WO2016179876A1 - 窄边框柔性显示装置及其制作方法 - Google Patents

窄边框柔性显示装置及其制作方法 Download PDF

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Publication number
WO2016179876A1
WO2016179876A1 PCT/CN2015/081728 CN2015081728W WO2016179876A1 WO 2016179876 A1 WO2016179876 A1 WO 2016179876A1 CN 2015081728 W CN2015081728 W CN 2015081728W WO 2016179876 A1 WO2016179876 A1 WO 2016179876A1
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Prior art keywords
substrate
wiring layer
circuit wiring
conductive
circuit
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PCT/CN2015/081728
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English (en)
French (fr)
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李文辉
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深圳市华星光电技术有限公司
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Priority to US14/761,311 priority Critical patent/US9793330B2/en
Publication of WO2016179876A1 publication Critical patent/WO2016179876A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a narrow frame flexible display device and a method for fabricating the same.
  • the narrow bezel display device has the characteristics of large effective display area and beautiful appearance, and is also a hot research topic in the industry.
  • the conventional flexible display device includes an upper substrate 100 , a lower substrate 200 , a sealant 300 sealingly connecting the upper substrate 100 and the lower substrate 200 , and electrically connected to the chassis through a flexible connecting circuit 410 .
  • the driving circuit board 400 of the substrate 200 is described.
  • the lower substrate 200 includes a first substrate 210 and a circuit wiring layer 230 on the first substrate 210.
  • the upper substrate 100 and the lower substrate 200 are disposed.
  • One side of the circuit wiring layer 230 is disposed opposite to each other, and the driving circuit board 400 is disposed adjacent to a side of the first substrate 210 away from the circuit wiring layer 230, and is electrically connected to the circuit through the flexible connecting circuit 410
  • Layer 230 is electrically connected.
  • the side of the circuit wiring layer 230 of the lower substrate 200 needs to be provided with an additional connection region for connection with the flexible connection circuit 410. Since the connection region cannot achieve effective display, And occupying a certain width, thereby increasing the frame area of the flexible display device.
  • the flexible connecting circuit 410 since one end of the flexible connecting circuit 410 is connected to the circuit wiring layer 210 on the upper surface of the lower substrate 200, the other end is located
  • the driving circuit board 300 on the lower surface side of the lower substrate 200 is connected, so that the flexible connecting circuit 410 needs to bypass the side of the lower substrate 200, and is disposed in a U shape, since the flexible connecting circuit 410 is in the It is described that the side of the substrate 200 occupies a certain space, so that the frame of the flexible display device becomes larger, and it is difficult to realize a narrow bezel display.
  • Another object of the present invention is to provide a method for fabricating a flexible display device by disposing a conductive connecting body in a lower substrate, the conductive connecting body respectively connecting a circuit wiring layer and a flexible connecting circuit connecting the driving circuit board, thereby driving the driving circuit
  • the board is connected to the circuit wiring layer so that the circuit wiring layer side of the lower substrate does not need to be provided with an additional connection area for connection with the flexible connection circuit, so that the effective display area of the flexible display device can be increased, and the implementation can be realized.
  • a narrow border enhances display quality.
  • the present invention provides a narrow frame flexible display device, comprising an upper substrate, a lower substrate, a sealant for sealingly connecting the upper substrate and the lower substrate, and electrically connected to the lower substrate through a flexible connecting circuit.
  • Drive circuit board
  • the lower substrate includes a first substrate, a conductive connecting body disposed in the first substrate, and a circuit wiring layer disposed on the first substrate;
  • the upper substrate is disposed opposite to a side of the lower substrate on which the circuit wiring layer is disposed;
  • a region of the first substrate adjacent to the edge is provided with a through hole, the conductive connector is disposed in the through hole, and the circuit wiring layer is in contact with and electrically connected to one end of the conductive connector, and the driving
  • the circuit board and the flexible connecting circuit are disposed adjacent to a side of the first substrate away from the circuit wiring layer, and the two ends of the flexible connecting circuit are respectively connected to the driving circuit board and the conductive connector away from the circuit One end of the wiring layer, thereby electrically connecting the driving circuit board and the circuit wiring layer.
  • the lower substrate further includes a thin film transistor disposed between the first substrate and the circuit wiring layer, and an organic light emitting diode disposed on the circuit wiring layer.
  • the size of the upper substrate is smaller than the size of the lower substrate, and after the lower substrate and the upper substrate are paired, the conductive connection is located on a region of the lower substrate that is not overlapped with the upper substrate.
  • the first substrate is a flexible substrate.
  • the material of the conductive connector is metal, and the sealant is UV glue.
  • the invention also provides a method for manufacturing a narrow frame flexible display device, comprising the following steps:
  • Step 1 providing a glass substrate, and forming a first substrate on the glass substrate;
  • Step 2 forming a through hole on a region of the first substrate near the edge;
  • Step 3 forming a conductive connecting body in the through hole
  • Step 4 forming a circuit wiring layer on the first substrate and the conductive connection, the circuit wiring layer is in contact with one end of the conductive connection body and electrically connected to thereby obtain a lower substrate, the lower substrate includes a first substrate, a conductive connection body located in the first substrate, and a circuit wiring layer on the first substrate;
  • Step 5 providing an upper substrate, the upper substrate and the lower substrate are disposed opposite to a side on which the circuit wiring layer is disposed, and after the group is assembled, sealing the connection by using a sealant;
  • Step 6 the glass substrate is peeled off from the first substrate, thereby exposing a side of the first substrate away from the circuit wiring layer, and an end of the conductive connecting body away from the circuit wiring layer;
  • Step 7 Providing a driving circuit board and a flexible connecting circuit, and setting the driving circuit board and the flexible connecting circuit to be close to a side of the first substrate away from the circuit wiring layer, and two of the flexible connecting circuits
  • the terminals are respectively connected to the driving circuit board and one end of the conductive connecting body away from the circuit wiring layer. Since the conductive connecting body is electrically connected to the circuit wiring layer, the electrical connection between the driving circuit board and the circuit wiring layer is realized.
  • the conductive connecting body is formed by forming a conductive film on the first substrate by physical vapor deposition, and patterning the conductive film by a photolithography process, leaving only at the through hole a portion to form an electrically conductive connector within the through hole.
  • step 4 before forming the circuit wiring layer, a thin film transistor is formed on the first substrate, and after the circuit wiring layer is formed, an organic light emitting diode is formed on the circuit wiring layer, so that the obtained lower substrate further includes a thin film transistor between the first substrate and the circuit wiring layer and an organic light emitting diode provided on the circuit wiring layer.
  • the size of the upper substrate is smaller than the size of the lower substrate, and after the lower substrate and the upper substrate are paired, the conductive connection is located on a region of the lower substrate that is not overlapped with the upper substrate.
  • the first substrate is a flexible substrate, and the first substrate is formed by coating; the material of the conductive connector is metal, and the frame sealant is UV glue.
  • the invention also provides a method for manufacturing a narrow frame flexible display device, comprising the following steps:
  • Step 1 providing a glass substrate, and forming a first substrate on the glass substrate;
  • Step 2 forming a through hole on a region of the first substrate near the edge;
  • Step 3 forming a conductive connecting body in the through hole
  • Step 4 forming a circuit wiring layer on the first substrate and the conductive connection, the circuit wiring layer is in contact with one end of the conductive connection body and electrically connected to thereby obtain a lower substrate, the lower substrate includes a first substrate, a conductive connection body located in the first substrate, and a circuit wiring layer on the first substrate;
  • Step 5 providing an upper substrate, the upper substrate and the lower substrate are disposed opposite to a side on which the circuit wiring layer is disposed, and after the group is assembled, sealing the connection by using a sealant;
  • Step 6 the glass substrate is peeled off from the first substrate, thereby exposing a side of the first substrate away from the circuit wiring layer, and an end of the conductive connecting body away from the circuit wiring layer;
  • Step 7 Providing a driving circuit board and a flexible connecting circuit, and setting the driving circuit board and the flexible connecting circuit to be close to a side of the first substrate away from the circuit wiring layer, and two of the flexible connecting circuits
  • the terminals are respectively connected to the driving circuit board and one end of the conductive connecting body away from the circuit wiring layer, and the conductive connecting body is electrically connected to the circuit wiring layer, thereby electrically connecting the driving circuit board and the circuit wiring layer;
  • the conductive connecting body is formed by forming a conductive film on the first substrate by physical vapor deposition, and patterning the conductive film by a photolithography process, leaving only the through hole a portion, thereby forming a conductive connecting body in the through hole;
  • a thin film transistor is formed on the first substrate, and after the circuit wiring layer is formed, an organic light emitting diode is formed on the circuit wiring layer, thereby preparing the lower substrate
  • the method includes a thin film transistor disposed between the first substrate and the circuit wiring layer, and an organic light emitting diode disposed on the circuit wiring layer;
  • the size of the upper substrate is smaller than the size of the lower substrate, and after the lower substrate and the upper substrate are paired, the conductive connection body is located on a region of the lower substrate that does not overlap with the upper substrate;
  • the first substrate is a flexible substrate, and the first substrate is formed by coating; the material of the conductive connector is metal, and the frame sealant is UV glue.
  • the present invention provides a narrow-frame flexible display device and a manufacturing method thereof, wherein a through hole is disposed in a region near the edge of the first substrate in the lower substrate, and a conductive connecting body is disposed in the through hole. Connecting the circuit wiring layer and the flexible connection circuit connecting the driving circuit board through the conductive connecting body, thereby connecting the driving circuit board and the circuit wiring layer, and the setting of the present invention makes the circuit wiring of the lower substrate be compared with the prior art.
  • the effective display area of the flexible display device can be increased, the frame area can be reduced, and since the flexible connection circuit is only disposed on the lower substrate On one side, the problem that the flexible connecting circuit of the prior art bypasses the side of the lower substrate is avoided, thereby occupying the space of the side of the lower substrate, and the frame area can be further reduced to realize narrow frame display.
  • FIG. 1 is a schematic structural view of a conventional flexible display device
  • FIG. 2 is a schematic structural view of a narrow bezel flexible display device of the present invention.
  • FIG. 3 is a flow chart of a method for fabricating a narrow bezel flexible display device according to the present invention.
  • step 1 is a schematic diagram of step 1 of a method for fabricating a narrow bezel flexible display device according to the present invention
  • step 2 is a schematic diagram of step 2 of a method for fabricating a narrow bezel flexible display device according to the present invention
  • step 3 is a schematic diagram of step 3 of a method for fabricating a narrow bezel flexible display device according to the present invention.
  • step 4 is a schematic diagram of step 4 of a method for fabricating a narrow bezel flexible display device according to the present invention.
  • step 5 is a schematic diagram of step 5 of a method for fabricating a narrow bezel flexible display device according to the present invention.
  • FIG. 9 is a schematic diagram of step 6 of a method for fabricating a narrow bezel flexible display device according to the present invention.
  • the present invention provides a narrow frame flexible display device, including an upper substrate 10 , a lower substrate 20 , a sealant 30 sealingly connecting the upper substrate 10 and the lower substrate 20 , and electrically connected through a flexible connecting circuit 41 .
  • Driving circuit board 40 to the lower substrate 20;
  • the lower substrate 20 includes a first substrate 21, a conductive connecting body 22 disposed in the first substrate 21, and a circuit wiring layer 23 disposed on the first substrate 21;
  • the upper substrate 10 is disposed opposite to a side of the lower substrate 20 on which the circuit wiring layer 23 is disposed;
  • a region of the first substrate 21 adjacent to the edge is provided with a through hole 211, the conductive connector 22 is disposed in the through hole 211, and the circuit wiring layer 23 is opposite to one end of the conductive connector 22.
  • the driving circuit board 40 and the flexible connecting circuit 41 are disposed adjacent to a side of the first substrate 21 away from the circuit wiring layer 23, and two ends of the flexible connecting circuit 41 are respectively connected.
  • the driving circuit board 40 and one end of the conductive connecting body 22 away from the circuit wiring layer 23 are electrically connected to the driving circuit board 40 and the circuit wiring layer 23.
  • the lower substrate 20 further includes a thin film transistor (TFT) disposed between the first substrate 21 and the circuit wiring layer 23, and an organic light emitting diode (OLED) provided on the circuit wiring layer 23 (not Graphic).
  • TFT thin film transistor
  • OLED organic light emitting diode
  • the size of the upper substrate 10 is smaller than the size of the lower substrate 20, and after the lower substrate 20 and the upper substrate 10 are paired, the conductive connecting body 22 is located on the lower substrate 20 The area where the upper substrate 10 overlaps.
  • the first substrate 21 is a flexible substrate.
  • the upper substrate 10 includes a second substrate, and preferably, the second substrate is a flexible substrate.
  • the upper substrate 10 is a package cover plate, and after the sealant 30 is sealed and connected to the lower substrate 20, the package of the lower substrate 20 is realized.
  • the material of the conductive connecting body 22 is a metal such as molybdenum, aluminum, copper, silver or the like.
  • the sealant 30 is a UV glue.
  • the present invention provides a narrow-frame flexible display device.
  • a through hole 211 is disposed in a region near the edge of the first substrate 21 in the lower substrate 20, and a conductive connecting body 22 is disposed in the through hole 211 through the conductive connecting body 22.
  • the circuit wiring layer 23 and the flexible connection circuit 41 connected to the driving circuit board 40 are respectively connected to connect the driving circuit board 40 and the circuit wiring layer 23, and the arrangement of the present invention makes the lower substrate 20
  • the side of the circuit wiring layer 23 does not need to be provided with an additional connection region for connection with the flexible connection circuit 41, the effective display area of the flexible display device can be increased, the frame area can be reduced, and since the flexible connection circuit 41 is only set On one side of the lower substrate 20, the problem that the flexible connecting circuit 410 of the prior art bypasses the side of the lower substrate 200, thereby occupying the space of the side of the lower substrate 200 (as shown in FIG. 1) is avoided. , you can further reduce the border area to achieve a narrow border display.
  • the present invention further provides a method for fabricating a narrow bezel flexible display device, comprising the following steps:
  • Step 1 As shown in FIG. 4, a glass substrate 50 is provided, and a first substrate 21 is formed on the glass substrate 50.
  • the first substrate 21 is a flexible substrate.
  • the first substrate 21 is formed by coating.
  • Step 2 As shown in FIG. 5, a through hole 211 is formed in a region of the first substrate 21 near the edge.
  • the through hole 211 is formed by a photolithography process.
  • Step 3 As shown in FIG. 6, a conductive connecting body 22 is formed in the through hole 211.
  • the conductive connecting body 22 is formed by forming a conductive film on the first substrate 21 by physical vapor deposition (PVD), and patterning the conductive film by a photolithography process, leaving only the through hole A portion at 211, thereby forming a conductive connecting body 22 in the through hole 211.
  • PVD physical vapor deposition
  • the lithography process includes a process of coating photoresist, exposure, development, wet etching, and photoresist stripping.
  • the material of the conductive connecting body 22 is a metal such as molybdenum, aluminum, copper, silver or the like.
  • Step 4 as shown in FIG. 7, forming circuit wiring on the first substrate 21 and the conductive connecting body 22.
  • the layer 23 is in contact with and electrically connected to one end of the conductive connecting body 22, thereby manufacturing a lower substrate 20 including a first substrate 21 and a conductive connection in the first substrate 21.
  • a device such as a thin film transistor (TFT) may be formed on the first substrate 21, and after the circuit wiring layer 23 is formed, organic light emission may be formed on the circuit wiring layer 23.
  • a device such as a diode (OLED); therefore, the obtained lower substrate 20 further includes a thin film transistor (TFT) provided between the first substrate 21 and the circuit wiring layer 23 and is provided on the circuit wiring A device such as an organic light emitting diode (OLED) on layer 23.
  • TFT thin film transistor
  • Step 5 as shown in FIG. 8, the upper substrate 10 is provided, and the upper substrate 10 and the side of the lower substrate 20 on which the circuit wiring layer 23 is disposed are disposed opposite to each other. After the group is assembled, the sealant 30 is sealed. connection.
  • the upper substrate 10 is a package cover plate, and after the sealant 30 is sealed and connected to the lower substrate 20, the package of the lower substrate 20 is realized.
  • the upper substrate 10 includes a second substrate, and preferably, the second substrate is a flexible substrate.
  • the size of the upper substrate 10 is smaller than the size of the lower substrate 20, and after the lower substrate 20 and the upper substrate 10 are paired, the conductive connector 22 is located on the lower substrate 20 and the upper substrate 10 Overlapping areas.
  • the sealant 30 is a UV glue.
  • Step 6 as shown in FIG. 9, the glass substrate 20 is peeled off from the first substrate 21, thereby exposing the side of the first substrate 21 away from the circuit wiring layer 23, and the conductive connecting body 22 It is away from one end of the circuit wiring layer 23.
  • Step 7 providing a driving circuit board 40 and a flexible connecting circuit 41, and setting the driving circuit board 40 and the flexible connecting circuit 41 to be close to a side of the first substrate 21 away from the circuit wiring layer 23,
  • the two ends of the flexible connecting circuit 41 are respectively connected to the driving circuit board 40 and one end of the conductive connecting body 22 away from the circuit wiring layer 23, and the conductive connecting body 22 is electrically connected to the circuit wiring layer 23 to realize driving.
  • the circuit board 40 is electrically connected to the circuit wiring layer 23 to obtain a flexible display device as described in FIG.
  • the present invention provides a method for fabricating a narrow-frame flexible display device.
  • a through hole 211 is disposed in a region of the first substrate 21 in the lower substrate 20 near the edge, and a conductive connecting body 22 is disposed in the through hole 211 to conduct electricity.
  • the connecting body 22 is connected to the circuit wiring layer 23 and the flexible connecting circuit 41 connected to the driving circuit board 40, respectively, thereby connecting the driving circuit board 40 and the circuit wiring layer 23.
  • the setting of the present invention makes the lower Circuit wiring layer 23 of substrate 20 There is no need to provide an additional connection area on one side for connection with the flexible connection circuit 41, the effective display area of the flexible display device can be increased, the frame area can be reduced, and since the flexible connection circuit 41 is only disposed under the One side of the substrate 20 avoids the problem that the flexible connecting circuit 410 of the prior art bypasses the side of the lower substrate 200, thereby occupying the space of the side of the lower substrate 200 (as shown in FIG. 1 ), and can be further reduced.
  • the border area enables a narrow border display.

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Abstract

一种窄边框柔性显示装置及其制作方法，通过在下基板（20）内的第一基板（21）上靠近边缘的区域设置一通孔（211），所述通孔（211）内设置一导电连接体（22），通过导电连接体（22）分别连接电路布线层（23）及连接驱动电路板（40）的柔性连接电路（41），从而将驱动电路板（40）与电路布线层（23）连接起来。该设置使得所述下基板（20）的电路布线层（23）一侧不需要再设置额外的连接区域用作与柔性连接电路（41）相连接，可以增大柔性显示装置的有效显示区域，缩小边框区域，并且，由于所述柔性连接电路（41）仅设置于所述下基板（20）的一侧，避免了现有技术中柔性连接电路绕过所述下基板的侧边，从而占用所述下基板侧边空间的问题，可以进一步缩小边框区域，实现窄边框显示。

Description

窄边框柔性显示装置及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种窄边框柔性显示装置及其制作方法。
背景技术
目前，随着便携式移动设备、可穿戴显示产品等方面需求的快速增长,柔性显示器持续受到业界的普遍关注，已成为显示技术领域的最热趋势之一，所述柔性显示器的显示技术种类较多，包括传统的液晶显示技术、双稳态液晶显示技术、有机发光二极管(organic light-emitting diode，OLED)显示技术、电泳显示技术、电致变色(electrochromism，EC)显示技术与电致发光(electroluminescent，EL)显示技术等。
窄边框显示装置具有有效显示面积大、美观等特点，也是目前业界的研究热门。
传统的柔性显示装置，如附图1所示，包括上基板100、下基板200、密封连接所述上基板100与下基板200的密封胶300、及通过一柔性连接电路410电性连接至所述下基板200的驱动电路板400，其中，所述下基板200包括第一基板210及位于所述第一基板210上的电路布线层230，所述上基板100与所述下基板200上设有电路布线层230的一侧相向设置，所述驱动电路板400设置为靠近所述第一基板210远离所述电路布线层230的一侧，并且通过所述柔性连接电路410与所述电路布线层230电性连接。
上述柔性显示装置中，所述下基板200的电路布线层230一侧除设置有效显示区域外，还需要设置额外的连接区域用作与柔性连接电路410相连接，由于连接区域不能实现有效显示，且占据一定的宽度，从而增加了柔性显示装置的边框面积，除此之外，由于所述柔性连接电路410一端与位于所述下基板200上表面的电路布线层210相连接，另一端与位于所述下基板200下表面一侧的驱动电路板300相连接，从而所述柔性连接电路410需要绕过所述下基板200的侧边，呈U型设置，由于所述柔性连接电路410在所述下基板200侧边占用了一定的空间，从而使得柔性显示装置的边框变得更大，难以实现窄边框显示。
发明内容
本发明的目的在于提供一种窄边框柔性显示装置，具有较窄的边框，可以提升显示品质。
本发明的目的还在于提供一种柔性显示装置的制作方法，通过在下基板内设置一导电连接体，所述导电连接体分别连接电路布线层及连接驱动电路板的柔性连接电路，从而将驱动电路板与电路布线层连接起来，使得所述下基板的电路布线层一侧不需要再设置额外的连接区域用作与柔性连接电路相连接，从而可以增大柔性显示装置的有效显示区域，实现较窄的边框，提升显示品质。
为实现上述目的，本发明提供一种窄边框柔性显示装置，包括上基板、下基板、密封连接上基板与下基板的封框胶、及通过一柔性连接电路电性连接至所述下基板的驱动电路板；
所述下基板包括第一基板、设于第一基板内的导电连接体、及设于所述第一基板上的电路布线层；
所述上基板与所述下基板上设有电路布线层的一侧相向设置；
所述第一基板上靠近边缘的区域设有一通孔，所述导电连接体设置于该通孔内，所述电路布线层与所述导电连接体的一端相接触并且电性连接，所述驱动电路板与柔性连接电路均设置为靠近所述第一基板上远离所述电路布线层的一侧，所述柔性连接电路的两端分别连接驱动电路板与所述导电连接体上远离所述电路布线层的一端，从而实现所述驱动电路板与电路布线层的电性连接。
所述下基板还包括设于第一基板与电路布线层之间的薄膜晶体管及设于所述电路布线层上的有机发光二极管。
所述上基板的尺寸小于所述下基板的尺寸，且所述下基板与所述上基板对组后，所述导电连接体位于所述下基板上未与上基板重叠的区域。
所述第一基板为柔性基板。
所述导电连接体的材料为金属，所述封框胶为UV胶。
本发明还提供一种窄边框柔性显示装置的制作方法，包括如下步骤：
步骤1、提供玻璃基板，并在所述玻璃基板上形成第一基板；
步骤2、在所述第一基板上靠近边缘的区域形成一通孔；
步骤3、在所述通孔内形成一导电连接体；
步骤4、在第一基板及导电连接体上形成电路布线层，所述电路布线层与导电连接体的一端相接触并电性连接，从而制得下基板，所述下基板包括第一基板、位于第一基板内的导电连接体、及位于所述第一基板上的电路布线层；
步骤5、提供上基板，将所述上基板与所述下基板上设有电路布线层的一侧相向设置，对组后，采用封框胶进行密封连接；
步骤6、将玻璃基板从第一基板上剥离，从而暴露出所述第一基板上远离所述电路布线层的一侧，以及所述导电连接体上远离所述电路布线层的一端；
步骤7、提供一驱动电路板及柔性连接电路，将所述驱动电路板与柔性连接电路均设置为靠近所述第一基板上远离所述电路布线层的一侧，所述柔性连接电路的两端分别连接驱动电路板与所述导电连接体上远离所述电路布线层的一端，由于所述导电连接体电性连接电路布线层，从而实现驱动电路板与电路布线层的电性连接。
所述步骤3中，所述导电连接体的制作方法为：通过物理气相沉积在所述第一基板上形成一导电薄膜，通过光刻制程使所述导电薄膜图形化，仅保留位于通孔处的部分，从而在所述通孔内形成一导电连接体。
所述步骤4中，在形成电路布线层之前，在第一基板上形成薄膜晶体管，在形成电路布线层之后，在电路布线层上形成有机发光二极管，从而制得的所述下基板还包括设于第一基板与电路布线层之间的薄膜晶体管及设于所述电路布线层上的有机发光二极管。
所述上基板的尺寸小于所述下基板的尺寸，且所述下基板与所述上基板对组后，所述导电连接体位于所述下基板上未与上基板重叠的区域。
所述第一基板为柔性基板，且所述第一基板通过涂布的方式形成；所述导电连接体的材料为金属，所述封框胶为UV胶。
本发明还提供一种窄边框柔性显示装置的制作方法，包括如下步骤：
步骤1、提供玻璃基板，并在所述玻璃基板上形成第一基板；
步骤2、在所述第一基板上靠近边缘的区域形成一通孔；
步骤3、在所述通孔内形成一导电连接体；
步骤4、在第一基板及导电连接体上形成电路布线层，所述电路布线层与导电连接体的一端相接触并电性连接，从而制得下基板，所述下基板包括第一基板、位于第一基板内的导电连接体、及位于所述第一基板上的电路布线层；
步骤5、提供上基板，将所述上基板与所述下基板上设有电路布线层的一侧相向设置，对组后，采用封框胶进行密封连接；
步骤6、将玻璃基板从第一基板上剥离，从而暴露出所述第一基板上远离所述电路布线层的一侧，以及所述导电连接体上远离所述电路布线层的一端；
步骤7、提供一驱动电路板及柔性连接电路，将所述驱动电路板与柔性连接电路均设置为靠近所述第一基板上远离所述电路布线层的一侧，所述柔性连接电路的两端分别连接驱动电路板与所述导电连接体上远离所述电路布线层的一端，由于所述导电连接体电性连接电路布线层，从而实现驱动电路板与电路布线层的电性连接；
其中，所述步骤3中，所述导电连接体的制作方法为：通过物理气相沉积在所述第一基板上形成一导电薄膜，通过光刻制程图形化所述导电薄膜，仅保留位于通孔处的部分，从而在所述通孔内形成一导电连接体；
其中，所述步骤4中，在形成电路布线层之前，在第一基板上形成薄膜晶体管，在形成电路布线层之后，在电路布线层上形成有机发光二极管，从而制得的所述下基板还包括设于第一基板与电路布线层之间的薄膜晶体管及设于所述电路布线层上的有机发光二极管；
其中，所述上基板的尺寸小于所述下基板的尺寸，且所述下基板与所述上基板对组后，所述导电连接体位于所述下基板上未与上基板重叠的区域；
其中，所述第一基板为柔性基板，且所述第一基板通过涂布的方式形成；所述导电连接体的材料为金属，所述封框胶为UV胶。
本发明的有益效果：本发明提供的一种窄边框柔性显示装置及其制作方法，通过在下基板内的第一基板上靠近边缘的区域设置一通孔，所述通孔内设置一导电连接体，通过导电连接体分别连接电路布线层及连接驱动电路板的柔性连接电路，从而将驱动电路板与电路布线层连接起来，与现有技术相比，本发明的设置使得所述下基板的电路布线层一侧不需要再设置额外的连接区域用作与柔性连接电路相连接，可以增大柔性显示装置的有效显示区域，缩小边框区域，并且，由于所述柔性连接电路仅设置于所述下基板的一侧，避免了现有技术中柔性连接电路绕过所述下基板的侧边，从而占用所述下基板侧边空间的问题，可以进一步缩小边框区域，实现窄边框显示。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为一种现有柔性显示装置的结构示意图；
图2为本发明窄边框柔性显示装置的结构示意图；
图3为本发明窄边框柔性显示装置的制作方法的流程图；
图4为本发明窄边框柔性显示装置的制作方法步骤1的示意图；
图5为本发明窄边框柔性显示装置的制作方法步骤2的示意图；
图6为本发明窄边框柔性显示装置的制作方法步骤3的示意图；
图7为本发明窄边框柔性显示装置的制作方法步骤4的示意图；
图8为本发明窄边框柔性显示装置的制作方法步骤5的示意图；
图9为本发明窄边框柔性显示装置的制作方法步骤6的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种窄边框柔性显示装置，包括上基板10、下基板20、密封连接上基板10与下基板20的封框胶30、及通过一柔性连接电路41电性连接至所述下基板20的驱动电路板40；
具体的，所述下基板20包括第一基板21、设于第一基板21内的导电连接体22、及设于所述第一基板21上的电路布线层23；
具体的，所述上基板10与所述下基板20上设有电路布线层23的一侧相向设置；
具体的，所述第一基板21上靠近边缘的区域设有一通孔211，所述导电连接体22设置于该通孔211内，所述电路布线层23与所述导电连接体22的一端相接触并且电性连接，所述驱动电路板40与柔性连接电路41均设置为靠近所述第一基板21上远离所述电路布线层23的一侧，所述柔性连接电路41的两端分别连接驱动电路板40与所述导电连接体22上远离所述电路布线层23的一端，从而实现所述驱动电路板40与电路布线层23的电性连接。
具体的，所述下基板20还包括设于第一基板21与电路布线层23之间的薄膜晶体管(TFT)及设于所述电路布线层23上的有机发光二极管(OLED)等器件(未图示)。
具体的，所述上基板10的尺寸小于所述下基板20的尺寸，且所述下基板20与所述上基板10对组后，所述导电连接体22位于所述下基板20上未与上基板10重叠的区域。
优选的，所述第一基板21为柔性基板。
具体的，所述上基板10包括第二基板，优选的，所述第二基板为柔性基板。具体的，所述上基板10为封装盖板，通过封框胶30与所述下基板20进行密封连接后，实现对所述下基板20的封装。
具体的，所述导电连接体22的材料为金属，如钼、铝、铜、银等。
优选的，所述封框胶30为UV胶。
本发明提供的一种窄边框柔性显示装置，通过在下基板20内的第一基板21上靠近边缘的区域设置一通孔211，所述通孔211内设置一导电连接体22，通过导电连接体22分别连接电路布线层23及连接驱动电路板40的柔性连接电路41，从而将驱动电路板40与电路布线层23连接起来，与现有技术相比，本发明的设置使得所述下基板20的电路布线层23一侧不需要再设置额外的连接区域用作与柔性连接电路41相连接，可以增大柔性显示装置的有效显示区域，缩小边框区域，并且，由于所述柔性连接电路41仅设置于所述下基板20的一侧，避免了现有技术中柔性连接电路410绕过所述下基板200的侧边，从而占用所述下基板200侧边空间的问题(如图1所示)，可以进一步缩小边框区域，实现窄边框显示。
请参阅图3，本发明还提供一种窄边框柔性显示装置的制作方法，包括如下步骤：
步骤1、如图4所示，提供玻璃基板50，并在所述玻璃基板50上形成第一基板21。
具体的，所述第一基板21为柔性基板，优选的，所述第一基板21通过涂布的方式形成。
步骤2、如图5所示，在所述第一基板21上靠近边缘的区域形成一通孔211。
具体的，所述通孔211通过光刻制程形成。
步骤3、如图6所示，在所述通孔211内形成一导电连接体22。
具体的，所述导电连接体22的制作方法为：通过物理气相沉积(PVD)在所述第一基板21上形成一导电薄膜，通过光刻制程图形化所述导电薄膜，仅保留位于通孔211处的部分，从而在所述通孔211内形成一导电连接体22。
具体的，所述光刻制程包括涂光阻、曝光、显影、湿蚀刻、及光阻剥离等制程。
优选的，所述导电连接体22的材料为金属，如钼、铝、铜、银等。
步骤4、如图7所示，在第一基板21及导电连接体22上形成电路布线 层23，所述电路布线层23与导电连接体22的一端相接触并电性连接，从而制得下基板20，所述下基板20包括第一基板21、位于第一基板21内的导电连接体22、及位于所述第一基板21上的电路布线层23。
具体的，在形成电路布线层23之前，可以在第一基板21上形成薄膜晶体管(TFT)等器件(未图示)，在形成电路布线层23之后，可以在电路布线层23上形成有机发光二极管(OLED)等器件(未图示)；因此，制得的所述下基板20还包括设于第一基板21与电路布线层23之间的薄膜晶体管(TFT)及设于所述电路布线层23上的有机发光二极管(OLED)等器件。
步骤5、如图8所示，提供上基板10，将所述上基板10与所述下基板20上设有电路布线层23的一侧相向设置，对组后，采用封框胶30进行密封连接。
具体的，所述上基板10为封装盖板，通过封框胶30与所述下基板20进行密封连接后，实现对所述下基板20的封装。
具体的，所述上基板10包括第二基板，优选的，所述第二基板为柔性基板。
所述上基板10的尺寸小于所述下基板20的尺寸，且所述下基板20与所述上基板10对组后，所述导电连接体22位于所述下基板20上未与上基板10重叠的区域。
优选的，所述封框胶30为UV胶。
步骤6、如图9所示，将玻璃基板20从第一基板21上剥离，从而暴露出所述第一基板21上远离所述电路布线层23的一侧，以及所述导电连接体22上远离所述电路布线层23的一端。
步骤7、提供一驱动电路板40及柔性连接电路41，将所述驱动电路板40与柔性连接电路41均设置为靠近所述第一基板21上远离所述电路布线层23的一侧，所述柔性连接电路41的两端分别连接驱动电路板40与所述导电连接体22上远离所述电路布线层23的一端，由于所述导电连接体22电性连接电路布线层23，从而实现驱动电路板40与电路布线层23的电性连接，得到如图2所述的柔性显示装置。
本发明提供的一种窄边框柔性显示装置的制作方法，通过在下基板20内的第一基板21上靠近边缘的区域设置一通孔211，所述通孔211内设置一导电连接体22，通过导电连接体22分别连接电路布线层23及连接驱动电路板40的柔性连接电路41，从而将驱动电路板40与电路布线层23连接起来，与现有技术相比，本发明的设置使得所述下基板20的电路布线层23 一侧不需要再设置额外的连接区域用作与柔性连接电路41相连接，可以增大柔性显示装置的有效显示区域，缩小边框区域，并且，由于所述柔性连接电路41仅设置于所述下基板20的一侧，避免了现有技术中柔性连接电路410绕过所述下基板200的侧边，从而占用所述下基板200侧边空间的问题(如图1所示)，可以进一步缩小边框区域，实现窄边框显示。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (11)

  1. 一种窄边框柔性显示装置，包括上基板、下基板、密封连接上基板与下基板的封框胶、及通过一柔性连接电路电性连接至所述下基板的驱动电路板；
    所述下基板包括第一基板、设于第一基板内的导电连接体、及设于所述第一基板的电路布线层；
    所述上基板与所述下基板上设有电路布线层的一侧相向设置；
    所述第一基板上靠近边缘的区域设有一通孔，所述导电连接体设置于该通孔内，所述电路布线层与所述导电连接体的一端相接触并且电性连接，所述驱动电路板与柔性连接电路均设置为靠近所述第一基板上远离所述电路布线层的一侧，所述柔性连接电路的两端分别连接驱动电路板与所述导电连接体上远离所述电路布线层的一端，从而实现所述驱动电路板与电路布线层的电性连接。
  2. 如权利要求1所述的窄边框柔性显示装置，其中，所述下基板还包括设于第一基板与电路布线层之间的薄膜晶体管及设于所述电路布线层上的有机发光二极管。
  3. 如权利要求1所述的窄边框柔性显示装置，其中，所述上基板的尺寸小于所述下基板的尺寸，且所述下基板与所述上基板对组后，所述导电连接体位于所述下基板上未与上基板重叠的区域。
  4. 如权利要求1所述的窄边框柔性显示装置，其中，所述第一基板为柔性基板。
  5. 如权利要求1所述的窄边框柔性显示装置，其中，所述导电连接体的材料为金属，所述封框胶为UV胶。
  6. 一种窄边框柔性显示装置的制作方法，包括如下步骤：
    步骤1、提供玻璃基板，并在所述玻璃基板上形成第一基板；
    步骤2、在所述第一基板上靠近边缘的区域形成一通孔；
    步骤3、在所述通孔内形成一导电连接体；
    步骤4、在第一基板及导电连接体上形成电路布线层，所述电路布线层与导电连接体的一端相接触并电性连接，从而制得下基板，所述下基板包括第一基板、位于第一基板内的导电连接体、及位于所述第一基板上的电路布线层；
    步骤5、提供上基板，将所述上基板与所述下基板上设有电路布线层的 一侧相向设置，对组后，采用封框胶进行密封连接；
    步骤6、将玻璃基板从第一基板上剥离，从而暴露出所述第一基板上远离所述电路布线层的一侧，以及所述导电连接体上远离所述电路布线层的一端；
    步骤7、提供一驱动电路板及柔性连接电路，将所述驱动电路板与柔性连接电路均设置为靠近所述第一基板上远离所述电路布线层的一侧，所述柔性连接电路的两端分别连接驱动电路板与所述导电连接体上远离所述电路布线层的一端，由于所述导电连接体电性连接电路布线层，从而实现驱动电路板与电路布线层的电性连接。
  7. 如权利要求6所述的窄边框柔性显示装置的制作方法，其中，所述步骤3中，所述导电连接体的制作方法为：通过物理气相沉积在所述第一基板上形成一导电薄膜，通过光刻制程图形化所述导电薄膜，仅保留位于通孔处的部分，从而在所述通孔内形成一导电连接体。
  8. 如权利要求6所述的窄边框柔性显示装置的制作方法，其中，所述步骤4中，在形成电路布线层之前，在第一基板上形成薄膜晶体管，在形成电路布线层之后，在电路布线层上形成有机发光二极管，从而制得的所述下基板还包括设于第一基板与电路布线层之间的薄膜晶体管及设于所述电路布线层上的有机发光二极管。
  9. 如权利要求6所述的窄边框柔性显示装置的制作方法，其中，所述上基板的尺寸小于所述下基板的尺寸，且所述下基板与所述上基板对组后，所述导电连接体位于所述下基板上未与上基板重叠的区域。
  10. 如权利要求6所述的窄边框柔性显示装置的制作方法，其中，所述第一基板为柔性基板，且所述第一基板通过涂布的方式形成；所述导电连接体的材料为金属，所述封框胶为UV胶。
  11. 一种窄边框柔性显示装置的制作方法，包括如下步骤：
    步骤1、提供玻璃基板，并在所述玻璃基板上形成第一基板；
    步骤2、在所述第一基板上靠近边缘的区域形成一通孔；
    步骤3、在所述通孔内形成一导电连接体；
    步骤4、在第一基板及导电连接体上形成电路布线层，所述电路布线层与导电连接体的一端相接触并电性连接，从而制得下基板，所述下基板包括第一基板、位于第一基板内的导电连接体、及位于所述第一基板上的电路布线层；
    步骤5、提供上基板，将所述上基板与所述下基板上设有电路布线层的一侧相向设置，对组后，采用封框胶进行密封连接；
    步骤6、将玻璃基板从第一基板上剥离，从而暴露出所述第一基板上远离所述电路布线层的一侧，以及所述导电连接体上远离所述电路布线层的一端；
    步骤7、提供一驱动电路板及柔性连接电路，将所述驱动电路板与柔性连接电路均设置为靠近所述第一基板上远离所述电路布线层的一侧，所述柔性连接电路的两端分别连接驱动电路板与所述导电连接体上远离所述电路布线层的一端，由于所述导电连接体电性连接电路布线层，从而实现驱动电路板与电路布线层的电性连接；
    其中，所述步骤3中，所述导电连接体的制作方法为：通过物理气相沉积在所述第一基板上形成一导电薄膜，通过光刻制程图形化所述导电薄膜，仅保留位于通孔处的部分，从而在所述通孔内形成一导电连接体；
    其中，所述步骤4中，在形成电路布线层之前，在第一基板上形成薄膜晶体管，在形成电路布线层之后，在电路布线层上形成有机发光二极管，从而制得的所述下基板还包括设于第一基板与电路布线层之间的薄膜晶体管及设于所述电路布线层上的有机发光二极管；
    其中，所述上基板的尺寸小于所述下基板的尺寸，且所述下基板与所述上基板对组后，所述导电连接体位于所述下基板上未与上基板重叠的区域；
    其中，所述第一基板为柔性基板，且所述第一基板通过涂布的方式形成；所述导电连接体的材料为金属，所述封框胶为UV胶。
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