TWI798610B - 統計資料產生方法、切斷裝置及系統 - Google Patents
統計資料產生方法、切斷裝置及系統 Download PDFInfo
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- TWI798610B TWI798610B TW109144401A TW109144401A TWI798610B TW I798610 B TWI798610 B TW I798610B TW 109144401 A TW109144401 A TW 109144401A TW 109144401 A TW109144401 A TW 109144401A TW I798610 B TWI798610 B TW I798610B
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- 239000004065 semiconductor Substances 0.000 description 57
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- 238000000465 moulding Methods 0.000 description 11
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- 238000003860 storage Methods 0.000 description 10
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/005—Computer numerical control means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/007—Control means comprising cameras, vision or image processing systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Forests & Forestry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- General Engineering & Computer Science (AREA)
- Mining & Mineral Resources (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Details Of Cutting Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Complex Calculations (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
- Radar Systems Or Details Thereof (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-226092 | 2019-12-16 | ||
JP2019226092A JP7377092B2 (ja) | 2019-12-16 | 2019-12-16 | 統計データ生成方法、切断装置及びシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202125603A TW202125603A (zh) | 2021-07-01 |
TWI798610B true TWI798610B (zh) | 2023-04-11 |
Family
ID=76431522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109144401A TWI798610B (zh) | 2019-12-16 | 2020-12-16 | 統計資料產生方法、切斷裝置及系統 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP7377092B2 (ko) |
KR (1) | KR20220109463A (ko) |
CN (1) | CN114746232B (ko) |
MX (1) | MX2022007395A (ko) |
TW (1) | TWI798610B (ko) |
WO (1) | WO2021124602A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023013000A (ja) * | 2021-07-15 | 2023-01-26 | Towa株式会社 | 加工装置、及び加工品の製造方法 |
Citations (10)
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JP2000091177A (ja) * | 1998-09-16 | 2000-03-31 | Sony Corp | データ管理装置とその方法 |
US6307210B1 (en) * | 1996-09-17 | 2001-10-23 | Cognex Technology And Investment Corporation | Device for imaging object to be inspected and device for inspecting semiconductor package |
JP2004014689A (ja) * | 2002-06-05 | 2004-01-15 | Disco Abrasive Syst Ltd | 検査用チップサイズパッケージ基板 |
JP2007152438A (ja) * | 2005-11-30 | 2007-06-21 | Nec Electronics Corp | 半導体製造装置及びその製造方法 |
JP2011210775A (ja) * | 2010-03-29 | 2011-10-20 | Renesas Electronics Corp | 半導体装置の製造方法 |
TW201608666A (zh) * | 2014-07-16 | 2016-03-01 | Towa Corp | 單片化物品之移送方法、製造方法及製造裝置 |
TW201824423A (zh) * | 2016-04-19 | 2018-07-01 | 愛爾蘭商亞德諾半導體環球公司 | 磨耗監視裝置 |
TW201841278A (zh) * | 2017-01-23 | 2018-11-16 | 美商特索羅科學有限公司 | 發光二極體測試設備及其製造方法 |
TW201917811A (zh) * | 2017-06-26 | 2019-05-01 | 美商特索羅科學有限公司 | 發光二極體質量傳遞設備及製造方法 |
JP2019158389A (ja) * | 2018-03-08 | 2019-09-19 | 株式会社ディスコ | チッピング測定方法及びチッピング測定装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0590365A (ja) * | 1991-09-27 | 1993-04-09 | Hitachi Ltd | 検査装置 |
JP3055104B2 (ja) * | 1998-08-31 | 2000-06-26 | 亜南半導体株式会社 | 半導体パッケ―ジの製造方法 |
JP2003042968A (ja) * | 2001-07-27 | 2003-02-13 | Hitachi Industries Co Ltd | 基板検査結果表示装置 |
JP2003179193A (ja) | 2001-12-12 | 2003-06-27 | Matsushita Electric Ind Co Ltd | リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法ならびに樹脂封止型半導体装置の検査方法 |
JP2004333446A (ja) * | 2003-05-12 | 2004-11-25 | Matsushita Electric Ind Co Ltd | 外観検査方法、外観検査装置、そのプログラム及びその記録媒体 |
CN100470758C (zh) | 2004-05-07 | 2009-03-18 | 韩美半导体株式会社 | 用于制造半导体封装的切割和处理系统 |
JP4537810B2 (ja) * | 2004-09-14 | 2010-09-08 | アイパルス株式会社 | 実装基板の検査用データ作成方法 |
GB2427913B (en) * | 2005-06-24 | 2008-04-02 | Aew Delford Systems Ltd | Two colour vision system |
JP4548356B2 (ja) * | 2006-02-13 | 2010-09-22 | セイコーインスツル株式会社 | 自動薄切片標本作製装置及び自動薄切片標本作製方法 |
JP5134216B2 (ja) * | 2006-06-23 | 2013-01-30 | 株式会社ディスコ | ウエーハの加工結果管理方法 |
JP5215556B2 (ja) * | 2006-12-20 | 2013-06-19 | Towa株式会社 | 電子部品製造用の個片化装置 |
WO2010059921A1 (en) * | 2008-11-20 | 2010-05-27 | E. I. Du Pont De Nemours And Company | Semi-automated reworkability equipment for de-bonding a display |
JP2010165876A (ja) * | 2009-01-15 | 2010-07-29 | Olympus Corp | 欠陥関連付け装置、基板検査システム、および欠陥関連付け方法 |
JP5479855B2 (ja) * | 2009-11-10 | 2014-04-23 | アピックヤマダ株式会社 | 切削装置及び切削方法 |
JP5613463B2 (ja) | 2010-06-03 | 2014-10-22 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
JP2012118038A (ja) * | 2010-11-30 | 2012-06-21 | Shin King Pay | 半導体製造での欠陥信号の検出における、統計システム及びその方法 |
JP6218511B2 (ja) * | 2013-09-02 | 2017-10-25 | Towa株式会社 | 切断装置及び切断方法 |
JP5812555B1 (ja) * | 2014-06-20 | 2015-11-17 | 上野精機株式会社 | 電子部品検査装置 |
JP6218686B2 (ja) * | 2014-07-17 | 2017-10-25 | Towa株式会社 | 基板切断装置および基板切断方法 |
US10379155B2 (en) | 2014-10-02 | 2019-08-13 | Xilinx, Inc. | In-die transistor characterization in an IC |
JP6212507B2 (ja) * | 2015-02-05 | 2017-10-11 | Towa株式会社 | 切断装置及び切断方法 |
JP6415411B2 (ja) | 2015-09-18 | 2018-10-31 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP6640142B2 (ja) | 2017-03-31 | 2020-02-05 | Towa株式会社 | 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法 |
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2019
- 2019-12-16 JP JP2019226092A patent/JP7377092B2/ja active Active
-
2020
- 2020-07-02 CN CN202080082298.9A patent/CN114746232B/zh active Active
- 2020-07-02 KR KR1020227023378A patent/KR20220109463A/ko not_active Application Discontinuation
- 2020-07-02 WO PCT/JP2020/026056 patent/WO2021124602A1/ja active Application Filing
- 2020-07-02 MX MX2022007395A patent/MX2022007395A/es unknown
- 2020-12-16 TW TW109144401A patent/TWI798610B/zh active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US6307210B1 (en) * | 1996-09-17 | 2001-10-23 | Cognex Technology And Investment Corporation | Device for imaging object to be inspected and device for inspecting semiconductor package |
JP2000091177A (ja) * | 1998-09-16 | 2000-03-31 | Sony Corp | データ管理装置とその方法 |
JP2004014689A (ja) * | 2002-06-05 | 2004-01-15 | Disco Abrasive Syst Ltd | 検査用チップサイズパッケージ基板 |
JP2007152438A (ja) * | 2005-11-30 | 2007-06-21 | Nec Electronics Corp | 半導体製造装置及びその製造方法 |
JP2011210775A (ja) * | 2010-03-29 | 2011-10-20 | Renesas Electronics Corp | 半導体装置の製造方法 |
TW201608666A (zh) * | 2014-07-16 | 2016-03-01 | Towa Corp | 單片化物品之移送方法、製造方法及製造裝置 |
TW201824423A (zh) * | 2016-04-19 | 2018-07-01 | 愛爾蘭商亞德諾半導體環球公司 | 磨耗監視裝置 |
TW201841278A (zh) * | 2017-01-23 | 2018-11-16 | 美商特索羅科學有限公司 | 發光二極體測試設備及其製造方法 |
TW201917811A (zh) * | 2017-06-26 | 2019-05-01 | 美商特索羅科學有限公司 | 發光二極體質量傳遞設備及製造方法 |
JP2019158389A (ja) * | 2018-03-08 | 2019-09-19 | 株式会社ディスコ | チッピング測定方法及びチッピング測定装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20220109463A (ko) | 2022-08-04 |
JP7377092B2 (ja) | 2023-11-09 |
JP2021097093A (ja) | 2021-06-24 |
CN114746232B (zh) | 2024-03-19 |
TW202125603A (zh) | 2021-07-01 |
WO2021124602A1 (ja) | 2021-06-24 |
MX2022007395A (es) | 2022-07-13 |
CN114746232A (zh) | 2022-07-12 |
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