WO2021124602A1 - 統計データ生成方法、切断装置及びシステム - Google Patents

統計データ生成方法、切断装置及びシステム Download PDF

Info

Publication number
WO2021124602A1
WO2021124602A1 PCT/JP2020/026056 JP2020026056W WO2021124602A1 WO 2021124602 A1 WO2021124602 A1 WO 2021124602A1 JP 2020026056 W JP2020026056 W JP 2020026056W WO 2021124602 A1 WO2021124602 A1 WO 2021124602A1
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
package
unit
statistical data
cutting
Prior art date
Application number
PCT/JP2020/026056
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
高橋　和宏
貴俊 尾関
彩香 水田
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to MX2022007395A priority Critical patent/MX2022007395A/es
Priority to CN202080082298.9A priority patent/CN114746232B/zh
Priority to KR1020227023378A priority patent/KR20220109463A/ko
Publication of WO2021124602A1 publication Critical patent/WO2021124602A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005—Computer numerical control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Definitions

  • the present invention relates to a statistical data generation method, a cutting device and a system.
  • Patent Document 1 discloses a method for managing the processing result of a wafer.
  • the cutting groove formed in the processing process of the wafer is imaged by the imaging means, and the cutting groove data is generated based on the generated image information.
  • This cutting groove data is cumulatively stored in the storage means in association with the image information and the position information.
  • the stored cutting groove data, image information, and the like are displayed on the display panel (see Patent Document 1).
  • the present invention has been made to solve such a problem, and an object of the present invention is to generate statistical data capable of generating data used for realizing advanced production control in a post-process as compared with the conventional one. To provide methods, cutting devices and systems.
  • the statistical data generation method is based on a step of aggregating inspection data including inspection result information of a package part produced by cutting a package substrate and statistical data based on the aggregated inspection data. Includes steps to generate.
  • the cutting device includes a cutting mechanism, an inspection mechanism, and a calculation unit.
  • the cutting mechanism is configured to produce a plurality of package components by cutting the package substrate.
  • the inspection mechanism is configured to inspect each of a plurality of package parts.
  • the calculation unit is configured to perform a calculation using inspection data including inspection result information by the inspection mechanism.
  • the calculation unit is configured to aggregate inspection data and generate statistical data based on the aggregated inspection data.
  • a system includes the above-mentioned cutting device and a storage device external to the cutting device.
  • the storage device is configured to store inspection data.
  • the present invention it is possible to provide a statistical data generation method, a cutting device and a system capable of generating data used for realizing advanced production control in a post-process as compared with the conventional one.
  • FIG. 1 is a diagram schematically showing a system 100 according to the present embodiment. As shown in FIG. 1, the system 100 includes a cutting device 1 and a storage device 30.
  • the cutting device 1 is configured to separate the package substrate into a plurality of package parts by cutting the package substrate (object to be cut).
  • the substrate on which the semiconductor chip is mounted or the lead frame is resin-sealed.
  • package substrates include BGA (BallGridArray) package substrate, LGA (LandGridArray) package substrate, CSP (ChipSizePackage) package substrate, LED (LightEmittingDiode) package substrate, and QFN (QuadFlatNo-leaded). ) Package substrate can be mentioned.
  • the cutting device 1 is configured to inspect each of a plurality of individualized package parts.
  • an image of each package part is imaged, and each package part is inspected based on the image. Inspection data is generated through the inspection, and each package part is classified as "non-defective" or "defective".
  • the storage device 30 is configured to store the inspection data generated through the inspection in the cutting device 1. Inspection data is sequentially accumulated in the storage device 30. The inspection data does not necessarily have to be stored in the storage device 30, and may be stored in, for example, a memory in the cutting device 1.
  • the cutting device 1 is configured to aggregate inspection data including inspection result information of package parts and generate statistical data based on the aggregated inspection data.
  • statistical data of inspection data including inspection result information of package parts for example, early detection of problems occurring in a post-process can be promoted. That is, according to the cutting device 1, it is possible to generate data (statistical data) used for advanced production control in the post-process as compared with the conventional one.
  • the cutting device 1 according to the present embodiment will be described in detail.
  • FIG. 2 is a plan view schematically showing a cutting device 1 according to the present embodiment.
  • the package substrate P1 is used as the object to be cut, and the package substrate P1 is separated into a plurality of semiconductor packages S1 by the cutting device 1.
  • the resin-sealed surface is referred to as a mold surface, and the surface opposite to the mold surface is referred to as a ball / lead surface.
  • the cutting device 1 includes a cutting module A1 and an inspection / storage module B1 as components.
  • the cutting module A1 is configured to produce a plurality of semiconductor packages S1 by cutting the package substrate P1.
  • the inspection / storage module B1 is configured to inspect each of the plurality of produced semiconductor packages S1 and then store the semiconductor package S1 in a tray.
  • each component is removable and replaceable with respect to other components.
  • the cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, and a transport unit 7.
  • the substrate supply unit 3 supplies the package substrates P1 to the positioning unit 4 one by one by pushing out the package substrates P1 one by one from the magazine M1 accommodating the plurality of package substrates P1. At this time, the package substrate P1 is arranged with the ball / lead surface facing upward.
  • the positioning unit 4 positions the package substrate P1 by arranging the package substrate P1 extruded from the substrate supply unit 3 on the rail portion 4a. After that, the positioning unit 4 conveys the positioned package substrate P1 to the cutting table 5.
  • the cutting table 5 holds the package substrate P to be cut.
  • a cutting device 1 having a twin cut table configuration having two cutting tables 5 is exemplified.
  • the cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c.
  • the holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning unit 4 from below.
  • the rotation mechanism 5b can rotate the holding member 5a in the ⁇ direction in the figure.
  • the moving mechanism 5c can move the holding member 5a along the Y axis in the figure.
  • the spindle portion 6 separates the package substrate P1 into a plurality of semiconductor packages S1 by cutting the package substrate P1.
  • a cutting device 1 having a twin spindle configuration having two spindle portions 6 is exemplified.
  • the spindle portion 6 is movable along the X-axis and the Z-axis in the figure.
  • the cutting device 1 may have a single spindle configuration having one spindle portion 6.
  • FIG. 3 is a side view schematically showing the spindle portion 6.
  • the spindle portion 6 includes a blade 6a, a rotating shaft 6c, a first flange 6d, a second flange 6e, and a fastening member 6f.
  • the blade 6a rotates at high speed to cut the package substrate P1 and separate the package substrate P1 into a plurality of semiconductor packages S1.
  • the blade 6a is mounted on the rotating shaft 6c in a state of being sandwiched by one flange (first flange) 6d and the other flange (second flange) 6e.
  • the first flange 6d and the second flange 6e are fixed to the rotating shaft 6c by a fastening member 6f such as a nut.
  • the first flange 6d is also referred to as a back flange.
  • the second flange 6e is arranged on the fastening member 6f side with the blade 6a interposed therebetween, and is also referred to as an outer flange.
  • the spindle portion 6 has a cutting water nozzle that injects cutting water toward a blade 6a that rotates at high speed, a cooling water nozzle that injects cooling water, and a cleaning water nozzle that injects cleaning water for cleaning cutting debris. (All not shown) and the like are provided.
  • the package substrate P1 is imaged by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed.
  • the confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of the mark provided on the package substrate P1.
  • the mark indicates, for example, the cutting position of the package substrate P1.
  • the cutting table 5 moves toward the spindle portion 6 along the Y axis in the figure.
  • the package substrate P1 is cut by relatively moving the cutting table 5 and the spindle portion 6.
  • the package substrate P1 is imaged by the second position confirmation camera 6b as necessary, and the position of the package substrate P1 and the like are confirmed.
  • the confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position, cutting width, and the like of the package substrate P1.
  • the cutting table 5 moves in a direction away from the spindle portion 6 along the Y axis in the figure in a state where the plurality of fragmented semiconductor packages S1 are adsorbed.
  • the first cleaner 5e cleans and dries the upper surface (ball / lead surface) of the semiconductor package S1.
  • the transport unit 7 attracts the semiconductor package S1 held on the cutting table 5 from above, and transports the semiconductor package S1 to the inspection table 11 of the inspection / storage module B1.
  • the second cleaner 7a cleans and dries the lower surface (mold surface) of the semiconductor package S1.
  • the inspection / storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement unit 14, and an extraction unit 15.
  • the inspection table 11 holds the semiconductor package S1 for optical inspection of the semiconductor package S1.
  • the inspection table 11 can be moved along the X axis in the figure. Further, the inspection table 11 can be turned upside down.
  • the inspection table 11 is provided with a holding member that holds the semiconductor package S1 by adsorbing the semiconductor package S1.
  • the first optical inspection camera 12 and the second optical inspection camera 13 image both surfaces (ball / lead surface and mold surface) of the semiconductor package S1. Various inspections of the semiconductor package S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13.
  • Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged so as to take an image of the upper side in the vicinity of the inspection table 11.
  • Each of the first optical inspection camera 12 and the second optical inspection camera 13 is provided with a lighting device (not shown) capable of irradiating light during inspection.
  • the first optical inspection camera 12 may be provided in the cutting module A1.
  • the first optical inspection camera 12 images the molded surface of the semiconductor package S1 transported to the inspection table 11 by the transport unit 7. After that, the transport unit 7 places the semiconductor package S1 on the holding member of the inspection table 11. After the holding member adsorbs the semiconductor package S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the ball / lead surface of the semiconductor package S1 is imaged by the second optical inspection camera 13. As described above, various inspections of the semiconductor package S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection items in this inspection will be described in detail later.
  • the inspected semiconductor package S1 is arranged in the arrangement unit 14.
  • the arrangement portion 14 is movable along the Y axis in the figure.
  • the inspected semiconductor package S1 is arranged in the arrangement unit 14.
  • the extraction unit 15 transfers the semiconductor package S1 arranged in the arrangement unit 14 to the tray.
  • the semiconductor package S1 is classified into a "non-defective product" or a "defective product” based on the results of inspections using the first optical inspection camera 12 and the second optical inspection camera 13.
  • the extraction unit 15 transfers each semiconductor package S1 to the non-defective product tray 15a or the defective product tray 15b based on the result of sorting. That is, the non-defective product is stored in the non-defective product tray 15a, and the defective product is stored in the defective product tray 15b.
  • the non-defective product tray 15a and the defective product tray 15b is filled with the semiconductor package S1, it is replaced with a new tray.
  • the cutting device 1 further includes a computer 50.
  • the computer 50 controls the operation of each part of the cutting module A1 and the inspection / storage module B1.
  • the operation of unit 15 is controlled.
  • the computer 50 performs various inspections of the semiconductor package S1 based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, for example.
  • the computer 50 aggregates the inspection data generated through various inspections in the storage device 30 (FIG. 1), and generates statistical data based on the aggregated inspection data. Next, the computer 50 will be described in detail.
  • FIG. 4 is a diagram schematically showing a hardware configuration of the computer 50.
  • the computer 50 includes a calculation unit 70, an input / output I / F (interface) 90, a communication I / F 91, and a storage unit 80, and each configuration is electrically connected via a bus. Is connected.
  • the calculation unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like.
  • the calculation unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 according to information processing.
  • the input / output I / F 90 is configured to communicate with each component included in the cutting device 1 via a signal line.
  • the input / output I / F 90 is used for transmitting data from the computer 50 to each component in the cutting device 1 and receiving data transmitted from each component in the cutting device 1 to the computer 50.
  • the communication I / F 91 is configured to communicate with an external device (for example, a storage device 30 (FIG. 1)) provided outside the disconnecting device 1 via the Internet.
  • the communication I / F91 is composed of, for example, a wired LAN (Local Area Network) module or a wireless LAN module.
  • the storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid state drive.
  • the storage unit 80 is configured to store, for example, the control program 81.
  • the storage unit 80 may store the inspection data generated through the inspection using the first optical inspection camera 12 and the second optical inspection camera 13.
  • FIG. 5 is a diagram showing the relationship of each function realized by the computer 50.
  • the calculation unit 70 expands the control program 81 stored in the storage unit 80 into the RAM 74. Then, the calculation unit 70 interprets and executes the control program 81 expanded in the RAM 74 by the CPU 72, so that the computer 50 controls each component in the cutting device 1. As shown in FIG. 5, the computer 50 operates as an image acquisition unit 52, an inspection unit 54, a statistical data generation unit 56, and an image generation unit 58.
  • the image acquisition unit 52 sends an imaging instruction to the first optical inspection camera 12 and the second optical inspection camera 13.
  • the imaging instruction includes, for example, information for specifying an imaging range on the package substrate P1.
  • the image acquisition unit 52 sequentially changes the imaging range. As a result, both sides of all the semiconductor packages S1 included in the package substrate P1 are imaged.
  • the image acquisition unit 52 acquires the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 via the input / output I / F 90.
  • the inspection unit 54 analyzes the image data acquired by the image acquisition unit 52 to perform various inspections of each semiconductor package S1 included in the image data.
  • inspection items include "number of terminals (Lead Pad Number)", “Die Pad Defect”, and "Mark Angle” in QFN.
  • FIG. 6 is a diagram for explaining the inspection of the number of terminals in QFN.
  • the image ID 1 is an image included in the image captured by the second optical inspection camera 13. That is, the image ID 1 is an image showing a surface (ball / lead surface) opposite to the mold surface of the package component 60.
  • a die pad 61 is arranged at the center of the package component 60, and a plurality of terminals (electrode pads) 62 are arranged around the package component 60.
  • the inspection unit 54 In the inspection of the number of terminals of the package component 60, the inspection unit 54 detects the number of terminals (number of lead pads) on each side through image analysis. The inspection unit 54 determines whether or not the number of terminals on each side is a predetermined number. The inspection unit 54 determines that the package component 60 is a non-defective product with respect to the "number of terminals" when the number of terminals on each side is a predetermined number, and packages the package with respect to the "number of terminals" when the number of terminals on each side is not a predetermined number. It is determined that the part 60 is a defective product.
  • the inspection unit 54 stores the detected number of terminals on each side and the determination result of a non-defective product / defective product in the storage device 30 in association with the position information of the package component 60 on the package substrate. That is, depending on the inspection item, the inspection unit 54 not only determines the non-defective product / defective product but also the measured value of the measurement target (“number of terminals” in this example) obtained through image analysis as a package component on the package substrate. It is stored in the storage device 30 in association with the position information of the 60.
  • FIG. 7 is a diagram for explaining the inspection of die pad defects in QFN.
  • the image ID 2 is an image included in the image captured by the second optical inspection camera 13. That is, the image ID 2 is an image showing a surface (ball / lead surface) opposite to the mold surface of the package component 60.
  • the inspection unit 54 detects a foreign substance on the die pad 61 through image analysis. In addition, the inspection unit 54 determines whether or not the level of the foreign matter existing on the die pad 61 is within a predetermined range. When the level of the foreign matter existing on the die pad 61 is within the predetermined range, the inspection unit 54 determines that the package component 60 is a non-defective product with respect to the die pad defect, and the level of the foreign matter existing on the die pad 61 is within the predetermined range. If it does not fit inside, it is determined that the package component 60 is a defective product with respect to the die pad defect. The inspection unit 54 stores the determination result of the non-defective product / defective product in the storage device 30 in association with the position information of the package component 60 on the package substrate.
  • FIG. 8 is a diagram for explaining the inspection of the mark angle in QFN.
  • the image ID 3 is an image included in the image captured by the first optical inspection camera 12. That is, the image ID 3 is an image showing the mold surface of the package component 60.
  • the brand mark of the package part 60 is printed on the mold surface of the package part 60.
  • the inspection unit 54 determines whether or not the inclination of the mark Mk1 printed on the surface of the package component 60 is within a predetermined range through image analysis.
  • the inspection unit 54 determines that the package component 60 is a non-defective product with respect to the mark angle when the inclination of the mark Mk1 is within a predetermined range, and when the inclination of the mark Mk1 is out of the predetermined range, the package component 60 with respect to the mark angle Determined to be defective.
  • the inspection unit 54 stores the determination result of the non-defective product / defective product in the storage device 30 in association with the position information of the package component 60 on the package substrate.
  • the inspection unit 54 can perform inspections of various other inspection items.
  • Table 1 below shows an example of inspection items that can be inspected by the inspection unit 54.
  • the inspection items corresponding to BGA show the inspection items on the ball / lead surface of BGA. Further, the inspection items corresponding to the QFN indicate the inspection items on the ball / lead surface of the QFN. In addition, the inspection items that correspond in common indicate the inspection items on the mold surface of BGA and QFN.
  • Examples of inspections specific to package parts are “Lead Pad Offset”, “Lead Pad Number”, “Lead Pad Size”, “Lead Pad Pitch”, “Lead Pad Defect”, “Die Pad Size”, “Die Pad Defect”, “Die Pad Number”, “Lead Pad Side”, “Mark Offset”, “No Marking”, “Mark Angle”, “Broken Mark”, “Broken Character”, “ “Splash Character” and “Wrong Character”.
  • the inspection unit 54 measures the deviation of each terminal (lead) 62 from the predetermined position and determines whether the deviation is within the predetermined range. In the "Lead Pad Number”, the inspection unit 54 determines whether the number of terminals 62 is as predetermined. In “Lead Pad Size”, the inspection unit 54 determines whether the size of each terminal 62 is within a predetermined range. In the “Lead Pad Pitch”, the inspection unit 54 determines whether the length between the terminals 62 is within a predetermined range. In the “Lead Pad Defect”, the inspection unit 54 determines the presence or absence of foreign matter on the terminal 62.
  • the inspection unit 54 determines whether the size of the die pad 61 exposed to the outside is within a predetermined range. In the “Die Pad Defect”, the inspection unit 54 determines the presence or absence of foreign matter on the die pad 61. In the “Die Pad Number”, the inspection unit 54 determines whether the number of die pads 61 is as predetermined. In the “Lead Pad Side”, the inspection unit 54 determines whether the state of the cut surface (side surface of the package component 60) of the terminal is appropriate. In “Mark Offset”, the inspection unit 54 measures the deviation of the mark Mk1 (brand mark, etc.) from the predetermined position, and determines whether the deviation is within the predetermined range.
  • the mark Mk1 brand mark, etc.
  • the inspection unit 54 detects that there is no mark Mk1 that should originally exist.
  • the inspection unit 54 determines whether the inclination of the mark Mk1 on the package component is within a predetermined range.
  • the inspection unit 54 determines whether or not a part of the characters constituting the mark Mk1 is missing.
  • the inspection unit 54 detects that a part of the characters constituting the mark Mk1 is not sufficiently printed.
  • the inspection unit 54 determines whether or not the bleeding of a part of the characters constituting the mark Mk1 is within a predetermined range.
  • the inspection unit 54 detects that some of the characters constituting the mark Mk1 are different characters.
  • the inspection data including the inspection result information by the inspection unit 54 is stored in the storage device 30.
  • a plurality of inspection data are aggregated and managed on the database DB1.
  • FIG. 9 is a diagram showing an example of the database DB1.
  • each row in the database DB1 shows inspection data for each package component 60.
  • the result information for each "lot”, “No.”, "frame No.”, "position”, and "inspection item” is associated.
  • the package component 60 whose "No.” is “2” is “2" on the X coordinate and “1" on the Y coordinate in the package substrate (frame) P1 whose "frame No.” is “1". It exists in the position of.
  • the frame containing the package component 60 is included in the "lot” of "0000".
  • a "lot” is a unit including a plurality of frames (package substrate P1).
  • the result is "1 (for example, defective product)” for the inspection item "0”
  • the result is "0 (for example, non-defective product)” for the inspection item "1”
  • the inspection item " Regarding "2” the result is "5.005 (measured value)”.
  • the user of the system 100 can acquire statistical data from the system 100 regarding the production status of the semiconductor package S1.
  • This statistical data is generated based on the data stored in the database DB1.
  • the user can analyze problems related to the production of the semiconductor package S1 by referring to the statistical data.
  • the user specifies the range of data used to generate the statistical data according to the statistical data to be acquired.
  • the user specifies a range of data by inputting through the image 200 (FIG. 10) described later.
  • statistical data is generated using the data within the specified range.
  • the statistical data generation unit 56 acquires the inspection data from the storage device 30 according to the instruction from the user, and generates the statistical data by aggregating the acquired inspection data.
  • the statistical data generation unit 56 generates, for example, statistical data in which each position in the package substrate P1 is associated with the good / bad status of the semiconductor package S1. Further, the statistical data generation unit 56 generates defects for each position of the package substrate P1 from data indicating the good / bad status of the semiconductor package S1 for each position in each of the plurality of package substrates P1 included in a specific lot. Generate statistical data showing the rate.
  • the image generation unit 58 generates image data that visualizes the statistical data generated by the statistical data generation unit 56.
  • FIG. 10 is a diagram showing an example of an image 200 generated by the image generation unit 58.
  • the image 200 includes a type selection unit 202, an instruction unit 214, a region T1, and a region T2.
  • the user selects whether the type of the package substrate to be analyzed is BGA or QFN via the type selection unit 202. Further, the user gives an instruction to output statistical data by pressing the instruction unit 214 with a cursor (mouse pointer) or the like.
  • the area T1 is an area for displaying an image that visualizes statistical data on a specific package substrate (frame).
  • the area T2 is an area for displaying an image that visualizes statistical data in a specific lot.
  • the area T1 includes an input unit 204, a selection unit 206, and a result output unit 208, 210, 212.
  • the user inputs the "frame No.” of the package substrate (frame) P1 to be analyzed via the input unit 204. Further, the user selects the "inspection item" to be analyzed via the selection unit 206.
  • the result output unit 208 outputs a rectangular image as a whole.
  • This rectangular image contains multiple blocks.
  • This rectangular image corresponds to the package substrate P1, and each of the plurality of blocks corresponds to the semiconductor package S1.
  • the upper left block of the rectangular image shows the coordinates (1,1).
  • the X coordinate exists from “1" to "14” from the left to the right, and the Y coordinate exists from "1" to "48” from the top to the bottom.
  • the corresponding blocks are color-coded according to the degree of defect of each package component 60. The user can visually recognize the defect occurrence status for each position in the package substrate by referring to the image output to the result output unit 208.
  • the result output unit 210 outputs, for example, the total number of semiconductor packages S1 included in the package substrate P1 to be analyzed, the number of non-defective products, and the number of defective products.
  • the result output unit 212 outputs, for example, the number of defective products and the occurrence rate of defective products.
  • Region T2 includes result output units 220, 224, 226 and selection unit 222.
  • the user selects the "inspection item" to be analyzed via the selection unit 222.
  • the result output unit 224 outputs an image showing the total result of the defective product occurrence positions on the plurality of package substrates P1 included in the lot.
  • the meanings of the X coordinate and the Y coordinate are the same as the image output by the result output unit 208.
  • the Z coordinate indicates the total number of defective products generated at that position. The user can visually recognize the defect occurrence status for each position in the package substrate by referring to the image output to the result output unit 224.
  • the result output unit 220 outputs, for example, the total number of package substrates P1 included in the lot to be analyzed, the total number of semiconductor packages S1, the number of non-defective products, and the number of defective products.
  • the result output unit 226 outputs, for example, the number of defective products and the occurrence rate of defective products.
  • the image generated by the image generation unit 58 is displayed on the monitor 20 included in the cutting device 1.
  • the user can statistically grasp the production status of the semiconductor package S1 by referring to the image displayed on the monitor 20.
  • FIG. 11 is a flowchart showing a procedure for accumulating the inspection results of the semiconductor package S1 in the storage device 30. The process shown in this flowchart is executed by the computer 50 at predetermined cycles.
  • the computer 50 instructs the first optical inspection camera 12 and the second optical inspection camera 13 to sequentially image a predetermined range of the package substrate P1 on the inspection table 11 (step S100).
  • the computer 50 sequentially acquires the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 (step S110).
  • the computer 50 performs various inspections on each semiconductor package S1 through the analysis of the acquired image data (step S120).
  • the computer 50 updates the database DB1 so as to add the inspection data generated through the inspection (step S130).
  • FIG. 12 is a flowchart showing a procedure for outputting statistical data. The process shown in this flowchart is executed by the computer 50 at predetermined cycles.
  • the computer 50 determines whether or not the user has instructed to output statistical data (step S200). For example, the computer 50 determines whether or not the indicator 214 (FIG. 10) has been pressed by the user. If it is determined that there is no statistical data output instruction (NO in step S200), the process shifts to "return".
  • the computer 50 reads out the inspection data matching the instruction content from the user from the storage device 30 (database DB1) (step S210).
  • the computer 50 generates statistical data by aggregating the read inspection data (step S220).
  • the computer 50 generates image data in which the statistical data is visually represented (step S230).
  • the computer 50 controls the monitor 20 (FIG. 5) to display the generated image (step S240).
  • the user can statistically grasp the production status of the semiconductor package S1 by referring to the image displayed on the monitor 20.
  • the cutting device 1 is configured to aggregate inspection data including inspection result information of package parts and generate statistical data based on the aggregated inspection data.
  • statistical data of inspection data including inspection result information of package parts for example, early detection of problems occurring in a post-process can be promoted. That is, according to the cutting device 1, it is possible to generate data (statistical data) used for advanced production control in the subsequent process as compared with the conventional one.
  • the inspection data includes the position information of the semiconductor package S1 to be inspected on the package substrate P1. Therefore, according to the cutting device 1, the inspection result information of the semiconductor package S1 can be managed in association with the position information of the semiconductor package S1 on the package substrate P1, so that more useful statistical data can be generated.
  • the computer 50 controls the entire cutting device 1.
  • the control of the cutting device 1 does not necessarily have to be performed by one computer.
  • the control of the cutting device 1 may be executed by a plurality of computers.
  • the control of the cutting device 1 by the plurality of computers is realized by communicating between the plurality of computers.
  • an image showing the generated statistical data is displayed on the monitor 20.
  • the generated statistical data does not necessarily have to be displayed on the monitor 20.
  • the generated statistical data may only be sent to other devices.
  • cutting of the package substrate P1, inspection of the semiconductor package S1, and generation of statistical data based on the inspection data are performed in the same cutting device 1. However, they do not necessarily have to be performed on the same device. For example, each may be run by a different device.
  • the position information of the semiconductor package S1 on the package substrate P1 and the result information of each inspection item are associated and managed on the database DB1.
  • the database DB1 does not necessarily have to include the position information of the semiconductor package S1 on the package substrate P1.
  • the cutting device 1 includes a first optical inspection camera 12 and a second optical inspection camera 13 that image the mold surface and the ball / lead surface of the semiconductor package S1, respectively.
  • the optical inspection camera included in the cutting device 1 is not limited to the first optical inspection camera 12 and the second optical inspection camera 13.
  • the cutting device 1 may further include an optical inspection camera that inspects the cut surface (side surface of the package component 60) of the terminal.
  • the optical inspection camera for inspecting the cut surface is provided, for example, between the arrangement portion 14 and the non-defective tray 15a.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Details Of Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Complex Calculations (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/JP2020/026056 2019-12-16 2020-07-02 統計データ生成方法、切断装置及びシステム WO2021124602A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
MX2022007395A MX2022007395A (es) 2019-12-16 2020-07-02 Metodo para la generacion de datos estadisticos, aparato de corte y sistema.
CN202080082298.9A CN114746232B (zh) 2019-12-16 2020-07-02 统计数据生成方法、切割装置以及系统
KR1020227023378A KR20220109463A (ko) 2019-12-16 2020-07-02 통계 데이터 생성 방법, 절단 장치 및 시스템

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019226092A JP7377092B2 (ja) 2019-12-16 2019-12-16 統計データ生成方法、切断装置及びシステム
JP2019-226092 2019-12-16

Publications (1)

Publication Number Publication Date
WO2021124602A1 true WO2021124602A1 (ja) 2021-06-24

Family

ID=76431522

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/026056 WO2021124602A1 (ja) 2019-12-16 2020-07-02 統計データ生成方法、切断装置及びシステム

Country Status (6)

Country Link
JP (1) JP7377092B2 (ko)
KR (1) KR20220109463A (ko)
CN (1) CN114746232B (ko)
MX (1) MX2022007395A (ko)
TW (1) TWI798610B (ko)
WO (1) WO2021124602A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023013000A (ja) * 2021-07-15 2023-01-26 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590365A (ja) * 1991-09-27 1993-04-09 Hitachi Ltd 検査装置
JP2000091177A (ja) * 1998-09-16 2000-03-31 Sony Corp データ管理装置とその方法
JP2003179193A (ja) * 2001-12-12 2003-06-27 Matsushita Electric Ind Co Ltd リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法ならびに樹脂封止型半導体装置の検査方法
JP2007152438A (ja) * 2005-11-30 2007-06-21 Nec Electronics Corp 半導体製造装置及びその製造方法
JP2011210775A (ja) * 2010-03-29 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
JP2016021541A (ja) * 2014-07-16 2016-02-04 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置
JP2019158389A (ja) * 2018-03-08 2019-09-19 株式会社ディスコ チッピング測定方法及びチッピング測定装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3995030B2 (ja) * 1996-09-17 2007-10-24 コグネックス・テクノロジー・アンド・インベストメント・コーポレーション 半導体パッケージの検査装置
JP3055104B2 (ja) * 1998-08-31 2000-06-26 亜南半導体株式会社 半導体パッケ―ジの製造方法
JP2003042968A (ja) * 2001-07-27 2003-02-13 Hitachi Industries Co Ltd 基板検査結果表示装置
JP4294265B2 (ja) * 2002-06-05 2009-07-08 株式会社ディスコ 検査用チップサイズパッケージ基板
JP2004333446A (ja) * 2003-05-12 2004-11-25 Matsushita Electric Ind Co Ltd 外観検査方法、外観検査装置、そのプログラム及びその記録媒体
WO2005109492A1 (en) 2004-05-07 2005-11-17 Hanmi Semiconductor Co., Ltd Sawing and handler system for manufacturing semiconductor package
JP4537810B2 (ja) * 2004-09-14 2010-09-08 アイパルス株式会社 実装基板の検査用データ作成方法
EP1915240B1 (en) * 2005-06-24 2014-04-30 AEW Delford Systems Limited Two colour vision system
JP4548356B2 (ja) * 2006-02-13 2010-09-22 セイコーインスツル株式会社 自動薄切片標本作製装置及び自動薄切片標本作製方法
JP5134216B2 (ja) 2006-06-23 2013-01-30 株式会社ディスコ ウエーハの加工結果管理方法
JP5215556B2 (ja) * 2006-12-20 2013-06-19 Ｔｏｗａ株式会社 電子部品製造用の個片化装置
KR20110086621A (ko) * 2008-11-20 2011-07-28 이 아이 듀폰 디 네모아 앤드 캄파니 디스플레이를 접합 해제하기 위한 반-자동화된 재가공성 장비
JP2010165876A (ja) * 2009-01-15 2010-07-29 Olympus Corp 欠陥関連付け装置、基板検査システム、および欠陥関連付け方法
JP5479855B2 (ja) * 2009-11-10 2014-04-23 アピックヤマダ株式会社 切削装置及び切削方法
JP5613463B2 (ja) 2010-06-03 2014-10-22 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
JP2012118038A (ja) * 2010-11-30 2012-06-21 Shin King Pay 半導体製造での欠陥信号の検出における、統計システム及びその方法
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP5812555B1 (ja) * 2014-06-20 2015-11-17 上野精機株式会社 電子部品検査装置
JP6218686B2 (ja) * 2014-07-17 2017-10-25 Ｔｏｗａ株式会社 基板切断装置および基板切断方法
US10379155B2 (en) 2014-10-02 2019-08-13 Xilinx, Inc. In-die transistor characterization in an IC
JP6212507B2 (ja) * 2015-02-05 2017-10-11 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6415411B2 (ja) 2015-09-18 2018-10-31 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN116053273A (zh) * 2016-04-19 2023-05-02 亚德诺半导体国际无限责任公司 磨损监控装置
WO2018136970A1 (en) * 2017-01-23 2018-07-26 Tesoro Scientific, Inc. Light emitting diode (led) test apparatus and method of manufacture
JP6640142B2 (ja) 2017-03-31 2020-02-05 Ｔｏｗａ株式会社 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法
TW201917811A (zh) * 2017-06-26 2019-05-01 美商特索羅科學有限公司 發光二極體質量傳遞設備及製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590365A (ja) * 1991-09-27 1993-04-09 Hitachi Ltd 検査装置
JP2000091177A (ja) * 1998-09-16 2000-03-31 Sony Corp データ管理装置とその方法
JP2003179193A (ja) * 2001-12-12 2003-06-27 Matsushita Electric Ind Co Ltd リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法ならびに樹脂封止型半導体装置の検査方法
JP2007152438A (ja) * 2005-11-30 2007-06-21 Nec Electronics Corp 半導体製造装置及びその製造方法
JP2011210775A (ja) * 2010-03-29 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
JP2016021541A (ja) * 2014-07-16 2016-02-04 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置
JP2019158389A (ja) * 2018-03-08 2019-09-19 株式会社ディスコ チッピング測定方法及びチッピング測定装置

Also Published As

Publication number Publication date
TW202125603A (zh) 2021-07-01
MX2022007395A (es) 2022-07-13
TWI798610B (zh) 2023-04-11
JP2021097093A (ja) 2021-06-24
CN114746232B (zh) 2024-03-19
CN114746232A (zh) 2022-07-12
KR20220109463A (ko) 2022-08-04
JP7377092B2 (ja) 2023-11-09

Similar Documents

Publication Publication Date Title
JP4767995B2 (ja) 部品実装方法、部品実装機、実装条件決定方法、実装条件決定装置およびプログラム
CN103207187A (zh) 外观检查装置及外观检查方法
US8290241B2 (en) Analyzing apparatus, program, defect inspection apparatus, defect review apparatus, analysis system, and analysis method
JP2013545266A (ja) 個別部品後方追跡可能性および半導体装置前方追跡可能性
JP4922800B2 (ja) 電子機器の製造方法
JP2002299401A (ja) 検査システムと検査装置と半導体デバイスの製造方法及び検査プログラム
US20120221586A1 (en) Inspection system, management server, inspection apparatus and method for managing inspection data
EP3687272A1 (en) Electronic device and method for displaying results of inspection of substrate
WO2021124602A1 (ja) 統計データ生成方法、切断装置及びシステム
US7630536B2 (en) Printing inspection apparatus, printing inspection method, printing inspection data generating apparatus, and printing inspection data generating method
US20210404973A1 (en) Method and electronic apparatus for displaying inspection result of board
JP2004235314A (ja) プリント回路基板の測定結果表示システム及び測定結果表示方法
JP2008046012A (ja) 欠陥検出装置および欠陥検出方法
WO2023037671A1 (ja) メンテナンス方法、及び電子部品の製造方法
WO2023037670A1 (ja) 校正方法、及び電子部品の製造方法
KR100819796B1 (ko) 반도체패키지의 분류방법
JP2004286532A (ja) 外観検査方法及びその装置
JP5205224B2 (ja) 部品実装状態検査装置
JP2010085145A (ja) 検査装置及び検査方法
WO2024034171A1 (ja) 切断装置、及び、切断品の製造方法
JP2015146418A (ja) 個別部品後方追跡可能性および半導体装置前方追跡可能性
WO2023062866A1 (ja) 切断装置、及び切断品の製造方法
WO2022157995A1 (ja) 検査管理システム、検査管理装置、検査管理方法、及びプログラム
JP2021166245A (ja) 部品実装方法及び部品実装システム
JP5427841B2 (ja) 開発支援方法及びプログラム

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20902120

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20227023378

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20902120

Country of ref document: EP

Kind code of ref document: A1