WO2015127860A1 - 一种无卤阻燃型树脂组合物 - Google Patents

一种无卤阻燃型树脂组合物 Download PDF

Info

Publication number
WO2015127860A1
WO2015127860A1 PCT/CN2015/072756 CN2015072756W WO2015127860A1 WO 2015127860 A1 WO2015127860 A1 WO 2015127860A1 CN 2015072756 W CN2015072756 W CN 2015072756W WO 2015127860 A1 WO2015127860 A1 WO 2015127860A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
weight
halogen
parts
free flame
Prior art date
Application number
PCT/CN2015/072756
Other languages
English (en)
French (fr)
Inventor
奚龙
何岳山
王碧武
Original Assignee
广东生益科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广东生益科技股份有限公司 filed Critical 广东生益科技股份有限公司
Priority to KR1020167026455A priority Critical patent/KR101814322B1/ko
Priority to US15/120,549 priority patent/US10696844B2/en
Priority to EP15755556.6A priority patent/EP3112422B1/en
Publication of WO2015127860A1 publication Critical patent/WO2015127860A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation

Definitions

  • the present invention relates to a resin composition, and more particularly to a halogen-free flame-retardant resin composition and a laminate for a prepreg, a laminate and a printed circuit board produced therefrom.
  • Laminates for circuit boards have become one of the major laminate types on the market.
  • phosphorus-nitrogen synergistic flame retardancy can be achieved using a compound containing a dihydrobenzoxazine ring and a phosphorus-containing compound.
  • Laminates for printed circuit boards made using benzoxazine have a certain market size due to their low water absorption, excellent heat resistance and high reliability.
  • the hardness of the benzoxazine resin after curing is high, and the brittleness is larger than that of the epoxy resin, which may cause a problem of large wear of the drill plate and difficulty in processing when the sheet is processed. Accordingly, the toughening modification of benzoxazine has become the focus of research in this field.
  • a common method of toughening is to add a thermoplastic resin as a modified toughening agent, such as a blend of high toughness polyaryletherketone, polyarylene ether sulfone thermoplastic resin and benzoxazine.
  • the method can effectively form a phase separation structure, reduce the expansion of the internal crack of the material, and absorb the impact energy of the material.
  • Another method is to add rubber toughening, such as amino terminated nitrile rubber ATBN, carboxylated nitrile rubber CTBN and other kinds of core shell rubber. This method can also effectively absorb the impact energy of the material and increase the elongation at break.
  • the plate made of the benzoxazine modified by the above method has a problem that the glass transition temperature is lowered, the heat resistance is largely lowered and unstable, and the moist heat resistance is drastically lowered. Due to the complicated structure of the system, Anti-CAF property It is difficult to get a guarantee.
  • CN102850545A proposes to prepare a blended resin having high toughness and high heat resistance by melt blending/solution blending of trimethylhexamethylene bismaleimide resin and benzoxazine resin.
  • the resin mixture must form a specific phase at a specific ratio. In this case, the two resins are mixed with other components in actual use. It is extremely prone to phase separation, which seriously restricts its application prospects in the electronics industry.
  • CN102134375 provides a halogen-free high Tg resin composition and prepregs and laminates made therefrom.
  • the resin composition provided has high Tg, low water absorption, low CET, good dielectric properties, etc., but its toughness is poor, machining is difficult, and industrialization cannot be achieved.
  • CN102977551A provides a halogen-free resin composition and a method of producing a copper clad laminate therewith.
  • the halogen-free resin composition provided has excellent heat resistance and good processability, but its toughness is insufficient and needs to be further improved.
  • One of the objects of the present invention is to provide a halogen-free flame-retardant resin composition which is suitably combined with a suitable ratio by combining a benzoxazine resin and a bismaleimide resin.
  • the polyepoxy compound, the phosphorus-containing flame retardant, the curing agent and the like make the composition improve the toughness of the existing benzoxazine resin while ensuring heat resistance and moist heat resistance.
  • a second object of the present invention is to provide a prepreg made of a halogen-free flame-retardant resin composition according to one of the objects, which has excellent flame retardancy and high vitrification.
  • Change temperature Degree (Tg) high heat resistance, high bending strength, high reliability, low dielectric loss factor, low water absorption, low coefficient of thermal expansion (CTE), etc.; in addition, the prepreg also has excellent resistance Chemical and mechanical processing properties.
  • a third object of the present invention is to provide a laminate made of a halogen-free flame-retardant resin composition according to one of the objects, which has excellent flame retardancy and high glass transition temperature. (Tg), high heat resistance, high bending strength, high reliability, low dielectric loss factor, low water absorption, low coefficient of thermal expansion (CTE), etc.; in addition, the laminate also has excellent chemical resistance And machining performance.
  • Tg flame retardancy and high glass transition temperature.
  • CTE coefficient of thermal expansion
  • a fourth object of the present invention is to provide a laminate for a printed circuit made of a halogen-free flame-retardant resin composition according to any one of the objects, wherein the laminate for a printed circuit board has excellent flame retardancy. At the same time, it has the advantages of high glass transition temperature (Tg), high heat resistance, high bending strength, high reliability, low dielectric loss factor, low water absorption, low coefficient of thermal expansion (CTE), etc. Laminates for circuit boards also have excellent chemical and mechanical properties.
  • Tg glass transition temperature
  • CTE coefficient of thermal expansion
  • a halogen-free flame-retardant resin composition comprising, by weight of the organic solids, the following components:
  • (A) bismaleimide resin 1 to 10 parts by weight;
  • (E) curing agent 1 to 25 parts by weight
  • the curing agent is an amine curing agent and/or a phenol resin curing agent.
  • Bismaleimide has a moderately long aliphatic segment, and in the halogen-free flame-retardant resin composition of the present invention, a bismaleimide resin is used in combination with a benzoxazine resin in a resin composition. Curing The stage and the other resin of the system undergo a curing cross-linking reaction, and under the joint action of the bismaleimide five-membered heterocyclic ring and the aliphatic segment, the high glass transition temperature and high heat resistance of the halogen-free flame-retardant resin are maintained. High heat and humidity resistance, improving toughness and reducing processing difficulty.
  • the viscosity of the bismaleimide resin is large, which makes the process control of the resin production process difficult, and the controllable production cannot be achieved.
  • the invention realizes the purpose of reducing the viscosity of the resin by selecting various raw materials in the halogen-free flame-retardant resin composition and the optimal arrangement of the content between the raw materials, and solves the technical problem that the process control is difficult in the production process, and is controllable. Chemical production offers the possibility.
  • the bismaleimide resin is added in an amount of 1 to 10 parts by weight, for example, 2 parts by weight, 6 parts by weight, 8 parts by weight, 9 parts by weight, or the like. It is preferably from 3 to 7 parts by weight.
  • the bismaleimide resin of the present invention is obtained by any one or at least two of the following bismaleimide monomers:
  • R and X are independently selected from -CH 2 -, Any one of them;
  • R 2 and X 2 are independently selected from H or CH 3 .
  • the bismaleimide is a bifunctional compound having a maleimide (MI) as a living end group.
  • maleimide (MI) is a five-membered heterocyclic ring at both ends.
  • maleimide (MI) at both ends is bonded through a linear or branched alkylene group, and the number of carbon atoms of the alkylene group is not specified. Preferably, it is 5-9. In the alkylene group, the number of carbon atoms is too large, and the solubility of the bismaleimide resin in a solvent is lowered.
  • the alkylene group (MI) at the two ends is bonded to the alkylene group.
  • the four methyl groups, that is, the alkylene group is a branched alkylene group, typically, but not limited to, the number of methyl groups linked to the alkylene group is 1, 2, 3, 4, and the like.
  • the structure of the bismaleimide monomer of the present invention is not specifically limited, and those skilled in the art can select, but are not limited to, the structure of the bismaleimide resin, and further preferably, The structure of the bismaleimide monomer is Or
  • a benzoxazine resin or a compound having a dihydrobenzoxazine ring
  • a benzoxazine resin is a benzo six-membered heterocyclic compound synthesized from a phenol, a primary amine, and a formaldehyde, and is subjected to ring-opening polymerization to produce nitrogen-containing A network structure similar to phenolic resin.
  • the benzoxazine resin can improve the flame retardancy, moisture resistance, heat resistance, mechanical properties and electrical properties required for the halogen-free resin composition, the prepreg obtained from the resin, the laminate, and the like.
  • the benzoxazine resin is added in an amount of 30 to 60 parts by weight, for example, 35 parts by weight, 43 parts by weight, 52 parts by weight, 58 parts by weight or the like. If the amount of benzoxazine resin added is too large, the sheet will be too hard to be processed, and too little will cause the water absorption rate of the system to rise, and the glass transition temperature (Tg), storage modulus, dielectric properties, etc. will decrease; preferably 40 to 60 parts by weight.
  • Tg glass transition temperature
  • the type of the benzoxazine resin in the present invention is not particularly limited, and a benzoxazine resin which is known to those skilled in the art can be used in the present invention.
  • the benzoxazine resin of the present invention is selected from the group consisting of bisphenol A type benzoxazine resin, bisphenol F type benzoxazine resin, phenolphthalein type benzoxazine resin, and MDA type benzoxazine resin. Any one or a combination of at least two of them.
  • the structure of the bisphenol A type benzoxazine resin monomer and the bisphenol F type benzoxazine resin monomer and the phenolphthalein type benzoxazine resin monomer are as shown by the formula ( ⁇ ):
  • R 3 is R 4 is -CH 2 - or Any one of them.
  • R 4 When R 4 is When the structural formula ( ⁇ ) is a bisphenol A type benzoxazine resin monomer; when R 4 is -CH 2 -, the structural formula ( ⁇ ) is a bisphenol F type benzoxazine resin monomer; when R 4 is In the formula, the structural formula ( ⁇ ) is a phenolphthalein type benzoxazine resin monomer.
  • MDA type benzoxazine resin also known as (4,4'-diaminodiphenylmethane) type benzoxazine resin, has a structure as shown by formula ( ⁇ ):
  • a bisphenol F type benzoxazine resin has a methylene group in its molecular structure, and its viscosity is relatively low while maintaining a certain rigidity; and a phenolphthalein type benzoxazole
  • the heat resistance of the azine resin and the MDA type benzoxazine resin is better.
  • the combination of the benzoxazine resin of the present invention typically, but not exclusively, includes a combination of a bisphenol A type benzoxazine resin and a phenolphthalein type benzoxazine resin, a MDA type benzoxazine resin and a bisphenol F type.
  • the weight of the benzoxazine resin of the present invention accounts for 50% of the total weight of the resin in the halogen-free flame-retardant resin composition, based on the weight of the organic solid.
  • the total weight of the resin in the halogen-free flame-retardant resin composition is a bismaleimide resin, a benzoxazine resin, a polyepoxide, and a phosphorus-containing resistance in the halogen-free flame-retardant resin composition.
  • the sum of the weight of the fuel and curing agent (the weight refers to the weight of the organic solid).
  • the glass transition temperature (Tg) of the composition can be further increased, and the thermal decomposition temperature can reach 385 ° C or more. It is easy to obtain a lower water absorption rate (less than 0.1%). Due to the above performance improvement, the board made of the resin composition will have more obvious improvement in reliability and has a certain cost advantage.
  • the benzoxazine resin needs to be blended with the bismaleimide resin before being mixed with other component resins.
  • the present invention is not particularly limited in terms of the manner of blending, such as solution blending, or melt blending, which can be used in the present invention.
  • the specific operation of the typical but non-limiting blending of the benzoxazine resin and the bismaleimide resin solution is as follows: the bismaleimide resin and the benzoxazine resin are respectively dissolved at a temperature of 20 to 50 ° C. In the solvent, after the dissolution is completed, the two resins are mixed, and stirring is continued until the mixture is uniform.
  • the specific operation of the typical but non-limiting melt blending of the benzoxazine resin and the bismaleimide resin is as follows: at a temperature of 80-150 ° C, the bismaleimide resin and the benzoxazine resin are separately placed. Stir in a kettle with a stirrer and heating device for 5-10 minutes.
  • the polyepoxy compound can obtain basic mechanical and thermal properties of the halogen-free resin composition after curing, the prepreg obtained from the resin, a laminate, and the like.
  • the polyepoxy compound is added in an amount of 10 to 40 parts by weight, for example, 15 parts by weight, 23 parts by weight, 32 parts by weight, 38 parts by weight or the like, preferably 10 Up to 25 parts by weight. If the amount of polyepoxide added is too large, the water absorption rate will increase, the coefficient of thermal expansion of the system will increase, and too little will result in insufficient bonding properties of the composition.
  • the laminate and copper foil/, laminate layer and layer are produced. Insufficient adhesion, plus Deterioration of workability.
  • the specific selection of the polyepoxy compound in the present invention is not limited.
  • the polyepoxy compound of the present invention is selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol type novolac epoxy resin, o-cresol novolac type epoxy resin, bisphenol A type phenol no.
  • Epoxy resin epoxy resin having biphenyl structure, epoxy resin having aralkyl structure, dicyclopentadiene epoxy resin, halogen-free epoxy resin having oxazolidinone ring, epoxidized polybutylene Any one or at least two of the olefins are mixed.
  • the various polyepoxy compounds listed may be used singly or in combination.
  • the phosphorus-containing flame retardant according to the present invention can improve the combustion performance of the halogen-free resin composition and the prepreg, laminate, and the like obtained from the resin, and achieve a flame retarding effect.
  • the phosphorus-containing flame retardant is added in an amount of 5 to 25 parts by weight, for example, 7 parts by weight, 12 parts by weight, 18 parts by weight, 26 parts by weight or the like in the halogen-free flame-retardant resin composition of the present invention. If the amount of the phosphorus-containing flame retardant is too large, the key properties such as heat resistance and moisture resistance of the resin composition will be lowered, and the precipitation of the phosphorus-containing flame retardant may bring a failure of the PCB processing. Too little, the produced sheet will cause insufficient flame retardant performance, posing a safety hazard for the end product.
  • the phosphorus-containing flame retardant is added in an amount of 8 to 18 parts by weight in the halogen-free flame-retardant resin composition of the present invention.
  • the type of the phosphorus-containing flame retardant of the present invention is not particularly limited, and examples thereof include phosphates and compounds thereof, phosphorus phenanthrenes and derivatives thereof, and the like which are easily conceivable by those skilled in the art.
  • the phosphorus-containing flame retardant of the present invention is selected from the group consisting of resorcinol-bis(diphenyl phosphate), bisphenol A-bis(diphenyl phosphate), resorcinol-bis (2,6) Any one or a combination of at least two of -dimethylphenol phosphate), dimethyl methyl phosphate or phosphazene composition is preferably a phosphazene compound.
  • the phosphazene compound of the present invention is a phosphazene compound containing a cyclic compound and a chain, and has a softening point of 60 to 150 °C.
  • the phosphazene compound is used as the phosphorus-containing flame retardant, it is preferably used in an amount of 5 to 25 parts by weight, further preferably 8 to 18 parts by weight.
  • Halogen-free flame retardant when phosphazene compound is selected as flame retardant The resin composition is more excellent in chemical resistance and less prone to hydrolysis, and has more excellent chemical resistance and anti-CAF properties, that is, higher reliability, in the preparation of a subsequent laminate for printed circuit.
  • the curing agent of the present invention is capable of chemically reacting with a resin in the halogen-free resin composition to form a network-like solid polymer, which causes the linear resin to become a tough bulk solid.
  • the curing agent is added in an amount of 1 to 25 parts by weight, for example, 3 parts by weight, 8 parts by weight, 15 parts by weight, 18 parts by weight, 24 parts by weight or the like.
  • the amount of the curing agent added is too large, more than 25 parts by weight causes the heat resistance of the cured resin to deteriorate, and is too small.
  • the amount is less than 1 part by weight, the resin composition is insufficiently cured and the glass transition temperature is lowered.
  • the type of the curing agent is not specifically limited in the present invention.
  • the phenolic resin-based curing agent is selected from the group consisting of a phenol novolac resin, a bisphenol A type phenol resin, a nitrogen-containing phenol resin, a biphenolic resin, an aralkyl phenol resin, an alkyl phenol aldehyde or a Any one or a combination of at least two of the phosphorus phenolic resins.
  • the amine curing agent is selected from the group consisting of dicyandiamide curing agent or/and an aromatic amine curing agent;
  • the aromatic amine curing agent is selected from the group consisting of diaminodiphenyl ether, diaminodiphenyl sulfone, and diamino bis Any one or a combination of at least two of phenylmethane, m-xylylenediamine or benzidine.
  • the curing accelerator can accelerate the reaction rate of the resin and the curing agent, lower the curing temperature, shorten the curing time, reduce the amount of the curing agent, and can improve the mechanical and chemical properties of the resin to some extent. Therefore, in the halogen-free flame-retardant resin composition of the present invention, it is preferable to further include a curing accelerator: 0.1 to 1 part by weight, for example, 0.2 part by weight, 0.5 part by weight, 0.7 part by weight, 0.9 part by weight or the like.
  • the type of the curing accelerator is not specifically limited in the present invention.
  • the curing accelerator is selected from the group consisting of imidazoles, preferably from any of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole or 2-undecylimidazole Kind or a combination of at least two.
  • the filler is further included: 5 to 60 parts by weight, for example, 6 parts by weight, 12 parts by weight, 23 parts by weight, 32 parts by weight, 38 Parts by weight, 45 parts by weight, 49 parts by weight, 56 parts by weight, etc., preferably 25 to 40 parts by weight.
  • the type of the filler is not particularly limited in the present invention, and may be an inorganic filler, an organic filler, or a mixture of an inorganic filler and an organic filler.
  • the filler is selected from the group consisting of inorganic fillers or/and organic fillers;
  • the inorganic filler is selected from the group consisting of aluminum hydroxide, silica, talc, boehmite, zeolite, wollastonite, magnesia, calcium silicate, Any one or a combination of at least two of calcium carbonate, clay or mica;
  • the organic filler is selected from any one or a combination of at least two of melamine and/or melamine cyanurate.
  • the present invention may also add a known additive such as a thermoplastic resin, an inorganic filler, a coloring pigment, an antifoaming agent, a surfactant, a flame retardant, an ultraviolet absorber, an antioxidant, a flow regulator, etc., as needed.
  • a known additive such as a thermoplastic resin, an inorganic filler, a coloring pigment, an antifoaming agent, a surfactant, a flame retardant, an ultraviolet absorber, an antioxidant, a flow regulator, etc.
  • the method for preparing the halogen-free flame-retardant resin composition of the present invention can be selected by those skilled in the art with reference to the preparation method of the existing resin composition, and the present invention is not particularly limited.
  • a typical but non-limiting method of preparing the halogen-free flame-retardant resin composition comprises the steps of:
  • the formulated amount of the phosphorus-containing flame retardant is dissolved in a certain liquid solvent (such as methyl ethyl ketone MEK, propylene glycol methyl ether PM, etc.), stirred until completely dissolved, and then liquid benzoxazine resin, polyepoxy resin and double Maleimide resin, and other additive components (such as thermoplastic resin, inorganic filler, coloring pigment and other additives); then add the curing agent and accelerator dissolved in the liquid solvent, continue to stir evenly, and finally use the liquid solvent
  • a certain liquid solvent such as methyl ethyl ketone MEK, propylene glycol methyl ether PM, etc.
  • the halogen-free flame-retardant resin composition of the present invention comprises, by weight of the organic solids, the following components:
  • (A) bismaleimide resin 1 to 10 parts by weight;
  • (E) curing agent 1 to 25 parts by weight
  • (G) filler 5 to 60 parts by weight
  • the curing agent is an amine curing agent or a phenol resin curing agent.
  • the halogen-free flame-retardant resin composition of the present invention comprises the following components in parts by weight of the organic solid:
  • (E) curing agent 1 to 25 parts by weight
  • (G) filler 25 to 40 parts by weight
  • the curing agent is an amine curing agent or a phenol resin curing agent.
  • the prepreg according to the second object of the present invention is made of a halogen-free flame-retardant resin composition as described in one of the objects.
  • the prepreg is a combination of a resin matrix and a reinforcement formed by impregnating a continuous fiber or fabric under a strictly controlled condition with a resin matrix, and is an intermediate material for manufacturing a composite material.
  • the prepreg according to the present invention comprises a binder and a halogen-free flame-retardant resin composition attached to the binder.
  • the binder is a nonwoven fabric or other fabric, typically but not limited to natural fibers, organic synthetic fibers or inorganic fibers.
  • the prepreg is obtained by subjecting the base material to impregnation and drying treatment in a halogen-free flame-retardant resin composition provided in one of the purposes; that is, the prepreg comprises a base material and passes through A halogen-free flame-retardant resin composition adhered to the base after impregnation and drying treatment.
  • the typical but non-limiting preparation method of the prepreg includes The following steps:
  • the impregnated base material of the halogen-free flame-retardant resin provided by one of the purposes is prepared by heating and drying the impregnated glass cloth in an oven at 140 to 200 ° C for 3 to 8 minutes.
  • the laminate of the third object of the present invention comprises a plurality of prepregs according to the two objects of the superposition.
  • a laminate is a type of laminate which is a composite of two or more layers of resin-impregnated fibers or fabrics (i.e., prepregs) which are laminated and heat-pressed.
  • the laminate of the present invention is preferably obtained by laminating and thermocompression bonding of two or more layers of the prepreg according to the second purpose, that is, each prepreg used for the laminated composite laminate comprises a base material. And a halogen-free flame-retardant resin composition adhered to the base material after being impregnated and dried.
  • the laminate of the present invention is prepared by laminating one or more prepregs by heat and pressure to form a laminate.
  • a laminate for a printed circuit according to the fourth aspect of the present invention comprising: a plurality of prepregs according to the purpose of superimposing, and a metal of one or both sides of the prepreg after lamination Foil
  • each of the prepregs comprises a base material and a halogen-free flame-retardant resin composition adhered to the base material after being impregnated and dried.
  • a laminate for a printed circuit is obtained by coating a metal foil on one or both sides of a conventional laminate.
  • the metal foil of the present invention is not particularly limited, and typical, but not limited to, copper foil, nickel foil, aluminum foil, SUS foil, and the like.
  • the present invention has the following beneficial effects:
  • the present invention achieves the object of improving the toughness of the existing benzoxazine resin while ensuring heat resistance and moist heat resistance by adding a suitable amount of bismaleimide resin;
  • the present invention provides a halogen-free flame-retardant resin composition having a low viscosity by introducing a polyepoxy resin, thereby overcoming the problem of excessive viscosity caused by introduction of the bismaleimide resin and difficulty in industrial production;
  • the bismaleimide resin selected by the invention contains a small amount of branching, which not only overcomes the problem of difficulty in dissolution caused by more branching, but also avoids the disadvantage that the unbranched sample is easy to crystallize, and realizes the improvement of mechanical properties. Without impairing the operability of the production process;
  • the prepreg, the laminate, and the laminate for printed circuit provided by the present invention have excellent flame retardancy, and also have high glass transition temperature (Tg), high heat resistance, high bending strength, and high reliability. Advantages, lower dielectric loss factor, low water absorption, low coefficient of thermal expansion (CTE), etc.; more expensive, the prepreg, laminate, printed circuit laminate also has excellent chemical resistance and mechanical Processing performance.
  • Tg glass transition temperature
  • CTE coefficient of thermal expansion
  • A is a bismaleimide resin
  • A-1 is a bismaleimide resin in which the monomer is 1,6-bismaleimidohexane, and the specific structure of the 1,6-bismaleimidohexane is:
  • B-1 is a model of LZ 8280 purchased from Huntsman Advanced Materials of the United States.
  • B-2 is a model D125 purchased from Sichuan Dongcai Technology Group Co., Ltd.;
  • C-1 is a product of the model HP-7200HHH purchased from Japan DIC Corporation.
  • C-2 is a product of KF8100 purchased from KOLON Corporation of Korea;
  • D is a phosphorus-containing flame retardant, and is a product of SPB-100 purchased from Otsuka Chemical Co., Ltd., Japan;
  • E-1 is a product of the model EPONOL 6635M65 purchased from Korea's momentive company.
  • E-2 is a model of DICY purchased from Ningxia Darong Chemical.
  • F curing accelerator which is 2-phenylimidazole purchased from Shikoku Chemicals Co., Ltd.;
  • G-1 is aluminum hydroxide having a purity of 99% or more.
  • G-2 is silica having a purity of 99% or more.
  • A-2 in Table 2 is a bismaleimide resin of trimethylhexamethylene bismaleimide described in CN102850545A, the trimethylhexamethylene bismaleimide
  • the specific structure of the amine is:
  • halogen-free flame-retardant resin compositions provided in Examples 1 to 8 and Comparative Examples 1 to 8 were prepared as follows, and laminates for printed circuit boards were prepared, and the prepared laminates were subjected to performance tests.
  • the preparation method of the laminate for printed circuit board comprises:
  • step 2 8 pieces of prepreg and 2 pieces of one ounce (35 ⁇ m thick) metal foil are laminated together;
  • the operating conditions of the lamination are: when the temperature is 80-140 ° C, the controlled heating rate is 1.5-2.5 ° C / min; when the outer layer temperature is 80-100 ° C, the full pressure is applied, the full pressure is applied. It is about 350 psi; when curing, the temperature of the material is controlled at 195 ° C and kept for more than 60 minutes.
  • the measurement was carried out in accordance with the DSC method specified in 2.4.25 of IPC-TM-650.
  • the peel strength of the metal cap layer was tested in accordance with the experimental conditions of "after thermal stress" in the method specified in 2.4.8 of IPC-TM-650.
  • the sample (100 ⁇ 100 mm laminate for printed circuit) was held in a pressure cooker at 121 ° C and 105 kPa for 2 hours; then, the sample was immersed in a solder bath at 260 ° C for 20 seconds; Observe (h 1 ) whether there is delamination, (h 2 ) whether white spots or wrinkles occur, and record;
  • ⁇ indicates no change, ⁇ indicates that white spots occurred, and ⁇ indicates that delamination occurred.
  • the dielectric loss factor at 1 GHz was measured according to the method specified in 2.5.5.5 of IPC-TM-650 according to the resonance method using a strip line.
  • the test was carried out in accordance with the method specified in 2.4.4 of IPC-TM-650, that is, the load was applied to a sample of a predetermined size and shape at room temperature for measurement.
  • the 100 ⁇ 100 mm substrate was baked in an oven at 200° C. for 4 hours, and the exudation of the interlaminar material was observed with the naked eye: (h 1 ) no exudation, indicated by the symbol ⁇ ; (h 2 ) , denoted by the symbol ⁇ ; (h 3 ) is more, denoted by the symbol ⁇ .
  • the substrate with a thickness of 1.60mm and 100 ⁇ 100mm is horizontally placed on the gantry.
  • the circular passage with a diameter of 8cm inside the gantry runs through the upper and lower sections of the gantry.
  • a 1Kg weight cross hammer will be selected, and the diameter of the hammer head will be 10mm.
  • the head is placed at a height of 1 m, aligned with the circular cross section of the gantry, and vertically falls on the sheet, and the area of the white streaks of the sheet is calculated.
  • the halogen content of the copper clad laminate was measured by an oxygen cylinder combustion method and an ion chromatography method in accordance with JPCA-ES-01-2003 "Halogen Free Copper Clad Test Method".
  • the halogen-free resin composition provided in Comparative Example 4 was difficult to dissolve, and the composition had a large viscosity and a low sizing yield. In actual operation, the decrease of ambient temperature is likely to cause the precipitation of bismaleimide resin, which seriously affects production efficiency and has certain quality hazards.
  • the halogen-free resin compositions provided in Examples 1 to 8 can be well adapted to existing equipment and process control conditions, and can be continuously and stably produced without adding additional equipment, with high rubber coating yield and controllable quality.
  • the composition containing no bismaleimide had a larger falling weight area and poor toughness; a composition not containing a polyepoxy (Comparative Example 2)
  • the peel strength is very low, the bending strength is significantly reduced, the reliability (anti-CAF) is poor, and 4 reflects that the bismaleimide excess composition (Comparative Example 3), although the toughness is better, but peeling off
  • the strength is lowered, the bending strength is lowered, and the comprehensive performance of the composition is affected;
  • the bismaleimide resin having a large number of branches has a problem of difficulty in dissolution, a problem of poor workability; and a benzoxazine resin.
  • the amount has a significant effect on the composition. If the amount used is less than 30 parts (Comparative Example 5), the phenomenon of insufficient flame retardancy occurs; the amount used exceeds 60 parts (Comparative Example 6), although it is easy to obtain a higher Tg, but simultaneously The pore performance is reduced; the amount of polyepoxy resin is reduced to less than 10 parts (Comparative Example 7), and the peel strength will suddenly drop, affecting the use, if the polyepoxide is excessive (pair In proportion 8), the glass transition temperature, flammability and reliability are all lowered.
  • the present invention effectively combines the types, types, and contents of the components of the resin composition.
  • the selection of the epoxy resin allows the provided resin composition to ensure high peel strength while increasing the process operability of the composition; the selection of the bismaleimide resin allows the provided The resin composition maintains high toughness while maintaining high characteristics such as high glass transition temperature (Tg) and high reliability.
  • the laminate for printed circuit boards prepared by the halogen-free flame-retardant resin composition provided by the present invention can maintain high glass transition temperature, high reliability, flame resistance, solder resistance, chemical resistance, and low water absorption. Simultaneous and low dielectric loss factor, the brittleness of the benzoxazine system is greatly reduced, and the toughness of the sheet is improved.
  • the halogen content can reach the flame retardancy test UL94 in the ULC halogen-free standard. -0 standard; the halogen content of the present invention is less than 0.09% by weight, thereby achieving environmental protection.
  • the glass transition temperature (Tg) of the composition can reach 160 ° C or higher, and the flame resistance can reach UL94 V-0 level. At the same time, the water absorption rate is maintained at about 0.10%, and the toughness is good.
  • the content of benzoxazine resin is less than 30 parts, although the peeling strength is improved, the glass transition temperature (Tg) decreases significantly, the water absorption rate increases, and the Anti-CAF decreases, which seriously affects the comprehensive performance of the composition.
  • the content of the benzoxazine is more than 60 parts, the toughness of the composition is deteriorated, and the workability is lowered, which is not satisfactory.
  • Reasonable use of the filler can reduce the water absorption of the composition, increase its reliability, and enhance the overall performance of the resin composition.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

提供一种无卤阻燃型树脂组合物，以有机固形物重量份计，包括如下组分：(A)双马来酰亚胺树脂：1至10重量份；(B)苯并噁嗪树脂：30至60重量份；(C)聚环氧化合物：10至40重量份；(D)含磷阻燃剂：5到25重量份；(E)固化剂：1至25重量份；所述固化剂为胺类固化剂和/或酚醛树脂类固化剂。还提供用所述树脂组合物制备的预浸料、层压板、印制电路用层压板。

Description

一种无卤阻燃型树脂组合物 技术领域
本发明涉及一种树脂组合物，尤其涉及一种无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板。
背景技术
随着今年来技术的发展，特别是欧盟《关于报废电气电子设备指令》和《关于在电气电子设备中限制使用有害物质指令》于2006年7月1日正式实施以来，无卤阻燃型印制电路用层压板已经成为了市场上主要的层压板类型之一。实现印制电路板用层压板的无卤化，可使用含有二氢苯并噁嗪环的化合物和含磷化合物实现磷-氮协效阻燃。使用苯并噁嗪制造的印制电路用层压板具有较低吸水率，优异的耐热性和较高的可靠性，已经形成了一定的市场规模。然而，苯并噁嗪树脂固化后硬度较高，与环氧树脂相比脆性较大，易导致板材加工时出现钻刀磨损大，加工难度偏大的问题。相应地，对苯并噁嗪的增韧改性成为该领域的研究重点。
增韧的一种常用的方法是加入热塑性树脂作为改性增韧剂，如高韧性的聚芳醚酮、聚芳醚砜类热塑性树脂与苯并噁嗪的共混改性。此方法能有效形成分相结构，降低材料内部裂纹的扩张，吸收材料受到的冲击能量。另一种方法是加入橡胶进行增韧，如端氨基丁腈橡胶ATBN，端羧基丁腈橡胶CTBN以及其他种类的核壳橡胶。这种方法亦能有效吸收材料的冲击能量，提高断裂伸长率。然而，以上方法改性后的苯并噁嗪制作的板材，均存在玻璃化转变温度降低，耐热性大幅降低且不稳定，耐湿热性急剧下降的问题，由于体系构成繁杂，Anti-CAF性难以得到保证。
综上所述，对印制电路用层压板所用的苯并噁嗪树脂进行有效地改性，保证耐热性和玻璃化转变温度的同时，提升材料的韧性，具有重要意义。CN102850545A提出用三甲基六亚甲基双马来酰亚胺树脂与苯并噁嗪树脂熔融共混/溶液共混的方式制备具有高韧性高耐热的共混树脂。然而由于其双马来酰亚胺树脂结构中有较多的侧链，须在特定比例下树脂混合物才可形成特定相态，此种相态在实际使用中两种树脂与其他组分混合后极容易出现相分离，严重制约了其在电子行业的应用前景。
CN102134375提供了一种无卤高Tg树脂组合物及用其制作的预浸料与层压板。其提供的树脂组合物虽然具有高Tg，低吸水率，低CET，良好的介电性能等，但是其韧性较差，机械加工困难，无法实现工业化。
CN102977551A提供了一种无卤树脂组合物以及使用其制作覆铜板的方法。其提供的无卤树脂组合物具有优异的耐热性能，和较好的可加工性，但是其韧性不足，有待进一步提高。
由此，本领域需要开发一种综合性能优异的无卤树脂组合物，所述无卤树脂组合物应当具有高玻璃化温度、高可靠性、耐燃烧性、耐浸焊性、耐化学性、低吸水性、较低介电损耗因素等性能，但同时又具有较低的脆性和较高的韧性。
发明内容
本发明的目的之一在于提供一种无卤阻燃型树脂组合物，所述组合物通过将苯并噁嗪树脂和双马来酰亚胺树脂进行合适的配比组合，并辅以合适量的聚环氧化合物、含磷阻燃剂和固化剂等，使得所述组合物在保证了现有苯并噁嗪树脂耐热性，耐湿热性的同时，提高了其韧性。
本发明的目的之二在于提供一种用目的之一所述的无卤阻燃型树脂组合物制成的预浸料，所述预浸料具有优异的阻燃性能，同时还具有高玻璃化转变温 度(Tg)、高耐热性、高弯曲强度、高可靠性、较低介电损耗因素、低吸水性、低热膨胀系数(C.T.E)等优点；另外，所述预浸料还具有优良的耐化学性及机械加工性能。
本发明的目的之三是提供一种用目的之一所述的无卤阻燃型树脂组合物制成的层压板，所述层压板具有优异的阻燃性能，同时还具有高玻璃化转变温度(Tg)、高耐热性、高弯曲强度、高可靠性、较低介电损耗因素、低吸水性、低热膨胀系数(C.T.E)等优点；另外，所述层压板还具有优良的耐化学性及机械加工性能。
本发明的目的之四是提供一种用目的之一所述的无卤阻燃型树脂组合物制成的印制电路用层压板，所述印制电路用层压板具有优异的阻燃性能，同时还具有高玻璃化转变温度(Tg)、高耐热性、高弯曲强度、高可靠性、较低介电损耗因素、低吸水性、低热膨胀系数(C.T.E)等优点；另外，所述印制电路用层压板还具有优良的耐化学性及机械加工性能。
本发明通过如下具体方案实现：
一种无卤阻燃型树脂组合物，以有机固形物重量份计，包括如下组分：
(A)双马来酰亚胺树脂：1至10重量份；
(B)苯并噁嗪树脂：30至60重量份；
(C)聚环氧化合物：10至40重量份；
(D)含磷阻燃剂：5到25重量份；
(E)固化剂：1至25重量份；
所述固化剂为胺类固化剂和/或酚醛树脂类固化剂。
双马来酰亚胺具有长度适中的脂肪链段，在本发明所述的无卤阻燃型树脂组合物中，利用双马来酰亚胺树脂与苯并噁嗪树脂配合，在树脂组合物的固化 阶段与体系其他树脂发生固化交联反应，在双马来酰亚胺五元杂环和脂肪链段的共同作用下，达到了保持无卤阻燃型树脂高玻璃化转变温度、高耐热性、高耐湿热性的同时，提高韧性，降低加工难度的目的。
双马来酰亚胺树脂的黏度较大，造成树脂的生产过程工艺控制困难，无法实现可控化生产。本发明通过对无卤阻燃型树脂组合物中各种原料的选择，以及各原料间含量的优化配置，实现了降低树脂粘度的目的，解决了生产过程工艺控制困难的技术问题，为可控化生产提供了可能性。
在本发明所述的无卤阻燃型树脂组合物中，双马来酰亚胺树脂的添加量为1至10重量份，例如2重量份、6重量份、8重量份、9重量份等，优选为3至7重量份。双马来酰亚胺树脂的添加量过多，会导致组合物固化温度高，与现有层压工艺不兼容，其固化物的刚性降低，不利于板材的应用；另外，过量的双马来酰亚胺树脂易造成组合物黏度上升，给工业化生产造成困难；而过少的双马来酰亚胺树脂对组合物韧性改善的贡献变小，无法实现增加组合物韧性的目的。
优选地，本发明所述的双马来酰亚胺树脂由以下双马来酰亚胺单体中的任意1种或至少2种聚合得到：
Figure PCTCN2015072756-appb-000001
式(I)中，R和X独立地选自-CH2-、
Figure PCTCN2015072756-appb-000002
中的任意1种；
Figure PCTCN2015072756-appb-000003
式(II)中，R2和X2独立地选自H或CH3。
双马来酰亚胺是以马来酰亚胺(MI)为活性端基的双官能团化合物，在本发明中，马来酰亚胺(MI)即为两端的五元杂环。本发明所述的双马来酰亚胺单体的分子结构中，两端的马来酰亚胺(MI)通过直链或支链的亚烃基连接，所述亚烃基的碳原子数不做具体限定，优选5～9个。所述亚烃基中，碳原子数过多，降低双马来酰亚胺树脂在溶剂中的溶解性，当无卤树脂组合物固含量较高时，容易析出；若碳原子数过少，双马来酰亚胺树脂合成困难，且两端的五元杂环有强烈的相互作用，造成组合物结构较硬，影响体系的增韧。
为更好地与本发明中其他树脂融合，减少树脂的结晶倾向，本发明所述双马来酰亚胺单体中，连接两端的马来酰亚胺(MI)的亚烃基连接有1～4个甲基，即所述亚烃基为支链亚烃基，典型但非限制性地，所述亚烃基中连接的甲基的个数为1个、2个、3个、4个等。
本发明所述双马来酰亚胺单体的结构，本发明不做具体限定，本领域技术人员可以但不限于在前述双马来酰亚胺树脂的结构中选择，进一步优选地，所述双马来酰亚胺单体的结构为
Figure PCTCN2015072756-appb-000004
或 者
Figure PCTCN2015072756-appb-000005
苯并噁嗪树脂，或称具有二氢苯并噁嗪环的化合物，是由酚、伯胺和甲醛为原料合成的一种苯并六元杂环化合物，经开环聚合可生产含氮且类似酚醛树脂的网状结构。本发明中，苯并噁嗪树脂能够提高无卤树脂组合物及由所述树脂得到的预浸料、层压板等所需的阻燃性能、耐湿性、耐热性、力学性能及电学性能。
在本发明所述的无卤阻燃型树脂组合物中，苯并噁嗪树脂的添加量为30至60重量份，例如35重量份、43重量份、52重量份、58重量份等。苯并噁嗪树脂的添加量过多，会造成板材过硬无法加工，过少，会导致体系吸水率上升，玻璃化转变温度(Tg)、储能模量、介电性能等下降；优选40至60重量份。
本发明对苯并噁嗪树脂的种类不做具体限定，本领域技术人员有能力获知的苯并噁嗪树脂均可用于本发明。
优选地，本发明所述的苯并噁嗪树脂选自双酚A型苯并噁嗪树脂、双酚F型苯并噁嗪树脂、酚酞型苯并噁嗪树脂以及MDA型苯并噁嗪树脂中的任意1种或至少2种的组合。
其中，双酚A型苯并噁嗪树脂单体和双酚F型苯并噁嗪树脂单体、酚酞型苯并噁嗪树脂单体的结构如式(γ)所示：
Figure PCTCN2015072756-appb-000006
其中，R3为
Figure PCTCN2015072756-appb-000007
R4为
Figure PCTCN2015072756-appb-000008
-CH2-或
Figure PCTCN2015072756-appb-000009
中的任意1种。
当R4为
Figure PCTCN2015072756-appb-000010
时，结构式(γ)为双酚A型苯并噁嗪树脂单体；当R4为-CH2-时，结构式(γ)为双酚F型苯并噁嗪树脂单体；当R4为
Figure PCTCN2015072756-appb-000011
时，结构式(γ)为酚酞型苯并噁嗪树脂单体。
MDA型苯并噁嗪树脂，又称(4，4’-二胺基二苯甲烷)型苯并噁嗪树脂，其结构如式(δ)所示：
Figure PCTCN2015072756-appb-000012
在本发明所述的苯并噁嗪树脂中，双酚F型苯并噁嗪树脂的分子结构中存在亚甲基，在保持一定刚性的同时，其黏度相对较低；而酚酞型苯并噁嗪树脂和MDA型苯并噁嗪树脂的耐热性表现较好。
本发明所述苯并噁嗪树脂的组合典型但非限制性的包括双酚A型苯并噁嗪树脂和酚酞型苯并噁嗪树脂的组合，MDA型苯并噁嗪树脂和双酚F型苯并噁嗪树脂的组合，双酚F型苯并噁嗪树脂、酚酞型苯并噁嗪树脂和MDA型苯并噁嗪树脂的组合等。
进一步优选地，以有机固形物重量计，本发明所述苯并噁嗪树脂的重量(所述重量指有机固形物重量)占所述无卤阻燃型树脂组合物中树脂总重量的50％ 以上，其中，所述无卤阻燃型树脂组合物中树脂总重量为无卤阻燃型树脂组合物中双马来酰亚胺树脂、苯并噁嗪树脂、聚环氧化合物、含磷阻燃剂、固化剂的重量(所述重量指有机固形物重量)之和。
将苯并噁嗪树脂在无卤阻燃型树脂组合物中的含量设置在50％以上，能够进一步提高组合物的玻璃化转变温度(Tg)，热分解温度可以达到385℃以上的同时，更容易获得较低的吸水率(低于0.1％)。由于以上性能的提升，用此树脂组合物制造出的板材在可靠性方面将获得更加明显的改善，且具备一定的成本优势。
本发明中苯并噁嗪树脂需要和双马来酰亚胺树脂进行共混后，方可与其他组分树脂混合使用。本发明对于共混的方式不做具体限定，如溶液共混，或熔融共混均可用于本发明。
典型但非限制性的苯并噁嗪树脂和双马来酰亚胺树脂溶液共混的具体操作为：20～50℃温度下，双马来酰亚胺树脂和苯并噁嗪树脂分别溶于溶剂中，溶解完全后，将两种树脂混合，继续搅拌至混合均匀。
典型但非限制性的苯并噁嗪树脂和双马来酰亚胺树脂熔融共混的具体操作为：80-150℃温度下，双马来酰亚胺树脂和苯并噁嗪树脂分别放置于带有搅拌器和加热装置的釜中，搅拌5～10min。
聚环氧化合物在本发明中，能够使固化后的无卤树脂组合物及由所述树脂得到的预浸料、层压板等获得基本的机械和热学性能。在本发明所述的无卤阻燃型树脂组合物中，聚环氧化合物的添加量为10至40重量份，例如15重量份、23重量份、32重量份、38重量份等，优选10至25重量份。聚环氧化合物的添加量过多，会造成吸水率升高，体系热膨胀系数会上升，过少，会造成组合物粘结性能不足，制作的层压板与铜箔/，层压板层与层之间粘结力不足，同时加 工性劣化。
本发明对聚环氧化合物的具体选择种类不做限定。
优选地，本发明所述的聚环氧化合物选自双酚A型环氧树脂、双酚F型环氧树脂、苯酚型酚醛环氧树脂、邻甲酚醛型环氧树脂、双酚A型酚醛环氧树脂、具有联苯结构的环氧树脂、具有芳烷基结构的环氧树脂、双环戊二烯环氧树脂、具有噁唑烷酮环的无卤环氧树脂、环氧化聚丁二烯中的任意1种或至少2种的混合。所列举的各种聚环氧化合物可单独使用或混合使用。
本发明所述的含磷阻燃剂能够提高无卤树脂组合物及由所述树脂得到的预浸料、层压板等的燃烧性能，达到阻燃效果。在本发明所述的无卤阻燃型树脂组合物中含磷阻燃剂的添加量为5至25重量份，例如7重量份、12重量份、18重量份、26重量份等。含磷阻燃剂的添加量过多，将降低树脂组合物的耐热性，耐湿性等关键性能，含磷阻燃剂的析出可能给PCB加工带来失效隐患。过少，所制作的板材会造成阻燃性能不足，为终端产品带来安全隐患。
优选地，本发明所述的无卤阻燃型树脂组合物中含磷阻燃剂的添加量为8至18重量份。
本发明对于含磷阻燃剂的种类不做具体限定，例如本领域技术人员容易想到的磷酸酯及其化合物、磷菲类及其衍生物等等。
优选地，本发明所述的含磷阻燃剂选自间苯二酚-双(磷酸二苯酯)、双酚A-双(磷酸二苯酯)、间苯二酚-双(2，6-二甲苯基磷酸酯)、甲基磷酸二甲酯或磷腈组合物中的任意1种或至少2种的组合，优选磷腈化合物。
本发明所述磷腈化合物为含有环状化合物和链状的磷腈化合物，其软化点为60～150℃。当使用所述磷腈化合物作为含磷阻燃剂时，其用量优选为5到25重量份，进一步优选为8至18重量份。选用磷腈化合物为阻燃剂时，无卤阻燃 型树脂组合物的耐化学性更加优异，并较不易水解，在制备后续的印制电路用层压板时，具有更加优异的耐化学性、Anti-CAF性，即可靠性更高。
本发明所述固化剂能够与无卤树脂组合物中的树脂发生化学反应，形成网状立体聚合物，使线型树脂变成坚韧的体型固体。在本发明所述的无卤阻燃型树脂组合物中，固化剂的添加量为1至25重量份，例如3重量份、8重量份、15重量份、18重量份、24重量份等。固化剂的添加量过多，超过25重量份，会引起树脂固化物耐热性变差，过少，低于1重量份，会引起树脂组合物固化不足，玻璃化转变温度降低。
本发明对于固化剂的种类不做具体限定。优选地，本发明所述固化剂中，酚醛树脂类固化剂选自苯酚酚醛树脂、双酚A型酚醛树脂、含氮酚醛树脂、联苯酚醛树脂、芳烷基酚醛树脂、烷基酚醛或含磷酚醛树脂中的任意1种或至少2种的组合。
本发明所述固化剂中，胺类固化剂选自双氰胺固化剂或/和芳香胺固化剂；所述芳香胺固化剂选自二氨基二苯醚、二氨基二苯砜、二氨基二苯基甲烷、间苯二甲胺或联苯胺中的任意1种或至少2种的组合。
固化促进剂能够加快树脂与固化剂的反应速率，降低固化温度，缩短固化时间，减少固化剂的用量，并能够一定程度的改善树脂的机械和化学性能。因此，在本发明所述的无卤阻燃型树脂组合物中，优选还包括固化促进剂：0.1至1重量份，例如0.2重量份、0.5重量份、0.7重量份、0.9重量份等。
本发明对于固化促进剂的种类不做具体限定。优选地，所述固化促进剂选自咪唑类化合物，优选自2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑或2-十一烷基咪唑中的任意1种或至少2种的组合。
树脂组合物中，为了降低成本，或一定程度上改善树脂的机械或化学性能， 会添加一定量的填料。因此，可选地，在本发明所述的无卤阻燃型树脂组合物中，还包括填料：5至60重量份，例如6重量份、12重量份、23重量份、32重量份、38重量份、45重量份、49重量份、56重量份等，优选25至40重量份。
本发明对于填料的种类不做具体限定，可以是无机填料，也可以是有机填料，或无机填料和有机填料的混合。优选地，所述填料选自无机填料或/和有机填料；所述无机填料选自氢氧化铝，二氧化硅，滑石粉，勃姆石，沸石、硅灰石、氧化镁、硅酸钙、碳酸钙、粘土或云母中的任意1种或至少2种的组合；所述有机填料选自三聚氰胺和/或三聚氰胺氰尿酸盐中的任意1种或至少2种的组合。
当然，本发明还可根据需要添加热塑性树脂、无机填充剂、着色颜料、消泡剂、表面活性剂、阻燃剂、紫外吸收剂、抗氧剂、流动调整剂等公知的添加剂，所述添加剂的种类和添加量本发明不做具体限定，本领域技术人员可以根据掌握的专业知识进行选择。
本发明所述的无卤阻燃型树脂组合物的制备方法，本领域技术人员可以参考现有的树脂组合物的制备方法，结合实际情况进行选择，本发明不做特殊限定。典型但非限制性的所述无卤阻燃型树脂组合物的制备方法包括如下步骤：
将配方量的含磷阻燃剂溶解于一定的液态溶剂(如丁酮MEK、丙二醇甲醚PM等)中，搅拌直至完全溶解后，再加入液态苯并噁嗪树脂，聚环氧树脂和双马来酰亚胺树脂，以及其他添加组分(如热塑性树脂、无机填充剂、着色颜料等添加剂)；然后加入溶解于液态溶剂的固化剂和促进剂，继续搅拌均匀即可，最后用液态溶剂适当调整溶液的固体含量至60～75％，制成胶液，即本无卤阻燃型树脂。
作为优选技术方案，本发明所述的无卤阻燃型树脂组合物，以有机固形物重量份计，包括如下组分：
(A)双马来酰亚胺树脂：1至10重量份；
(B)苯并噁嗪树脂：30至60重量份；
(C)聚环氧化合物：10至40重量份；
(D)含磷阻燃剂：5到25重量份；
(E)固化剂：1至25重量份；
(F)固化促进剂：0.1至1重量份；
(G)填料：5至60重量份；
所述固化剂为胺类固化剂或酚醛树脂类固化剂。
作为可选技术方案，本发明所述的无卤阻燃型树脂组合物，以有机固形物重量份计，包括如下组分：
(A)双马来酰亚胺树脂：3至7重量份；
(B)苯并噁嗪树脂：40至60重量份；
(C)聚环氧化合物：10至25重量份；
(D)含磷阻燃剂：8到18重量份；
(E)固化剂：1至25重量份；
(F)固化促进剂：0.1至1重量份；
(G)填料：25至40重量份；
所述固化剂为胺类固化剂或酚醛树脂类固化剂。
本发明目的之二所述的预浸料是由目的之一所述的无卤阻燃型树脂组合物制成的。
预浸料是用树脂基体在严格控制的条件下浸渍连续纤维或织物，制成树脂基体与增强体的组合物，是制造复合材料的中间材料。
本发明所述的预浸料包括基料和附着在所述基料上的无卤阻燃型树脂组合物。所述基料为无纺织物或其它织物，典型但非限制性的包括天然纤维、有机合成纤维或无机纤维等。
优选地，所述预浸料是将所述基料经过在目的之一提供的无卤阻燃型树脂组合物中进行含浸、干燥处理后获得的；即，所述预浸料包括基料及通过含浸、干燥处理后附着在所述基料上的无卤阻燃型树脂组合物。
本发明所述的预浸料的制备方法，本领域技术人员可以参考现有的预浸料的制备方法，本发明不做具体限定，典型但非限制性的所述预浸料的制备方法包括如下步骤：
使用目的之一提供的无卤阻燃型树脂的胶液含浸基料，将含浸好的玻璃布在140～200℃的烘箱中加热干燥3～8分钟制成。
本发明的目的之三所述的层压板，包括数个叠合的目的之二所述的预浸料。
层压板是层压制品的一种，是由两层或多层浸有树脂的纤维或织物(即预浸料)，经叠合、热压结合成的整体。
本发明所述的层压板优选由两层或多层目的之二所述的预浸料经叠合、热压结合得到，即，用于叠合成层压板的每一预浸料均包括基料和，通过含浸、干燥处理后附着在所述基料上的无卤阻燃型树脂组合物。
本发明所述的层压板的制备方法为：通过加热和加压作用使一张或一张以上的预浸料粘合在一起，制成的层压板。
本发明的目的之四所述的印制电路用层压板，包括数个叠合的目的之二所述的预浸料，及设于叠合后的预浸料的单面或双面的金属箔；
其中，每个所述预浸料均包括基料和，通过含浸、干燥处理后附着在所述基料上的无卤阻燃型树脂组合物。
印制电路用层压板，是在普通层压板的单面或双面的覆金属箔得到的。
本发明对于金属箔不做具体限定，典型但非限制性的有铜箔、镍箔、铝箔及SUS箔等。
与现有技术相比，本发明具有如下有益效果：
(1)本发明通过加入合适量的双马来酰亚胺树脂，实现了在保证现有苯并噁嗪树脂耐热性，耐湿热性的同时，提高了其韧性的目的；
(2)本发明通过引入聚环氧树脂，提供的无卤阻燃型树脂组合物的粘度较低，克服了引入双马来酰亚胺树脂造成的粘度过大，工业化生产困难的问题；
本发明选用的双马来酰亚胺树脂含有少量支链，既克服了支链较多带来的溶解难的问题，也避免了没有支链样品易结晶的弊端，实现了力学性能改善的同时，不损害生产工艺的可操作性；
(3)本发明提供的预浸料、层压板、印制电路用层压板具有优异的阻燃性能，同时还具有高玻璃化转变温度(Tg)、高耐热性、高弯曲强度、高可靠性、较低介电损耗因素、低吸水性、低热膨胀系数(C.T.E)等优点；更可贵地，所述预浸料、层压板、印制电路用层压板还具有优良的耐化学性及机械加工性能。
具体实施方式
为更好地说明本发明，便于理解本发明的技术方案，本发明的典型但非限制性的实施例如下：
在所述实施例和对比例中，如无特别说明，其份代表重量份，其％代表“重量％”。
实施例1～8提供的无卤阻燃型树脂组合物的配方见表1。
表1实施例1～8提供的无卤阻燃型树脂组合物的配方
Figure PCTCN2015072756-appb-000013
在表1中，对于组分*的标号进行解释：
A为双马来酰亚胺树脂，
A-1为单体是1，6-双马来酰亚胺基己烷的双马来酰亚胺树脂，所述1，6-双马来酰亚胺基己烷的具体结构为：
Figure PCTCN2015072756-appb-000014
B为苯并噁嗪树脂，
B-1为购于美国亨斯迈先进材料公司的型号为LZ 8280的产品，
B-2为购于四川东材科技集团股份有限公司的型号为D125的产品；
C为无卤环氧树脂，
C-1为购于日本DIC公司的型号为HP-7200HHH的产品，
C-2为购于韩国KOLON公司的型号为KF8100的产品；
D为含磷阻燃剂，购于日本大塚化学株式会社的型号为SPB-100的产品；
E为固化剂，
E-1为购于韩国momentive公司的型号为EPONOL 6635M65的产品，
E-2为购于宁夏大荣化工的型号为DICY的产品，
F固化促进剂，为购于日本四国化成株式会社的2-苯基咪唑；
G无机填料，
G-1为纯度99％以上的氢氧化铝，
G-2为纯度99％以上的二氧化硅。
对比例1～8提供的无卤阻燃型树脂组合物的配方见表2。
表2对比例1～8提供的无卤阻燃型树脂组合物的配方
Figure PCTCN2015072756-appb-000015
在表2中，对于“组分*”中相同标号的解释与表1中的解释相同；
另外，表2中A-2为CN102850545A中所述的三甲基六亚甲基双马来酰亚胺的双马来酰亚胺树脂，所述三甲基六亚甲基双马来酰亚胺的具体结构为：
Figure PCTCN2015072756-appb-000016
性能测试：
将实施例1～8和对比例1～8提供的无卤阻燃型树脂组合物，按照如下方法制备印制电路用层压板，并对制备得到的层压板进行性能测试。
所述印制电路用层压板的制备方法包括：
①通过加热和加压作用使一张或一张以上的预浸料粘合在一起，制成的层压板；
②在步骤①制得的层压板的一面或两面上粘合金属箔；
③在层压机中进行层压；
在步骤②的过程中，使用8片预浸料和2片一盎司(35μm厚)的金属箔叠合在一起；
在步骤③的过程中，层压的操作条件为：料温80～140℃时，控制升温速率为1.5～2.5℃/min；外层料温80-100℃时，施加满压，满压压力为350psi左右；固化时，控制料温在195℃，并保温60min以上。
性能测试的项目及具体方法为：
(a)玻璃化转变温度：
根据差示扫描量热法，按照IPC-TM-650中2.4.25所规定的DSC方法进行测定。
(b)剥离强度：
按照IPC-TM-650中2.4.8所规定的方法中“热应力后”的实验条件，测试金属盖层的剥离强度。
(c)耐燃烧性：
依据UL94法测定。
(d)耐浸焊性：
首先将试样(100×100mm的印制电路用层压板)在121℃、105kPa的加压蒸煮处理装置内保持2小时；之后将试样浸在260℃的焊锡槽中20秒钟；以肉眼观察(h1)有无分层，(h2)有无发生白斑或起皱，并记录；
用符号○表示无变化，△表示发生白斑，×表示发生分层。
(e)吸水性：
按照IPC-TM-650中的2.6.2.1所规定的方法进行测定。
(f)介电损耗因素
根据使用条状线的共振法，按照IPC-TM-650中的2.5.5.5所规定的方法测定1GHz下的介电损耗因素。
(g)弯曲强度
按照IPC-TM-650中的2.4.4所规定的方法进行测试，即在室温下把负载施加于规定尺寸和形状的试样上进行测定。
(h)冲孔性
将1.6mm厚的基材放于一定图形的冲模器上进行冲孔，以肉眼观察孔边情况：(h1)孔边无白圈，用符号○表示；(h2)空边有白圈，用符号△表示；(h3)孔边开裂，用符号×表示。
(i)耐迁移性
将100×100mm的基材置于200℃的烘箱中烘烤4小时，以肉眼观察层压板间物质的渗出情况：(h1)无渗出，用符号○表示；(h2)有一点，用符号△表示；(h3)较多，用符号×表示。
(j)Anti-CAF性
按照JPCA-ES-04标准方法进行。
(k)落锤冲击面积
将厚度1.60mm，100×100mm的基材水平置于台架上，台架内部有直径8cm的圆形通道贯穿于台架上下截面，将选取1Kg重的十字锤，锤头直径10mm，将锤头置于1m高度，对准台架圆截面，垂直自由落于板材，对板材出现白纹的面积进行计算。
(1)卤素含量
按照JPCA-ES-01-2003《无卤型覆铜板试验方法》测定，采用氧瓶燃烧法和离子色谱法测定覆铜箔层压板的卤素含量。
由实施例1～8提供的无卤阻燃型树脂组合物制备的印制电路用层压板的性能测试结果如表3所示：
表3实施例1～8树脂组合物制备的印制电路用层压板的性能测试结果
Figure PCTCN2015072756-appb-000017
Figure PCTCN2015072756-appb-000018
由对比例1～8提供的无卤阻燃型树脂组合物制备的印制电路用层压板的性能测试结果如表4所示：
表4对比例1～8树脂组合物制备的印制电路用层压板的性能测试结果
Figure PCTCN2015072756-appb-000019
Figure PCTCN2015072756-appb-000020
在表4中，对比例4提供的无卤树脂组合物的溶解难度大，组合物胶液黏度大，上胶良率低。在实际操作中，环境气温降低极易引起双马来酰亚胺树脂的析出，严重影响生产效率且存在一定质量隐患。而实施例1～8提供的无卤树脂组合物可以很好的适应现有设备和工艺控制条件，无需增加额外的设备便可连续稳定生产，上胶良率高，品质可控。
从表4的性能测试结果可以看出，不含双马来酰亚胺的组合物(对比例1)落锤面积更大，韧性较差；不含有聚环氧的组合物(对比例2)剥离强度很低，弯曲强度下降明显，可靠性(anti-CAF)较差；和4则反映出，双马来酰亚胺过量的组合物(对比例3)，虽然韧性表现较佳，但剥离强度降低，弯曲强度下降，影响了组合物的综合性能；支链较多的双马来酰亚胺树脂(对比例4)则存在溶解难的问题，工艺性差的问题；苯并噁嗪树脂的量对组合物有显著影响，若使用量低于30份(对比例5)，则出现阻燃不足的现象；使用量超过60份(对比例6)，虽然容易获得较高Tg，但同时冲孔性能降低；聚环氧树脂使用量降低至10份以下(对比例7)，其剥离强度将骤然下降，影响使用，若聚环氧过量(对 比例8)，其玻璃化转变温度，耐燃烧性以及可靠性均会下降。
从实施例1～8和对比例1～8提供的无卤阻燃树脂组合物和相应的性能测试结果可以看出，本发明通过对树脂组合物各组分类型、种类、含量的有效组合，尤其是对环氧树脂的选择，使得所提供的树脂组合物在增加了组合物工艺操作性的同时，保证了其较高的剥离强度；对双马来酰亚胺树脂的选择，使得所提供的树脂组合物在获得较高的韧性的同时，保持了较高的玻璃化转变温度(Tg)和高可靠性等优良特性。
上述结果可知，由本发明提供的无卤阻燃型树脂组合物制备的印制电路用层压板，可保持高玻璃化温度、高可靠性、耐燃烧性、耐浸焊性、耐化学性、低吸水性、较低介电损耗因素的同时，大幅降低了苯并噁嗪系统的脆性，提升了板材的韧性；另外，卤素含量在JPCA无卤标准要求范围内能达到难燃性试验UL94中的V-0标准；本发明卤素含量在0.09重量％以下，从而达到环保之功效。
实施例9～12和对比例9～12提供的无卤阻燃型树脂组合物的配方见表5。
表5实施例9～12和对比例9～12提供的无卤阻燃型树脂组合物的配方
Figure PCTCN2015072756-appb-000021
Figure PCTCN2015072756-appb-000022
在表5中，对于“组分*”中相同标号的解释与表1中的解释相同。
由实施例9～12和对比例9～12提供的无卤阻燃型树脂组合物制备的印制电路用层压板的性能测试结果如表6所示：
表6实施例9～12和对比例9～12树脂组合物制备的印制电路用层压板的性能测试结果
Figure PCTCN2015072756-appb-000023
Figure PCTCN2015072756-appb-000024
由表6的性能测试结果可以看出，苯并噁嗪树脂在30-60份之间时，组合物的玻璃化转变温度(Tg)能达到160℃以上，耐燃烧性可达到UL94V-0等级，同时吸水率保持在0.10％左右，韧性较好。当苯并噁嗪树脂含量低于30份时，虽然剥离强度有所提升，但是玻璃化转变温度(Tg)下降明显，吸水率上升，Anti-CAF下降，严重影响了组合物的综合性能。苯并噁嗪含量高于60份时，组合物韧性劣化，加工性降低，不能满足要求。填料的合理使用则可以降低组合物的吸水率，增加其可靠性，提升树脂组合物的综合表现。
应该注意到并理解，在不脱离后附的权利要求所要求的本发明的精神和范围的情况下，能够对上述详细描述的本发明做出各种修改和改进。因此，要求保护的技术方案的范围不受所给出的任何特定示范教导的限制。
申请人声明，本发明通过上述实施例来说明本发明的详细方法，但本发明并不局限于上述详细方法，即不意味着本发明必须依赖上述详细方法才能实施。 所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。

Claims (12)

  1. 一种无卤阻燃型树脂组合物，其特征在于，所述组合物，以有机固形物重量份计，包括如下组分：
    (A)双马来酰亚胺树脂：1至10重量份；
    (B)苯并噁嗪树脂：30至60重量份；
    (C)聚环氧化合物：10至40重量份；
    (D)含磷阻燃剂：5到25重量份；
    (E)固化剂：1至25重量份；
    所述固化剂为胺类固化剂和/或酚醛树脂类固化剂。
  2. 如权利要求1所述的组合物，其特征在于，所述的双马来酰亚胺树脂由以下双马来酰亚胺单体中的任意1种或至少2种聚合得到：
    Figure PCTCN2015072756-appb-100001
    式(I)中，R和X独立地选自-CH2-、
    Figure PCTCN2015072756-appb-100002
    中的任意1种；
    Figure PCTCN2015072756-appb-100003
    式(II)中，R2和X2独立地选自H或CH3。
  3. 如权利要求1或2所述的组合物，其特征在于，所述的苯并噁嗪树脂选 自双酚A型苯并噁嗪树脂、双酚F型苯并噁嗪树脂、酚酞型苯并噁嗪树脂以及MDA型苯并噁嗪树脂中的任意1种或至少2种的组合。
  4. 如权利要求1～3之一所述的组合物，其特征在于，所述的聚环氧化合物选自双酚A型环氧树脂、双酚F型环氧树脂、苯酚型酚醛环氧树脂、邻甲酚醛型环氧树脂、双酚A型酚醛环氧树脂、具有联苯结构的环氧树脂、具有芳烷基结构的环氧树脂、双环戊二烯环氧树脂、具有噁唑烷酮环的无卤环氧树脂、环氧化聚丁二烯中的任意1种或至少2种的混合。
  5. 如权利要求1～4之一所述的组合物，其特征在于，所述的含磷阻燃剂选自间苯二酚-双(磷酸二苯酯)、双酚A-双(磷酸二苯酯)、间苯二酚-双(2，6-二甲苯基磷酸酯)、甲基磷酸二甲酯或磷腈化合物中的任意1种或至少2种的组合，优选磷腈化合物。
  6. 如权利要求1～5之一所述的组合物，其特征在于，所述酚醛树脂类固化剂选自苯酚酚醛树脂、双酚A型酚醛树脂、含氮酚醛树脂、联苯酚醛树脂、芳烷基酚醛树脂、烷基酚醛或含磷酚醛树脂中的任意1种或至少2种的组合；
    所述胺类固化剂选自双氰胺固化剂或/和芳香胺固化剂；所述芳香胺固化剂选自二氨基二苯醚、二氨基二苯砜、二氨基二苯基甲烷、间苯二甲胺或联苯胺中的任意1种或至少2种的组合。
  7. 如权利要求1～6之一所述的组合物，其特征在于，所述无卤阻燃型树脂组合物中，双马来酰亚胺树脂的含量为3至7重量份；
    优选地，以有机固形物重量计，所述苯并噁嗪树脂占所述无卤阻燃型树脂组合物中树脂总重量的50％以上；
    优选地，所述无卤阻燃型树脂组合物中，苯并噁嗪树脂的含量为40至60重量份；
    优选地，所述无卤阻燃型树脂组合物中，聚环氧化合物的含量为10至25重量份；
    优选地，所述无卤阻燃型树脂组合物中，含磷阻燃剂的含量为8至18重量份。
  8. 如权利要求1～7之一所述的组合物，其特征在于，所述组合物还包括(F)固化促进剂：0.1至1重量份；
    优选地，所述固化促进剂选自咪唑类化合物，优选自2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑或2-十一烷基咪唑中的任意1种或至少2种的组合。
  9. 如权利要求1～8之一所述的组合物，其特征在于，所述组合物还包括(G)填料：5至60重量份；优选25至40重量份；
    优选地，所述填料选自无机填料或/和有机填料；
    优选地，所述无机填料选自氢氧化铝，二氧化硅，滑石粉，勃姆石，沸石、硅灰石、氧化镁、硅酸钙、碳酸钙、粘土或云母中的任意1种或至少2种的组合；
    优选地，所述有机填料选自三聚氰胺和/或三聚氰胺氰尿酸盐中的任意1种或至少2种的组合。
  10. 一种预浸料，其特征在于，所述预浸料包括权利要求1～9之一所述的无卤阻燃型树脂组合物；
    优选地，所述预浸料包括基料和附着在所述基料上的无卤阻燃型树脂组合物；
    优选地，所述预浸料包括基料及通过含浸、干燥处理后附着在所述基料上的无卤阻燃型树脂组合物。
  11. 一种层压板，其特征在于，所述层压板包括数个叠合的权利要求10所 述的预浸料；
    优选地，每一预浸料包括基料和，通过含浸、干燥处理后附着在所述基料上的无卤阻燃型树脂组合物。
  12. 一种印制电路用层压板，其特征在于，所述印制电路用层压板包括数个叠合的权利要求10所述的预浸料，及设于叠合后的预浸料的单面或双面的金属箔；
    其中，每个所述预浸料均包括基料和，通过含浸、干燥处理后附着在所述基料上的无卤阻燃型树脂组合物。
PCT/CN2015/072756 2014-02-25 2015-02-11 一种无卤阻燃型树脂组合物 WO2015127860A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020167026455A KR101814322B1 (ko) 2014-02-25 2015-02-11 무할로겐 난연형 수지 조성물
US15/120,549 US10696844B2 (en) 2014-02-25 2015-02-11 Halogen-free flame retardant type resin composition
EP15755556.6A EP3112422B1 (en) 2014-02-25 2015-02-11 Halogen-free flame retardant type resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410064624.X 2014-02-25
CN201410064624.XA CN103834168B (zh) 2014-02-25 2014-02-25 一种无卤阻燃型树脂组合物

Publications (1)

Publication Number Publication Date
WO2015127860A1 true WO2015127860A1 (zh) 2015-09-03

Family

ID=50798081

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/072756 WO2015127860A1 (zh) 2014-02-25 2015-02-11 一种无卤阻燃型树脂组合物

Country Status (5)

Country Link
US (1) US10696844B2 (zh)
EP (1) EP3112422B1 (zh)
KR (1) KR101814322B1 (zh)
CN (1) CN103834168B (zh)
WO (1) WO2015127860A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588204B (zh) * 2015-12-28 2017-06-21 Shengyi Technology Co Ltd An epoxy resin composition and a prepreg and a laminate using the same
US9873789B2 (en) 2014-12-26 2018-01-23 Shengyi Technology Co., Ltd. Halogen-free epoxy resin composition, prepreg and laminate using same
US10208156B2 (en) 2014-12-26 2019-02-19 Shengyi Technology Co., Ltd. Epoxy resin composition, prepreg and laminate using same
US10696844B2 (en) 2014-02-25 2020-06-30 Shengyi Technology Co., Ltd. Halogen-free flame retardant type resin composition
CN117384457A (zh) * 2023-10-16 2024-01-12 江苏耀鸿电子有限公司 一种无卤阻燃碳氢树脂覆铜板及其制备方法

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103992622B (zh) * 2014-06-10 2017-03-01 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
KR101769264B1 (ko) * 2014-06-10 2017-08-17 셍기 테크놀로지 코. 엘티디. 무할로겐 수지 조성물 및 이를 사용하는 프리프레그와 인쇄 회로용 적층판
CN105331053B (zh) * 2014-07-22 2017-12-05 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
CN105802128B (zh) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
EP3279262B1 (en) * 2015-03-31 2023-11-08 Namics Corporation Resin composition, electroconductive resin composition, adhesive, electroconductive adhesive, paste for forming electrodes, and semiconductor device
CN105542396A (zh) * 2016-01-26 2016-05-04 广东汕头超声电子股份有限公司覆铜板厂 一种高模量型环氧树脂组合物及其制备方法及用其制作的半固化片、层压板及其制备方法
CN106218136A (zh) * 2016-07-27 2016-12-14 重庆德凯实业股份有限公司 环保型cem‑3覆铜板的制备方法
CN106928478B (zh) * 2016-10-20 2020-04-10 蓝星（成都）新材料有限公司 一种苯并噁嗪树脂层压板的制备方法
CN106496936A (zh) * 2016-10-20 2017-03-15 蓝星（成都）新材料有限公司 一种苯并噁嗪树脂及其制备方法
CN106867252B (zh) * 2017-01-24 2022-04-22 杭州恺恒新材料有限公司 用于拉挤成型的苯并噁嗪树脂体系及由其生产拉挤成型体的方法
KR102049024B1 (ko) 2017-03-22 2019-11-26 주식회사 엘지화학 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판
CN107459650A (zh) * 2017-08-07 2017-12-12 武汉理工大学 一种改性双马来酰亚胺树脂预聚物及其制备方法
CN107987664A (zh) * 2017-11-27 2018-05-04 四川威亿塑胶制品有限公司 一种漆膜硬度高的阻燃绝缘漆及其制备方法
CN109955544A (zh) * 2017-12-14 2019-07-02 广州金发碳纤维新材料发展有限公司 一种汽车内饰用复合板及其制备方法
KR102187162B1 (ko) 2017-12-14 2020-12-04 주식회사 엘지화학 금속 박막 코팅용 열경화성 수지 조성물 및 이를 이용한 금속 적층체
JP6989086B6 (ja) 2018-02-13 2022-02-28 エルジー・ケム・リミテッド 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ
CN108485020A (zh) * 2018-03-22 2018-09-04 常州天马集团有限公司（原建材二五三厂） 一种无卤阻燃胶衣树脂
CN109810504A (zh) * 2019-01-24 2019-05-28 江苏澳盛复合材料科技有限公司 一种双马树脂组合物及其固化物和复合材料
CN109825081B (zh) 2019-01-30 2021-06-04 广东生益科技股份有限公司 一种热固性树脂组合物、包含其的预浸料以及覆金属箔层压板和印制电路板
CN111995867B (zh) * 2020-07-28 2021-10-12 江南大学 第三代半导体器件封装用热固性树脂组合物及其制备方法
CN114672167B (zh) * 2020-12-24 2023-11-07 广东生益科技股份有限公司 一种无卤阻燃型树脂组合物及其制成的预浸料和印制电路用层压板
TWI759144B (zh) * 2020-12-28 2022-03-21 大陸商中山台光電子材料有限公司 樹脂組合物及其製品
TWI800386B (zh) * 2021-12-16 2023-04-21 元鴻應用材料股份有限公司 一種苯並噁嗪樹脂、其組成物及由其製成的銅箔基板
CN114133704A (zh) * 2021-12-31 2022-03-04 广东盈骅新材料科技有限公司 树脂组合物以及半固化片、应用
CN115449335A (zh) * 2022-09-05 2022-12-09 瑞声科技（南京）有限公司 树脂组合物及胶粘剂
CN116685050B (zh) * 2023-05-31 2024-01-23 江苏耀鸿电子有限公司 一种pcb电路板的制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102134375A (zh) * 2010-12-23 2011-07-27 广东生益科技股份有限公司 无卤高Tg树脂组合物及用其制成的预浸料与层压板
CN102558858A (zh) * 2011-12-22 2012-07-11 云南云天化股份有限公司 覆铜层压板用树脂组合物及半固化片
CN102732029A (zh) * 2012-06-21 2012-10-17 广东生益科技股份有限公司 无卤树脂组合物及粘结片与覆铜箔层压板
CN103265791A (zh) * 2013-05-29 2013-08-28 苏州生益科技有限公司 一种用于集成电路的热固性树脂组合物及使用其制作的半固化片及层压板
CN103834168A (zh) * 2014-02-25 2014-06-04 广东生益科技股份有限公司 一种无卤阻燃型树脂组合物

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH634558A5 (de) * 1978-04-06 1983-02-15 Ciba Geigy Ag Verfahren zur herstellung von aliphatischen n-substituierten maleinimiden.
ZA839459B (en) 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
JPH068298B2 (ja) 1985-01-21 1994-02-02 住友化学工業株式会社 芳香族系イミドエポキシエ−テル
US4927736A (en) 1987-07-21 1990-05-22 Hoechst Celanese Corporation Hydroxy polyimides and high temperature positive photoresists therefrom
JPH01319528A (ja) 1988-06-20 1989-12-25 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
JPH1152567A (ja) 1997-08-08 1999-02-26 Fuji Photo Film Co Ltd ポジ型フォトレジスト組成物
US6096853A (en) 1998-12-21 2000-08-01 General Electric Company Synthesis of phenolic monomers containing imide or diimide moieties and high heat carbonate polymers prepared therefrom
JP2000186133A (ja) 1998-12-22 2000-07-04 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP3721950B2 (ja) 2000-06-06 2005-11-30 松下電工株式会社 エポキシ樹脂組成物、プリプレグ、多層プリント配線板
JP2003231753A (ja) 2001-10-30 2003-08-19 Mitsui Chemicals Inc 新規ポリイミド、該ポリイミドからなる耐熱性接着剤、ポリイミドフィルム、接着性絶縁テープおよび金属積層体
JP4058672B2 (ja) 2002-02-28 2008-03-12 大日本インキ化学工業株式会社 エポキシ樹脂組成物およびその硬化物
JP4119232B2 (ja) 2002-11-29 2008-07-16 住友ベークライト株式会社 樹脂組成物、プリプレグおよび積層板
CN100560631C (zh) 2004-06-29 2009-11-18 旭化成电子材料株式会社 阻燃环氧树脂组合物
CN100351254C (zh) 2005-01-13 2007-11-28 吉林大学 含有酰亚胺结构双酚单体的合成方法
US8063161B2 (en) * 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
JP5628678B2 (ja) 2007-10-31 2014-11-19 ダウ グローバル テクノロジーズ エルエルシー 融着エポキシ樹脂用の非焼結イソシアネート改質エポキシ樹脂
WO2009075746A2 (en) * 2007-12-06 2009-06-18 Henkel Ag & Co. Kgaa Curable benzoxazine macromonomers, their preparation and cured products thereof
CN101244645B (zh) 2007-12-07 2010-10-13 中电电气集团有限公司 噁唑烷酮环氧玻璃布层压板的制造方法
JP5181769B2 (ja) 2008-03-26 2013-04-10 Ｄｉｃ株式会社 エポキシ樹脂組成物、及びその硬化物
JP5304105B2 (ja) 2008-08-28 2013-10-02 三菱化学株式会社 ビスイミドフェノール化合物及びその製造方法
JP5304106B2 (ja) 2008-08-28 2013-10-02 三菱化学株式会社 ビスイミドフェノール化合物及びその製造方法
JP5655284B2 (ja) 2008-09-11 2015-01-21 三菱化学株式会社 可溶性イミド骨格樹脂、可溶性イミド骨格樹脂溶液組成物、硬化性樹脂組成物、およびその硬化物
JP2010100802A (ja) * 2008-09-24 2010-05-06 Sekisui Chem Co Ltd エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
CN105713179A (zh) 2009-11-12 2016-06-29 陶氏环球技术有限责任公司 聚噁唑烷酮树脂
JP2011173827A (ja) 2010-02-24 2011-09-08 Mitsubishi Chemicals Corp ビスイミドフェノール誘導体及びその製造方法並びに高分子化合物
CN102206397B (zh) 2010-03-29 2012-11-28 台光电子材料股份有限公司 树脂组合物及包含其的半固化胶片、层合板和电路板
US20130126217A1 (en) 2010-04-23 2013-05-23 Panasonic Corporation Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board
CN101831051B (zh) 2010-05-07 2012-01-04 黄山市善孚化工有限公司 含萘环、双环戊二烯环和酰亚胺结构的耐高温环氧树脂及其制备方法
CN102399415B (zh) 2010-09-14 2014-03-26 联茂电子股份有限公司 预浸体组合物及应用该预浸体组合物所制成的胶片和基板
US8663803B2 (en) 2010-11-29 2014-03-04 Iteq Corporation Varnish composition, and pre-impregnated manufacture thereof
CN102051022A (zh) 2010-12-09 2011-05-11 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与层压板
KR101236642B1 (ko) 2011-01-06 2013-02-22 주식회사 두산 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판
KR101868190B1 (ko) 2011-03-16 2018-06-15 도레이 카부시키가이샤 에폭시 수지 조성물 및 그의 제조 방법 및 그것을 사용한 반도체 장치
JP2013020395A (ja) * 2011-07-11 2013-01-31 Sony Corp 情報処理装置、情報処理方法及びプログラム
CN102977551B (zh) 2011-09-02 2014-12-10 广东生益科技股份有限公司 无卤树脂组合物以及使用其制作覆铜板的方法
WO2013056411A1 (zh) 2011-10-18 2013-04-25 广东生益科技股份有限公司 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
CN102516541B (zh) 2011-11-22 2013-08-07 中国航空工业集团公司北京航空材料研究院 一种含酚羟基的聚酰亚胺
US9005761B2 (en) 2011-12-22 2015-04-14 Elite Material Co., Ltd. Halogen-free resin composition and its application for copper clad laminate and printed circuit board
CN103421273B (zh) 2012-05-22 2016-02-10 中山台光电子材料有限公司 无卤素树脂组成物
WO2014040261A1 (zh) 2012-09-14 2014-03-20 广东生益科技股份有限公司 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
CN102850545A (zh) 2012-10-10 2013-01-02 四川大学 一种高韧性高耐热性聚苯并噁嗪/双马来酰亚胺共混树脂及其制备方法
TWI572665B (zh) 2012-10-17 2017-03-01 Dainippon Ink & Chemicals 活性酯樹脂、環氧樹脂組成物、其硬化物、預浸體、 電路基板以及積層膜
BR112015010973A2 (pt) 2012-11-14 2017-08-29 Bayer Materialscience Ag Método para a produção de compostos de oxazolidinona
JP6314456B2 (ja) 2012-12-06 2018-04-25 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
US20140228483A1 (en) 2013-02-13 2014-08-14 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
CN103382242B (zh) 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
CN103540220A (zh) 2013-09-26 2014-01-29 上海海隆石油化工研究所 一种管道用耐磨型环氧粉末涂料
WO2015179232A1 (en) 2014-05-21 2015-11-26 Icl-Ip America Inc. Halogen-free active ester curing agent compound for epoxy resins, flame retardant composition comprising same, articles made therefrom and method of making said compound
CN103992621B (zh) 2014-06-04 2016-06-01 苏州生益科技有限公司 一种热固性树脂组合物及使用其制作的半固化片和层压板
CN107266639B (zh) 2014-08-15 2019-08-27 江苏雅克科技股份有限公司 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物
CN105778413B (zh) 2014-12-26 2018-11-27 广东生益科技股份有限公司 一种无卤环氧树脂组合物以及使用它的预浸料和层压板
CN105778414B (zh) 2014-12-26 2018-05-29 广东生益科技股份有限公司 一种环氧树脂组合物以及使用它的预浸料和层压板
CN105295041B (zh) 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN105440263A (zh) 2015-12-15 2016-03-30 广东广山新材料有限公司 一种环氧树脂固化剂及其制备方法和用途
CN105482076A (zh) 2015-12-15 2016-04-13 广东广山新材料有限公司 一种异氰酸酯改性环氧树脂及用途
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102134375A (zh) * 2010-12-23 2011-07-27 广东生益科技股份有限公司 无卤高Tg树脂组合物及用其制成的预浸料与层压板
CN102558858A (zh) * 2011-12-22 2012-07-11 云南云天化股份有限公司 覆铜层压板用树脂组合物及半固化片
CN102732029A (zh) * 2012-06-21 2012-10-17 广东生益科技股份有限公司 无卤树脂组合物及粘结片与覆铜箔层压板
CN103265791A (zh) * 2013-05-29 2013-08-28 苏州生益科技有限公司 一种用于集成电路的热固性树脂组合物及使用其制作的半固化片及层压板
CN103834168A (zh) * 2014-02-25 2014-06-04 广东生益科技股份有限公司 一种无卤阻燃型树脂组合物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10696844B2 (en) 2014-02-25 2020-06-30 Shengyi Technology Co., Ltd. Halogen-free flame retardant type resin composition
US9873789B2 (en) 2014-12-26 2018-01-23 Shengyi Technology Co., Ltd. Halogen-free epoxy resin composition, prepreg and laminate using same
US10208156B2 (en) 2014-12-26 2019-02-19 Shengyi Technology Co., Ltd. Epoxy resin composition, prepreg and laminate using same
TWI588204B (zh) * 2015-12-28 2017-06-21 Shengyi Technology Co Ltd An epoxy resin composition and a prepreg and a laminate using the same
US10544255B2 (en) 2015-12-28 2020-01-28 Shengyi Technology Co., Ltd. Epoxy resin composition, prepreg and laminate prepared therefrom
CN117384457A (zh) * 2023-10-16 2024-01-12 江苏耀鸿电子有限公司 一种无卤阻燃碳氢树脂覆铜板及其制备方法
CN117384457B (zh) * 2023-10-16 2024-03-19 江苏耀鸿电子有限公司 一种无卤阻燃碳氢树脂覆铜板及其制备方法

Also Published As

Publication number Publication date
KR101814322B1 (ko) 2018-01-30
US20170009074A1 (en) 2017-01-12
US10696844B2 (en) 2020-06-30
EP3112422B1 (en) 2021-01-20
CN103834168B (zh) 2016-09-07
CN103834168A (zh) 2014-06-04
KR20160126043A (ko) 2016-11-01
EP3112422A1 (en) 2017-01-04
EP3112422A4 (en) 2017-08-16

Similar Documents

Publication Publication Date Title
WO2015127860A1 (zh) 一种无卤阻燃型树脂组合物
EP3053963B1 (en) Halogen-free resin composition and uses thereof
EP2770025B1 (en) Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same
KR100705269B1 (ko) 비할로겐 난연성 에폭시 수지 조성물, 이를 이용한프리프레그 및 동박 적층판
US8581107B2 (en) Halogen-free flame-retardant epoxy resin composition, and prepreg and printed circuit board using the same
WO2012083727A1 (zh) 无卤高tg树脂组合物及用其制成的预浸料与层压板
US20120024580A1 (en) Epoxy resin composition, and prepreg and printed circuit board using the same
KR20130125383A (ko) 비할로겐계 수지 조성물 및 이를 이용한 비할로겐계 구리 피복 라미네이트의 제작방법
WO2016119356A1 (zh) 一种无卤树脂组合物及用其制作的预浸料和层压板
CN103435812B (zh) 一种苯并噁嗪中间体及其制备方法
CN109851997B (zh) 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
KR101681442B1 (ko) 할로겐 비함유 난연성 수지 조성물 및 그 용도
TWI666248B (zh) 馬來醯亞胺樹脂組合物、預浸料、層壓板和印刷電路板
WO2015154314A1 (zh) 一种热固性树脂组合物
EP3412722B1 (en) Halogen-free thermosetting resin composition, prepreg containing same, laminate, and printed circuit board
KR20200060498A (ko) 말레이미드 수지 조성물, 프리프레그, 적층판과 인쇄회로기판
CN109608828B (zh) 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
CN109535628B (zh) 一种阻燃型树脂预聚物及使用其制备的热固性树脂组合物、半固化片和层压板
TW201823359A (zh) 一種無鹵阻燃型樹脂組合物及其製成的預浸料和覆銅箔層壓板
EP3040358B1 (en) Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
EP3156451B1 (en) Halogen-free resin composition, and prepreg and laminated board for printed circuit using same
CN106751821B (zh) 一种无卤阻燃型树脂组合物以及使用它的粘结片及覆铜箔层压板
CN114605779B (zh) 一种热固性树脂组合物及包含其的预浸料、电路基板和印刷电路板
EP3241868A1 (en) Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using same
CN114672167A (zh) 一种无卤阻燃型树脂组合物及其制成的预浸料和印制电路用层压板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15755556

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 15120549

Country of ref document: US

REEP Request for entry into the european phase

Ref document number: 2015755556

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2015755556

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20167026455

Country of ref document: KR

Kind code of ref document: A