WO2016183899A1 - 无边框显示装置及其制作方法 - Google Patents

无边框显示装置及其制作方法 Download PDF

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Publication number
WO2016183899A1
WO2016183899A1 PCT/CN2015/082025 CN2015082025W WO2016183899A1 WO 2016183899 A1 WO2016183899 A1 WO 2016183899A1 CN 2015082025 W CN2015082025 W CN 2015082025W WO 2016183899 A1 WO2016183899 A1 WO 2016183899A1
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Prior art keywords
substrate
connecting body
display device
conductive connecting
hole
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PCT/CN2015/082025
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English (en)
French (fr)
Inventor
李文辉
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深圳市华星光电技术有限公司
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Priority to US14/764,579 priority Critical patent/US9741964B2/en
Publication of WO2016183899A1 publication Critical patent/WO2016183899A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a frameless display device and a method for fabricating the same.
  • a conventional display device as shown in FIG. 1 , includes an upper substrate 100 , a lower substrate 200 , a sealant 300 sealingly connecting the upper substrate 100 and the lower substrate 200 , and electrically connected to the lower portion through a flexible connecting circuit 410 .
  • a driving circuit board 400 of the substrate 200 wherein the lower substrate 200 includes a first substrate 210 and a circuit wiring layer 230 on the first substrate 210, and the upper substrate 100 and the lower substrate 200 are provided with a circuit One side of the wiring layer 230 is disposed opposite to each other, and the driving circuit board 400 is disposed adjacent to a side of the first substrate 210 away from the circuit wiring layer 230, and passes through the flexible connecting circuit 410 and the circuit wiring layer 230 Electrical connection.
  • a special connection region needs to be disposed on the circuit wiring layer 230 of the lower substrate 200 to be connected to the flexible connection circuit 410, since the connection region cannot realize effective display and occupy a certain width, thereby increasing The frame area of the display device is reduced, and the effective display area is reduced.
  • one end of the flexible connecting circuit 410 is connected to the circuit wiring layer 210 on the upper surface of the lower substrate 200, and the other end is located under the lower substrate 200.
  • the driving circuit board 300 on one side of the surface is connected, so the flexible connecting circuit 410 needs to bypass the side of the lower substrate 200, and is disposed in a U shape, since the flexible connecting circuit 410 is on the side of the lower substrate 200. Taking up a certain space, the frame area of the display device is further increased, so that the conventional display device is difficult to realize a narrow bezel display, and the frameless display is not realized.
  • An object of the present invention is to provide a frameless display device.
  • the flexible connecting circuit and the driving circuit board are disposed on the back surface of the substrate, and do not occupy an effective display area, thereby achieving a frameless display and improving display quality.
  • Another object of the present invention is to provide a method for manufacturing a frameless display device, by forming a conductive connecting body on a substrate, forming a first through hole on the protective layer over the conductive connecting body, in the conductive connection Forming a second via hole on the substrate under the body, the circuit wiring layer is connected to the conductive connecting body through the first through hole, and the flexible connecting circuit connecting the driving circuit board passes The second through hole is connected to the conductive connecting body, thereby realizing electrical connection between the driving circuit board and the circuit wiring layer.
  • the method is simple and easy to operate, and the obtained frameless display device, the flexible connecting circuit and the driving circuit board are all provided. On the back side of the substrate, the effective display area is not occupied, so that the frameless display can be realized and the display quality can be improved.
  • the present invention provides a frameless display device including a substrate, a conductive connecting body disposed on the substrate, a protective layer disposed on the conductive connecting body, and a circuit wiring layer disposed on the protective layer.
  • a first through hole is disposed on the protective layer corresponding to the conductive connecting body, and the circuit wiring is in contact with the conductive connecting body via the first through hole and electrically connected;
  • a second through hole is disposed on the substrate corresponding to the conductive connecting body, and one end of the flexible connecting circuit is electrically connected to the driving circuit board, and the other end is connected from the bottom of the substrate to the second through hole.
  • the conductive connectors are in contact and electrically connected to achieve electrical connection between the driving circuit board and the circuit wiring layer.
  • the conductive connector is located in an intermediate region of the substrate.
  • the substrate is a flexible substrate.
  • the material of the conductive connector is metal.
  • the borderless display device is a top-emitting OLED display device.
  • the present invention also provides a frameless display device, comprising: a substrate, a conductive connecting body disposed on the substrate, a protective layer disposed on the conductive connecting body, a circuit wiring layer disposed on the protective layer, and disposed at the An OLED light emitting layer or an encapsulating layer on the circuit wiring layer, and a driving circuit board disposed on a side of the substrate away from the conductive connecting body and connected to the conductive connecting body through a flexible connecting circuit;
  • a first through hole is disposed on the protective layer corresponding to the conductive connecting body, and the circuit wiring layer is in contact with the conductive connecting body via the first through hole and electrically connected;
  • a second through hole is disposed on the substrate corresponding to the conductive connecting body, and one end of the flexible connecting circuit is electrically connected to the driving circuit board, and the other end is connected from the bottom of the substrate to the second through hole.
  • the conductive connectors are in contact and electrically connected to achieve electrical connection between the driving circuit board and the circuit wiring layer;
  • the conductive connector is located in an intermediate region of the substrate
  • the substrate is a flexible substrate
  • the material of the conductive connector is metal.
  • the invention also provides a method for manufacturing a borderless display device, comprising the following steps:
  • Step 1 providing a substrate, forming a conductive connecting body on the substrate;
  • Step 2 depositing and patterning a protective layer on the substrate and the conductive connecting body, forming a first through hole on the protective layer corresponding to the conductive connecting body, and forming a circuit wiring on the protective layer a layer, the circuit wiring layer is in contact with the conductive connection via the first through hole and electrically connected;
  • Step 3 forming an OLED light emitting layer or an encapsulation layer on the circuit wiring layer;
  • Step 4 forming a second through hole on the substrate corresponding to the conductive connecting body by laser digging;
  • Step 5 providing a driving circuit board and a flexible connecting circuit, the driving circuit board and the flexible connecting circuit are both disposed close to a side of the first substrate away from the circuit wiring layer, and the flexible connecting circuit has one end
  • the driving circuit board is electrically connected, and the other end is in contact with the conductive connecting body via the second through hole and electrically connected to the other end, and the conductive connecting body is electrically connected to the circuit wiring layer Thereby, the electrical connection between the driving circuit board and the circuit wiring layer is realized.
  • the substrate is a flexible substrate.
  • the material of the conductive connector is metal.
  • the conductive connector is located in an intermediate region of the substrate.
  • the frameless display device produced in the step 5 is a top-emitting OLED display device.
  • the present invention provides a frameless display device and a method for fabricating the same, by forming a conductive connecting body on a substrate, forming a first through hole on the protective layer over the conductive connecting body, Forming a second through hole on the substrate under the conductive connecting body, the circuit wiring layer is connected to the conductive connecting body through the first through hole, and the flexible connecting circuit connecting the driving circuit board is connected to the conductive through the second through hole
  • the body is connected to realize electrical connection between the driving circuit board and the circuit wiring layer.
  • the method is simple and easy to operate, and the obtained frameless display device, the flexible connecting circuit and the driving circuit board are all disposed on the back surface of the substrate, and do not occupy an effective display. Area, which can achieve borderless display and improve display quality.
  • FIG. 1 is a schematic structural view of a conventional display device
  • FIG. 2 is a schematic structural view of a frameless display device of the present invention.
  • FIG. 3 is a flow chart of a method for fabricating a frameless display device of the present invention.
  • step 2 is a schematic diagram of step 2 of a method for manufacturing a frameless display device according to the present invention.
  • FIG. 6 is a schematic diagram of step 3 of a method for manufacturing a frameless display device according to the present invention.
  • FIG. 7 is a schematic diagram of step 4 of the method for fabricating the frameless display device of the present invention.
  • the present invention provides a frameless display device, including a substrate 21, a conductive connecting body 22 disposed on the substrate 21, a protective layer 23 disposed on the conductive connecting body 22, and a protective layer disposed on the protective layer a circuit wiring layer 24 on the 23, an OLED light emitting layer or encapsulation layer 25 disposed on the circuit wiring layer 24, and a side of the substrate 21 remote from the conductive connecting body 22 and disposed through a flexible connecting circuit 41 driving circuit board 40 connected to the conductive connector 22;
  • a first through hole 231 is disposed on the protective layer 23 corresponding to the conductive connecting body 22, and the circuit wiring layer 24 is in contact with the conductive connecting body 22 via the first through hole 231 and is electrically connected. connection;
  • a second through hole 211 is disposed on the substrate 21 corresponding to the conductive connecting body 22, and one end of the flexible connecting circuit 41 is electrically connected to the driving circuit board 40, and the other end is connected from the lower side of the first substrate 21.
  • the second through hole 211 is in contact with and electrically connected to the conductive connecting body 22 , thereby achieving electrical connection between the driving circuit board 40 and the circuit wiring layer 24 .
  • the conductive connector 22 is located at an intermediate portion of the substrate 21.
  • the substrate 21 is a flexible substrate.
  • the substrate 21 is a plastic substrate.
  • the frameless display device of the present invention is a frameless flexible display device.
  • the material of the conductive connecting body 22 is a metal such as molybdenum, aluminum, copper, silver or the like.
  • the protective layer 23 is an insulating layer or a flat layer; when the protective layer 23 is an insulating layer, the material of the insulating layer is silicon oxide or silicon nitride; when the protective layer 23 is a flat layer
  • the material of the flat layer is an organic photoresist.
  • the borderless display device of the present invention is a top-emitting OLED display device.
  • the drive circuit board 40 and the flexible connection circuit 41 are disposed on the lower surface side of the first substrate 21, and the electrical An additional connection region is provided on the circuit wiring layer 24 for connection with the flexible connection circuit 41, and the flexible connection circuit 41 does not need to bypass the side of the display device to be connected to the circuit wiring layer 24, thereby The setting of the frame area is omitted, so that the upper surface of the entire display device is an effective display area, forming a frameless display device.
  • the present invention further provides a method for manufacturing a frameless display device, comprising the following steps:
  • Step 1 As shown in FIG. 4, a substrate 21 is provided, and a conductive connecting body 22 is formed on the substrate 21.
  • the substrate 21 is a flexible substrate.
  • the first substrate 21 is formed by coating.
  • the conductive connecting body 22 is formed by forming a conductive film on the first substrate 21 by physical vapor deposition (PVD), and patterning the conductive film by a photolithography process to form a conductive connecting body. twenty two.
  • PVD physical vapor deposition
  • the lithography process includes a process of coating photoresist, exposure, development, wet etching, and photoresist stripping.
  • the conductive connector 22 is located at an intermediate portion of the substrate 21.
  • the material of the conductive connecting body 22 is a metal such as molybdenum, aluminum, copper, silver or the like.
  • Step 2 As shown in FIG. 5, a protective layer 23 is deposited and patterned on the substrate 21 and the conductive connecting body 22, and a first pass is formed on the protective layer 23 corresponding to the conductive connecting body 22.
  • the hole 231 forms a circuit wiring layer 24 on the protective layer 23, and the circuit wiring layer 24 is in contact with the conductive connecting body 22 via the first through hole 231 and is electrically connected.
  • the protective layer 23 is an insulating layer or a flat layer; when the protective layer 23 is an insulating layer, the material of the insulating layer is silicon oxide or silicon nitride; when the protective layer 23 is a flat layer
  • the material of the flat layer is an organic photoresist.
  • the circuit wiring layer 24 is an in-plane trace or an electrode or the like.
  • Step 3 As shown in FIG. 6, an OLED light-emitting layer or encapsulation layer 25 is formed on the circuit wiring layer 24.
  • Step 4 as shown in FIG. 7, a second through hole 211 is formed on the substrate 21 by laser hole drilling under the conductive connecting body 22.
  • Step 5 providing a driving circuit board 40 and a flexible connecting circuit 41, and setting the driving circuit board 40 and the flexible connecting circuit 41 to be close to a side of the first substrate 21 away from the circuit wiring layer 24,
  • One end of the flexible connecting circuit 41 is electrically connected to the driving circuit board 40, and the other end is in contact with the conductive connecting body 22 via the second through hole 211 under the first substrate 21 and is electrically connected due to
  • the conductive connecting body 22 is electrically connected to the circuit wiring layer 24, thereby
  • the electrical connection between the driving circuit board 40 and the circuit wiring layer 24 is realized, and a frameless display device as shown in FIG. 2 is obtained.
  • the method for fabricating the frameless display device provided by the present invention comprises: forming a conductive connecting body 22 on the substrate 21, forming a first through hole 231 on the protective layer 23 above the conductive connecting body 22, in the conductive connection A second through hole 211 is formed on the substrate 21 under the body 22, and the circuit wiring layer 24 is connected to the conductive connecting body 22 through the first through hole 231, and the flexible connecting circuit 41 connecting the driving circuit board 40 passes through the second through hole 211.
  • the conductive connecting body 22 is connected to realize electrical connection between the driving circuit board 40 and the circuit wiring layer 24.
  • the method is simple and easy to operate, and the obtained frameless display device, the flexible connecting circuit 41 and the driving circuit board 40 are both It is disposed on the back surface of the substrate 21, and does not occupy an effective display area, thereby enabling borderless display and improving display quality.
  • the present invention provides a frameless display device and a method for fabricating the same, by forming a conductive connecting body on a substrate, forming a first through hole on the protective layer over the conductive connecting body. Forming a second via hole on the substrate under the conductive connecting body, the circuit wiring layer is connected to the conductive connecting body through the first through hole, and the flexible connecting circuit connecting the driving circuit board passes through the second through hole and the conductive connecting body Connected to realize electrical connection between the driving circuit board and the circuit wiring layer.
  • the method is simple and easy to operate, and the obtained frameless display device, the flexible connecting circuit and the driving circuit board are all disposed on the back surface of the substrate, and do not occupy an effective display area. Therefore, the borderless display can be realized, and the display quality is improved.

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Abstract

一种无边框显示装置及其制作方法，制作方法包括在基板（21）上设置一导电连接体（22），在导电连接体（22）上方形成位于保护层（23）上的第一通孔（231），在导电连接体（22）下方形成位于基板（21）上的第二通孔（211），电路布线层（24）通过第一通孔（231）与导电连接体（22）相连，连接驱动电路板（40）的柔性连接电路（41）通过第二通孔（211）与导电连接体（22）相连，从而实现驱动电路板（40）与电路布线层（24）的电性连接。制作方法简单，易于操作，制得的无边框显示装置，柔性连接电路（41）及驱动电路板（40）均设于基板（21）的背面，不占据有效显示区域，从而可以实现无边框显示，提升显示品质。

Description

无边框显示装置及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种无边框显示装置及其制作方法。
背景技术
随着显示行业的不断发展，无边框显示技术正在成为未来显示领域发展一个重要方向。传统的显示装置，如图1所示，包括上基板100、下基板200、密封连接所述上基板100与下基板200的密封胶300、及通过一柔性连接电路410电性连接至所述下基板200的驱动电路板400，其中，所述下基板200包括第一基板210及位于所述第一基板210上的电路布线层230，所述上基板100与所述下基板200上设有电路布线层230的一侧相向设置，所述驱动电路板400设置为靠近所述第一基板210远离所述电路布线层230的一侧，并且通过所述柔性连接电路410与所述电路布线层230电性连接。
上述显示装置中，所述下基板200的电路布线层230上需要设置专门的连接区域以与所述柔性连接电路410相连接，由于连接区域不能实现有效显示，且占据一定的宽度，从而增加了显示装置的边框面积，缩减了有效显示区域面积，另外，由于所述柔性连接电路410一端与位于所述下基板200上表面的电路布线层210相连接，另一端与位于所述下基板200下表面一侧的驱动电路板300相连接，因此所述柔性连接电路410需要绕过所述下基板200的侧边，呈U型设置，由于所述柔性连接电路410在所述下基板200侧边占用了一定的空间，进一步增加了显示装置的边框面积，从而使得传统的显示装置难以实现窄边框显示，更不能实现无边框显示。
发明内容
本发明的目的在于提供一种无边框显示装置，柔性连接电路及驱动电路板均设于基板的背面，不占据有效显示区域，从而可以实现无边框显示，提升显示品质。
本发明的目的还在于提供一种无边框显示装置的制作方法，通过在基板上设置一导电连接体，在所述导电连接体上方形成位于保护层上的第一通孔，在所述导电连接体下方形成位于基板上的第二通孔，电路布线层通过第一通孔与所述导电连接体相连，连接驱动电路板的柔性连接电路通过 第二通孔与所述导电连接体相连，从而实现驱动电路板与电路布线层的电性连接，该方法简单，易于操作，制得的无边框显示装置，柔性连接电路及驱动电路板均设于基板的背面，不占据有效显示区域，从而可以实现无边框显示，提升显示品质。
为实现上述目的，本发明提供一种无边框显示装置，包括基板、设于基板上的导电连接体、设于所述导电连接体上的保护层、设于所述保护层上的电路布线层、设于所述电路布线层上的OLED发光层或封装层、及设置于靠近所述基板上远离所述导电连接体的一侧并通过一柔性连接电路与所述导电连接体相连的驱动电路板；
其中，所述保护层上对应所述导电连接体上方设有第一通孔，所述电路布线经由所述第一通孔与所述导电连接体相接触并电性连接；
所述基板上对应所述导电连接体下方设有第二通孔，所述柔性连接电路一端与所述驱动电路板电性连接，另一端从所述基板下方经由所述第二通孔与所述导电连接体相接触并电性连接，从而实现所述驱动电路板与所述电路布线层的电性连接。
所述导电连接体位于所述基板的中间区域。
所述基板为柔性基板。
所述导电连接体的材料为金属。
所述无边框显示装置为顶部发光的OLED显示装置。
本发明还提供一种无边框显示装置，包括基板、设于基板上的导电连接体、设于所述导电连接体上的保护层、设于所述保护层上的电路布线层、设于所述电路布线层上的OLED发光层或封装层、及设置于靠近所述基板上远离所述导电连接体的一侧并通过一柔性连接电路与所述导电连接体相连的驱动电路板；
其中，所述保护层上对应所述导电连接体上方设有第一通孔，所述电路布线层经由所述第一通孔与所述导电连接体相接触并电性连接；
所述基板上对应所述导电连接体下方设有第二通孔，所述柔性连接电路一端与所述驱动电路板电性连接，另一端从所述基板下方经由所述第二通孔与所述导电连接体相接触并电性连接，从而实现所述驱动电路板与所述电路布线层的电性连接；
其中，所述导电连接体位于所述基板的中间区域；
其中，所述基板为柔性基板；
其中，所述导电连接体的材料为金属。
本发明还提供一种无边框显示装置的制作方法，包括如下步骤：
步骤1、提供一基板，在所述基板上制作导电连接体；
步骤2、在所述基板、及所述导电连接体上沉积并图案化保护层，在所述保护层上对应所述导电连接体上方形成第一通孔，在所述保护层上形成电路布线层，所述电路布线层经由所述第一通孔与所述导电连接体相接触并电性连接；
步骤3、在电路布线层上形成OLED发光层或封装层；
步骤4、在所述基板上对应所述导电连接体下方通过激光挖孔的方式形成第二通孔；
步骤5、提供一驱动电路板及柔性连接电路，将所述驱动电路板与柔性连接电路均设置为靠近所述第一基板上远离所述电路布线层的一侧，所述柔性连接电路一端与所述驱动电路板电性连接，另一端从所述第一基板下方经由所述第二通孔与所述导电连接体相接触并电性连接，由于所述导电连接体电性连接电路布线层，从而实现所述驱动电路板与所述电路布线层的电性连接。
所述基板为柔性基板。
所述导电连接体的材料为金属。
所述导电连接体位于所述基板的中间区域。
所述步骤5制得的无边框显示装置为顶部发光的OLED显示装置。
本发明的有益效果：本发明提供的一种无边框显示装置及其制作方法，通过在基板上设置一导电连接体，在所述导电连接体上方形成位于保护层上的第一通孔，在所述导电连接体下方形成位于基板上的第二通孔，电路布线层通过第一通孔与所述导电连接体相连，连接驱动电路板的柔性连接电路通过第二通孔与所述导电连接体相连，从而实现驱动电路板与电路布线层的电性连接，该方法简单，易于操作，制得的无边框显示装置，柔性连接电路及驱动电路板均设于基板的背面，不占据有效显示区域，从而可以实现无边框显示，提升显示品质。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为一种现有的显示装置的结构示意图；
图2为本发明的无边框显示装置的结构示意图；
图3为本发明的无边框显示装置的制作方法的流程图；
图4为本发明的无边框显示装置的制作方法步骤1的示意图；
图5为本发明的无边框显示装置的制作方法步骤2的示意图；
图6为本发明的无边框显示装置的制作方法步骤3的示意图；
图7为本发明的无边框显示装置的制作方法步骤4的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种无边框显示装置，包括基板21、设于基板21上的导电连接体22、设于所述导电连接体22上的保护层23、设于所述保护层23上的电路布线层24、设于所述电路布线层24上的OLED发光层或封装层25、及靠近所述基板21上远离所述导电连接体22的一侧设置并通过一柔性连接电路41与所述导电连接体22相连的驱动电路板40；
其中，所述保护层23上对应所述导电连接体22上方设有第一通孔231，所述电路布线层24经由所述第一通孔231与所述导电连接体22相接触并电性连接；
所述基板21上对应所述导电连接体22下方设有第二通孔211，所述柔性连接电路41一端与所述驱动电路板40电性连接，另一端从所述第一基板21下方经由所述第二通孔211与所述导电连接体22相接触并电性连接，从而实现所述驱动电路板40与所述电路布线层24的电性连接。
具体的，所述导电连接体22位于所述基板21的中间区域。
具体的，所述基板21为柔性基板，优选的，所述基板21为塑料基板。
具体的，当所述基板21为柔性基板时，本发明的无边框显示装置为无边框柔性显示装置。
具体的，所述导电连接体22的材料为金属，如钼、铝、铜、银等。
具体的，所述保护层23为绝缘层或平坦层；当所述保护层23为绝缘层时，所述绝缘层的材料为氧化硅或氮化硅；当所述保护层23为平坦层时，所述平坦层的材料为有机光阻。
优选的，本发明的无边框显示装置为顶部发光的OLED显示装置。
本发明的无边框显示装置，与现有技术相比，所述驱动电路板40和柔性连接电路41均设置于所述第一基板21的下表面一侧，不需要在所述电 路布线层24上设置额外的连接区域用作与柔性连接电路41相连接，所述柔性连接电路41也不需要绕过所述显示装置的侧边来与所述路布线层24进行连接，从而省去了边框区域的设置，使得整个显示装置的上表面均为有效显示区域，形成无边框显示装置。
请参阅图3，本发明还提供一种无边框显示装置的制作方法，包括如下步骤：
步骤1、如图4所示，提供一基板21，在所述基板21上制作导电连接体22。
具体的，所述基板21为柔性基板，优选的，所述第一基板21通过涂布的方式形成。
具体的，所述导电连接体22的制作方法为：通过物理气相沉积(PVD)在所述第一基板21上形成一导电薄膜，通过光刻制程图形化所述导电薄膜，形成一导电连接体22。
具体的，所述光刻制程包括涂光阻、曝光、显影、湿蚀刻、及光阻剥离等制程。
具体的，所述导电连接体22位于所述基板21的中间区域。
优选的，所述导电连接体22的材料为金属，如钼、铝、铜、银等。
步骤2、如图5所示，在所述基板21、及所述导电连接体22上沉积并图案化保护层23，在所述保护层23上对应所述导电连接体22上方形成第一通孔231，在所述保护层23上形成电路布线层24，所述电路布线层24经由所述第一通孔231与所述导电连接体22相接触并电性连接。
具体的，所述保护层23为绝缘层或平坦层；当所述保护层23为绝缘层时，所述绝缘层的材料为氧化硅或氮化硅；当所述保护层23为平坦层时，所述平坦层的材料为有机光阻。
具体的，所述电路布线层24为面内走线或电极等。
步骤3、如图6所示，在电路布线层24上形成OLED发光层或封装层25。
步骤4、如图7所示，在所述基板21上对应所述导电连接体22下方通过激光挖孔的方式形成第二通孔211。
步骤5、提供一驱动电路板40及柔性连接电路41，将所述驱动电路板40与柔性连接电路41均设置为靠近所述第一基板21上远离所述电路布线层24的一侧，所述柔性连接电路41一端与所述驱动电路板40电性连接，另一端从所述第一基板21下方经由所述第二通孔211与所述导电连接体22相接触并电性连接，由于所述导电连接体22电性连接电路布线层24，从而 实现所述驱动电路板40与所述电路布线层24的电性连接，制得一种如图2所示的无边框显示装置。
本发明提供的无边框显示装置的制作方法，通过在基板21上设置一导电连接体22，在所述导电连接体22上方形成位于保护层23上的第一通孔231，在所述导电连接体22下方形成位于基板21上的第二通孔211，电路布线层24通过第一通孔231与所述导电连接体22相连，连接驱动电路板40的柔性连接电路41通过第二通孔211与所述导电连接体22相连，从而实现驱动电路板40与电路布线层24的电性连接，该方法简单，易于操作，制得的无边框显示装置，柔性连接电路41及驱动电路板40均设于基板21的背面，不占据有效显示区域，从而可以实现无边框显示，提升显示品质。
综上所述，本发明提供的一种无边框显示装置及其制作方法，通过在基板上设置一导电连接体，在所述导电连接体上方形成位于保护层上的第一通孔，在所述导电连接体下方形成位于基板上的第二通孔，电路布线层通过第一通孔与所述导电连接体相连，连接驱动电路板的柔性连接电路通过第二通孔与所述导电连接体相连，从而实现驱动电路板与电路布线层的电性连接，该方法简单，易于操作，制得的无边框显示装置，柔性连接电路及驱动电路板均设于基板的背面，不占据有效显示区域，从而可以实现无边框显示，提升显示品质。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (12)

  1. 一种无边框显示装置，包括基板、设于基板上的导电连接体、设于所述导电连接体上的保护层、设于所述保护层上的电路布线层、设于所述电路布线层上的OLED发光层或封装层、及设置于靠近所述基板上远离所述导电连接体的一侧并通过一柔性连接电路与所述导电连接体相连的驱动电路板；
    其中，所述保护层上对应所述导电连接体上方设有第一通孔，所述电路布线层经由所述第一通孔与所述导电连接体相接触并电性连接；
    所述基板上对应所述导电连接体下方设有第二通孔，所述柔性连接电路一端与所述驱动电路板电性连接，另一端从所述基板下方经由所述第二通孔与所述导电连接体相接触并电性连接，从而实现所述驱动电路板与所述电路布线层的电性连接。
  2. 如权利要求1所述的无边框显示装置，其中，所述导电连接体位于所述基板的中间区域。
  3. 如权利要求1所述的无边框显示装置，其中，所述基板为柔性基板。
  4. 如权利要求1所述的无边框显示装置，其中，所述导电连接体的材料为金属。
  5. 如权利要求1所述的无边框显示装置，其中，所述无边框显示装置为顶部发光的OLED显示装置。
  6. 一种无边框显示装置，包括基板、设于基板上的导电连接体、设于所述导电连接体上的保护层、设于所述保护层上的电路布线层、设于所述电路布线层上的OLED发光层或封装层、及设置于靠近所述基板上远离所述导电连接体的一侧并通过一柔性连接电路与所述导电连接体相连的驱动电路板；
    其中，所述保护层上对应所述导电连接体上方设有第一通孔，所述电路布线层经由所述第一通孔与所述导电连接体相接触并电性连接；
    所述基板上对应所述导电连接体下方设有第二通孔，所述柔性连接电路一端与所述驱动电路板电性连接，另一端从所述基板下方经由所述第二通孔与所述导电连接体相接触并电性连接，从而实现所述驱动电路板与所述电路布线层的电性连接；
    其中，所述导电连接体位于所述基板的中间区域；
    其中，所述基板为柔性基板；
    其中，所述导电连接体的材料为金属。
  7. 如权利要求6所述的无边框显示装置，其中，所述无边框显示装置为顶部发光的OLED显示装置。
  8. 一种无边框显示装置的制作方法，包括如下步骤：
    步骤1、提供一基板，在所述基板上制作导电连接体；
    步骤2、在所述基板、及所述导电连接体上沉积并图案化保护层，在所述保护层上对应所述导电连接体上方形成第一通孔，在所述保护层上形成电路布线层，所述电路布线层经由所述第一通孔与所述导电连接体相接触并电性连接；
    步骤3、在电路布线层上形成OLED发光层或封装层；
    步骤4、在所述基板上对应所述导电连接体下方通过激光挖孔的方式形成第二通孔；
    步骤5、提供一驱动电路板及柔性连接电路，将所述驱动电路板与柔性连接电路均设置为靠近所述第一基板上远离所述电路布线层的一侧，所述柔性连接电路一端与所述驱动电路板电性连接，另一端从所述第一基板下方经由所述第二通孔与所述导电连接体相接触并电性连接，由于所述导电连接体电性连接电路布线层，从而实现所述驱动电路板与所述电路布线层的电性连接。
  9. 如权利要求8所述的无边框显示装置的制作方法，其中，所述基板为柔性基板。
  10. 如权利要求8所述的无边框显示装置的制作方法，其中，所述导电连接体的材料为金属。
  11. 如权利要求8所述的无边框显示装置的制作方法，其中，所述导电连接体位于所述基板的中间区域。
  12. 如权利要求11所述的无边框显示装置的制作方法，其中，所述步骤5制得的无边框显示装置为顶部发光的OLED显示装置。
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