MX2022007395A - Metodo para la generacion de datos estadisticos, aparato de corte y sistema. - Google Patents

Metodo para la generacion de datos estadisticos, aparato de corte y sistema.

Info

Publication number
MX2022007395A
MX2022007395A MX2022007395A MX2022007395A MX2022007395A MX 2022007395 A MX2022007395 A MX 2022007395A MX 2022007395 A MX2022007395 A MX 2022007395A MX 2022007395 A MX2022007395 A MX 2022007395A MX 2022007395 A MX2022007395 A MX 2022007395A
Authority
MX
Mexico
Prior art keywords
generation method
data generation
statistic data
cutting device
inspection
Prior art date
Application number
MX2022007395A
Other languages
English (en)
Spanish (es)
Inventor
Kazuhiro Takahashi
Takatoshi Ozeki
ayaka Mizuta
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MX2022007395A publication Critical patent/MX2022007395A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005—Computer numerical control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Details Of Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Complex Calculations (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
MX2022007395A 2019-12-16 2020-07-02 Metodo para la generacion de datos estadisticos, aparato de corte y sistema. MX2022007395A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019226092A JP7377092B2 (ja) 2019-12-16 2019-12-16 統計データ生成方法、切断装置及びシステム
PCT/JP2020/026056 WO2021124602A1 (ja) 2019-12-16 2020-07-02 統計データ生成方法、切断装置及びシステム

Publications (1)

Publication Number Publication Date
MX2022007395A true MX2022007395A (es) 2022-07-13

Family

ID=76431522

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022007395A MX2022007395A (es) 2019-12-16 2020-07-02 Metodo para la generacion de datos estadisticos, aparato de corte y sistema.

Country Status (6)

Country Link
JP (1) JP7377092B2 (ko)
KR (1) KR20220109463A (ko)
CN (1) CN114746232B (ko)
MX (1) MX2022007395A (ko)
TW (1) TWI798610B (ko)
WO (1) WO2021124602A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023013000A (ja) * 2021-07-15 2023-01-26 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590365A (ja) * 1991-09-27 1993-04-09 Hitachi Ltd 検査装置
JP3995030B2 (ja) * 1996-09-17 2007-10-24 コグネックス・テクノロジー・アンド・インベストメント・コーポレーション 半導体パッケージの検査装置
JP3055104B2 (ja) * 1998-08-31 2000-06-26 亜南半導体株式会社 半導体パッケ―ジの製造方法
JP2000091177A (ja) * 1998-09-16 2000-03-31 Sony Corp データ管理装置とその方法
JP2003042968A (ja) * 2001-07-27 2003-02-13 Hitachi Industries Co Ltd 基板検査結果表示装置
JP2003179193A (ja) 2001-12-12 2003-06-27 Matsushita Electric Ind Co Ltd リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法ならびに樹脂封止型半導体装置の検査方法
JP4294265B2 (ja) * 2002-06-05 2009-07-08 株式会社ディスコ 検査用チップサイズパッケージ基板
JP2004333446A (ja) * 2003-05-12 2004-11-25 Matsushita Electric Ind Co Ltd 外観検査方法、外観検査装置、そのプログラム及びその記録媒体
CN100470758C (zh) 2004-05-07 2009-03-18 韩美半导体株式会社 用于制造半导体封装的切割和处理系统
JP4537810B2 (ja) * 2004-09-14 2010-09-08 アイパルス株式会社 実装基板の検査用データ作成方法
GB2427913B (en) * 2005-06-24 2008-04-02 Aew Delford Systems Ltd Two colour vision system
JP4933774B2 (ja) 2005-11-30 2012-05-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4548356B2 (ja) * 2006-02-13 2010-09-22 セイコーインスツル株式会社 自動薄切片標本作製装置及び自動薄切片標本作製方法
JP5134216B2 (ja) * 2006-06-23 2013-01-30 株式会社ディスコ ウエーハの加工結果管理方法
JP5215556B2 (ja) * 2006-12-20 2013-06-19 Ｔｏｗａ株式会社 電子部品製造用の個片化装置
WO2010059921A1 (en) * 2008-11-20 2010-05-27 E. I. Du Pont De Nemours And Company Semi-automated reworkability equipment for de-bonding a display
JP2010165876A (ja) * 2009-01-15 2010-07-29 Olympus Corp 欠陥関連付け装置、基板検査システム、および欠陥関連付け方法
JP5479855B2 (ja) * 2009-11-10 2014-04-23 アピックヤマダ株式会社 切削装置及び切削方法
JP2011210775A (ja) 2010-03-29 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
JP5613463B2 (ja) 2010-06-03 2014-10-22 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
JP2012118038A (ja) * 2010-11-30 2012-06-21 Shin King Pay 半導体製造での欠陥信号の検出における、統計システム及びその方法
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP5812555B1 (ja) * 2014-06-20 2015-11-17 上野精機株式会社 電子部品検査装置
JP6333648B2 (ja) * 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置
JP6218686B2 (ja) * 2014-07-17 2017-10-25 Ｔｏｗａ株式会社 基板切断装置および基板切断方法
US10379155B2 (en) 2014-10-02 2019-08-13 Xilinx, Inc. In-die transistor characterization in an IC
JP6212507B2 (ja) * 2015-02-05 2017-10-11 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6415411B2 (ja) 2015-09-18 2018-10-31 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN109313150B (zh) * 2016-04-19 2022-10-28 亚德诺半导体国际无限责任公司 磨损监控装置
KR20190112294A (ko) * 2017-01-23 2019-10-04 테소로 사이언티픽, 인코포레이티드 발광 다이오드 테스트 장치 및 제조 방법
JP6640142B2 (ja) 2017-03-31 2020-02-05 Ｔｏｗａ株式会社 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法
TW201917811A (zh) * 2017-06-26 2019-05-01 美商特索羅科學有限公司 發光二極體質量傳遞設備及製造方法
JP7002369B2 (ja) 2018-03-08 2022-02-10 株式会社ディスコ チッピング測定方法及びチッピング測定装置

Also Published As

Publication number Publication date
KR20220109463A (ko) 2022-08-04
JP7377092B2 (ja) 2023-11-09
TWI798610B (zh) 2023-04-11
JP2021097093A (ja) 2021-06-24
CN114746232B (zh) 2024-03-19
TW202125603A (zh) 2021-07-01
WO2021124602A1 (ja) 2021-06-24
CN114746232A (zh) 2022-07-12

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