CA2511005C - Group iii nitride based flip-chip integrated circuit and method for fabricating - Google Patents

Group iii nitride based flip-chip integrated circuit and method for fabricating Download PDF

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Publication number
CA2511005C
CA2511005C CA2511005A CA2511005A CA2511005C CA 2511005 C CA2511005 C CA 2511005C CA 2511005 A CA2511005 A CA 2511005A CA 2511005 A CA2511005 A CA 2511005A CA 2511005 C CA2511005 C CA 2511005C
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Prior art keywords
circuit substrate
flip
substrate
wafer
terminals
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Expired - Lifetime
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CA2511005A
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English (en)
French (fr)
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CA2511005A1 (en
Inventor
Umesh K. Mishra
Primit Parikh
Yifeng Wu
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Wolfspeed Inc
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Cree Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
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    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
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    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
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  • Junction Field-Effect Transistors (AREA)
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CA2511005A 2003-01-02 2003-12-23 Group iii nitride based flip-chip integrated circuit and method for fabricating Expired - Lifetime CA2511005C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/335,915 US6825559B2 (en) 2003-01-02 2003-01-02 Group III nitride based flip-chip intergrated circuit and method for fabricating
US10/335,915 2003-01-02
PCT/US2003/041420 WO2004061973A1 (en) 2003-01-02 2003-12-23 Group iii nitride based flip-chip integrated circuit and method for fabricating

Publications (2)

Publication Number Publication Date
CA2511005A1 CA2511005A1 (en) 2004-07-22
CA2511005C true CA2511005C (en) 2016-05-17

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