JP7377092B2 - 統計データ生成方法、切断装置及びシステム - Google Patents

統計データ生成方法、切断装置及びシステム Download PDF

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Publication number
JP7377092B2
JP7377092B2 JP2019226092A JP2019226092A JP7377092B2 JP 7377092 B2 JP7377092 B2 JP 7377092B2 JP 2019226092 A JP2019226092 A JP 2019226092A JP 2019226092 A JP2019226092 A JP 2019226092A JP 7377092 B2 JP7377092 B2 JP 7377092B2
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package
inspection
data
image
statistical data
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JP2019226092A
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English (en)
Japanese (ja)
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JP2021097093A (ja
Inventor
和宏 高橋
貴俊 尾関
彩香 水田
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Towa Corp
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Towa Corp
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Priority to JP2019226092A priority Critical patent/JP7377092B2/ja
Priority to MX2022007395A priority patent/MX2022007395A/es
Priority to CN202080082298.9A priority patent/CN114746232B/zh
Priority to PCT/JP2020/026056 priority patent/WO2021124602A1/ja
Priority to KR1020227023378A priority patent/KR20220109463A/ko
Priority to TW109144401A priority patent/TWI798610B/zh
Publication of JP2021097093A publication Critical patent/JP2021097093A/ja
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Publication of JP7377092B2 publication Critical patent/JP7377092B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005—Computer numerical control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Details Of Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Complex Calculations (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2019226092A 2019-12-16 2019-12-16 統計データ生成方法、切断装置及びシステム Active JP7377092B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019226092A JP7377092B2 (ja) 2019-12-16 2019-12-16 統計データ生成方法、切断装置及びシステム
MX2022007395A MX2022007395A (es) 2019-12-16 2020-07-02 Metodo para la generacion de datos estadisticos, aparato de corte y sistema.
CN202080082298.9A CN114746232B (zh) 2019-12-16 2020-07-02 统计数据生成方法、切割装置以及系统
PCT/JP2020/026056 WO2021124602A1 (ja) 2019-12-16 2020-07-02 統計データ生成方法、切断装置及びシステム
KR1020227023378A KR20220109463A (ko) 2019-12-16 2020-07-02 통계 데이터 생성 방법, 절단 장치 및 시스템
TW109144401A TWI798610B (zh) 2019-12-16 2020-12-16 統計資料產生方法、切斷裝置及系統

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019226092A JP7377092B2 (ja) 2019-12-16 2019-12-16 統計データ生成方法、切断装置及びシステム

Publications (2)

Publication Number Publication Date
JP2021097093A JP2021097093A (ja) 2021-06-24
JP7377092B2 true JP7377092B2 (ja) 2023-11-09

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JP2019226092A Active JP7377092B2 (ja) 2019-12-16 2019-12-16 統計データ生成方法、切断装置及びシステム

Country Status (6)

Country Link
JP (1) JP7377092B2 (ko)
KR (1) KR20220109463A (ko)
CN (1) CN114746232B (ko)
MX (1) MX2022007395A (ko)
TW (1) TWI798610B (ko)
WO (1) WO2021124602A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023013000A (ja) * 2021-07-15 2023-01-26 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

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JP2007152438A (ja) 2005-11-30 2007-06-21 Nec Electronics Corp 半導体製造装置及びその製造方法
JP2007536727A (ja) 2004-05-07 2007-12-13 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ製造工程用切断及びハンドラシステム
JP2011210775A (ja) 2010-03-29 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
JP2011253972A (ja) 2010-06-03 2011-12-15 Renesas Electronics Corp 半導体装置及びその製造方法
JP2015228531A (ja) 2015-09-18 2015-12-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2017537459A (ja) 2014-10-02 2017-12-14 ザイリンクス インコーポレイテッドＸｉｌｉｎｘ Ｉｎｃｏｒｐｏｒａｔｅｄ Ｉｃでのダイ内トランジスタ特性評価
JP2018174191A (ja) 2017-03-31 2018-11-08 Ｔｏｗａ株式会社 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法
JP2019158389A (ja) 2018-03-08 2019-09-19 株式会社ディスコ チッピング測定方法及びチッピング測定装置

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JP3055104B2 (ja) * 1998-08-31 2000-06-26 亜南半導体株式会社 半導体パッケ―ジの製造方法
JP2000091177A (ja) * 1998-09-16 2000-03-31 Sony Corp データ管理装置とその方法
JP2003042968A (ja) * 2001-07-27 2003-02-13 Hitachi Industries Co Ltd 基板検査結果表示装置
JP4294265B2 (ja) * 2002-06-05 2009-07-08 株式会社ディスコ 検査用チップサイズパッケージ基板
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JP4537810B2 (ja) * 2004-09-14 2010-09-08 アイパルス株式会社 実装基板の検査用データ作成方法
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JP5134216B2 (ja) 2006-06-23 2013-01-30 株式会社ディスコ ウエーハの加工結果管理方法
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KR20110086621A (ko) * 2008-11-20 2011-07-28 이 아이 듀폰 디 네모아 앤드 캄파니 디스플레이를 접합 해제하기 위한 반-자동화된 재가공성 장비
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JP2003179193A (ja) 2001-12-12 2003-06-27 Matsushita Electric Ind Co Ltd リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法ならびに樹脂封止型半導体装置の検査方法
JP2007536727A (ja) 2004-05-07 2007-12-13 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ製造工程用切断及びハンドラシステム
JP2007152438A (ja) 2005-11-30 2007-06-21 Nec Electronics Corp 半導体製造装置及びその製造方法
JP2011210775A (ja) 2010-03-29 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
JP2011253972A (ja) 2010-06-03 2011-12-15 Renesas Electronics Corp 半導体装置及びその製造方法
JP2017537459A (ja) 2014-10-02 2017-12-14 ザイリンクス インコーポレイテッドＸｉｌｉｎｘ Ｉｎｃｏｒｐｏｒａｔｅｄ Ｉｃでのダイ内トランジスタ特性評価
JP2015228531A (ja) 2015-09-18 2015-12-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2018174191A (ja) 2017-03-31 2018-11-08 Ｔｏｗａ株式会社 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法
JP2019158389A (ja) 2018-03-08 2019-09-19 株式会社ディスコ チッピング測定方法及びチッピング測定装置

Also Published As

Publication number Publication date
TW202125603A (zh) 2021-07-01
WO2021124602A1 (ja) 2021-06-24
MX2022007395A (es) 2022-07-13
TWI798610B (zh) 2023-04-11
JP2021097093A (ja) 2021-06-24
CN114746232B (zh) 2024-03-19
CN114746232A (zh) 2022-07-12
KR20220109463A (ko) 2022-08-04

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