ATE525498T1 - Verfahren zum ziehen von beta-ga2o3 einkristallen - Google Patents

Verfahren zum ziehen von beta-ga2o3 einkristallen

Info

Publication number
ATE525498T1
ATE525498T1 AT04711454T AT04711454T ATE525498T1 AT E525498 T1 ATE525498 T1 AT E525498T1 AT 04711454 T AT04711454 T AT 04711454T AT 04711454 T AT04711454 T AT 04711454T AT E525498 T1 ATE525498 T1 AT E525498T1
Authority
AT
Austria
Prior art keywords
single crystals
light
ga2o3 single
type
growing beta
Prior art date
Application number
AT04711454T
Other languages
English (en)
Inventor
Noboru Ichinose
K Shimamura
Kazuo Aoki
Villora Encarnacion Antonia Garcia
Original Assignee
Univ Waseda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003046552A external-priority patent/JP4630986B2/ja
Priority claimed from JP2003066020A external-priority patent/JP4565062B2/ja
Priority claimed from JP2003137916A external-priority patent/JP4020314B2/ja
Application filed by Univ Waseda filed Critical Univ Waseda
Application granted granted Critical
Publication of ATE525498T1 publication Critical patent/ATE525498T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/16Oxides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B13/00Single-crystal growth by zone-melting; Refining by zone-melting
    • C30B13/34Single-crystal growth by zone-melting; Refining by zone-melting characterised by the seed, e.g. by its crystallographic orientation
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02Epitaxial-layer growth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02414Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02565Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02631Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H01L33/18Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Devices (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Semiconductor Lasers (AREA)
AT04711454T 2003-02-24 2004-02-16 Verfahren zum ziehen von beta-ga2o3 einkristallen ATE525498T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003046552A JP4630986B2 (ja) 2003-02-24 2003-02-24 β−Ga2O3系単結晶成長方法
JP2003066020A JP4565062B2 (ja) 2003-03-12 2003-03-12 薄膜単結晶の成長方法
JP2003137916A JP4020314B2 (ja) 2003-05-15 2003-05-15 Ga2O3系発光素子およびその製造方法
PCT/JP2004/001653 WO2004074556A2 (ja) 2003-02-24 2004-02-16 β‐Ga2O3系単結晶成長方法、薄膜単結晶の成長方法、Ga2O3系発光素子およびその製造方法

Publications (1)

Publication Number Publication Date
ATE525498T1 true ATE525498T1 (de) 2011-10-15

Family

ID=32912842

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04711454T ATE525498T1 (de) 2003-02-24 2004-02-16 Verfahren zum ziehen von beta-ga2o3 einkristallen

Country Status (8)

Country Link
US (4) US7393411B2 (de)
EP (3) EP1598450B1 (de)
KR (1) KR100787272B1 (de)
AT (1) ATE525498T1 (de)
CA (1) CA2517024C (de)
RU (1) RU2313623C2 (de)
TW (3) TWI370804B (de)
WO (1) WO2004074556A2 (de)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3679097B2 (ja) 2002-05-31 2005-08-03 株式会社光波 発光素子
EP1598450B1 (de) * 2003-02-24 2011-09-21 Waseda University VERFAHREN ZUM ZIEHEN VON Beta-Ga2O3 EINKRISTALLEN
JP2005235961A (ja) * 2004-02-18 2005-09-02 Univ Waseda Ga2O3系単結晶の導電率制御方法
JP4803634B2 (ja) * 2004-10-01 2011-10-26 学校法人早稲田大学 p型Ga2O3膜の製造方法およびpn接合型Ga2O3膜の製造方法
US7829444B2 (en) * 2004-11-10 2010-11-09 Canon Kabushiki Kaisha Field effect transistor manufacturing method
JP5003013B2 (ja) * 2006-04-25 2012-08-15 株式会社日立製作所 シリコン発光ダイオード、シリコン光トランジスタ、シリコンレーザー及びそれらの製造方法。
JP5529420B2 (ja) * 2009-02-09 2014-06-25 住友電気工業株式会社 エピタキシャルウエハ、窒化ガリウム系半導体デバイスを作製する方法、窒化ガリウム系半導体デバイス、及び酸化ガリウムウエハ
US8529802B2 (en) * 2009-02-13 2013-09-10 Samsung Electronics Co., Ltd. Solution composition and method of forming thin film and method of manufacturing thin film transistor using the solution composition
KR101664958B1 (ko) * 2009-04-09 2016-10-12 삼성전자주식회사 산화물 박막 형성용 용액 조성물 및 상기 산화물 박막을 포함하는 전자 소자
US8319300B2 (en) * 2009-04-09 2012-11-27 Samsung Electronics Co., Ltd. Solution composition for forming oxide thin film and electronic device including the oxide thin film
WO2011074407A1 (en) 2009-12-18 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR100969127B1 (ko) 2010-02-18 2010-07-09 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
US9187815B2 (en) * 2010-03-12 2015-11-17 United Technologies Corporation Thermal stabilization of coating material vapor stream
JP2011061225A (ja) * 2010-11-01 2011-03-24 Waseda Univ pn型Ga2O3膜の製造方法
KR101935755B1 (ko) * 2010-12-20 2019-01-04 토소가부시키가이샤 금속 갈륨 침투 질화갈륨 성형물 및 이의 제조방법
USD672327S1 (en) 2010-12-28 2012-12-11 Samsung Electronics Co., Ltd. Portable telephone
USD647870S1 (en) 2010-12-28 2011-11-01 Samsung Electronics Co., Ltd. Portable telephone
USD649134S1 (en) 2010-12-28 2011-11-22 Samsung Electronics Co., Ltd. Portable telephone
JP5807282B2 (ja) * 2011-09-08 2015-11-10 株式会社タムラ製作所 Ga2O3系半導体素子
CN107653490A (zh) * 2011-09-08 2018-02-02 株式会社田村制作所 晶体层叠结构体
WO2013035845A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子
JP5543672B2 (ja) 2011-09-08 2014-07-09 株式会社タムラ製作所 結晶積層構造体
JP5745073B2 (ja) 2011-09-08 2015-07-08 株式会社タムラ製作所 Ga2O3系単結晶体のドナー濃度制御方法
JP2013102081A (ja) * 2011-11-09 2013-05-23 Tamura Seisakusho Co Ltd ショットキーバリアダイオード
JP5491483B2 (ja) * 2011-11-15 2014-05-14 株式会社タムラ製作所 β−Ga2O3系単結晶の成長方法
JP6082700B2 (ja) 2011-11-29 2017-02-15 株式会社タムラ製作所 Ga2O3系結晶膜の製造方法
JP5756075B2 (ja) * 2012-11-07 2015-07-29 株式会社タムラ製作所 β−Ga2O3系単結晶の育成方法
JP5536920B1 (ja) 2013-03-04 2014-07-02 株式会社タムラ製作所 Ga2O3系単結晶基板、及びその製造方法
JP5788925B2 (ja) 2013-04-04 2015-10-07 株式会社タムラ製作所 β−Ga2O3系単結晶の成長方法
JP5984069B2 (ja) * 2013-09-30 2016-09-06 株式会社タムラ製作所 β−Ga2O3系単結晶膜の成長方法、及び結晶積層構造体
JP5892495B2 (ja) * 2013-12-24 2016-03-23 株式会社タムラ製作所 Ga2O3系結晶膜の成膜方法、及び結晶積層構造体
JP6013383B2 (ja) * 2014-02-28 2016-10-25 株式会社タムラ製作所 β−Ga2O3系単結晶基板の製造方法
TWI550909B (zh) 2014-03-21 2016-09-21 A flip chip type light emitting diode and a method for manufacturing the same, and a flip chip type structure thereof
JP5907465B2 (ja) * 2014-08-29 2016-04-26 株式会社タムラ製作所 半導体素子及び結晶積層構造体
EP3042986A1 (de) 2015-01-09 2016-07-13 Forschungsverbund Berlin e.V. Verfahren zur Herstellung des ß-Ga2O3 Einkristalle, dem in einem Metalltiegel enthaltenen ist, durch Erstarrungs des Schmelzs und dem Sauerstoffsdruck.
JP6726910B2 (ja) * 2016-04-21 2020-07-22 国立大学法人信州大学 酸化ガリウム結晶の製造装置および酸化ガリウム結晶の製造方法
US10593544B2 (en) * 2016-10-14 2020-03-17 Case Westen Reverse University Method for forming a thin film comprising an ultrawide bandgap oxide semiconductor
CN108342775B (zh) * 2017-01-25 2024-04-12 中国科学院上海光学精密机械研究所 一种钽掺杂β氧化镓晶态材料及其制备方法和应用
SG11202000619WA (en) * 2017-01-25 2020-02-27 Shanghai Inst Optics & Fine Mech Cas Gallium oxide-doped crystalline material, preparation method and application thereof
JP2018135228A (ja) * 2017-02-21 2018-08-30 住友金属鉱山株式会社 LiTaO3単結晶の育成方法とLiTaO3単結晶の処理方法
KR101897494B1 (ko) 2017-06-27 2018-09-12 충남대학교산학협력단 산화질화갈륨 박막의 제조방법
CN107827369B (zh) * 2017-12-06 2020-08-07 浙江海洋大学 一种ZnMgO纳米柱及其制备方法
JP6834062B2 (ja) * 2018-08-01 2021-02-24 出光興産株式会社 結晶構造化合物、酸化物焼結体、及びスパッタリングターゲット
CN109136859A (zh) * 2018-10-22 2019-01-04 哈尔滨工业大学 一种制备高透光率氧化镓薄膜的方法
CN109671612B (zh) * 2018-11-15 2020-07-03 中国科学院上海微系统与信息技术研究所 一种氧化镓半导体结构及其制备方法
FR3085535B1 (fr) 2019-04-17 2021-02-12 Hosseini Teherani Ferechteh Procédé de fabrication d’oxyde de gallium de type p par dopage intrinsèque, le film mince obtenu d’oxyde de gallium et son utilisation
CN114423883B (zh) * 2019-09-30 2024-03-12 日本碍子株式会社 α-Ga2O3系半导体膜
CN110911270B (zh) * 2019-12-11 2022-03-25 吉林大学 一种高质量氧化镓薄膜及其同质外延生长方法
US11674239B2 (en) * 2020-02-27 2023-06-13 Fujikoshi Machinery Corp. Gallium oxide crystal manufacturing device
US11680337B2 (en) * 2020-04-03 2023-06-20 Psiquantum, Corp. Fabrication of films having controlled stoichiometry using molecular beam epitaxy
US11342484B2 (en) * 2020-05-11 2022-05-24 Silanna UV Technologies Pte Ltd Metal oxide semiconductor-based light emitting device
WO2021246697A1 (ko) * 2020-06-05 2021-12-09 고려대학교 산학협력단 베타 산화갈륨 박막 제조방법
CN111628019B (zh) * 2020-06-28 2022-05-27 中国科学院长春光学精密机械与物理研究所 一种三氧化二镓日盲紫外探测器及其制备方法
WO2022094222A1 (en) * 2020-10-30 2022-05-05 The Regents Of The University Of California Nitride-based ultraviolet light emitting diode with an ultraviolet transparent contact
CN112281211A (zh) * 2020-11-06 2021-01-29 鲁东大学 一种多晶氧化镓纳米片薄膜的制备方法
CN112993085A (zh) * 2021-02-09 2021-06-18 中国科学院上海光学精密机械研究所 一种氧化镓x射线探测器及其制备方法
CN113223929A (zh) * 2021-04-16 2021-08-06 西安电子科技大学 基于非平衡激光等离子体的氧化镓高效掺杂方法
CN113584587B (zh) * 2021-07-30 2022-04-08 中国科学院宁波材料技术与工程研究所 Sn掺杂的介稳态氧化镓晶相薄膜及其制备方法与应用
WO2023073404A1 (en) 2021-10-27 2023-05-04 Silanna UV Technologies Pte Ltd Methods and systems for heating a wide bandgap substrate
US11522103B1 (en) 2021-11-10 2022-12-06 Silanna UV Technologies Pte Ltd Epitaxial oxide materials, structures, and devices
WO2023084283A1 (en) * 2021-11-10 2023-05-19 Silanna UV Technologies Pte Ltd Epitaxial oxide materials, structures, and devices
WO2023084275A1 (en) 2021-11-10 2023-05-19 Silanna UV Technologies Pte Ltd Ultrawide bandgap semiconductor devices including magnesium germanium oxides
WO2023084274A1 (en) 2021-11-10 2023-05-19 Silanna UV Technologies Pte Ltd Epitaxial oxide materials, structures, and devices
EP4219803A1 (de) 2022-01-31 2023-08-02 Siltronic AG Verfahren und vorrichtung zur herstellung von elektrisch leitenden beta-ga2o3-volumeneinkristallen und elektrisch leitender beta-ga2o3-volumeneinkristall

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0226899A (ja) * 1988-07-16 1990-01-29 Mitsumi Electric Co Ltd Fe−Si−Al系合金単結晶の育成法
JP2854623B2 (ja) 1989-09-05 1999-02-03 株式会社東芝 酸化物超電導体薄膜の製造方法
US5418216A (en) * 1990-11-30 1995-05-23 Fork; David K. Superconducting thin films on epitaxial magnesium oxide grown on silicon
US5330855A (en) * 1991-09-23 1994-07-19 The United States Of America, As Represented By The Secretary Of Commerce Planar epitaxial films of SnO2
JP2735422B2 (ja) * 1991-12-03 1998-04-02 日鉄鉱業株式会社 ルチル単結晶の処理方法
JPH05179430A (ja) 1991-12-28 1993-07-20 Nec Corp パルスレーザ蒸着法によるセラミックス複合系材料薄膜の製造方法
JP2778405B2 (ja) 1993-03-12 1998-07-23 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
US5670966A (en) 1994-12-27 1997-09-23 Ppg Industries, Inc. Glass antenna for vehicle window
US5625202A (en) * 1995-06-08 1997-04-29 University Of Central Florida Modified wurtzite structure oxide compounds as substrates for III-V nitride compound semiconductor epitaxial thin film growth
EP0856600B1 (de) 1997-01-30 2001-04-25 Nippon Telegraph And Telephone Corporation LiGa02 Einkristall, Einkristallinessubstrat und Verfahren zu ihrer Herstellung
US6030453A (en) * 1997-03-04 2000-02-29 Motorola, Inc. III-V epitaxial wafer production
US6057561A (en) * 1997-03-07 2000-05-02 Japan Science And Technology Corporation Optical semiconductor element
JPH11145717A (ja) 1997-11-11 1999-05-28 Asahi Glass Co Ltd 車両用ガラスアンテナ
US6065543A (en) 1998-01-27 2000-05-23 Halliburton Energy Services, Inc. Sealed lateral wellbore junction assembled downhole
US6159834A (en) * 1998-02-12 2000-12-12 Motorola, Inc. Method of forming a gate quality oxide-compound semiconductor structure
US6094295A (en) * 1998-02-12 2000-07-25 Motorola, Inc. Ultraviolet transmitting oxide with metallic oxide phase and method of fabrication
EP0975027A2 (de) * 1998-07-23 2000-01-26 Sony Corporation Licht-emittierende Vorrichtung und Herstellungsverfahren
JP2000174529A (ja) 1998-12-07 2000-06-23 Asahi Glass Co Ltd 自動車用高周波ガラスアンテナ
JP2001286814A (ja) 2000-04-05 2001-10-16 Horiba Ltd 粒子膜形成方法
US7445671B2 (en) * 2000-06-29 2008-11-04 University Of Louisville Formation of metal oxide nanowire networks (nanowebs) of low-melting metals
US7182812B2 (en) * 2002-09-16 2007-02-27 University Of Louisville Direct synthesis of oxide nanostructures of low-melting metals
JP4083396B2 (ja) * 2000-07-10 2008-04-30 独立行政法人科学技術振興機構 紫外透明導電膜とその製造方法
JP3579712B2 (ja) * 2000-08-28 2004-10-20 独立行政法人産業技術総合研究所 酸化物立方晶系(111)基板を用いる酸化亜鉛等の六方晶系物質の(0001)エピタキシャル薄膜の作製方法及び同法で作製した薄膜
WO2002043466A2 (en) * 2000-11-30 2002-06-06 North Carolina State University Non-thermionic sputter material transport device, methods of use, and materials produced thereby
JP5110744B2 (ja) * 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光装置及びその製造方法
JP3969959B2 (ja) * 2001-02-28 2007-09-05 独立行政法人科学技術振興機構 透明酸化物積層膜及び透明酸化物p−n接合ダイオードの作製方法
TW541723B (en) 2001-04-27 2003-07-11 Shinetsu Handotai Kk Method for manufacturing light-emitting element
JP3907981B2 (ja) 2001-07-30 2007-04-18 富士通株式会社 データ処理プログラム及びデータ処理装置
US7169227B2 (en) * 2001-08-01 2007-01-30 Crystal Photonics, Incorporated Method for making free-standing AIGaN wafer, wafer produced thereby, and associated methods and devices using the wafer
JP2003066020A (ja) 2001-08-22 2003-03-05 Sumitomo Chem Co Ltd 分析システム
JP2003137916A (ja) 2001-11-07 2003-05-14 Mitsubishi Rayon Co Ltd 両親媒性重合体の製造方法
WO2003063227A2 (en) * 2002-01-22 2003-07-31 Massachusetts Institute Of Technology A method of fabrication for iii-v semiconductor surface passivation
JP3679097B2 (ja) * 2002-05-31 2005-08-03 株式会社光波 発光素子
AU2003262981A1 (en) * 2002-08-28 2004-03-19 Moxtronics, Inc. A hybrid beam deposition system and methods for fabricating zno films, p-type zno films, and zno-based ii-vi compound semiconductor devices
JP3795007B2 (ja) * 2002-11-27 2006-07-12 松下電器産業株式会社 半導体発光素子及びその製造方法
EP1598450B1 (de) * 2003-02-24 2011-09-21 Waseda University VERFAHREN ZUM ZIEHEN VON Beta-Ga2O3 EINKRISTALLEN
TWI312582B (en) * 2003-07-24 2009-07-21 Epistar Corporatio Led device, flip-chip led package and light reflecting structure
JP2005235961A (ja) * 2004-02-18 2005-09-02 Univ Waseda Ga2O3系単結晶の導電率制御方法
KR100665298B1 (ko) * 2004-06-10 2007-01-04 서울반도체 주식회사 발광장치
US7087351B2 (en) * 2004-09-29 2006-08-08 Eastman Kodak Company Antistatic layer for electrically modulated display
JP2007165626A (ja) * 2005-12-14 2007-06-28 Toyoda Gosei Co Ltd 発光素子及びその製造方法
US7488384B2 (en) * 2006-05-03 2009-02-10 Ohio University Direct pyrolysis route to GaN quantum dots
US20080008964A1 (en) * 2006-07-05 2008-01-10 Chia-Hua Chan Light emitting diode and method of fabricating a nano/micro structure

Also Published As

Publication number Publication date
EP2267194A3 (de) 2011-10-19
TWI370804B (en) 2012-08-21
EP2273569A2 (de) 2011-01-12
KR100787272B1 (ko) 2007-12-20
TW200424128A (en) 2004-11-16
TWI450865B (zh) 2014-09-01
US20080265264A1 (en) 2008-10-30
EP2267194A2 (de) 2010-12-29
RU2005126721A (ru) 2006-02-10
US7393411B2 (en) 2008-07-01
WO2004074556A2 (ja) 2004-09-02
EP1598450A2 (de) 2005-11-23
WO2004074556A3 (ja) 2004-11-11
KR20060007366A (ko) 2006-01-24
US20060150891A1 (en) 2006-07-13
EP1598450A4 (de) 2008-04-23
CA2517024A1 (en) 2004-09-02
US20100229789A1 (en) 2010-09-16
TW201242901A (en) 2012-11-01
US7713353B2 (en) 2010-05-11
EP2267194B1 (de) 2013-04-17
CA2517024C (en) 2009-12-01
RU2313623C2 (ru) 2007-12-27
US8262796B2 (en) 2012-09-11
EP2273569A3 (de) 2011-03-02
EP1598450B1 (de) 2011-09-21
US20120304918A1 (en) 2012-12-06
US8747553B2 (en) 2014-06-10
TW201144227A (en) 2011-12-16

Similar Documents

Publication Publication Date Title
ATE525498T1 (de) Verfahren zum ziehen von beta-ga2o3 einkristallen
ATE546828T1 (de) Verfahren zum herstellen von halbleiterbauelementen auf einem gruppe-iv- substrat mit kontrollierten grenzflächeneigenschaften und diffusionsausläufern
TW200742126A (en) Semiconductor light emitting device and its manufacturing method
WO2004105099A3 (en) Group ii-vi semiconductor devices
TW200746454A (en) Semiconductor light-emitting device and fabricating method of the same
WO2007001295A3 (en) Quantum dot based optoelectronic device and method of making same
TW200514281A (en) Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
ATE487239T1 (de) Lichtemittierende vorrichtung und verfahren zu ihrer herstellung
EP2012361A3 (de) Organisches lichtemittierendes Element und Herstellungsverfahren dafür
ATE425557T1 (de) Lichtemittierendes halbleiterelement und zugehöriges produktionsverfahren
ATE492032T1 (de) Cluster-kapselung von leuchtdioden
DE60324413D1 (de) Verfahren zur herstellung von vertikalstruktur-leds
TW200601586A (en) Flip-chip light emitting diode and fabricating method thereof
EP1840247A3 (de) Verfahren zur Herstellung von Siliziumnanodrähten mit einem porösen Glasmuster und Vorrichtung mit damit hergestellten Siliziumnanodrähten
ATE535027T1 (de) Lichtemittierende iii-nitrid-vorrichtung mit spannungsreduzierter lichtemittierender schicht
TW200633331A (en) Semiconductor laser device and fabricating method thereof
TW200705706A (en) Light emitting diode structure
TW200705709A (en) Method of making a vertical light emitting diode
WO2007036837A3 (en) A method of compensating an aging process of an illumination device
EP1328024A3 (de) Optoelektronische Vorrichtung aus Silizium und Lichtemittierende Vorrichtung
WO2005081750A3 (en) Group iii-nitride based led having a transparent current spreading layer
TW200419825A (en) Optoelectronic device made by semiconductor compound
ATE361654T1 (de) Elektrolumineszente vorrichtungen und verfahren
TW200505062A (en) Light-emitting diode
TW200603249A (en) Improved process for RESURF diffusion for high voltage MOSFET

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties