TWI798610B - 統計資料產生方法、切斷裝置及系統 - Google Patents

統計資料產生方法、切斷裝置及系統 Download PDF

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Publication number
TWI798610B
TWI798610B TW109144401A TW109144401A TWI798610B TW I798610 B TWI798610 B TW I798610B TW 109144401 A TW109144401 A TW 109144401A TW 109144401 A TW109144401 A TW 109144401A TW I798610 B TWI798610 B TW I798610B
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Taiwan
Prior art keywords
inspection
package
aforementioned
data
statistical data
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TW109144401A
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English (en)
Chinese (zh)
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TW202125603A (zh
Inventor
高橋和宏
尾關貴俊
水田彩香
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日商Towa股份有限公司
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Publication of TW202125603A publication Critical patent/TW202125603A/zh
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005Computer numerical control means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007Control means comprising cameras, vision or image processing systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Details Of Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Complex Calculations (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW109144401A 2019-12-16 2020-12-16 統計資料產生方法、切斷裝置及系統 TWI798610B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-226092 2019-12-16
JP2019226092A JP7377092B2 (ja) 2019-12-16 2019-12-16 統計データ生成方法、切断装置及びシステム

Publications (2)

Publication Number Publication Date
TW202125603A TW202125603A (zh) 2021-07-01
TWI798610B true TWI798610B (zh) 2023-04-11

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Family Applications (1)

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TW109144401A TWI798610B (zh) 2019-12-16 2020-12-16 統計資料產生方法、切斷裝置及系統

Country Status (6)

Country Link
JP (1) JP7377092B2 (ko)
KR (1) KR20220109463A (ko)
CN (1) CN114746232B (ko)
MX (1) MX2022007395A (ko)
TW (1) TWI798610B (ko)
WO (1) WO2021124602A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023013000A (ja) * 2021-07-15 2023-01-26 Towa株式会社 加工装置、及び加工品の製造方法

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US6307210B1 (en) * 1996-09-17 2001-10-23 Cognex Technology And Investment Corporation Device for imaging object to be inspected and device for inspecting semiconductor package
JP2004014689A (ja) * 2002-06-05 2004-01-15 Disco Abrasive Syst Ltd 検査用チップサイズパッケージ基板
JP2007152438A (ja) * 2005-11-30 2007-06-21 Nec Electronics Corp 半導体製造装置及びその製造方法
JP2011210775A (ja) * 2010-03-29 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
TW201608666A (zh) * 2014-07-16 2016-03-01 Towa Corp 單片化物品之移送方法、製造方法及製造裝置
TW201824423A (zh) * 2016-04-19 2018-07-01 愛爾蘭商亞德諾半導體環球公司 磨耗監視裝置
TW201841278A (zh) * 2017-01-23 2018-11-16 美商特索羅科學有限公司 發光二極體測試設備及其製造方法
TW201917811A (zh) * 2017-06-26 2019-05-01 美商特索羅科學有限公司 發光二極體質量傳遞設備及製造方法
JP2019158389A (ja) * 2018-03-08 2019-09-19 株式会社ディスコ チッピング測定方法及びチッピング測定装置

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JP3055104B2 (ja) * 1998-08-31 2000-06-26 亜南半導体株式会社 半導体パッケ―ジの製造方法
JP2003042968A (ja) * 2001-07-27 2003-02-13 Hitachi Industries Co Ltd 基板検査結果表示装置
JP2003179193A (ja) 2001-12-12 2003-06-27 Matsushita Electric Ind Co Ltd リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法ならびに樹脂封止型半導体装置の検査方法
JP2004333446A (ja) * 2003-05-12 2004-11-25 Matsushita Electric Ind Co Ltd 外観検査方法、外観検査装置、そのプログラム及びその記録媒体
CN100470758C (zh) 2004-05-07 2009-03-18 韩美半导体株式会社 用于制造半导体封装的切割和处理系统
JP4537810B2 (ja) * 2004-09-14 2010-09-08 アイパルス株式会社 実装基板の検査用データ作成方法
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JP5215556B2 (ja) * 2006-12-20 2013-06-19 Towa株式会社 電子部品製造用の個片化装置
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JP6640142B2 (ja) 2017-03-31 2020-02-05 Towa株式会社 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6307210B1 (en) * 1996-09-17 2001-10-23 Cognex Technology And Investment Corporation Device for imaging object to be inspected and device for inspecting semiconductor package
JP2000091177A (ja) * 1998-09-16 2000-03-31 Sony Corp データ管理装置とその方法
JP2004014689A (ja) * 2002-06-05 2004-01-15 Disco Abrasive Syst Ltd 検査用チップサイズパッケージ基板
JP2007152438A (ja) * 2005-11-30 2007-06-21 Nec Electronics Corp 半導体製造装置及びその製造方法
JP2011210775A (ja) * 2010-03-29 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
TW201608666A (zh) * 2014-07-16 2016-03-01 Towa Corp 單片化物品之移送方法、製造方法及製造裝置
TW201824423A (zh) * 2016-04-19 2018-07-01 愛爾蘭商亞德諾半導體環球公司 磨耗監視裝置
TW201841278A (zh) * 2017-01-23 2018-11-16 美商特索羅科學有限公司 發光二極體測試設備及其製造方法
TW201917811A (zh) * 2017-06-26 2019-05-01 美商特索羅科學有限公司 發光二極體質量傳遞設備及製造方法
JP2019158389A (ja) * 2018-03-08 2019-09-19 株式会社ディスコ チッピング測定方法及びチッピング測定装置

Also Published As

Publication number Publication date
KR20220109463A (ko) 2022-08-04
JP7377092B2 (ja) 2023-11-09
JP2021097093A (ja) 2021-06-24
CN114746232B (zh) 2024-03-19
TW202125603A (zh) 2021-07-01
WO2021124602A1 (ja) 2021-06-24
MX2022007395A (es) 2022-07-13
CN114746232A (zh) 2022-07-12

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