WO2004008494A2 - Systeme et procede de commande de servomoteurs dans un environnement de fabrication de semi-conducteurs - Google Patents

Systeme et procede de commande de servomoteurs dans un environnement de fabrication de semi-conducteurs Download PDF

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Publication number
WO2004008494A2
WO2004008494A2 PCT/US2003/021647 US0321647W WO2004008494A2 WO 2004008494 A2 WO2004008494 A2 WO 2004008494A2 US 0321647 W US0321647 W US 0321647W WO 2004008494 A2 WO2004008494 A2 WO 2004008494A2
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Prior art keywords
network
servomotor
controller card
local control
command
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PCT/US2003/021647
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English (en)
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WO2004008494A3 (fr
Inventor
John Ma
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Aviza Technology, Inc.
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Publication date
Application filed by Aviza Technology, Inc. filed Critical Aviza Technology, Inc.
Priority to AU2003249030A priority Critical patent/AU2003249030A1/en
Publication of WO2004008494A2 publication Critical patent/WO2004008494A2/fr
Publication of WO2004008494A3 publication Critical patent/WO2004008494A3/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4409—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber characterised by sealing means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45578—Elongated nozzles, tubes with holes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Definitions

  • This invention relates generally to semiconductor manufacturing equipment, and more specifically to methods and apparatuses for controlling servomotors in semiconductor manufacturing equipment.
  • servomotors In a semiconductor manufacturing environment, multiple processes or mechanisms may be controlled by servomotors. For example, robotic arms, conveyor belts, elevators, and so forth may all be actuated through one or more servomotors. Generally, these servomotors are connected to a central control or operations area that oversees and controls the servomotors' operation.
  • each servomotor is connected to a servocontroller that is located in the central control area in a discrete wiring scheme.
  • Each servomotor represents a single axis of freedom or motion and each servocontroller typically controls multiple servomotors.
  • the discrete wiring scheme for each servomotor, at least twenty-four wires must be run from the motor's location all the way to the central area. In a five- axis (servomotor) subsystem, this would require a minimum of 120 wires reaching from the servomotor controllers to the various servomotors. This requires a massive amount of cabling, and may also require intermediate cable connections or signal boosters to connect truly remote servomotors to the control network as, for example, when several discrete semiconductor manufacturing units are assembled into one commonly controlled machine.
  • the relatively massive amount of cabling required in such a wiring scheme when coupled with the packing of cables into cable runs or other enclosed, unshielded spaces, may degrade signals transmitted across the network.
  • an electrical signal transmitted across one cable may, if the cable or cable run is improperly shielded, cause interference (or "noise") in signal transmitted across an adjacent cable.
  • This noise may render a portion of the signal unintelligible, thus requiring the signal be re-sent.
  • the more signal repetitions required the more likely that noise disrupts or damages other signals.
  • one embodiment of the invention takes the form of a servomotor network having at least one local control node (or servocontroller) remotely located from a central processing area.
  • the local control node actuates one or more servomotors, and is physically placed near the controlled servomotors.
  • Each servomotor manipulates a different servomechanism.
  • Sample servomechanisms controlled or operated by the embodiment include elevators, valves, robotic arms, automated doors, and any other commonly known element in an automated or industrial control setting.
  • One embodiment of the present invention is well suited for controlling various servomechanisms in a semiconductor manufacturing environment.
  • a network connects each local control node to a controller card.
  • the controller card is generally placed in an expansion slot of an appropriately-configured computer, and is responsible for polling, monitoring, and controlling the various local control nodes.
  • the controller card further acts as an interface between a central processing unit (CPU) and the local control nodes.
  • CPU central processing unit
  • the controller card receives instructions from the CPU by way of a local bus, determines the local control node responsible for the servomotor to which the instruction relates, formats the instructions for transmission across the network, and relays the instructions to the node.
  • "Formatting" in this context includes determining a network address for the proper local control node and ensuring the instruction complies with all network and specialized software protocols. Once the servomotor receives the instructions, it carries them out.
  • the modular nature of the embodiment permits simple addition or substitution of local control nodes. Because all addressing and polling is handled by the controller card, rather than permitting servocontroUers to communicate directly with the CPU, the system programming does not need to be constantly updated to provide current network connections to the CPU. Instead, the plug-and-play nature of the controller card permits it to automatically handle additional local control nodes.
  • Fig. 1 displays one embodiment of the present invention.
  • Fig. 2 displays an exemplary operating environment for one embodiment of the present invention.
  • Fig. 3 displays a network card in accordance with one embodiment of the present invention.
  • Fig. 4 displays a flowchart detailing the operation of the embodiment of Fig. 1 in accordance with the present invention.
  • one embodiment 100 takes the form of a servomotor network, as shown in Fig. 1.
  • a servomotor 150 operates a mechanical device in a servomechanism, such as an elevator, valve, gate, piston, and so forth.
  • Each servomotor is connected to a local control node 140, which is in turn connected to a controller card 120.
  • the embodiment 100 may have multiple servomotors 150 connected to a single control node 140, and multiple control nodes connected to a single controller card 120.
  • Each control node 140 comprises a servocontroller, such as a computer card or other hardware element capable of receiving and executing computer-issued instructions across a single wire network 130.
  • the control node 140 carries out commands relayed by the controller card 120, which generally instruct the control node to operate or otherwise manipulate one or more servomotors 150.
  • the controller card 120 typically is placed in an expansion slot of a computer 105, and handles communication between the various control nodes 140 and a central processing unit (CPU) 110, effectively serving as an intermediary between the two.
  • the controller card 120 may communicate with multiple control nodes 140 under an Ethernet protocol by sequentially polling each node.
  • the controller card 120 is a custom-manufactured card in the present embodiment 100, but may be any computer- compatible card capable of interfacing with control nodes 140 and a CPU 110.
  • Alternate embodiments may use multiple controller cards 120 serially chained, networked in parallel, or otherwise connected to one another instead of a single controller card in order to increase the number of control nodes that may be managed by the embodiment.
  • the computer 105 housing the CPU 110 and controller card may be of any type known to those skilled in the art, including minicomputers, microcomputers, personal (desktop) computers, UNIX stations, SUN stations, programmable logic controllers (PLCs), network servers, and so forth.
  • a UNIX-compatible computer 105 is typically used, with the controller card 120 seated in a Versa Module Eurocard (VME) expansion slot.
  • VME Versa Module Eurocard
  • the controller card 120 communicates with the CPU 110 via a VME bus 115.
  • the controller card 120 may be located in a cage or rack located near, but not in, the computer 105 housing the CPU 110. In such an embodiment, a VME bus 115 nonetheless connects the controller card and CPU.
  • control nodes 140 are connected to the controller card 120 via a single wire lOBaseT or other Ethernet connection 130, although alternate local area network (LAN) standards may be employed.
  • the controller card 120 communicates with the CPU via the NME bus 115.
  • the controller card 120 may be seated in a different type of expansion slot, such as peripheral component interconnect (PCI), industry standard architecture (ISA), Video Electronics Standards Association (VESA), or Accelerated Graphics Port (AGP) slot.
  • PCI peripheral component interconnect
  • ISA industry standard architecture
  • VESA Video Electronics Standards Association
  • AGP Accelerated Graphics Port
  • controller card 120 uses a VME bus 115 to interact with the CPU 110, data may be transferred between the two at approximately 40 megabytes per second (MBps), a rate which presumes 32 bits of data are transferred during every bus cycle (i.e., during each read/write operation). Data may be transferred between the card 120 and CPU 110 at 80 MBps if a 64-bit transfer is used, or even as quickly as 320-500 MBps if a VME320-compliant card is seated in a bus employing the 2eSST transfer protocol. By contrast, a lOBaseT Ethernet connection (such as network 130) transfers data at 10 megabits per second (Mbps), or approximately 1.25 MBps.
  • MBps megabytes per second
  • the controller card 120 may communicate with the CPU 110 at speeds many times that reached by communication between the controller card and a single local control node 140.
  • controller card 120 may interface with the CPU 110 at the high speeds achieved by the VME bus 115 and may poll the control nodes 140 at lower network 130 speeds, no CPU processing cycles need be dedicated to controlling communications with individual control nodes. Instead, the controller card 120 handles polling, collates data received from each node 140, and transmits the data to the CPU 110 across the faster internal bus 115. Thus, the CPU is not forced to wait for data from each individual node 140, and does not dedicate unnecessary clock cycles to requesting data. Accordingly, the overall operation of the present embodiment 100 takes place at much faster speeds than that of previous servomotor control systems. Operating commands are issued by the CPU 110 in accordance with software resident on the computer. These commands are transmitted across the VME bus 115 to the controller card 120 in Versa Module Eurocard format.
  • the VME bus 115 format and corresponding specifications are well known to those skilled in the art.
  • the controller card 120 receives the commands, each of which is resident in a memory space corresponding to a specific control node 140, maps the command to the control node's network address, and transmits the command using the carrier sense multiple access/collision detect (CSMA/CD) protocol to the network address.
  • CSMA/CD carrier sense multiple access/collision detect
  • the local control node 140 then receives the command and executes it as necessary, generally resulting in some motion or action by the servomotor 150 or other attached servomechanism.
  • Fig. 2 displays an exemplary operating environment for the embodiment shown in Fig. 1, namely a small batch vertical furnace system.
  • the furnace 210 includes a process chamber 211, in which various thermal processes are carried out.
  • An elevator 212 is used to move a carrier 213 containing a plurality of semiconductor wafers into and out of the process chamber 211.
  • the term wafer is used broadly herein to indicate any substrate containing a plurality of integrated circuits, one or more vapor-deposited layers, and the like.
  • Wafers are transported between the carrier 213 and a front opening unified pod ("FOUP") 218 with a wafer transfer unit 214.
  • FOUP front opening unified pod
  • the FOUP 218 is placed into position on a shelf 219 and mated to a load port 216.
  • the elevator 212 is lowered so that the carrier 213 is generally opposite the FOUP 218 when mated to the loadport 216.
  • the motion of the elevator 212 is controlled by a servomotor 150 (not shown).
  • the servomotor 150 typically raises and lowers the elevator 212, thus pushing the carrier 213 into the process chamber 211.
  • the servomotor 150 may also place the elevator 212 in at least two loading positions in order to transfer one or more semiconductor wafers onto the carrier 213.
  • Other servomotors are used in the wafer transfer unit 214, for example.
  • the elevator servomotor 150 may be controlled by the present embodiment 100.
  • a front opening unified pod (FOUP) buffering module (not shown) permits a user to queue multiple FOUPs in the present embodiment 100. Each FOUP is processed in turn, typically in batches of four.
  • the present operating environment permits sixteen total FOUPs to be queued for insertion into the furnace, although alternative environments may group FOUPs differently and/or have greater or lesser queues.
  • the FOUP buffering module transfers these groups of FOUPs (or individual
  • FOUPs from a holding or storage area to the load port 216.
  • the FOUPs are taken from the load port 216 to a wafer carrier by the wafer transfer unit 214. Accordingly, multiple FOUPs may be raised into the semiconductor furnace for processing simultaneously.
  • An exemplary FOUP buffering module may have five axes of freedom. Such a FOUP buffering module may also be controlled by the present embodiment 100.
  • the above is simply a single operating environment suitable for the present embodiment. More generally, the embodiment may be employed in any area or process having multiple remotely-located servomotors.
  • the controller card 120 is a custom-manufactured computer card serving as an interface between a CPU 110 and local area network 130 (LAN).
  • LAN local area network 130
  • Fig. 3 depicts a block diagram of one embodiment of a controller card 120 suitable for use with the present embodiment 100 (as shown, for example, in Fig. 1).
  • the controller card 120 includes at least a processor 300, a memory 310, a bus interface 320, and a network interface 330.
  • the controller card 120 serves as the interface between the network 130 (and associated local control nodes 140) and local bus 115 (and associated CPU 110 or other control element).
  • the processor 300 controls the various local control nodes 140, and is operative to issue commands to the node.
  • the processor (or an associated memory, such as memory 310) may also locally store the status of one or more control nodes, along with the last command issued to each node.
  • the processor may take the form of a digital signal processor (DSP) chip or integrated circuit. Alternative embodiments may use different processors.
  • DSP digital signal processor
  • the processor 300 also controls traffic on, routing of, and signals propagated through the network 130.
  • Such network and servomotor control functions are implemented through local, card-level programming.
  • programming relating to the physical location of local control nodes 140 within an operating environment, as well as sequences of operations for each local control node or associated servomotor 150 necessary to achieve a particular result is typically stored at or implemented in the CPU 110.
  • the processor 300 programming is typically stored in (and may be updated on) a flash memory, such as an erasable programmable read-only memory (EPROM). It should be noted that this EPROM is different from the memory 310 shown in Fig. 3.
  • the EPROM is a dedicated memory, generally accessible only by the processor 300 during operation of the card 120, containing programmable instructions executable by the processor. By contrast, the memory effectively functions as a buffer between the processor 300 and CPU 110, as discussed in more detail below.
  • the processor programming may be updated via an RS-232 port (not shown) or other interface connecting an external programming or update source to the EPROM.
  • the network interface 330 transmits commands issued by the processor 300 across the network 130 to the appropriate local control node 140.
  • the network interface 330 is responsible for properly addressing the command in accordance with network protocols, formatting the command, and (if necessary) multiplexing the command with other network traffic. Additionally, the network interface 330 generally accepts incoming data from the network 130, such as status reports and/or feedback from a local control node 140. When such data is received, the network interface may demultiplex or otherwise reconstruct the data (presuming the data was segmented for network transmission) and pass it to the processor 300. In some embodiments, the network interface 330 may transmit data to the memory 310 rather than directly to the processor 300, and similarly may accept commands read out from memory instead of the processor. This transmission path is generally indicated by a dashed line in Fig. 3. Typically, the controller card 120 also includes a memory 310.
  • the memory 310 may be read from and written to by either the CPU 110 (through the local bus interface 320, described below) or the processor 300. Accordingly, the memory 310 typically is a dual-ported memory, which allows simultaneous access by both the CPU and processor.
  • the CPU may transmit a command to the controller card 120, which is generally stored in the memory 310 for access and execution by the processor 300.
  • the processor 300 may write the present status of various local control nodes 140 to the memory 300, which in turn may be accessed by the CPU 110 for later analysis.
  • the local bus interface 320 generally facilitates communication and data transmission between the controller card 120 and the local bus 115 of Fig. 1.
  • the local bus interface may format data for transmission across the local bus 115, and/or format incoming data from the local bus 115 for receipt and processing by the controller card 120.
  • the local bus interface 320 may include multiplexing and traffic control functionality similar to that described with above respect to the network interface 330.
  • the present embodiment 100 employs a VME bus, and thus the local bus interface is optimized therefor, alternative embodiment may employ different types of buses and correspondingly different local bus interfaces 330.
  • the processor 300 generally implements commands initiated by the CPU 110.
  • the CPU 110 transmits a command across the local bus 115.
  • the command is received by the card via the local bus interface 320.
  • the local bus interface passes the command to the memory 310, where the command is stored.
  • the command remains stored in memory until expressly overwritten by a later command from the CPU 110, or (more likely) retrieved by the processor 300.
  • the processor 300 implements the command as one more instructions to one or more local control nodes 140.
  • This implementation typically requires drawing on the software and/or programming commands stored in the processor 300 itself or EPROM.
  • the command language employed by the CPU 110 is generally not the same as that recognized by the local control nodes 140.
  • the "converted" command is passed from the processor 300, through the network interface 330, and across the network 130 to the proper nodes.
  • controller card 120 has been described with reference to specific elements thereof, it should be noted that alternative embodiments of the controller card may omit some of these elements, or may add additional elements, without departing from the spirit and scope of the invention. Further, alternative embodiments of the controller card 120 may include additional functionality not discussed herein, or various card elements may have differing functionality. For example, in alternative embodiments, dual processors may be employed, one to handle network-side transmissions and one to handle local bus-side transmissions, or one to handle incoming data and one outgoing data, and so forth.
  • the controller card 120 may interact with up to four local control nodes 140, each of which is typically a single digital input/output servocontroller card typically placed locally near the servomotors 150 operated by the control node.
  • the controller card 120 is connected to all of the local control nodes 140, generally via a single network control wire.
  • Each control node 140 may typically accept up to thirty-two distinct inputs and outputs, or may instead supervise sixty-four inputs (with no outputs) where only a monitoring function is desired.
  • each local control node 140 has both monitoring and reporting capabilities. That is, the local control node may monitor the servomotor 150 status and actively report the same to the controller card 120.
  • each local control node 140 may instead passively wait for a status poll initiated across the network 130 by the controller card 120, instead of actively transmitting data.
  • the granularity of such monitoring and status transmissions may be configured by a user of the present invention through the CPU 110, by jumpering or otherwise updating programming on the controller card 120, or by locally setting each local control node 140.
  • each local control node 140 monitors and transmits servomotor 150 status every twenty milliseconds.
  • each node 140 may monitor up to two distinct axes of motion.
  • each servomotor 150 operates along a single axis of motion.
  • an elevator control motor operates only along a vertical axis- up and down.
  • each control node 140 may monitor and control two types of servomotors, each operating in two unique axes of freedom, or one type of servomotor operating in two axes of freedom.
  • a local control node 140 may monitor and control one type of servomotor 150, each operating in two axes.
  • Each axis of motion monitored or controlled by a local control node 140 requires twenty- four control cables running from the servomotor 150 to the local control node.
  • Alternative embodiments may employ servomotors 150 of local control nodes 140 requiring less cabling or having a different number of inputs. However, because the local control node 140 is located at or near the servomotor 150, these cables are only run a relatively short distance. As previously mentioned, only a single control wire is run from the node 140 to the controller card 120.
  • the controller card 120 accepts software commands from the CPU 110, and relays these instructions to the various local control nodes 140. Commands are relayed from the CPU 110 to the controller card 120 in VME format. Generally, each control node 140 is mapped to a specific VME memory space. When the CPU 110 transmits an instruction intended for a specific control node 140, the instruction is inserted into the memory space corresponding to the control node 140. The controller card 120 receives the command in the designated memory space, remaps the command to a network address, and transmits the command across the network 130 to the proper node. The node 140, in turn, executes the command. Thus, the controller card 120 deals with all network addressing, protocols employed by the servocontroller software, and so forth.
  • the present embodiment permits up to 100% of existing command software in many operating environments to be used with any number of local control nodes or servomotors, without requiring rewriting of the software for operation in an Ethernet or other local network.
  • the controller card 120 may be installed in a computer 105 and used without reconfiguring the operating system or other software resident on the computer, a feature commonly referred to as "plug and play.” Thus, the card may immediately perform its functions without requiring any user intervention.
  • the general structure of the controller card 120 is provided above.
  • Various embodiments of the controller card 120 may be configured for different computer systems and/or different operating systems resident on a computer. It should be understood that the particular computer and or operating system type is generally transparent to the function of a properly configured controller card 120.
  • the controller card 120 runs computer software that may monitor the status of all existing network 130 connections between the controller card and the various control nodes 140. If a network connection is severed or otherwise interrupted, the software immediately detects the interruption and alert an operator, monitor, or other user. Similarly, the software may detect servomotor 150 or local control node 140 failures and alert a user. Generally speaking, the software employed by the current embodiment performs the same functions as the prior art, but may be custom-scripted to add additional functionality. For example, various alarm methods may be employed, such as audio or visual cues, or electronic messages and/or may be sent to a designated recipient indicating function loss. Similarly, the software may be provided with diagnostic capabilities, permitting it to determine probable causes for network 130 interruptions.
  • the software may be custom programmed to notify a user when function is restored, or to automatically resume operation when an interruption is cleared.
  • software suitable for use with the present embodiment 100 is programmed in C language.
  • the software may permit the CPU 110 to monitor lost network connections or servomotor 150 failures (or other statuses).
  • network 130 information is received by the controller card 120 and converted to a form compatible with the CPU 110 and resident software.
  • Fig. 4 shows a flowchart detailing the logical operation of the embodiment shown in Fig. 1, including the controller card 120 of Fig. 3.
  • the process begins at start step 400.
  • step 405 the controller card 120 checks to determine whether the central processing unit has issued a command to a local control node 140. If no command has been issued, step 410 is executed.
  • step 410 the controller card 120 polls the various local control nodes 140 via the network 130 connections to determine whether any connections have been interrupted or control nodes 140 have temporarily ceased functioning. Essentially, the controller card 120 checks the status of each node 140 to ensure the node is accessible, active, and able to communicate with the card. When no service interruptions are detected by the controller card 120, the embodiment returns to start step 400.
  • the embodiment alerts a user, monitor, or designee in step 415 that a network outage or node 140 failure has occurred.
  • the alert may take any form known to those skilled in the art, including any variety of electronic messaging to any type of device equipped to receive such a message.
  • the embodiment After executing step 415, the embodiment returns to start step 400.
  • step 420 is accessed.
  • the embodiment checks to see whether the controller card 120 may communicate across the network 130 with the local control node 140 for which the CPU 110 command is intended. If no such network connection may be accessed, step 415 is carried out, as detailed above.
  • steps 410-420 may be carried out by independent monitoring software, rather than by the embodiment itself.
  • the CPU command issued in step 405 is directly mapped to bus memory in step 425, as described below, and steps 410-420 are not executed. Presuming a network connection exists between the controller card 120 and the local control node 140, step 425 is next.
  • the CPU 110 command is mapped to the memory space on the VME bus 115 corresponding to the local control node 140 ultimately receiving the instruction.
  • step 430 the controller card 120 receives the command transmitted across the VME bus 115 from the CPU 110.
  • step 435 the controller card 120 determines the network address of the local control node 140 for which the command is intended.
  • step 440 the controller card 120 formats the command for execution by the software and/or hardware comprising the local control node 140, and also in accordance with any network 130 protocols. Following formatting, the command is transmitted across the network 130 in step 445.
  • the local control node 140 receives the command in step 450, and executes the command in step 455. Typically, this results in activating one or more servomotors 150, thus moving the attached servomechanism.
  • a typical command might instruct the local control node 140 to raise the elevator into the process chamber, or place the carrier in position for wafer loading.
  • step 460 is accessed.
  • feedback may be sent from the local control node 140 to the controller card 120. Examples of feedback include indicating whether the command was or was not performed successfully. Another feedback example includes logging a reason for not executing the command, such as a faulty servomotor 150, manual override, unfulfilled prerequisite condition, and so forth.
  • step 465 the feedback is received by the controller card 120 and mapped to VME memory for transmission to the CPU 110 in step 470.
  • step 475 the feedback is processed by the CPU 110, any necessary actions are taken (for example, alerting an operator of a failed command, updating a database to show a properly executed instruction, or activating a status indicator to display the changed position of a servomechanism).
  • start step 400 is once more accessed and the process begins anew.
  • an embodiment may provide additional functionality to the controller card 120 or local control nodes, may vary the number of control nodes supported by a single controller card, may permit a local control node to operate a different number of servomotors 150, or may use different buses, such as the PCI bus.
  • the present invention has been described in the context of specific embodiments and processes, such descriptions are by way of example and not limitation. Accordingly, the proper scope of the present invention is specified by the following claims and not by the preceding examples.

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Abstract

L'invention concerne un système et un procédé permettant de commander un réseau de servomoteurs. Le système comprend au moins un noeud local de commande situé à distance d'une zone centrale de traitement. Le noeud local de commande actionne un ou plusieurs servomoteur(s) et est physiquement placé à proximité des servomoteurs commandés. Un réseau connecte chaque noeud local de commande à une carte de contrôleur. Ladite carte de contrôleur est généralement placée dans l'emplacement de carte d'un ordinateur configuré de manière appropriée, et est responsable des interrogations, de la surveillance et des commandes de différents noeuds locaux de commande ainsi que de l'établissement d'une interface avec une unité centrale de traitement (UC) et les noeuds. La carte de contrôleur reçoit des instructions de l'UC via un bus local, détermine le noeud local de commande responsable du servomoteur auquel l'instruction est associé, formate les instructions pour les transmettre sur le réseau et relaie les instructions vers le noeud. De ce fait, la commande de servomoteur est centralisée.
PCT/US2003/021647 2002-07-15 2003-07-10 Systeme et procede de commande de servomoteurs dans un environnement de fabrication de semi-conducteurs WO2004008494A2 (fr)

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US39653602P 2002-07-15 2002-07-15
US60/396,536 2002-07-15
US42852602P 2002-11-22 2002-11-22
US60/428,526 2002-11-22

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PCT/US2003/021644 WO2004007800A1 (fr) 2002-07-15 2003-07-10 Appareil de traitement thermique et procede d'evacuation d'une chambre de traitement
PCT/US2003/021645 WO2004008052A2 (fr) 2002-07-15 2003-07-10 Systeme et procede de refroidissement d'un appareil de traitement thermique
PCT/US2003/021642 WO2004008493A2 (fr) 2002-07-15 2003-07-10 Procede et appareil destines a supporter des plaquettes a semiconducteur
PCT/US2003/021575 WO2004008491A2 (fr) 2002-07-15 2003-07-10 Systeme de traitement thermique et chambre verticale configurable
PCT/US2003/021647 WO2004008494A2 (fr) 2002-07-15 2003-07-10 Systeme et procede de commande de servomoteurs dans un environnement de fabrication de semi-conducteurs
PCT/US2003/021646 WO2004008008A2 (fr) 2002-07-15 2003-07-10 Commande d'un environnement gazeux dans une chambre de chargement de tranches
PCT/US2003/021648 WO2004008054A1 (fr) 2002-07-15 2003-07-10 Element chauffant variable destine a des gammes de temperatures basses a elevees
PCT/US2003/021641 WO2004007105A1 (fr) 2002-07-15 2003-07-10 Appareil et procede de remplissage d'une chambre de traitement de plaquette a semiconducteur
PCT/US2003/021973 WO2004007318A2 (fr) 2002-07-15 2003-07-15 Appareil de port de chargement et son procede d'utilisation

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PCT/US2003/021645 WO2004008052A2 (fr) 2002-07-15 2003-07-10 Systeme et procede de refroidissement d'un appareil de traitement thermique
PCT/US2003/021642 WO2004008493A2 (fr) 2002-07-15 2003-07-10 Procede et appareil destines a supporter des plaquettes a semiconducteur
PCT/US2003/021575 WO2004008491A2 (fr) 2002-07-15 2003-07-10 Systeme de traitement thermique et chambre verticale configurable

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PCT/US2003/021648 WO2004008054A1 (fr) 2002-07-15 2003-07-10 Element chauffant variable destine a des gammes de temperatures basses a elevees
PCT/US2003/021641 WO2004007105A1 (fr) 2002-07-15 2003-07-10 Appareil et procede de remplissage d'une chambre de traitement de plaquette a semiconducteur
PCT/US2003/021973 WO2004007318A2 (fr) 2002-07-15 2003-07-15 Appareil de port de chargement et son procede d'utilisation

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JP (2) JP2005533378A (fr)
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AU2003253874A8 (en) 2004-02-02
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AU2003256486A1 (en) 2004-02-02
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JP2005533232A (ja) 2005-11-04
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