TW200416775A - Loadport apparatus and method for use thereof - Google Patents

Abstract

A loadport apparatus for conditioning the interior of a FOUP having a FOUP door. The apparatus includes platform, a housing, an loadport door, a loadport door seal and a conditioning system. The FOUP platform receives the FOUP. The housing includes an opening to a second chamber. The housing is configured for sealably engaging the FOUP. The loadport door includes a FOUP door access mechanism for opening the FOUP. The loadport door is movable between an open position and a closed position. The loadport door seal selectively seals the opening from the second chamber when the loadport door is in the closed position. The conditioning system communications with the opening for conditioning a mini-environment chamber defined by the loadport door, the seal, the opening, and an interior of the FOUP when the loadport door is in the closed position, the loadport door seal is sealed, and the FOUP door is open. A method is also disclosed.

Description

200416775 Π) ii. References to invention-related applications This application states the rights and priority of the following temporary applications: US Provisional Patent Application No. 6 0/3 9 6, 5 3 6, titled "Thermal Processing System" "Application date July 15, 2002 and US provisional patent application serial number 6 0/4 2 8, 5 2 6, heading" T herma 1 P r cessation System and Method for Using the Same'1 Application date November 22, 2002 . Both are combined by their references here. [Technical Field to which the Invention belongs] The present invention relates to general semiconductor processing equipment. In particular, the present invention relates to a load cell and a method of using the same. [Previous Technology] Various processing equipment and devices are widely used in integrated circuit and semiconductor wafer manufacturing. Such equipment is typically located in a semiconductor manufacturing facility and semiconductor wafers are transported through the manufacturing facility to the appropriate equipment for processing. With the development of industry, integrated circuits and semiconductor devices have become more complex and often include complex and elaborate devices and interconnected multilayer manufacturing. The size of the device has been greatly reduced, thus significantly increasing the number of devices made on a single half-conductor wafer. As a result, when a wafer is developed through the processing equipment in a manufacturing facility, the price of a semiconductor wafer is greatly increased. When moving a semiconductor wafer through the process device and when transferring the wafer -4-(2) (2) 200416775 into and out of the processing device, considerable protection must be implemented to reduce the risk of damage and / or contamination of the wafer. Further, the wafer must be kept in a clean environment and handled in a controlled atmosphere. A batch of wafers is usually transported through the process device, and enters and exits the processing device through a closed front open integrated vertical slot (front open integrated vertical slot), which is well known And is highly standardized by the industry. The batch of wafers is stored inside the closed front open integrated vertical groove, which was previously maintained in a highly clean state. When considerable protection must be implemented for wafer transport, speed and throughput are paramount. As a result, the semiconductor industry has invested significant efforts in wafer transport design and system development. For a specific application, X wafers are processed in batches. For example, large vertical ovens are often used for wafer thermal processing to complete thermal processing, such as annealing, diffusion, or dopant implantation. US patent symbol. An example of a large vertical oven with a wafer transfer machine and a boat-shaped container exchange unit is disclosed in 4.7.70; 5.90. A cassette support system 27 has a number of cassette support racks 61 on a vertical rod 63, whose vertical rods 63 are sequentially operated by individual drive mechanisms 65 to help the cassette loading and unloading. Cassette rack system 27. A wafer transfer module 29 operates to complete the transfer of wafers from the ship container 39 to the empty cassette after processing, and the transfer of unfinished wafers from the cassette to the ship container 39 to process. In such a large oven, each processing cycle usually requires a lot of time, so that when a wafer is transferred between other boat containers 39 and cassettes 37, the boat container exchange unit 25 makes a boat shape -5- (3) 200416775 Device 3! If the serial number please pfci Three main A delta 円 2002 wafer transport; the environment provides improved open system, open at a distance and fixed at the end (see the extraction and placement ) Within the processing chamber. Recently, semiconductor processing equipment has been designed to process small batches of wafers. A "mini-batch" type system is described in detail in the PCT patent application (Attorney Docket no. FP 7 1 7 4 8 / MSS / WEN), which simultaneously claims and claims the rights and interests of the US provisional patent application serial number 6 0 / 3 9 6,5 3 9 was filed on July 22, 2003 and 60 / 428,526 on November 22, and both are embodied by reference here. A small number allows faster transfer between the front open integrated vertical slot and the processing equipment. However, the environment in which the wafer is open in the front integrated vertical slot and the processing equipment environment is usually different, and The transfer of wafers in this case requires complexity and time. Some advances in transmission design have reached the highest level today. An example of a system is U.S. Patent No. 6 5 4 2 8, 2 6 2 which is guided to an ion implantation system in which the transmission design has a load fixing device with a vacuum robot zone 3 2 in an attempt to reduce the volume and most effectively The operation of moving through the front open integrated vertical groove and the ion implantation chamber 14 is performed. When a group of wafers is moved from the front integrated longitudinal slot by a first end effector, and when a group of wafers is lifted by the first end effector and lowers a first load device in a first air open position When the door is loaded into the load fixing device, the yield improvement is desired 1) The first load fixing device is then closed to its closed position by lifting the first load device. This load fixture is then raised; then a second load fixture door is raised to a vacuum opening. Finally, a 3-axis robot moves from the load fixture -6- (4) (4) 200416775 one of the wafers to the ion processing chamber load fixture. Unfortunately, the potential semiconductor speed is limited by the number of times each wafer is moved between the front open integrated longitudinal groove 12 and the ion processing chamber 14. Each action adds extra time and increases the complexity of the semiconductor processing system. A load port device, especially for batch processing and a method of using the device, is necessary for the facility to improve wafer transfer speeds and overcome the shortcomings of the above and other known load ports, and to use the device. SUMMARY OF THE INVENTION In one aspect t, the present invention advantageously provides a desired throughput of a semiconductor processing equipment, such as a small batch vertical oven system, without using a multiple load fixture system of the prior art. The present invention provides wafer transfer from a front open integrated vertical slot directly to a wafer carrier connected to a processing device. An isolated load fixture allows isolated sealing and cleaning, and can be combined with a standard load port. This combination can reduce the complexity and footprint of the system. The typical second-order load fixture can be incorporated into a general load port. The typical first-order load fixing device of the present invention "Load Bi" isolates two separate environments and is equipped to match the first and second environments, such as the environment in the front open integrated vertical tank and the environment in the oven. Another aspect of the invention is that pneumatic and / or electrical control of the load port is provided, which maintains a closed environment by means of a front open integrated longitudinal groove, regardless of whether the load port is in an open or closed position. 0neExample of the An embodiment of the present invention is directed to a -7- (5) (5) 200416775 load port device that facilitates wafer transfer from a front open integrated vertical slot to the processing equipment. Generally speaking, the load port The device includes a platform, a cover, a load port door, a load card door gasket, and an adaptation system. The platform is configured to safely receive the front open integrated longitudinal slot. The cover includes a second bore opening. When the front open integrated longitudinal groove is docked to the platform, the cover is fitted to seal the front open integrated longitudinal groove. The load port door includes a mechanical device entrance for opening The front open one-piece longitudinal slot door. The load port door is movable between an open position and a closed position, wherein the so-called opening is directly connected with the second chamber. When the load port door is in When in the closed position, the load port door gasket selectively maintains a closed second bore opening. An adaptation system is provided and communicates with the load port device. More specifically, the adaptation system is prepared to accommodate microenvironmental bores, the so-called microenvironment When the load port door is in the closed position, the load port door seal is back sealed, and when the front open integrated longitudinal groove door is opened, by the load port, the seal, the opening, and the front open integrated type The interior of the vertical slot is defined. A wafer transfer method from the previously open integrated vertical slot to the processing equipment is also disclosed. This load and its use have other features and advantages, which will change from the drawings. Obviously and provided in more detail in the accompanying drawings, which is included in a part of this design specification and detailed description of the present invention, and is used together to explain the principles of the present invention. The present invention is described in detail in the winter (6) (6) 200416775. A semiconductor processing equipment 100 shown in the figure, in this example, the only small batch of vertical oven system 'which has the load port device of the present invention is shown in Figure 1 Perspective view, side plan view of Fig. 2 and top view of Fig. 3. When the oven system 100 is displayed together with four units 1 1 0 '1 2 0, 1 3 0 and 1 4 0, The system can have one or any number of units as desired. The unit can be any form of processing unit and can be the same as other units, different from other units, or a combination of the two. In the diagram In this embodiment, all units 110, 12 0 '13 0 and 14 0 are included in the vertical batch oven system. The processing equipment described here is a small batch vertical oven unit, the invention is not limited to this and can be used For any form of semiconductor processing equipment. In this example, each unit includes 15 processing chambers, of which different thermal processes are performed here. Referring to unit 1 10, an elevator 1 1 2 is used to move a wafer carrier 1 1 3 carrying a plurality of semiconductor wafers into and out of the processing chamber 111. As shown in FIG. 1, each of the other units 120, 130, and 140 also includes a combined lift (only 142 cannot be removed) and a wafer destroyer 123 '13 3, 1 43, which are used to transport wafers in and out respectively. Processing chamber 1 2],] 3 1,] 4 1. For simplicity, one unit will be detailed, and it is understandable that such descriptions can be used in other units. The project wafer is widely used here to represent any item that contains a large number of integrated circuits, single or multiple flat objects, and so on. The wafer is transferred between the front open integrated vertical slot and the unit. As shown in Figure 1, two front open integrated longitudinal grooves are integrated into each unit. The front open one-piece vertical slot 1 1 6 and Π 8 are combined with the unit 110, and the front open one-piece vertical slot 126, 28 is tied to the unit 120 (7) (7) 200416775. The opening is one-piece vertical slot 丨 3 6, 1 3 8 is combined with unit 130, and the front open-body longitudinal grooves 146, 148 are combined with unit 140. Other configurations and the number of front open integrated longitudinal grooves can be utilized. Front open integrated longitudinal grooves are very common and are highly standardized in industry. The front open integrated 纮: The slot-through hanger is a vertical slot-shaped sealed container that stores many wafers inside the front open integrated vertical slot. The front open one-piece vertical slot has a front open one-piece vertical slot door to allow the wafer to enter at noon. Just as the former open integrated longitudinal groove is very common, we will not go into further details here. Referring to FIG. 2, a wafer is transferred between a front open integrated vertical groove 1 1 8 and the wafer carrier 1 1 3 via a wafer transfer unit i 4. The interior of the front open integrated vertical slot represents a first environment, and the general inteho of the and the general interior of the processing equipment (eg, the wafer carrier 1 1 3) represents a second environment. In order to facilitate wafer transport, the front open one-piece vertical slot 1 18 is supported on a platform 1 19 coupled to the load port 2000. The load port 200 (Figure 2) is assembled to ensure that the integrated vertical slot is opened before receiving the load port 200. When the load port 2 00 is visible in the side view, it can be understood that each bore; 1 丨; [,] 2],] 3 1,] 4 1 has a combined load port. An automatic and / or manual process can be used to couple the front open one-piece vertical slot n 8 through the load port 200. When wafers are being transported, the lift 1 12 is lowered, so the carrier 1 13 is usually placed opposite the front open integrated longitudinal slot 1 18 when the load port 200 is engaged. According to one embodiment, the first environment (the interior of the front open integrated longitudinal tank) typically contains an oxygen concentration with a volume of approximately 21 PPm, and the second environment (the interior of the processing equipment) typically contains an oxygen with a volume of approximately 5 ppm (8) (8) 200416775 gas concentration. Therefore, the environment in the front open integrated vertical groove is usually different from the environment in which the wafer is exposed to the processing equipment. A significant advantage is that the present invention prepares wafers for adaptation, or allows the wafers to be exposed from one environment to another, as needed in the processing room. Referring to a front plan view of FIG. 4 and a cross-sectional view of FIG. 5, the load port 200 is described in more detail. In Figures 4 and 5, the different sensors and control keys for the load j: Fu 2 00 are omitted to keep them clear, but are shown in Figure 6 to Figure 12 to illustrate. The load 璋 2 0 0 generally includes an outer cover 2 4 0, a load bank 250, a load port seal 260, and an adaptation system 2 70. When the load port door 2 50 is in the closed position 2 5 3, the load port door gasket 2 6 0 is closed 5 and the front open integrated longitudinal slot door 2 1 1 is opened, a miniature environmental chamber 2 7 1 It is defined as load field door 2 50, load port door gasket 2 60, a front open integrated longitudinal groove seal 2 4 6 and an opening 2 4], and the front open integral longitudinal groove 2 1 0 Inside 2 1 3. The adaptive system 2 7 0 includes an inlet port 2 7 3 and an exhaust port 2 7 4, and is connected to the miniature environmental bore 2 7 1 in order to adapt to the miniature environmental bore 2 7 1. In the described embodiment, the adaptation system 270 includes an intake port 273 and an exhaust port 274, which are provided within the housing 240. However, it should be understood that the number of gas inlet ports and the number of exhaust ports can be assembled and utilized as required. Further, the gas inlet port and the exhaust port may be combined with the movable load port door 250, the recess 24, and / or the front open integrated longitudinal groove 2 10 as required. As shown in FIG. 4 and FIG. 5, the load port door gasket 2 6 0 is preferably a (9) (9) 200416775 shrink-sealing pad, and the seal engages the load port door 2 5 0 and the cover 2 4 0 To selectively close the opening 2 4 1 from the bore 2 2 0. As shown in FIG. 5, the loadhead door gasket 2 60 closes the opening 241 from the bore 220. As shown in Fig. 9, the load j: Fumen gasket 2 60 is evacuated and moved to open with the load Fumen 150 (Fig. 12). It can be appreciated that any number of configurations can be used to make gaskets, including air-removable gaskets. As shown in FIG. 6, the front open integrated vertical slot platform 2 30 is assembled to receive and secure the front open integrated vertical slot 2 1 0. The front open integrated vertical slot platform 2 3 0 includes a pair of dynamic probes 231-1 and 231-2, and a pair of position sensors 2 located adjacent to the dynamic probes 2 3 1-1 and 2 3 1-2 3 2-1 and 2 3 2-2 and a front open one-piece longitudinal groove fixing mechanical structure 2 3 3. One or more dynamic probes may be used for the front open integrated longitudinal groove 2 1 0. One or more position sensors may be placed close to one or more dynamic probes, the purpose of which is to detect the position of the front open integrated vertical slot 2 10. In the described embodiment, three dynamic probes (only probes 2 3 1-1 and 2) corresponding to three dynamic probe sensors (only sensors 231-1 and 23b 2 are shown) 3 1-2 is shown) is included in the platform 2 3 0. Even better, each dynamic probe sensor is placed adjacent to the corresponding dynamic probe to determine whether a front open integrated vertical slot 2 10 is received. It will be appreciated that any number of configurations of dynamic probes and / or dynamic probe sensors may be used with the teachings of the present invention. As shown in FIG. 6, the fixed mechanical structure 2 3 3 is a pointed bolt that is received by the front open integrated longitudinal groove 2 1 0, so that the rotation of the pointed bolt closes the front open integrated longitudinal groove 2 1 0 to Platform 2 3 0. It can be appreciated that any number of -12- (10) 200416775 fixed mechanical structure configurations can be used on demand, and fixed mechanical structures are usually defined by an existing load port corresponding to the design specifications.

As shown in FIG. 6, a mobile container base system 2 3 9 can be defined to include the platform 2 3 0, a platform base 2 3 4 and a docking action mechanical structure 2 3 7. When the fixed mechanical structure 2 4 2 (such as the open integrated vertical slot clamp 2 4 2-2 and 2 4 2-2 described in FIG. 4) is connected with the corresponding probe (not shown), the movement Type container base system 2 3 9 Close the front open integrated longitudinal groove 2 1 0 to the platform 2 3 0. The probe extends from the front open integrated longitudinal groove 21 0 to close the front open integrated longitudinal groove 21 0 to the cover. 24 0. 54 Pinman 230 is fixed to the platform base 234 to support the front open integrated longitudinal slot platform 230 between two or more docking positions. A type of docking action mechanism that opens in front of a one-piece longitudinal slot platform. 2 3 0 and the platform base 2 3 4 supports the action of the platform 2 3 0. The described docking positions include a docking position 2 3 5 (Figure 6) and a docking position 2 3 6 (Figure 7). A docking sensor 2 3 8 can be used to detect the position of the front open integrated longitudinal slot platform 2 3 0. It can be appreciated that any forward and backward movement of the integrated vertical slotted platform 2 3 0 between the docking position 2 35 and the docking position 2 3 6 can be used in accordance with the teachings of the present invention. According to a described embodiment 'the docking action mechanical structure 2 3 7 comprises a gas bottle for initiating an action between the docking positions 2 3 5 and 2 3 6. As shown in FIG. 7, the outer cover 2 4 0 includes an opening 24 to a second bore 2 2 0 °. The second wax 2 2 0 is generally defined herein as a processing execution place, such as a wrong furnace environment; however, the The second bore need not be a processing bore, but can be any other bore used in the system. As shown in Figures 6 and 7, -13- (11) 200416775 The front open integrated vertical slot 2 1 0 is transported from the docking position 2 3 5 to the docking position 2 3 6. One or more fixed mechanical knots such as clamps 242-1 and 242-2 (Fig. 4) are connected to the front opening 2] 0 to ensure that the one-piece longitudinal groove 2 is opened front and the cover is airtight. According to a described embodiment, the fixed mechanical structure engages a clamp of a probe, the probe protrudes approximately from the front open one-piece longitudinal surface to the front open one-piece longitudinal slot 2 1 0 above the mechanical structure 2 4 2 The front open one-piece longitudinal cover 240 is engaged and offset. It will be appreciated that other fixed mechanical structures and configurations may be utilized by the teachings of the present invention. As shown in the front, the integrated vertical slot 2 1 0 is closed tightly to the platform 2 3 2 4 0 to seal. According to the embodiment shown in FIG. 7, a front-opening gasket 246 is placed adjacent to the opening 241, and the front-opening integrated vertical groove 2 10 is in the docking position 2 36. Fixed 2 4 2 engages and offsets the front open one-piece vertical slot 2] 0 face opening 2 4 1 so that the front open one-piece vertical slot closed pad 2 4 6 covers 2 4 0 related to the front open one-piece vertical slot The outer cover of 2 1 0 is any configuration that can be used to engage the front longitudinal groove 2 1 0 to the outer cover 2 4 in the case of airtight air. In the root embodiment, the front open integrated longitudinal groove gasket is a 5 240 o-ring gasket. Referring again to FIG. 7, a container engagement sensor 243 is covered 2 4 0 and is used to determine the front open integrated longitudinal groove 2 1 to approach the outer cover structure 242, such as 2 4 2 between the integrated longitudinal groove 2 4 0. It is the opposite side of a pair of grooves 2 1 0. The fixed groove 2 10 faces the number 2 2 2 as shown in the figure 7. The reconciliation is closely related to the cover body longitudinal groove. The purpose is to seal the mechanical structure and to seal the cover to the outside. Can understand the open one-piece type According to a picture, the dust is fixed on the cover and whether it is engaged with the -14- (12) 200416775 cover 24o. It can be appreciated that any configuration and number of container connections can be utilized upon request. As shown in FIG. 8, the load port door 250 can be moved in any direction between the required position (Fig. 12) and the closed position 2 53. When the door 250 is in the open position, the opening 241 is related to the second f. The load port door 2 5 0 includes a recess 2 5 4, the structure of the front open integrated vertical slot door 2 5 5, and sufficient space to store the front open integrated vertical slot door 2 1 The load load 240 of 240 is in the closed position to seal the second chamber 220 from the external environment. Moving to the closed position 2 5 3 must activate the load port door seal P 2 4 1 〇 Referring to FIG. 8 again, when the load port door 2 5 0 is closing the recess 2 5 of the load port door 2 5 0 4 and the opening 2 4 1 When the integrated vertical groove 2 1 0 is adjacent to the cover, the front opening 2 1 1 can be accessed through the opening 24 1. Entering the mechanical structure The vertical slot door 2 5 5 is unfolded from the recess 2 5 4 and is engaged with the vertical slot door 2] 1 to open and / or close the front opening 2 11. According to an illustrated embodiment, the access mechanism is placed; the integrated vertical slot door 2 5 5 is fixed by the recess 2 54, and the port door 250 is moved between the open position 2 5 2 (FIG. 12) and the closed position. One of today's general technologies will be to appreciate that the open integrated longitudinal slot can be used to engage the front open integrated longitudinal slot door 2 1 1 sensor 244 in the open position before other mechanical structures can be entered. When the load port is directly connected to 22 0, it contains 1 into the mechanical recess 254. As shown in Figure 7, position 2 5 3, so load port door 2 5 0 pad 2 6 0 is near from this open position 2 5 3. When the front-opening one-piece vertical slot door is front-opened and the front-opening one-piece one-piece vertical slot-door structure is the front-opening and the load range 2 5 3 (FIG. 11) of the invention's range door 2 5 5 is configured, for example A front-opening integrated longitudinal slot door that enters -15- (13) (13) 200416775 into the mechanical structure 2 5 5 causes the front-opening integral longitudinal slot door to retract into the front-opening integral longitudinal slot. As shown in FIG. 8, the open one-piece longitudinal slot door 2 5 5 includes a illustrated bolt assembly 2 5 6 before entering the mechanical structure, which has one or more rotary keys, such as rotary keys 2 5 7, a calibration probe. 2 5 8, a sensor 2 5 9. The bolt assembly 2 5 6 engages the front open integrated longitudinal slot door 21 1 through the opening 241. One or more rotary keys 2 5 7 are used to close the front one-piece longitudinal slot door 2 1 1 and open the one-piece longitudinal slot door 2 5 5 before entering the mechanical structure. One or more calibration probes 2 5 8 are used to calibrate the mobile front open integrated longitudinal groove door 2 1 1 in relation to the bolt assembly 2 5 6. One or more sensors 2 59 can be used to confirm the position of the mobile door associated with the bolt assembly 2 5 6. According to an illustrated embodiment, a double rotary key 2 5 7 is used to engage the front open one-piece longitudinal slot door 2 1 1 by using a single-action device between the engaged position and the released position Rotate the double spin key simultaneously. As shown in FIG. 9, before entering the mechanical structure, the integrated longitudinal slot door 2 5 5 is retractably extended from the recess 2 5 4 to connect and open the integral longitudinal slot door 2] 1. When the open integrated longitudinal groove door 2 5 5 is extended before entering the mechanical structure, the right probe 2 5 8 corrects the front open integral longitudinal groove door 2 1 1 and the bolt assembly 2 5 6. The sensor 2 5 9 shows the proximity between the mobile door and the bolt assembly 2 5 6. One or more rotary keys 2 5 7 are activated to engage the front-opening one-piece longitudinal slot door 2 1 1. As shown in Figs. 10 and 11, before opening the mechanical structure, the integrated vertical slot door 2 5 5 is retracted to the recess 2 5 4 and the front open integrated vertical slot door 2 1 1. Open the front open integrated vertical slot door -16- (14) (14) 200416775-1 1 Allow δ to enter the interior 2 1 3 of the front open integrated vertical slot 2 1 0. In order to adapt to the wafer, or move the wafer from the first environment to the second environment, the interior 2 1 3 of the front open integrated longitudinal groove 2 1 0 is cleaned, and the hanging is at the load port door 2 5 0. In the closed position 2 5 3, the load port door gasket 2 60 is dug closed and the front open integrated longitudinal groove seal 2 6 4 is executed when it is closed (as shown in FIG. 11). According to an illustrated embodiment, the front open integrated vertical slot 2 10 (for example, the front open integrated vertical slot η 8) is fixed on the cover 2 40 of a wafer processing apparatus, and the processing apparatus generally includes A second bore 220. The front open integrated vertical groove 2 is fixed to the cover 240 near the opening 24 by using, for example, the front open integrated vertical groove seal 264. The front open integrated vertical groove 210 is opened after the front open integrated vertical groove i! 8 is tightly engaged with the cover 240 near the opening 241. The action of opening the front open integrated vertical slot door 2 1 1 is performed by extending the front open integrated vertical slot door 2 5 5 through the opening 24 1 to engage and open the front open integrated vertical slot door 2 1 1. The action of opening the front open one-piece vertical slot door 2 1 1 includes connecting the open one-piece vertical slot door 2 5 5 and the mobile front open one-piece slot door 2 1 before entering the mechanical structure, and retracting the Before entering the mechanical structure, open the groove between the integrated vertical slot door 2 5 5 and the mobile front open integrated vertical slot door 2 1 1 to the load port door 250. According to an illustrated embodiment, after the front open integrated longitudinal slot door is opened, the microenvironment chamber is cleaned by injecting a first gas into the microenvironment through an air inlet, and exhausted through an exhaust The mouth releases a first gas from the microenvironment. According to an illustrated embodiment, the micro-environmental chamber is defined as passing through one or more air inlets 2 7 3 and via the front opening-17- (15) 200416775. One integrated longitudinal or multiple exhausts can be substituted for one inlet Port quality, such as the measuring chamber of oxygen cleaning gas 2 7 1 provides less sanitation. According to a load port door and the load port door 2 4 1 to maintain the movement within 2 2 between 0 2 0. The first kind of former opening is within. According to the front opening, the load 1 2) is moved to the gasket to the second door 2 1 1 and the front opening is integrated 2 1 1 to the front slot 2 1 0 part of the air flow inside the 2 1 3 and through a port 2 7 4 air flow. It is said that the micro-environment chamber 2 7 1 is adapted by 2 7 3 through a clean air. The cleaning gas passes through any exhaust port 274 with any unwanted gas, moisture, and particulate matter.淸 is determined by the size of the bore. Advantageously, the microenvironment has a smaller vent which typically consumes gas during a cleansing process. The illustrated embodiment 'the load port door 2 50 is opened by opening the gasket 2 60 and then moved from the closed position 25 3 to the open position 2 5 2 (Figure 1 2)' The interior 2 1 3 of the integrated longitudinal groove 2 1 0 is connected to the second bore through the front opening. Thus, a wafer 2 1 2 mounted on the front-opening integrated vertical slot 2 can be erected 220 from the front-opening integrated vertical slot 2 1 0. After processing, the wafer is moved into an integrated vertical slot or another front open integrated vertical slot. One illustrated embodiment, the wafer is then placed in another vertical slot such as a front open Integral vertical slot 1 1 6. The closing action of the port door 2 5 0 is from the open position 2 5 3 (Figure iJ closed position 2 5 2 (Figure 1 1)) and the opening 24 1 closing the load port door chamber 2 20. Close the front open integrated The vertical slot is to return the front open integrated vertical slot door by opening the vertical slot door 2 1 5 by extending the inlet vertical slot door 2 5 5 through the opening 24 1. According to the implementation of a diagram- 18- (16) (16) 200416775 For example, the action of closing the front open one-piece longitudinal slot door 2 1 1 involves extending the entry mechanical structure from the recess 25 4 defined within the range of the load card 2 5 0 The front open integrated vertical slot door 2 5 5 and the front open integrated vertical slot door 2 11 are closed, and the front open integrated vertical slot door 2 1 1 is closed to the front open integrated vertical slot 210, before entering the mechanical structure. Open the integrated vertical slot door 255 to release the front open integrated vertical slot door 2 1 1 and retract the integrated vertical slot door 2 5 5 to the recess 2 5 4 before entering the mechanical structure. The front open integrated The longitudinal slot 2 1 0 is then released from the housing 240 and the front open integrated longitudinal slot platform 2 3 4. For illustration and description For the purposes mentioned above, the above descriptions of specific embodiments of the present invention have been proposed. They do not mean that the present invention is all or limit this invention within the strict scope of the disclosure, and obviously, many amendments and changes are in accordance with the above The teaching is feasible. This embodiment was chosen and described in order to most effectively explain the principles and practical application of the invention, thereby making the most effective use of other present technology to the invention with different modifications to meet the particular use contemplated. And different embodiments. What is desired is that the point of view of the present invention is defined by the scope and equivalents of the attached patent. [Brief Description of the Drawings] Figure 1 is a general description of a small batch vertical oven system. Perspective illustration, which has four units according to an illustrated embodiment. Fig. 2 illustrates a side plan view according to Fig. 1 of a unit. Fig. 3 illustrates a view according to Fig. 1 of a unit. A top view. -19- (17) (17) 200416775 Figure 4 illustrates the front plan view of the load port according to Figure 2. Figure 5 illustrates the cross section of the load port according to Figure 2. Figure 6. Figure 6 is a schematic view of a load port device according to the illustrated embodiment of the present invention, which includes a front open-body vertical slot coupled with a removable container base. Figure 7 is a schematic view according to Figure 6 As shown, the load port device described therein includes a front open integrated longitudinal groove that is in close contact with the cover. Figure 8 is a schematic illustration according to Figure 6, which depicts the entrance of the mechanical device in the extended position. Φ Figure 9 Fig. 6 is a schematic diagram illustrating the extension of the mechanical device entrance and engaging a front open integrated longitudinal slot door. Fig. 10 is a schematic diagram according to Fig. 6 illustrating the extension of the front open integral longitudinal slot. The entrance of the mechanical device is coupled with the movable door of the front open integrated longitudinal groove. FIG. 11 is a schematic diagram according to FIG. 6, which illustrates a miniature environmental bore according to an embodiment of the present invention. FIG. 12 is a schematic diagram according to FIG. 6, which describes a load bar door @ ♦ open position. Comparison table of main components 110 OC3-Early stage 111 Processing chamber 112 Elevator 113 Wafer carrier -20- (18) 200416775] 1 6, 118 Front open integrated vertical groove 119 Platform 1 20 σ port early element 1 2 1 Processing Chamber 123 Wafer carrier 126, 128 Front open integrated vertical groove 13 0 Unit 13 1 Processing chamber 133 Wafer carrier 13 6 Front open integrated vertical groove 140 Unit 14 1 Processing chamber 1 42 Elevator 143 Wafer carrier 146, 148 Front open one-piece vertical slot 200 Load i Fu 2 10 纵 Open one-piece vertical slot 2 11 .. W .. 一体 Open one-piece vertical slot door 2 12 Wafer 2 13 Internal 220 bore 23 0 Platform 23 1- -1, 23 1- —2 Dynamic Probe 2 3 2--1, 2 3 2--2 Position Sensor

-21-(19) 200416775 233 solid 234 flat 23 5 out 23 6 into 237 stop 23 8 stop 23 9 shift 240 outside 24 1 open 242 solid 242 — 1, 242 -2 246/1 刖 250 negative 252 open 253 close 254 Concave 255 into 256 bolts 257 rotation 25 8 calibration 259 sense 260 negative 27 0 suitable 27 1 micro-determined mechanical structure platform base dock position dock position by action mechanical structure by sensor movable container base system cover □ fixed mechanical structure clamp open Integral longitudinal groove gasket carrying the door open position and closed position 'into the mechanical structure of the front open integral longitudinal groove door assembly turn key positive probe detector port door gasket should be a system-type environmental chamber-22- 200416775 ( 20) 273 Inlet 274 Exhaust

Claims (1)

200416775 范围 Patent application scope i A load port device whose purpose is to transfer a semiconductor wafer from a front-open integrated vertical slot with a front-open integrated vertical slot door to a semiconductor processing device, including: a A platform assembled to securely receive the front open integrated longitudinal slot; a cover including a second bore opening, the cover is assembled to hermetically engage the front when the front open integrated longitudinal slot is fastened to the platform An open one-piece vertical slot; a load port door includes an open one-piece vertical slot door before entering a mechanical structure, the purpose of which is to open the front open one-piece vertical slot door, the load port door, which can be closed in an open position Between positions' and wherein the opening is in direct contact with the second bore; a load port door gasket whose purpose is to selectively close the opening of the second bore when the load port door is in the closed position; and The adaptation system associated with the opening is designed to adapt to a miniature environmental bore when the load port door is in the closed position When the load port door gasket is sealed and the front open integrated longitudinal slot door is opened, the micro-environment is limited to the load port door, the opening, and the inside of the front open integrated longitudinal slot. 2 · As for the device of the scope of patent application, the load port door closer includes a recess of the load port door, and the miniature environment chamber is closer to -24-(2) (2) 200416775 step is limited For the load port door recess. 3. The device according to item 2 of the scope of the patent application, before the mechanical structure is opened, the one-piece longitudinal groove door is retractably extended from the recess of the load card. 4. The device according to item 3 of the patent application scope, the open one-piece longitudinal slot door before entering the mechanical structure includes a door bolt that can be extended to the front open one-piece longitudinal slot door having a movable door to engage the The movable door is retracted to the recess of the load port door by the movable door. 5. The device according to item 4 of the patent application, which further opens the integrated longitudinal slot door before entering the mechanical structure, and includes a bolt assembly for releasably engaging the movable door. 6. The device of the patent application scope item 1, the load port door gasket is coupled with the load port door. 7. As in the device of the scope of patent application item 6, the load port door gasket is an expansion seal coupled with the load port door, and its purpose is to tightly engage the cover when the load port door is in the closed position. 8. The device according to item 1 of the scope of patent application, the adaptation system includes: An air inlet for providing a first gas to the microenvironmental bore and an air outlet for releasing the gas from the microenvironmental bore are provided. 9. A method for adapting an interior of an integrated longitudinal groove with a front opening integral longitudinal groove door, the method comprising: extending through the joint opening a type of opening the integral longitudinal groove door before entering the mechanical structure and opening the Front open one-piece longitudinal slot door; Adapt to a miniature environmental chamber, when the front open one-piece longitudinal slot door of the front open one-piece longitudinal slot is opened, the micro-environment chamber is limited to that place-25-(3) 200416775 A load port door of the management device is in the closed position, the opening, and the interior of the 'integrated longitudinal slot; and Opening and moving the load port door to the door from the closed position thereby connecting the interior and a second chamber via the opening. 10. The method according to item 9 of the scope of patent application, closer to 歩% Moving and closing the load port door from the open position to the closed position engaged with the outer door. 11. The method according to item 9 of the scope of patent application, which is closer to ^^ through the cover before extending into the mechanical structure and open _1 ^; Door to close the front open one-piece vertical slot door; and release the front open one-piece vertical slot platform from the front open one-piece vertical slot platform. : &Amp; Matching a first gas to the micro__ via an air inlet; and 4 releasing the first gas_ from the microenvironment via an exhaust, the microenvironmental bore is defined as an air inlet and ~ _ Between the exhaust ports Kan. 13. The method according to item 9 of the scope of patent application, the further improvement of cleanliness includes: supplying a first gas to the micro-environment via an air inlet on the housing; and exhausting through a housing The port releases the first gas from the micro-environment, wherein the micro-environmental bore is defined as a -26- (4) (4) 200416775 gas flow between the intake and exhaust ports. 14. The method according to item 9 of the scope of patent application, further comprising: entering the front-opening integrated longitudinal groove through the opening. -27-