 96 is bent into a U shape, the curved portion extends to an upper portion, an air sensor 95 disposed immediately above. 优选在排气路径L2的从细缝喷嘴41到传感部94之间,设置配管96,使得配管96的顶点部分(U字形的底部部分)96a处于最高位置。 L2 is preferably in the exhaust path 41 from the slit nozzle to the sensing portion 94 is provided with a tube 96, such that the apex portion (the bottom portion of the U-shape) 96a of the pipe 96 at the highest position. 传感部94进行判定构成排气路径L2的配管96是否由抗蚀剂液充满、或空气是否混入的处理。 Sensing unit 94 determines the exhaust path L2 constituting the pipe 96 is full of the resist solution, or whether the process of aeration. 空气传感器95为所谓的光学传感器,发出光束,并接收其反射光束,将其光强度提供给控制系统6。 Air sensor 95 is a so-called optical sensor emits a light beam, and receives the reflected light beam, the light intensity provided to the control system 6. 因此,配管96的顶点部分96a光学透明,与该顶点部分96a相对的部分96b反射光束。 Thus, the pipe 96a optically transparent apex portion 96, the reflected beam portion 96b opposing the apex portion 96a. 后面说明使用传感部94的处理。 Processing described later using the sensor portion 94.

在排气阀V1之前连接到图中未示出的排泄管。 Before the exhaust valve V1 is connected to the discharge pipe, not shown in FIG. 如后述的那样,混入到供给到集管45的抗蚀剂液的内部的空气或包含空气的状态的抗蚀剂液从排气路径L2排出。 As described later, the resist solution is mixed air supplied to the interior of the resist solution or the state of manifold 45 comprising the air is discharged from the exhaust passage L2.

(抗蚀剂液的填充)下面,说明抗蚀剂液相对细缝喷嘴41的填充。 (Filled resist solution) Next, the resist solution 41 is filled opposing slit nozzle. 图6为供给抗蚀剂液过程中的细缝喷嘴41的平行于纵向方向的截面的示意图,图7为此时的图3的AA′截面的示意图。 FIG 6 is a schematic cross-section of the resist solution is supplied during the slit nozzle 41 is parallel to the longitudinal direction, a schematic AA 'cross section of FIG. 3 at this time is FIG 7. 图8为气泡混入到抗蚀剂液中的情况的细缝喷嘴41的平行于纵向方向的截面的示意图,图9为此时的图3的AA′截面的示意图。 FIG 8 is a schematic sectional view of a case where air bubbles are mixed in the resist solution nozzle slit 41 is parallel to the longitudinal direction, FIG. 9 is a case of FIG. 3 AA 'sectional schematic.

在将抗蚀剂液供给到抗蚀剂液完全未填充的细缝喷嘴41的情况下,首先使细缝喷嘴41位于待机位置。 In the case of the resist solution supply nozzle slit resist solution to complete the unfilled 41, first, the slit nozzle 41 at the standby position. 然后,在使细缝喷嘴41两端的阀V4、V5和排气阀V1都为“开”的状态下,通过供给泵92的定量送液或来自抗蚀剂液供给源91的加压供给进行抗蚀剂液的供给。 Then, the slit nozzle 41 so that at both ends of the valve V4, V5, and the exhaust valve V1 are "on" state by supplying the quantitative pump 92 supplying pressurized fluid or send the resist solution supply source for agent 91 from supplying the resist solution. 这样,经过了抗蚀剂液供给路径L1和分支供给路径L1a和L1b的抗蚀剂液从处于细缝喷嘴41的纵向方向侧端部的供给口46a和46b连续地注入到细缝喷嘴41的内部、集管45中。 Thus, after a resist solution supply path and branch supply paths L1 L1a and L1b resist solution is continuously injected from the supply port 41 in the longitudinal direction at the side end portion of the slit nozzles 46a and 46b to the slit nozzle 41 internally, the header 45.

如已说明的那样,在细缝喷嘴41中,缝隙41a(在图6中用斜线示出)形成于集管45的下方。 As already described, in the slit nozzle 41, the slit 41a (shown hatched in FIG. 6) is formed below the manifold 45. 由此,虽然流入到集管45的抗蚀剂液流入到该缝隙41a,但缝隙41a的间隙为50~250μm左右,较窄,而且抗蚀剂液的粘度较高,所以缝隙41a的抗蚀剂液的流动性保持得比集管45内部的流动性足够低。 Thus, although the resist flows into the liquid header 45 to flow into the slit 41a, the slit 41a but the gap is about 50 ~ 250μm, narrow, and higher viscosity of the resist solution, the resist slit 41a flowability agent was maintained than mobility within manifold 45 is sufficiently low. 因此,尽管流入到集管45的抗蚀剂液从细缝喷嘴41下端的细缝41b流出极少量,滴下到待机罐PT中,或附着于细缝41b的附近,但当大致充满缝隙41a时,如图6的箭头AR2和图7的箭头AR3所示,抗蚀剂液(在图6和图7中涂黑的部分)的液面上升,依次充满集管45、排气孔47、及排气路径L2(图3)。 Therefore, although flows to the header 45 of the resist solution from the lower end of the slit 41 of the slit nozzle 41b flows very small, the PT dropped into a standby tank, or adhered to the vicinity of the slit 41b, a slit 41a but when substantially filled , arrow AR2 in FIG. 6 and FIG. 7, the arrow shown in liquid level resist solution (in FIGS. 6 and section 7 blacked out) increases AR3, are sequentially filled with the header 45, vent 47, and an exhaust path L2 (FIG. 3).

换言之,当填充抗蚀剂液时,在集管45,抗蚀剂液主要从设于两侧端部的供给口46a和46b侧朝设于中央上端部的排气孔47流动。 In other words, when the resist solution is filled, the flow set 47 in the tube 45, mainly from the resist solution supply port provided in both side portions 46a and 46b provided on the side toward the center of the upper end portion of the exhaust hole. 随着该抗蚀剂液的流入,集管45内部的空气经过排气孔47和排气路径L2排气。 With the inflow of air inside the manifold 45 through the exhaust vent 47 and the exhaust path L2 resist solution. 另外,因为抗蚀剂液如此从细缝喷嘴41的两侧端部到中央部、即在集管45全体流动,所以,在集管45,填充时不产生滞留抗蚀剂液的部位。 Further, since the resist solution so from both ends of the slit nozzle 41 to the central portion, i.e. at all flows header 45, therefore, the collector pipe 45, no portion of the resist solution retentate filling. 如图8和图9所示,例如即使在空气成为气泡BL4、BL5混入到集管45中的情况下,这些气泡BL4、BL5也不会滞留,随着抗蚀剂的流动如箭头AR4和箭头AR5那样依次排出。 8 and 9, for example, even in the air into bubbles BL4, BL5 incorporated into the lower header 45, these bubbles BL4, BL5 does not stay, with the flow of the resist and arrows as indicated by arrows AR4 that in turn discharge AR5. 或者,由于排气孔47设于集管45的上方,气泡BL4、BL5本身易于排出到细缝喷嘴41外。 Alternatively, since the vent hole 47 is provided above the collector pipe 45, the bubble BL4, BL5 itself readily to the slit nozzle 41 is discharged outside. 即,在本实施形式的基板处理装置1中,可从细缝喷嘴41在短时间内确实地除去气泡。 That is, in this embodiment the form of the substrate processing apparatus 1, the nozzle 41 can reliably remove bubbles in a short time from the slit.

抗蚀剂液是否填充到集管45中,即集管45的空气是否由抗蚀剂液置换的判定通过空气传感器95和控制系统6的作用实现。 If the resist solution is filled into the manifold 45, i.e., whether the air manifold 45 by the displacement of the resist solution is determined to achieve the effect of 6 air sensor 95 and a control system. 如图5A所示,在配管96的内部完全不存在抗蚀剂液的情况下,空气传感器95相应于发出的入射光束BM1接收规定的光强度的反射光束BM2。 In the case shown, the resist was completely absent in FIG. 5A in the interior of the pipe 96, air sensor 95 corresponds to the reflected light beam BM1 BM2 receiving intensity of the incident light beam emitted predetermined. 另一方面如图5B那样,在配管96的内部存在抗蚀剂液的情况下,光由抗蚀剂液散射,从而由空气传感器95受光的反射光束BM2的光强度减少,所以即使施加与图5A的情况相同的光强度的入射光束BM1,也不产生反射,空气传感器95不能接收反射光束BM2,或与图5A的情况相比,仅接收非常小的光强度的反射光束BM2。 On the other hand, as shown in FIG 5B, the presence of a resist solution in the interior of the pipe 96, the light, thereby reducing agent by the resist liquid scattered light intensity of the reflected light beam BM2 from the light receiving sensor 95 of the air, even when applied to FIG. the same intensity of the incident light beam 5A BMl case, no reflection, the air sensor 95 can not receive the reflected light beam BM2, or, the intensity of the reflected light beam BM2 receives only very small compared with the case of FIG. 5A. 这样,配管96内部的抗蚀剂液的填充度的变化与空气传感器95接收到的反射光束BM2的光强度的变化相关。 Change in light intensity of the reflected light beam BM2 degree of filling and air sensor such changes, the pipe 96 inside the resist solution 95 received relevant. 在控制系统6,根据从空气传感器95发送的表示光强度的信号判定抗蚀剂液的填充度,如采用别的说法则是空气的混入度(或存在度)。 In the control system 6. The air sensor representing transmitted from the light intensity signal 95 determines the degree of filling of the resist solution, such as the use of the other argument is mixed with air (or present degrees). 具体地说,可考虑这样的形式等,即以某一光强度作为阈值,在接收到的光强度比其小的情况下,判定传感部94由抗蚀剂液充满,即,抗蚀剂液填充到集管中。 Specifically, such forms may be considered the like, i.e., a certain light intensity as a threshold value, the light intensity received at smaller than, the determination by the sensing unit 94 is filled resist solution, i.e., the resist liquid is filled into the header.

这样,通过简单的构成,不仅在涂敷处理之前的抗蚀剂液的填充时,即使在涂敷处理动作中也可确实地地判断是否在细缝喷嘴中填充了处理液,或者是否在抗蚀剂液中混入有空气。 Thus, a simple configuration, not only when filled with liquid before the resist coating process, the coating process even in the operation can be surely determine whether or not the treatment liquid filled in the slit nozzle, or whether the anti- corrosion inhibitor solution is mixed with air.

在传感部94中,当判断配管96充分地由抗蚀剂液充满时,抗蚀剂液的填充结束。 In the sensor section 94, when it is judged pipe 96 is sufficiently filled with the resist solution, the resist solution is filled end. 即,来自抗蚀剂液供给源91的抗蚀剂液的供给停止,排气阀V1成为“闭”状态。 That is, the resist solution supplied from the resist solution supply source 91 of the agent is stopped, the exhaust valve V1 becomes "closed" state.

集管45以及配管96的内部一旦由抗蚀剂液充满后,足以发生含气泡的抗蚀剂液流入的情况。 Manifold 45 and the interior of the pipe 96 once filled with the resist solution, the resist where bubble-containing liquid flowing into sufficient occur. 然而,在本实施形式中,细缝喷嘴41的集管45的上面45a具有上述那样的倾斜,所以混入的气泡即使没有抗蚀剂液的流动也可较容易地移动到排气孔47一方。 However, in the present embodiment, the upper slit nozzle headers 41 45a 45 having the above-described inclined, even without bubbles mixed resist solution can flow more easily move to the vent hole 47 side. 结果,如在图5C中由箭头AR1所示那样,由于抗蚀剂液中的气泡BL1到达以弯曲成U字形的形式设置的配管96的顶点部分(U字形的底部部分)附近,从而可能形成空气聚集部P1。 As a result, as in FIG. 5C as shown by the arrow AR1, the bubbles in the resist solution BL1 reaches the vertex bent portion (the bottom portion of the U-shaped) form near the U-shaped pipe 96 is provided, which may be formed air accumulation portion P1. 在具有空气聚集部P1的状态下,反射光束BM2的光强度比完全填充了抗蚀剂液的状态大,所以通过监视光强度的变动,可判定这样的空气聚集部P1的形成的有无。 In the state where an air accumulation portion P1, the light intensity of the reflected light beam BM2 is filled with a large ratio of the resist solution state completely, so that by monitoring changes in light intensity, can determine whether such an air accumulation formed portion P1. 例如,可考虑这样的形式,即一旦结束抗蚀剂填充动作后,按规定时间监视光强度的变动,如光强度在该阈值以下大致一定,则判断空气没有混入到集管45中,空气聚集部P1也没有形成。 For example, consider such a form that once the end of the filling operation of the resist, changes in the light intensity time monitoring as specified, such as the light intensity is substantially constant below the threshold, it is determined that air is not mixed into the header 45, air accumulation P1 portion not formed. 此时,如需要,也可反复进行为了充分除去空气而暂时结束了的填充动作。 At this time, if necessary, may be repeated in order to sufficiently remove air temporarily end the filling operation. 将该填充动作在以下称为“排气动作”。 The filling operation is hereinafter referred to as "exhaust operation." 在排气动作中,再次使排气阀V1为“开”状态,而且与上述同样,从抗蚀剂液供给源91供给抗蚀剂液。 In operation the exhaust gas, the exhaust valve V1 is again "on" state, and the resist solution is supplied as described above, the resist solution supply source 91.

(涂敷动作)下面,概括说明由细缝喷嘴41进行的抗蚀剂液的涂敷动作。 (Coating operation) Next, an overview of the operation of the resist solution is coated by the slit nozzle 41. 首先,通过操作者或图中未示出的输送机构将基板90输送到台3的规定位置,吸附保持在保持面30上。 First, the substrate 90 conveyed to a predetermined position by operating the station 3 or the conveying mechanism not shown in the figures, the sucked and held on the holding surface 30.

另外,通过喷嘴清洗机构7清洗细缝喷嘴41前端的细缝41b的附近。 Further, a slit nozzle cleaning nozzle cleaning mechanism 7 through the vicinity of the front end 41b of the slit 41. 喷嘴清洗机构7在实施规定的清洗处理后退避到图中未示出的退避位置。 Nozzle cleaning mechanism 7 in the cleaning process after a predetermined embodiment retracted to the retracted position, not shown in FIG.

清洗后,行进机构5使包括细缝喷嘴41的架桥结构4移动到预涂敷位置。 After washing, the traveling mechanism so that the bridge structure 5 comprises a slit nozzle 41 is moved to the pre-coat 4 position. 然后,通过升降机构43、44调节细缝喷嘴41的高度方向的位置。 Then, adjust the position of the slit nozzle 43, 44 in the height direction by the lifting mechanism 41. 此后,与驱动机构15的排出辊14的转动同步,供给泵92仅在规定时间内按规定的压力对抗蚀剂液进行推压,从而对排出辊14的某一被涂敷面进行抗蚀剂液的涂敷、即预涂敷处理。 Thereafter, in synchronization with the rotation of the discharge roller 15 of the drive mechanism 14, only the supply pump 92 at a predetermined pressure within a predetermined time of the resist liquid was pressed so as to discharge rollers 14 is a resist coating surface the coating liquid, i.e., a pre-coating process.

当预涂敷处理结束时,行进机构5将架桥结构4移动到基板90上的进行正式涂敷处理的位置,同时升降机构43、44将细缝喷嘴41的高度调节到规定的高度。 When the pre-coating process, the bridge structure 5 traveling mechanism 4 is moved onto the substrate 90, the coating process formal position while the elevator mechanism 43 is adjusted to the height of the slit nozzle 41 of a predetermined height. 优选细缝喷嘴41的高度在涂敷处理之前使架桥结构4对保持于保持面30上的基板进行扫描,通过间隙传感器42测量基板90的厚度,而根据该结果进行设定。 Highly preferred that the slit nozzle 41 prior to the coating process bridging structure 4 held on the substrate holding surface 30 is scanned by the gap sensor 42 measures the thickness of the substrate 90, which is set based on the result. 厚度的测量也可在进行涂敷处理时实施,或者如为连续地处理同一形状、尺寸精度高的基板90的情况,则对最初的1片进行测定,在以后的基板90的处理中使用该结果。 The thickness measurement can also be implemented during the coating process, or as a continuous process the same shape with high dimensional accuracy in the case where the substrate 90, then the initial one was measured using the substrate 90 in the subsequent process of result.

在这些位置调整结束之后,行进机构5按规定的速度使架桥结构4移动,同时通过供给泵92按规定压力推压抗蚀剂液,从而实施抗蚀剂液在基板90的涂敷、即正式涂敷处理。 After the end of the position adjustment mechanism 5 according to the traveling speed of a predetermined structure so that the bridge 4 is moved, the supply pump 92 simultaneously by predetermined urging pressure of the resist solution, so as to implement a resist solution is applied to the substrate 90, i.e., official coating process.

当正式涂敷处理结束时,行进机构5使架桥结构4移动,从而将细缝喷嘴41返回到待机位置。 When the coating process formal, traveling mechanism 5 bridge structure 4 is moved, so that the slit nozzle 41 returns to the standby position.

例如,在专利文献3中记载的那样的从细缝喷嘴的中央部的1个部位供给抗蚀剂液的情况下,集管的抗蚀剂的流动性产生差异,换言之,在具有供给口的中央部与端部,抗蚀剂液的置换性产生差异。 For example, in the case of supplying the resist solution in a central portion of the nozzle portion as the slit is described in Patent Document 3, a difference in flowability of the resist header, in other words, having a supply port a difference in displacement of the central portion and the end portion of the resist solution. 因此,在从中央部排出的抗蚀剂液的粘度与从端部排出的抗蚀剂液的粘度产生差异,可能发生由此引起的放射状的不均。 Accordingly, the viscosity of the resist solution is discharged from the central portion with a difference in the viscosity of the resist solution discharge end, the radial variation caused thereby may occur. 相对于此,在本实施形式的细缝喷嘴41中,由于从在细缝喷嘴41的两侧端部具有的供给口46a和46b供给抗蚀剂液,同时进行涂敷处理,所以,在集管45中抗蚀剂流量(或动压力分布)均匀化。 In contrast, in this embodiment in the form of a slit nozzle 41, since the resist solution is supplied from both sides of the slit end portion of nozzle 41 having a supply port 46a and 46b, while the coating process, therefore, the collector resist flow tube 45 (or dynamic pressure distribution) uniform. 即,相对于来自供给泵92的推压的抗蚀剂液的响应不产生局部的差异。 That is, with respect to the response of the resist solution supplied from the pressing pump 92 is no difference between local. 因此,可形成均匀的涂敷膜。 Thus, a uniform coating film can be formed. 这意味着可使用的抗蚀剂的种类和粘度的选择范围也宽。 This means that the choice of the type and viscosity of the resist may be used also wide.

另外,在预涂敷处理和正式涂敷处理之间也可能发生在抗蚀剂液中空气作为气泡混入的情况,但在该情况也如上述,使混入的气泡朝排气孔47的方向排出。 Further, between the pre-coating process and the coating process may also occur formally in the resist liquid as air bubbles mixed, but in this case also as described above, so that the bubbles mixed toward the discharge hole 47 in the discharging direction . 结果,上述那样的空气聚集部P1在涂敷处理过程中形成。 As a result, the above-described air accumulation portion P1 is formed in the coating process. 然而,根据气泡的混入程度,不一定所有的气泡都向排气孔47移动,在涂敷处理中也可能发生从缝隙41a来到外部的情形。 However, according to the degree of air bubbles, the bubbles are not necessarily all moved toward the discharge hole 47, to the outside of the case 41a from the slot may also occur during the coating process. 这影响了涂敷膜的均匀性,不理想。 This affects the uniformity of the coating film, such being undesirable. 因此,为了避免这一点,在传感部94由空气传感器95时常监视反射光束BM2的光强度,从而在光强度变动超过规定的阈值的情况下,中断涂敷处理,再次进行排气动作。 Therefore, to avoid this, in the sensing portion 94 by the air sensor 95 constantly monitors the intensity of the reflected light beam BM2, whereby in the case exceeds a predetermined threshold value of light intensity variation, interrupt the coating process, exhaust operation again. 此时,若在排出辊14上进行预涂敷处理的同时进行排气动作时,不由抗蚀剂液污染细缝41b附近,可进行排气动作,所以,可迅速地重新开始后面的正式的涂敷处理。 At this time, if the exhaust operation while the pre-coating process is performed on the discharge roller 14, the resist liquid decontaminant help nearby slit 41b, the exhaust operation can be performed, thus, can be rapidly restarted later formal the coating process.

如以上说明的那样,在本实施形式的基板处理装置1中,设置排气孔47,使得细缝喷嘴41在两侧端部具有抗蚀剂液的供给口46a、46b,同时使集管45侧的端部47a位于比该供给口46a、46b高的位置。 As described above, in the present form of embodiment of the substrate processing apparatus 1, a vent hole 47, so that the slit nozzle 41 having a liquid resist both ends of the supply port 46a, 46b, while the header 45 47a side of the end portion 46a, a position higher than the supply port 46b. 即,在细缝喷嘴41,集管45在纵向方向使其上面45a在排气孔47的端部47a与供给口46a和46b之间具有倾斜地形成,所以即使在空气等形成的气泡混入到填充的抗蚀剂液的情况下,该气泡也从排气孔47容易地引导至细缝喷嘴41外而排出。 That is, the slit nozzle 41, the manifold 45 in the longitudinal direction so that the top end portion 45a is formed between the supply port 47a and 46a and 46b having a vent hole 47 obliquely, even if air bubbles mixed into the formation in the case of the resist solution is filled, the bubbles 47 easily guided to the slit nozzle from the vent hole 41 is discharged outside. 因此,即使没有使细缝喷嘴41反转的机构,也可确实地除去空气。 Therefore, the slit nozzle 41 so that even without reversing mechanism, can surely remove air. 另外,在抗蚀剂液填充到细缝喷嘴41时,从供给口46a和46b侧朝排气孔47、即在集管45的整体上抗蚀剂液流动,所以在集管45不产生抗蚀剂液滞留的部位,可在短时间内确实地进行抗蚀剂液填充时的排气,同时,在涂敷处理时,在集管45中抗蚀剂流量(或动压力分布)均匀化,所以抗蚀剂液的粘度不产生局部的差异,可形成均匀的涂敷膜。 Further, in the resist solution is filled into the slit nozzle 41, 46a and 46b from the supply port side toward the discharge hole 47, i.e., the liquid resist flows in the overall collection tube 45 is not generated in the manifold 45 anti corrosion inhibitors liquid retention portion, can be reliably performed in a short time when the exhaust resist liquid filled, while during the coating process, resist flow in header 45 (or dynamic pressure distribution) homogenization , the viscosity of the resist solution so no local differences can form a uniform coating film.

(第2实施形式)下面,作为第2实施形式说明第1实施形式的基板处理装置1附加地具有进行细缝喷嘴41的清洗的构成要素的形式。 (Second embodiment) Next, a second embodiment of the first described embodiment of the substrate processing apparatus 1 additionally has the form of a slit nozzle components will be cleaned 41. 在以后的说明中,与第1实施形式的基板处理装置1的构成要素相同的部分采用相同符号,省略其说明。 In the following description, the constituent elements of the first embodiment of the substrate processing apparatus 1 of the same parts with the same reference numerals, and description thereof is omitted. 图10为示意地示出第2实施形式的细缝喷嘴41和供给机构9的视图。 FIG 10 is a view schematically illustrating a second embodiment of the slit nozzle 41 and the supply mechanism 9.

图10所示供给机构9与图3所示的机构大致相同,不同点在于具有清洗液供给源97和切换阀V6,该清洗液供给源97储存用于清洗集管45和缝隙41a的规定的清洗液W,该切换阀V6可选择地切换来自该清洗液供给源97的清洗液的供给和来自抗蚀剂液供给源91的抗蚀剂液的供给。 FIG supply mechanism 109 shown in FIG 3 is substantially the same mechanism, that having different cleaning solution supply source 97 and the switching valve V6, the predetermined cleaning solution supply source 97 and a reservoir 45 for cleaning the slit 41a of the header the cleaning liquid W, the supply of the switching valve V6 selectively switching the cleaning liquid supplied from the cleaning liquid supply source 97 and the resist solution from the resist solution supply source 91 of the agent. 本实施形式的基板处理装置1通过适当地对切换阀V6进行切换,可选择地实施供给抗蚀剂液R的通常的涂敷处理动作和供给清洗液W的清洗动作。 Typically the coating process and the supply operation of the present embodiment forms the substrate processing apparatus 1 by appropriately switching valve V6 is switched selectively supplying the resist solution embodiments of the cleaning liquid R W washing operation. 关于涂敷处理动作,与第1实施形式同样,所以省略其说明,以下说明清洗动作。 Operation on the coating process, similar to the first embodiment, the description is omitted, the cleaning operation described below.

如在第1实施形式中说明的那样,当涂敷处理动作结束时,细缝喷嘴41恢复到待机位置。 As explained in the first embodiment, when the processing operation at the end of the coating, slit nozzle 41 returns to the standby position. 而且,也可为规定用于进行清洗的清洗位置、在该清洗位置具有接收清洗液W的专用罐的形式。 Further, the washing may be performed for a predetermined cleaning position, the cleaning liquid W in the form of a dedicated receiving tank in the cleaning position. 当进行清洗动作时,在该时刻由切换阀V6进行切换,供给清洗液W。 When the cleaning operation, by the switching valve V6 is switched at this time, the cleaning liquid is supplied W. 此后,当使供给泵92动作时,从清洗液供给源97吸引上清洗液W,通过抗蚀剂液供给路径L1从供给口46a、46b供给到集管45。 Thereafter, when the supply pump 92 to evacuate the supernatant wash W from the cleaning liquid supply source 97, L1 46a, 46b is supplied from the supply port to the header 45 through the resist solution supply path agent. 这样,残存于抗蚀剂液供给路径L1、集管45、及缝隙41a中的抗蚀剂液R被清洗液W挤出,排出到细缝喷嘴41的外部。 Thus, the resist liquid remaining in the supply path L1, manifold 45 and slit 41a R resist solution is extruded in the cleaning liquid W, the discharge slit to the outside of the nozzle 41.

清洗液W通常使用粘度比抗蚀剂液R低的溶剂等,所以流动性比抗蚀剂液更高,所以清洗液W也容易进入到缝隙41a中,容易到达细缝喷嘴41的内部整体。 The cleaning liquid W is generally a viscosity lower than the resist solution R a solvent, it is more liquid than the resist solution, the cleaning liquid W can be easily entered into the slit 41a, easy to reach the inside of the slit nozzle 41 integrally. 例如专利文献3中记载的那样,仅在细缝喷嘴的中央部的1个部位具有供给口的情况下,即使从中央部的供给口供给粘度低的清洗液,也不充分地遍布到端部,所以,即使使用大量的清洗液,也未必可确实地进行清洗,而本实施形式的情况通过采用上述那样的形式,可由更少的清洗液确实地清洗细缝喷嘴41的内部。 For example, the Patent Document 3 described above, a portion of the central portion of the nozzle having a slit only at the supply port of the case, even if the low supply port from the central portion of the cleaning fluid viscosity, not sufficiently spread to the end portion Therefore, even if a large amount of cleaning liquid, it may not be surely cleaned, and the case of the present embodiment by using the form as described above may be less reliably cleaning liquid inside the washing nozzle 41 of the slit.

(第3实施形式)在以提高集管的抗蚀剂液的流动性和使得空气易于排出为目的的基础上,并不一定要采取如上述实施形式那样从细缝喷嘴的“两端”供给抗蚀剂液的形式。 (Third embodiment) in order to improve the flowability of the resist solution and the header for the purpose of easily discharged such that the air on the basis of the supply does not have to take the "ends" in the form of embodiment as described above from the slit nozzle form a resist solution. 上述实施形式针对结构的细缝喷嘴进行说明。 The above-described embodiment will be described in the form of a slit nozzle structure. 图11为示意地示出该细缝喷嘴141和与其对应地构成的供给机构190的视图。 FIG 11 is a schematic view illustrating the slit 190 of the nozzle 141 and supply mechanism configured to correspond thereto. 在本实施形式中,基板处理装置的其它各部分的构成要素与上述实施形式相同,所以省略图示和说明。 In the present embodiment, the constituent elements of each of the other portion of the substrate processing apparatus of the same form as the above-described embodiment, illustration and description thereof will be omitted.

细缝喷嘴141仅在纵向方向的单侧端部具有抗蚀剂液的供给口146,在另一端的上方具有排气孔147,而且,该排气孔147的集管145侧的端部147a处于比供给口146高的位置、即上面145a在纵向方向具有倾斜地形成集管145。 The supply port 141 having only a slit nozzle resist solution on one side of the longitudinal direction end portion 146, above the other end having a vent hole 147, and the end portion 147a of the exhaust hole 145 of the side 147 of the manifold It is higher than the position of the supply port 146, i.e., 145a having upper manifold 145 is formed obliquely in the longitudinal direction. 供给机构190的抗蚀剂液供给路径L1不分支地连接到供给口146,排气孔147连接排气路径L2,这一点与上述实施形式不同,但由于设于各路径的构成要素的作用相同,所以采用相同的符号,省略其说明。 Resist liquid supply path for supplying mechanism 190 is connected to the L1 unbranched supply port 146, exhaust port 147 connected to exhaust path L2, it forms the above-described embodiment is different, but the action of the components provided in the respective paths of the same Therefore the same reference numerals, and description thereof is omitted.

在本实施形式的细缝喷嘴141中,当进行抗蚀剂液的填充动作时,抗蚀剂液从处于细缝喷嘴41的一侧的供给口146到处于另一侧的排气孔147、即在集管145的整体内流动,所以在集管145不产生滞留抗蚀剂液的部位,可在短时间内确实地进行排气。 In the present form of embodiment the slit nozzle 141, the filling operation when a resist solution, the resist solution is supplied from the port side of the slit 146 to the nozzle 41 at the other side of the vent hole 147, i.e. within the overall flow of the header 145, is not generated in the retentate portion in the resist solution manifold 145, the exhaust gas can be performed reliably in a short time. 另外,集管145的上面145a在排气孔147的端部47a与供给口146之间具有倾斜,所以即使在由空气等形成的气泡混入到所填充的抗蚀剂液的情况下,也可从排气孔147容易地引导排出到细缝喷嘴141外。 Further, the above manifold 145 145a has an inclined portion between an end exhaust hole 47a and the supply port 146 147, even in the case where the air bubbles mixed into the resist solution to form a filled can also be is discharged from the exhaust hole 147 is easily guided to the outer slit nozzle 141.

(变形例)如第1实施形式那样,当进行正式涂敷处理时,在从细缝喷嘴41两侧端部供给抗蚀剂液的情况下,根据抗蚀剂液的种类和排出条件等,在细缝喷嘴41的中央部从各供给口46a、46b供给的抗蚀剂液相撞,可能使得在形成于基板90的涂敷膜上发生条状的不匀。 (Modification) The first embodiment above, when the coating process formal, in the case of the resist solution is supplied from both ends of the slit nozzle 41, depending on the kind of the resist solution and the discharge conditions, in the slit nozzle 41 of the central portion 46a, 46b of the resist solution supplied from the respective supply ports collides, so that the stripe-shaped unevenness may occur in the coating film formed on the substrate 90. 因此,为了避免这一点,也可采用这样的形式:在第1次涂敷中,仅开放阀V4,仅从供给口46a侧供给抗蚀剂液,在下一次涂敷中,仅开放阀V5,仅从供给口46b侧供给抗蚀剂液等,切换在正式涂敷处理动作时使用的供给口。 Therefore, to avoid this, a form may be adopted: the 1st coating, only the open valve V4, the resist solution is supplied from only the supply port 46a side, the next coating, only valve V5 is open, supplying only the resist solution supply port 46b side, etc., to switch the supply port used for the operation of the formal coating process. 在该情况下,在集管45中,抗蚀剂液不局部地滞留,相反,因为抗蚀剂液的流动方向频繁地切换,所以可获得集管内部的抗蚀剂液的粘度更均匀化的效果。 In this case, the manifold 45, the resist solution does not stay locally on the contrary, since the flow direction of the resist solution is frequently switched, so that the viscosity of the resist solution can be obtained more uniform set of inner tube Effect. 另外,即使在该情况下,混入到抗蚀剂液中的空气等形成的气泡也从排气孔47导入至排气路径L2。 Further, even in this case, bubbles mixed into the liquid resist or the like is also introduced into the air from the vent hole 47 to the exhaust path L2.

或者,也可在正式涂敷处理时仅从供给口46a侧使抗蚀剂流入,进行排出辊14的预涂敷处理时或其它排出时,从供给口46b侧使抗蚀剂液流入。 Or, only the supply port may be during the final coating process flows into the resist 46a side, the discharge roller 14 is pre-coated or otherwise treated is discharged, the resist liquid flows from the supply port 46b side.

但是,即使在采用这样的形式的情况下,排气动作中也一起开放阀V4、V5,供给抗蚀剂液。 However, even in the case of adopting such a form, the exhaust valve opening operation also with V4, V5, supplying the resist solution.

在第2实施形式中,是与抗蚀剂液供给源分开地单独设置清洗液供给源,在切换阀切换来自两者的供给的形式下,切换清洗动作和通常的涂敷处理动作,但也可作为其替代,当进行清洗动作时,将抗蚀剂液供给源91的内容物本身从抗蚀剂液置换成清洗液,从抗蚀剂液供给源91供给清洗液进行清洗处理。 In the second embodiment, the resist solution supply source with the cleaning agent liquid supply source provided separately individually, in the form of switching the switching valve from the supply of both of the switching operation and the cleaning operation of the normal coating process, but also can be used as an alternative to, when a cleaning operation, the resist solution supply source 91 itself is replaced with content from the resist liquid to the cleaning liquid, from a liquid supply source 91 supplying a cleaning liquid resist cleaning process.

在上述实施形式中,以集管的上面具有直线的倾斜的情况为例进行了说明,但集管的形状不限于此。 In the aforementioned embodiment, the case of the above header has a linear inclination has been described as an example, but the shape of the header is not limited thereto. 图12A~图12C为示出细缝喷嘴、特别是集管的形状的变形例的视图。 FIGS 12A ~ FIG. 12C is a diagram illustrating a slit nozzle, especially a view showing a modification of the shape of the header. 例如,如图12A、图12B所示的细缝喷嘴241或341那样,集管245或345的上面245a或345a可具有曲面状的倾斜,或如图12C所示的细缝喷嘴441具有的集管445那样,上面445a的倾斜也可在中途变化。 For example, as shown in FIG. 12A, 12B of the nozzle slit 241 or 341 as shown, or above the header 245 245a 345 345a may have a curved or inclined, or 12C, the slit nozzle 441 having a set as pipe 445, upper inclined 445a may also change in the middle. 即使在使用具有这些形状的细缝喷嘴的情况下,也可获得与上述实施形式同样的效果。 Even in the case where the slit nozzle having these shapes, the above-described embodiment can be obtained the same effect.

抗蚀剂液的填充状态或空气的混入状态也可由与上述实施形式不同的形状判定。 Air mixed state or fill state of the resist solution can be determined with the above-described embodiment in the form of a different shape. 例如也可如图13所示那样,以由光束的照射部95a和受光部95b夹着配管96的形式设置空气传感器95,另外,也可采取下述形式:配管96在顶点部分96a和相对的部分96b都在光学上设置成透明,在从照射部95a照射光束BM11的情况下,根据作为透射光在受光部95b接收的光束BM12的光强度的程度进行判定。 FIG 13 may be, for example, as to the light beam irradiating portion 95a and a light receiving portion 95b in the form of pipes 96 sandwich the air sensor 95 is provided, in addition, may take the form as shown: the pipe 96 at the vertex portion 96a and the opposite portion 96b are arranged on the optical transparency, in the case of the light beam BM11 from the irradiation unit 95a, in accordance with the degree of light intensity of the light beam BM12 light receiving portion 95b is determined as a transmission. 在该情况下,也可获得与上述实施形式同样的效果。 In this case, the above-described embodiment can be obtained the same effect.

Claims (22)

1.一种基板处理装置,具有:保持基板的保持台;排出规定的处理液的细缝喷嘴;使上述细缝喷嘴在沿着上述基板的表面的大致水平方向上移动的移动机构;将上述规定的处理液从规定的处理液供给源供给到上述细缝喷嘴的处理液供给机构,通过使上述细缝喷嘴在上述大致水平方向上移动,使上述细缝喷嘴扫描上述基板的表面,同时使填充于上述细缝喷嘴的内部的上述规定的处理液排出,从而将上述规定的处理液涂敷到基板上,其特征在于,在上述细缝喷嘴中,与上述处理液供给机构连接、将上述规定的处理液供给到上述细缝喷嘴的集管的供给口设置于上述集管的纵向方向的两侧端部中至少一个的侧端部,将存在于上述细缝喷嘴内部的流体排出到上述细缝喷嘴的外部的排出口设置于上述集管的上端部,上述排出口设置在比上述供给口高的位置。 1. A substrate processing apparatus, comprising: a substrate holding table; slit nozzle discharging a predetermined processing liquid; so that the slit nozzle moving mechanism moves on the surface of the substrate along a substantially horizontal direction; above treatment liquid supply means supplying a predetermined processing liquid from the processing liquid supply source to said predetermined slit nozzle, so that the slit nozzle by the movement in said substantially horizontal direction, so that the scanning slit nozzle surface of the substrate, while the filled in the inside of the predetermined slit processing liquid discharge nozzle, so that the treatment liquid is applied onto the predetermined substrate, wherein, in the slit nozzle, is connected to the processing liquid supply mechanism, the above-described both ends of a predetermined process liquid is supplied to said slit nozzle header supply port provided in the longitudinal direction of the manifold-side end portion of at least one, will be present in the fluid inside is discharged to said slit nozzle an upper end portion of the outer nozzle outlet slit is provided in the header, the outlet is provided higher than the supply position of the mouth.
2.根据权利要求1所述的基板处理装置,其特征在于,上述供给口设置于上述集管的纵向方向的两侧端部中的第1侧端部,上述排出口设置于上述集管的纵向方向的两侧端部中的第2侧端部。 The substrate processing apparatus according to claim 1, wherein the first end portion side end portion of both the supply port is provided in the longitudinal direction of the header in the outlet provided in the header the second end portion of both side ends in the longitudinal direction.
3.根据权利要求1所述的基板处理装置,其特征在于,上述至少1个供给口为分别设置于上述集管的纵向方向的两侧端部的第1和第2供给口。 3. The substrate processing apparatus according to claim 1, wherein said at least one supply port are arranged in the longitudinal direction of said header first and second end portions of both the supply port.
4.根据权利要求3所述的基板处理装置,其特征在于,上述排出口设置于连接上述第1与第2供给口的区间的大致中央位置。 4. The substrate processing apparatus according to claim 3, wherein the discharge outlet is provided at a substantially central position connecting the first section and the second feed port.
5.根据权利要求1~4中任一项所述的基板处理装置,其特征在于,上述集管的上面从上述供给口朝向上述排出口倾斜。 5. The substrate processing apparatus of one of claims 1 to 4, according to any of the preceding claims, wherein the inclined upper surface of the manifold from the supply port toward the discharge port.
6.根据权利要求1~4中任一项所述的基板处理装置,其特征在于,上述集管从下面到上面的高度从上述供给口侧越往上述排出口侧越大。 6. The substrate processing apparatus according to any one of claims 1-4, wherein said collector tube from below to above the greater the height from the supply port side toward the outlet side.
7.根据权利要求1~4中任一项所述的基板处理装置,其特征在于,上述集管的截面积从上述供给口侧越往上述排出口侧越大。 The substrate processing apparatus according to any one of claims 1 to 4, wherein the cross-sectional area of ​​the manifold from the supply of the larger opening side toward the outlet side.
8.根据权利要求1~4中任一项所述的基板处理装置,其特征在于,上述流体为存在于上述细缝喷嘴内部的气体和混入了气体的上述处理液。 8. The substrate processing apparatus of one of claims 1 to 4, according to any of the preceding claims, wherein the fluid present in the interior of the slit nozzle gas and mixed gas of the treatment solution.
9.根据权利要求8所述的基板处理装置,其特征在于,具有:连接于上述排出口的排出路径;配置于上述排出路径的中途、检测上述排出路径内的处理液的填充状态的检测装置。 9. The substrate processing apparatus according to claim 8, wherein: a discharge path connected to the discharge outlet; detecting means disposed in the middle of the discharge path, the detection of the filling state of the processing liquid in the discharge path .
10.根据权利要求9所述的基板处理装置,其特征在于,还具有判定相对于上述细缝喷嘴的上述规定的处理液的填充度的判定装置,上述排出路径具有光学上透明的、弯曲成U字形的弯曲部分,上述弯曲部分朝向上侧,上述检测装置配置在上述弯曲部分的附近,对上述弯曲部分的规定位置发出第1光束,同时接收伴随着上述第1光束的照射而从上述规定位置获得的第2光束,上述判定装置根据由上述检测装置接收到的上述第2光束的光强度的变动判定上述填充度。 10. The substrate processing apparatus according to claim 9, characterized by further having the predetermined degree of filling of the slit nozzle with respect to the determination of the determining means of the processing liquid, the discharge path having optically transparent, bent into the curved portion of the U-shape, the bent portion toward the upper side, the detecting means disposed in the vicinity of the curved portions, provisions for the curved portion of the emitted first light beam position while receiving accompanied by irradiating the first light beam from the predetermined second beam position obtained in said determination means determines the filling level based on changes in light intensity of the second light beam received by said detecting means.
11.根据权利要求8所述的基板处理装置,其特征在于,具有:连接于上述排出口的排出路径;配置于上述排出路径的中途、检测上述排出路径内的处理液的气体混入状态的检测装置。 Detector disposed at the middle of the discharge path detection processing liquid in the discharge path of the gas mixing state; connected to the outlet of the discharge path: 11. A substrate processing apparatus according to claim 8, characterized in that, having device.
12.根据权利要求11所述的基板处理装置,其特征在于,还具有判定装置,其判定气体对相对于上述细缝喷嘴的上述规定的处理液的混入,上述排出路径具有光学上透明的、弯曲成U字形的弯曲部分,上述弯曲部分朝向上侧,上述检测装置配置在上述弯曲部分的附近,对上述弯曲部分的规定位置发出第1光束,同时接收伴随着上述第1光束的照射而从上述规定位置获得的第2光束,上述判定装置根据由上述检测装置接收到的上述第2光束的光强度的变动判定上述气体的混入。 12. The substrate processing apparatus according to claim 11, wherein further comprising determining means for determining the predetermined mixed gas with respect to the slit nozzle of the processing liquid, the discharge path having optically transparent, bent into a curved portion of the U-shape, the bent portion toward the upper side, the detecting means disposed in the vicinity of the curved portions, provisions for the curved portion of the emitted first light beam position while receiving accompanied by irradiating the first light beam from the the second light flux obtained in the predetermined position, the determination means determines that the gas is mixed according to the variation of the light intensity of the second light beam received by said detecting means.
13.根据权利要求1~4中任一项所述的基板处理装置,其特征在于,上述处理液供给机构可选择地供给上述规定的处理液、和从规定的清洗液供给源获得的清洗上述细缝喷嘴的内部的清洗液。 13. The substrate processing apparatus of one of claims 1 to 4, according to any of the preceding claims, wherein said treatment liquid supply means selectively supply the predetermined processing liquid, washing and cleaning liquid supply source is obtained from the predetermined the cleaning liquid inside the slit nozzle.
14.根据权利要求1~4中任一项所述的基板处理装置,其特征在于,上述处理液供给机构可在用清洗上述细缝喷嘴内部的清洗液置换上述规定的处理液后供给上述清洗液。 14. The substrate processing apparatus of one of claims 1 to 4, according to any of the preceding claims, wherein said treatment liquid supply means may be a slit nozzle cleaning the inside of the cleaning liquid of the predetermined substitution treatment liquid supplied to said washing liquid.
15.一种细缝喷嘴,由规定的移动机构移动而扫描被处理体的表面,同时排出由规定的处理液供给机构供给的规定的处理液,从而对上述被处理体提供上述规定的处理液,其特征在于,连接于上述处理液供给机构、将上述规定的处理液供给到上述细缝喷嘴的集管的供给口设置于上述集管的纵向方向的两侧端部中至少一个的侧端部,将存在于上述细缝喷嘴内部的流体排出到上述细缝喷嘴的外部的排出口设置于上述集管的上端部,上述排出口设置在比上述供给口高的位置。 A slit nozzle by a predetermined moving mechanism and the scanned surface thereof to be treated, a predetermined process liquid while discharging a process liquid supply mechanism supplying predetermined, thereby providing the above-described the predetermined treatment liquid to be processed , wherein both ends of the side end portion of the supply port is connected to the header processing liquid supplying means, the predetermined processing liquid supplied to the slit nozzle disposed in the longitudinal direction of the header of at least one of unit, present in the fluid inside the nozzle discharge slit to the upper end portion of the outer outlet of said discharge slits is provided in the nozzle header, the outlet is provided higher than the supply position of the mouth.
16.根据权利要求15所述的细缝喷嘴,其特征在于,上述供给口设置于上述集管的纵向方向的两侧端部中的第1侧端部,上述排出口设置于上述集管的纵向方向的两侧端部中的第2侧端部。 16. The slit nozzle according to claim 15, wherein the first end portion side end portion of both the supply port is provided in the longitudinal direction of the header in the outlet provided in the header the second end portion of both side ends in the longitudinal direction.
17.根据权利要求15所述的细缝喷嘴,其特征在于,上述至少1个供给口为分别设置于上述集管的纵向方向的两侧端部的第1和第2供给口。 17. The slit nozzle according to claim 15, wherein said at least one supply port are arranged in the longitudinal direction of said header first and second end portions of both the supply port.
18.根据权利要求17所述的细缝喷嘴,其特征在于,上述排出口设置于连接上述第1与第2供给口的区间的大致中央位置。 18. The slit nozzle according to claim 17, wherein the discharge outlet is provided at a substantially central position for connecting the first section and the second supply port.
19.根据权利要求15~18中任一项所述的细缝喷嘴,其特征在于,上述集管的上面从上述供给口朝向上述排出口倾斜。 19. The claims 15 to 18 in the slit nozzle according, characterized in that the inclined upper surface of the manifold from the supply port toward the discharge port.
20.根据权利要求15~18中任一项所述的细缝喷嘴,其特征在于,上述集管从下面到上面的高度从上述供给口侧越往上述排出口侧越大。 20. The claims 15 to 18 in the slit nozzle according to any one, wherein said manifold from below to above the greater the height from the supply port side toward the outlet side.
21.根据权利要求15~18中任一项所述的细缝喷嘴,其特征在于,上述集管的截面积从上述供给口侧越往上述排出口侧越大。 21. The claims 15 to 18 in the slit nozzle according, characterized in that the cross-sectional area of ​​the manifold from the supply of the larger opening side toward the outlet side.
22.根据权利要求15~18中任一项所述的细缝喷嘴,其特征在于,上述流体为存在于上述细缝喷嘴内部的气体和混入了气体的上述处理液。 22. The claims 15 to 18 in the slit nozzle according, characterized in that the fluid present in the gas inside the slit nozzle and mixed gas of the treatment solution.
CN 200410092556 2003-11-18 2004-11-15 Base plate treater and slit jet nozzle CN100335182C (en)

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CN1618527A (en) 2005-05-25
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