JP3286240B2 - Load lock apparatus and method for semiconductor processing - Google Patents

Load lock apparatus and method for semiconductor processing

Info

Publication number
JP3286240B2
JP3286240B2 JP4101198A JP4101198A JP3286240B2 JP 3286240 B2 JP3286240 B2 JP 3286240B2 JP 4101198 A JP4101198 A JP 4101198A JP 4101198 A JP4101198 A JP 4101198A JP 3286240 B2 JP3286240 B2 JP 3286240B2
Authority
JP
Grant status
Grant
Patent type
Prior art keywords
holding means
chamber
means
portion
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4101198A
Other languages
Japanese (ja)
Other versions
JPH11233583A (en )
Inventor
光祐 京極
Original Assignee
日本エー・エス・エム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date
Family has litigation

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/139Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/141Associated with semiconductor wafer handling includes means for gripping wafer

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は処理室へ半導体ウエハを順次搬送する搬送装置と協働するべく複数の半導体ウエハを積載して待機するロードロック装置に関し,特に効率よく半導体ウエハを処理室に搬送するための構造を有するロードロック装置に関する。 It relates loadlock present invention to wait by stacking a plurality of semiconductor wafers in order to cooperate with a transfer device for sequentially transferring the semiconductor wafer into the processing chamber BACKGROUND OF THE INVENTION, especially efficiently semiconductor wafer into the processing chamber about load lock device having a structure for transporting.

【0002】 [0002]

【従来の技術】従来,半導体製造装置において半導体ウエハなどの被処理体を順次反応室に搬送して処理するために,複数の半導体ウエハを積載して待機するロードロック装置が使用されてきた。 Conventionally, in order to process and transport the sequential reaction chamber workpiece such as a semiconductor wafer in a semiconductor manufacturing device, a load lock device to wait by stacking a plurality of semiconductor wafers have been used. 図1(A)は従来の単一チャンバ型のロードロック装置を示したものである。 1 (A) is shows a conventional single-chamber load lock device. ロードロック装置は内部を真空排気されるチャンバ1と,複数の半導体ウエハ4を積載するためのウエハ保持手段6と, The load lock device with the chamber 1 is evacuated inside, the wafer holding means 6 for stacking a plurality of semiconductor wafers 4,
該ウエハ保持手段6から順次半導体ウエハ4を処理室2に搬送するための搬送機構7とから成る。 Consisting conveying mechanism 7 for for transporting sequentially the semiconductor wafer 4 into the processing chamber 2 from the wafer holding means 6. 該チャンバ1は, The chamber 1,
処理室2と当該チャンバ1とを連通するゲートバルブ3及び外部から半導体ウエハ4の装填されたウエハ保持手段6 Wafer holding means 6 loaded gate valve 3 and the semiconductor wafer 4 from the outside to communicate the processing chamber 2 and the chamber 1
を搬入及び搬出するためのフロントドア5を有する。 With a front door 5 for loading and unloading a.

【0003】フロントドア5が開放されて半導体ウエハ4 [0003] The front door 5 is opened by semiconductor wafer 4
が装填されたウエハ保持手段6がチャンバ1内に搬入された後,フロントドア5が閉じられてチャンバ1内部が真空排気される。 There wafer holding means 6 that is loaded is then carried into the chamber 1, the front door 5 is closed the chamber 1 inside is evacuated. その後ゲートバルブ3が開けられ搬送機構7 Then the gate valve 3 is opened transport mechanism 7
によって半導体ウエハ4が一枚だけ処理室2内に搬送される。 Semiconductor wafer 4 is conveyed only one processing chamber 2 by. 処理室2内での処理終了後に,当該半導体ウエハ4はウエハ保持手段6の元の場所に戻され,次の半導体ウエハ4が処理室2へ搬送される。 After completion of processing in the processing chamber 2, the semiconductor wafer 4 is returned to its original location in the wafer holding means 6, the next semiconductor wafer 4 is conveyed to the processing chamber 2. こうしてウエハ保持手段6 Thus, the wafer holding means 6
内のすべての半導体ウエハ4の処理が終了した後,ゲートバルブ3が閉じられフロントドア5が開かれて,チャンバ1内部からウエハ保持手段6が取り出される。 After the processing of all of the semiconductor wafer 4 of the is completed, it is opened the front door 5 is a gate valve 3 is closed, the wafer holding means 6 is taken out from the interior chamber 1. その後再び別のウエハ保持手段6がフロントドア5からチャンバ1 Then the chamber 1 again another wafer holding means 6 from the front door 5
内へ搬入される。 It is carried to the inner.

【0004】しかし,このような従来の単一チャンバ型のロードロック装置では,ウエハ保持手段の交換に要する時間の間処理装置を停止させなければならないため, However, since such a conventional single-chamber load lock device, it must be stopped during processing apparatus time required for replacement of the wafer holding means,
生産性が低いという欠点があった。 Productivity there has been a drawback that low.

【0005】そこで,生産性の向上を目的として,複数チャンバ型のロードロック装置が開発された。 [0005] Therefore, in order to improve the productivity, plural-chamber load lock system has been developed. 図1(B) Figure 1 (B)
は従来の複数チャンバ型のロードロック装置を略示したものである。 It shows a conventional multiple-chamber load lock system substantially. この装置は,一つの搬送機構10と,該搬送機構10に対してゲートバルブ12を介して接続された2つのロードロックチャンバ8,9と,該搬送機構10に対してゲートバルブ12を介して接続された2つの処理室13,14 This device includes one transport mechanism 10, and two load lock chambers 8, 9 which is connected via a gate valve 12 with respect to the conveying mechanism 10 through a gate valve 12 with respect to the conveying mechanism 10 two connected process chambers 13 and 14
とから成る。 Consisting of. 各チャンバ8,9は,所定の数の半導体ウエハを積載待機するウエハ保持手段16,17及び処理済みの半導体ウエハをチャンバ外部へ順次搬出するためのドアバルブ11A,11Bをそれぞれ有する。 Each chamber 8,9 has door valve 11A for sequentially unloading the wafer holding means 16, 17 and processed semiconductor wafers stacked waiting a predetermined number of semiconductor wafers into the chamber outside, 11B, respectively.

【0006】各ロードロックチャンバ8,9のドアバルブ [0006] The door valve of each of the load lock chamber 8, 9
11A,11Bが開かれてウエハ保持手段16,17内に所定の数の半導体ウエハ18が装填された後,各チャンバ8,9内部は真空排気される。 11A, after the 11B is a predetermined number of semiconductor wafers 18 in the wafer holding means 16 and 17 is opened is loaded, within each chamber 8,9 is evacuated. その後第1のゲートバルブ12Aが開放され,第1のロードロックチャンバ8から各処理室13, Then first opened gate valve 12A is, the first load lock chamber 8 from each treatment chamber 13,
14に順次半導体ウエハ18が搬送される。 14 sequentially semiconductor wafer 18 is transported to. 処理が終了すると,各処理室13,14内の半導体ウエハ18が第1のロードロックチャンバ8に戻され,第1のゲートバルブ12Aが閉じられる。 When the process is finished, the semiconductor wafer 18 in the processing chamber 13, 14 is returned to the first load lock chamber 8, the first gate valve 12A is closed. その後第2のゲートバルブ12Bが開放されて第2のロードロックチャンバ9から各処理室13,14へ順次半導体ウエハ18が搬送される。 Then the second gate valve 12B is opened and the second load lock sequential semiconductor wafer 18 from the chamber 9 to the respective processing chambers 13, 14 is conveyed. その間に第1のロードロックチャンバ8のドアバルブ11Aが開放されて,処理済みの半導体ウエハが順次取り出され,次の半導体ウエハがウエハ保持手段16に装填される。 Is between the door valve 11A is opened in the first load lock chamber 8, the processed semiconductor wafers are sequentially taken out, the next semiconductor wafer is loaded into the wafer holding means 16.

【0007】この従来の複数チャンバ型ロードロック装置によって,処理室のいわゆる空き状態の時間は減少し,生産性も向上した。 [0007] With this conventional multiple-chamber load lock system, the time of so-called idle state of the processing chamber is reduced, and improved productivity.

【0008】 [0008]

【発明が解決しようとする課題】しかし,この従来の複数チャンバ型ロードロック装置は以下のような欠点を有する。 [SUMMARY OF THE INVENTION] However, the conventional multiple-chamber load lock system has the following disadvantages.

【0009】従来の複数チャンバ型ロードロック装置では,処理室の稼働率を上げるために,第1のロードロック装置内の半導体ウエハを処理している時間中に,第2 [0009] In conventional multiple-chamber load lock device, in order to increase the operation rate of the processing chamber during processing the semiconductor wafer within the first loadlock time, the second
のロードロック装置は,ロードロックチャンバ内のウエハ保持手段から処理済みの半導体ウエハを搬出し,新しい半導体ウエハを装填し,ドアバルブを閉じて,チャンバ内部を真空排気して待機していなければならない。 Load lock device, unloads the processed semiconductor wafer from the wafer holding means in the load lock chamber, loaded with a new semiconductor wafer to close the door valve, it must be waiting to evacuate the interior chamber. この作業を半導体ウエハの処理時間中に実行できないと, Failure to perform this task during the processing time of the semiconductor wafer,
処理が終了しているにも関わらず,新しい半導体ウエハを処理室に搬送することができなくなり,処理室は空き状態となってしまう。 Process despite the end, will not be able to transport a new semiconductor wafer to the processing chamber, the processing chamber becomes a free state. 特に,薄膜処理のような処理時間の短いプロセスの場合には,この危険性が大きい。 Particularly, in the case of short process processing time, such as a thin film process, a large this risk. また処理室の数が多い場合にも同様の状況に陥りやすい。 Also prone to similar situation when the number of the processing chamber is large.

【0010】これを回避するために,ロードロックチャンバの数を増やす方法があるが,ロードロックチャンバを水平に複数配設する従来の構造では,装置全体が大型化してしまい,装置スペース削減の市場ニーズに反することになる。 In order to avoid this, there is a method to increase the number of load lock chambers, in the conventional structure for arranging a plurality of load lock chamber horizontally, the entire apparatus is increased in size, device space savings market It would be contrary to the needs.

【0011】したがって,本発明の目的は,装置スペースが削減でき,生産性を向上させるロードロック装置及び方法を与えることである。 Accordingly, an object of the present invention is to provide reduces device space, a load lock device and method to improve the productivity.

【0012】また,本発明の他の目的は,処理室が多い場合や,処理時間の短いプロセスに対しても高い生産性を保証するロードロック装置及び方法を与えることである。 [0012] Another object of the present invention, and when the processing chamber is large, is to provide a load lock apparatus and method ensures high productivity even for short process processing time.

【0013】 [0013]

【課題を解決するための手段】上記目的を達成するために,本発明に係るロードロック装置は以下の手段から成る。 To achieve the above object, according to the Invention The load lock device according to the present invention comprises the following means.

【0014】処理室へ被処理体を順次搬送する搬送機構と協働するべく該被処理体を積載して待機するロードロック装置は,チャンバ手段と,複数の前記被処理体を装填するためのウエハ保持手段であって,前記チャンバ内を上下に移動可能なウエハ保持手段と,前記ウエハ保持手段の側面に設けられたフランジ手段であって,前記チャンバの内壁の一部と係合することで,前記チャンバの内部空間を隔絶された2つの部屋に分離するところのフランジ手段と,から成る。 [0014] into the processing chamber load lock system to wait by stacking the 該被 being processed to cooperate with transport mechanism for successively conveying the object to be processed comprises a chamber means, for loading a plurality of said workpiece a wafer holding means, and the wafer holding means movable within the chamber vertically, a flange means provided on a side surface of said wafer holding means, that engage a portion of the inner wall of the chamber a flange means at which separation into two rooms that are isolating the inner space of the chamber, made of.

【0015】ここで,好適には前記搬送機構は前記チャンバ手段の側面の略中央部に接続されている。 [0015] Here, the transport mechanism preferably is coupled to the substantially central portion of the side surface of the chamber means.

【0016】また,好適には前記フランジ手段は前記ウエハ保持手段の側面の実質的に中央に結合されており, [0016] Preferably the said flange means being coupled to substantially the central side of the wafer holding means,
それが前記チャンバの前記内壁の一部と係合したとき前記ウエハ保持手段の一部が前記搬送機構から完全に離隔され,前記ウエハ保持手段の残りの部分が前記搬送機構にさらされる。 It part of the wafer holding means when engaged with a portion of the inner wall of the chamber is completely separated from the transport mechanism, the remaining portion of the wafer holding means is exposed to the transport mechanism.

【0017】さらに,好適には前記チャンバは,前記被処理体を前記ウエハ保持手段へ搬入及び搬出するための少なくとも一つのドアバルブを有する。 Furthermore, preferably the chamber has at least one door valve for loading and unloading the object to be processed to said wafer holding means.

【0018】さらに,前記ウエハ保持手段は具体的には昇降手段によって支持されている。 Furthermore, the wafer holding means is specifically supported by the lifting means.

【0019】さらにまた,好適には前記フランジ手段はシール手段を有する。 [0019] Furthermore, preferably the flange means comprises a sealing means.

【0020】一方本発明に係る,ロードロック装置の内部に積載待機された被処理体を順次所定の処理室へ搬入及び搬出する方法は,当該ロードロック装置が,チャンバ手段と,複数の前記被処理体を装填するためのウエハ保持手段であって,前記チャンバ内を上下に移動可能なウエハ保持手段と,前記ウエハ保持手段の側面に設けられたフランジ手段であって,前記チャンバの内壁の一部と係合することで,前記チャンバ内部空間を隔絶された2つの部屋に分離するところのフランジ手段と,から成るところの方法であって,前記フランジ手段を第1の位置で係合当接させた状態で,前記ウエハ保持手段の第1 Meanwhile according to the present invention, a method of loading and unloading to the object to be processed sequentially predetermined processing chambers stacked waiting inside of the load lock device, the load lock device, a chamber unit, a plurality of the object a wafer holding means for loading the processed, a wafer holding means movable within the chamber vertically, a flange means provided on a side surface of said wafer holding means, one interior wall of said chamber by engaging with part, wherein a flange means and a method where consisting of at separating the two rooms that are isolating the chamber interior space, engaging abutment with the flange means at a first position in a state of being, first the wafer holding means
部分へ前記被処理体を装填し,その間に処理済みの被処理体を前記処理室から搬出し前記ウエハ保持手段の第2 Part fart the object to be processed body Wo loaded, while two-processed field to be processed body wo the processing chamber scolded out to the wafer holding means mounting the second
部分へ戻す工程と,前記ウエハ保持手段を移動させ,前記フランジ手段を第2の位置で係合当接させた状態で, A step of returning to the part, moving the wafer holding means, said flange means in a state of being engaged abutment at a second location,
前記ウエハ保持手段の第1部分から前記被処理体を取り出して前記処理室へ搬送し,その間に前記ウエハ保持手段の第2部分から前記処理済みの被処理体をチャンバ外部へ搬出する工程と,前記フランジ手段を第2の位置で係合当接させた状態で,前記ウエハ保持手段の第2部分へ前記被処理体を装填し,その間に処理済みの被処理体を他の処理室から搬出し前記ウエハ保持手段の第1部分へ戻す工程と,前記ウエハ保持手段を移動させ,再び前記フランジ手段を第1の位置で係合当接させた状態で, A step from said first portion is conveyed into the processing chamber is taken out workpiece is unloaded from the second portion of the wafer holding means during the processed of the workpiece to the chamber outside of the wafer holding means, said flange means in a state of being engaged abutment at a second position, wherein the second portion of the wafer holding means loading the workpiece carry-out the processed workpiece during the other processing chamber in above the step of returning to the first portion of the wafer holding means, moving the wafer holding means, a state of being engaged again contacts the flange means at a first location,
前記ウエハ保持手段の第2部分から前記被処理体を取り出して前記他の処理室へ搬送し,その間に前記ウエハ保持手段の第1部分から前記処理済みの被処理体をチャンバ外部へ搬出する工程と,上記工程を繰り返す工程と, Step wherein the second portion of the wafer holding means is taken out the workpiece transported to the other process chamber, unloaded from the first portion of the wafer holding means during the processed of the workpiece to the chamber outside When a step of repeating the above steps,
から成る。 Consisting of.

【0021】ここで当該方法は,さらに,前記ウエハ保持手段への被処理体の装填またはチャンバ外部への搬出中において,搬送機構から隔絶された方の部屋を大気圧に戻す工程と,前記ウエハ保持手段への被処理体の装填または搬出が終了した後,搬送機構から隔絶された方の部屋を真空排気する工程と,を含むことができる。 [0021] Here, the method includes the steps further back during unloading into the loading or chamber outside of the object to be processed to the wafer holding means, the room of the person who has been isolated from the conveying mechanism to the atmospheric pressure, the wafer after loading or unloading of the object to the holding means is completed, it may include the steps of evacuating the room who is isolated from the conveying mechanism.

【0022】また,好適には搬送機構から隔絶された方の部屋を大気圧に戻す工程において,前記フランジ手段と前記チャンバ内壁の一部との係合が保持される。 Further, preferably in the step of returning the room who is isolated from the conveying mechanism to the atmospheric pressure, the engagement between the portion of said flange means and the inner wall of the chamber is maintained.

【0023】 [0023]

【発明の実施の形態】以下,図面を交えながら本発明を詳述する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention is described in detail along with some drawings.

【0024】図2は,本発明に係るロードロック装置を含む半導体製造装置の平面略示図である。 [0024] Figure 2 is a flat, substantially 示図 of a semiconductor manufacturing apparatus comprising a load lock device according to the present invention. 装置は,中央の搬送機構24と,該搬送機構24に接続された本発明に係るロードロック装置20と,該搬送機構24の周囲にゲートバルブ23を介して接続された4つの処理室22とから成る。 Apparatus includes a central transfer mechanism 24, a load lock device 20 according to the present invention connected to a conveying mechanism 24, and four processing chambers 22 connected via a gate valve 23 on the periphery of the conveying mechanisms 24 consisting of. ここで注意すべきは,後に詳しく説明するようにロードロックチャンバ25と搬送機構24の間にゲートバルブが存在しない点である。 Here noted is that there is no gate valves between the load lock chamber 25 and the transport mechanism 24 as will be described later in detail. これが本発明の最大の特徴である。 This is the greatest feature of the present invention. 搬送機構24は通常のアーム機構タイプのものである。 Transport mechanism 24 is of conventional arm mechanism type. また,処理室22は,例えば,熱CVD装置またはエッチング装置などである。 Further, the processing chamber 22, for example, a thermal CVD apparatus or an etching apparatus, and the like. 本発明に係るロードロック装置 Load-lock device according to the present invention
20は,好適実施例において一つのロードロックチャンバ 20, one of the load lock chamber in the preferred embodiment
25から成るが,図5に示すように2つのロードロックチャンバを水平方向に隣接配置して使用することも可能である。 Consists 25, it is also possible to use adjacent horizontally disposed two load lock chambers, as shown in FIG. また,同様に2つ以上のロードロックチャンバを使用することも可能である。 It is also possible to similarly use two or more load lock chambers.

【0025】図3は,図2の装置の断面図を示したものである。 [0025] Figure 3 shows a cross-sectional view of the apparatus of FIG. 図3(A)は線AA断面図を,図3(B)は線BB断面図をそれぞれ表す。 FIG. 3 (A) line AA sectional view, FIG. 3 (B) represents a line BB sectional view, respectively.

【0026】本発明に係る,処理室へ半導体ウエハを順次搬送する搬送機構と協働するべく該半導体ウエハを積載して待機するロードロック装置20は,チャンバ25と, [0026] According to the present invention, the load lock device 20 to wait by stacking the semiconductor wafer to successively cooperate with transport mechanism for transporting the semiconductor wafer into the processing chamber includes a chamber 25,
複数の半導体ウエハ38を装填するためのウエハ保持手段 Wafer holding means for loading a plurality of semiconductor wafers 38
31であって,チャンバ25内を上下に移動可能なウエハ保持手段31と,該ウエハ保持手段31の側面に設けられたフランジ手段30であって,チャンバの内壁の当接部36と係合することで,前記チャンバ25の内部空間を隔絶された2つの部屋X及びYに分離するところのフランジ手段30 A 31, the wafer holding means 31 movable in the chamber 25 up and down, a flange section 30 provided on the side surface of said wafer holding means 31, engages the abutment 36 of the inner wall of the chamber it is, flange means 30 where the separation into two chambers X and Y, which are isolating the inner space of the chamber 25
と,から成る。 If, consisting of.

【0027】チャンバ25の側面の略中央部には搬送機構 The transport mechanism is a substantially central portion of the side surface of the chamber 25
24が接続され,アーム機構35によって,ウエハ保持手段 24 is connected, by the arm mechanism 35, the wafer holding means
31に載置された半導体ウエハ38が処理室22内へ搬送される。 31 semiconductor wafer 38 which is placed is transported into the processing chamber 22 to the. また,チャンバ25の側面には好適に2つのドアバルブ32,33が設けられ,半導体ウエハ38が該ドアバルブを通じて外部のアーム機構39によってウエハ保持手段31へ搬入及び搬出される。 Further, preferably two door valve 32, 33 is provided on the side surface of the chamber 25, the semiconductor wafer 38 is carried in and carried out to the wafer holding means 31 by an external arm mechanism 39 through the door valve. ここで,ドアバルブ32,33は排気口及び吸気口として機能することもできる。 Here, door valve 32, 33 may also function as an exhaust port and the intake port. さらに,チャンバ25はチャンバ内部を排気及び吸気するための排気口及び/または吸気口を別々に有することもできる。 Further, the chamber 25 may also have an exhaust port and / or intake port for exhausting and intake inside the chamber separately.

【0028】ウエハ保持手段31は,好適には左右一対の支持体31d,31d',31e,31e'及びウエハを載置する複数の載置部31cから成る。 The wafer holding unit 31 is preferably a pair of left and right support 31d, 31d ', 31e, 31e' and comprising a plurality of mounting portion 31c for placing a wafer. ウエハ保持手段31は上記フランジ手段30によって上下2つの部分31a及び31bに分離される。 Wafer holding means 31 is separated into two upper and lower portions 31a and 31b by the flange means 30. ウエハ保持手段31に装填される半導体ウエハ38の数は,ロードロック装置に接続される処理室22の数や処理の内容によって異なり,生産性を考慮して最適な数が選択される。 The number of semiconductor wafers 38 to be loaded into the wafer holding means 31 differs depending on the contents of the number and the processing of the processing chamber 22 connected to the load lock device, the optimal number is selected in consideration of productivity. ウエハ保持手段31は外部の駆動装置(図示せず)に接続された昇降手段34によって支持され,チャンバ25内を上下に移動することができる。 Wafer holding means 31 is supported by the elevating means 34 connected to the external driving device (not shown), can move in the chamber 25 up and down.

【0029】フランジ手段30は好適には容易に変形しない材質から成るディスクであって,ウエハ保持手段31の略中央部に結合されている。 The flange means 30 is a disc made of suitably not easily deformed material is coupled to the substantially central portion of the wafer holding means 31. ウエハ保持手段31が昇降手段34によって上昇して上限位置まで達すると,フランジ手段30の周縁部がチャンバ25の内壁の当接部36と当接し係合する。 When the wafer holding means 31 is raised by the lifting means 34 reaches the upper limit position, the periphery of the flange means 30 is in contact engagement with the contact portion 36 of the inner wall of the chamber 25. 好適には,フランジ手段の周縁部及び/またはチャンバ内壁の当接部36にはシール手段37が設けられている。 Preferably, the sealing means 37 is provided in the abutment portion 36 of the peripheral portion and / or the inner wall of the chamber of the flange means. その結果ウエハ保持手段31の上部31aは搬送機構24から完全に隔絶され,同時にウエハ保持手段31の下部31bは搬送機構24にさらされる。 As a result the top 31a of the wafer holding means 31 is completely isolated from the conveying mechanism 24, the lower portion 31b of the wafer holding means 31 is exposed to the transport mechanism 24 at the same time. 上記当接部36は,他にチャンバ25の内側に伸張したフランジであってもよい。 The abutting portion 36 may be a flange extending inwardly of the chamber 25 to the other. この場合にはフランジ手段30の周縁部は,チャンバ Periphery of the flange means 30 in this case, the chamber
25の内壁に設けられたフランジと係合する。 Flanges engaging on the inner wall of 25.

【0030】次に,本発明に係るロードロック装置の動作について説明する。 [0030] Next, the operation of the load lock device according to the present invention. 図4は,本発明に係るロードロック装置の断面図を略示したものであり,図4(A)及び(D) Figure 4 is for a cross-sectional view of the load lock device according to the present invention schematically illustrated, Fig. 4 (A) and 4 (D)
はウエハ保持手段31が上限位置にあるときを示し,一方図4(B)及び(C)はウエハ保持手段31が下限位置にあるときを示している。 Indicates when the wafer holding means 31 is in the upper position, whereas FIG. 4 (B) and (C) shows a case where the wafer holding means 31 is in the lower limit position.

【0031】本発明に係るロードロック装置20を使って,チャンバ内部に積載された半導体ウエハを順次所定の処理室へ搬入及び搬出する方法は,フランジ手段30を上限位置でチャンバ内壁の当接部36と係合当接させた状態で,ドアバルブ32を開放し,該ウエハ保持手段30の上部31aへアーム機構39によって新しい半導体ウエハ38を装填し,ドアバルブ32を閉止して部屋Xを真空排気し, [0031] with a load lock apparatus 20 according to the present invention, a method of loading and unloading the semiconductor wafers stacked within the chamber sequential predetermined processing chamber, abutting portion of the chamber inner wall flange means 30 at the upper limit position in a state where 36 and engagement abutted to open the door valve 32, loaded with a new semiconductor wafer 38 by the arm mechanism 39 to the upper portion 31a of the wafer holding means 30, a room X was evacuated by closing the door valve 32 ,
その間に処理済みの半導体ウエハ43を処理室22から取り出し,アーム機構35によってウエハ保持手段31の下部31 The processed semiconductor wafer 43 during extraction from the processing chamber 22, the lower portion 31 of the wafer holding means 31 by the arm mechanism 35
bへ戻す工程(図4(A)参照)と,ウエハ保持手段31を昇降手段34によって下方へ移動させ,フランジ手段30を下限位置でチャンバ内壁の当接部40と係合当接させた状態で,ウエハ保持手段30の上部31aから半導体ウエハ38を取り出してアーム機構35によって処理室22へ搬送し,その間にドアバルブ33を開放してウエハ保持手段31の下部 State where the step of returning to b (see FIG. 4 (A)), a wafer holding means 31 is moved downward by the elevating means 34, the abutting portion 40 and the engaging abutted the inner chamber wall flange means 30 at the lower limit position in, transported to the processing chamber 22 by the arm mechanism 35 from the upper part 31a of the wafer holding means 30 takes out the semiconductor wafer 38, the lower portion of the wafer holding means 31 by opening the door valve 33 therebetween
31bから処理済みの半導体ウエハ43をアーム機構42によってチャンバ外部へ搬出する工程(図4(B)参照)と, A step of unloading the chamber outside the processed semiconductor wafer 43 by the arm mechanism 42 from 31b (see FIG. 4 (B)),
フランジ手段30を下限位置でチャンバ内壁の当接部40と係合当接させた状態で,ウエハ保持手段31の下部31bへ新しい半導体ウエハ38を装填し,ドアバルブ33を閉止して部屋Yを真空排気し,その間に処理済みの半導体ウエハ43を他の処理室22から搬出しアーム機構35によってウエハ保持手段31の上部31aへ戻す工程(図4(C)参照) In a state where the abutting portion 40 and the engaging abutted the inner chamber wall flange means 30 at the lower limit position, the new semiconductor wafer 38 to the bottom 31b of the wafer holding means 31 is loaded, the vacuum room Y closes the door valve 33 evacuated, step of returning the processed semiconductor wafer 43 during the upper 31a of the wafer holding means 31 by the arm mechanism 35 is unloaded from the other processing chamber 22 (see FIG. 4 (C))
と,ウエハ保持手段31を上昇移動させ,再びフランジ手段30を上限位置でチャンバ25の内壁の当接部36と係合当接させた状態で,ウエハ保持手段31の下部31bから半導体ウエハ38を取り出してアーム機構35によって他の処理室22へ搬送し,その間にドアバルブ32を開放してウエハ保持手段31の上部31aから処理済みの半導体ウエハ43をアーム機構39によってチャンバ外部へ搬出する工程(図4(D)参照)と,上記工程を繰り返す工程と,から成る。 When the wafer holding means 31 is moved upward, in a state that is again abutting portion 36 and the engaging abutment of the inner wall of the chamber 25 to the flange means 30 at the upper limit position, the semiconductor wafer 38 from the lower portion 31b of the wafer holding means 31 taken out steps transported to another processing chamber 22 by the arm mechanism 35, unloading the processed semiconductor wafer 43 from the top 31a of the wafer holding means 31 by opening the door valve 32 therebetween to the outside of the chamber by the arm mechanism 39 (FIG. 4 (D) and see), the step of repeating the above steps consist. 上記ウエハ保持手段31の上部31a及び下部31bへ装填される半導体ウエハの枚数は,処理室の数及び処理内容に応じて最適な数が選択される。 Number of semiconductor wafers to be loaded to the upper 31a and lower 31b of the wafer holding means 31, the optimal number is selected according to the number and the processing content of the processing chamber. チャンバ25の外部からウエハ保持手段31に半導体ウエハを搬入及び搬出する工程において,ドアバルブ32,33を開放すると部屋が大気圧に戻されるため,フランジ手段30は係合と逆方向の圧力を受ける。 In the process of loading and unloading the semiconductor wafers from outside of the chamber 25 to the wafer holding means 31, for the room when opening the door valve 32, 33 is returned to the atmospheric pressure, the flange means 30 receives the pressure of the engagement and reverse. この場合,好適には昇降手段34が密閉が維持されるようにウエハ保持手段を保持する。 In this case, the preferred second blade lifting means 34 moth sealed moth which is maintained Yo two wafer holding means wo hold to.

【0032】本発明に係るロードロック装置によれば、 According to the load lock device according to the invention,
フランジ手段30がバルブとして機能するため、従来、搬送機構24とロードロックチャンバ25の間に必要であったゲートバルブは省略可能となった。 The flange means 30 functions as a valve, conventionally, the gate valve was required between the conveying mechanism 24 and the load lock chamber 25 has become optional. その結果、ゲートバルブの開閉に要する時間が節約でき、生産性が向上した。 As a result, saving the time required for opening and closing the gate valve, and the productivity is improved.

【0033】また,上記ゲートバルブを省略できたことにより,チャンバ内壁面に設けられていたゲートバルブ取り付け部分の構造体を除去でき,その結果,搬送機構とロードロックチャンバとの距離が少なくとも120mm [0033] Also, by can omit the gate valve, thus eliminating structure of the gate valve attachment portion which is provided in the chamber wall, as a result, the distance between the conveying mechanism and the load lock chamber at least 120mm
程度短縮できて装置の小型化が達成できた。 Miniaturization of the degree of shortening can the apparatus could be achieved.

【0034】さらに,本発明に係るロードロック装置の有する作用効果は,従来の2つのロードロックチャンバを水平配置したロードロック装置の有する作用効果と実質的に同等であるため,平面的に見れば,1つのロードロックチャンバでその2つ分の効果を有することになる。 Furthermore, advantageous effects with the load lock device according to the present invention is substantially the same as the operation and effects of the prior loadlock apparatus horizontally arranged two load lock chambers, when viewed in a plan view , it will have the effect of the two partial one load lock chamber. その結果,搬送機構及びロードロック装置部分の装置面積を約40%削減できた。 As a result, it reduces the device area of ​​the transfer mechanism and the load lock device portion about 40%.

【0035】さらにまた,従来型のロードロック装置では処理時間の短い薄膜処理の場合や処理室が多い場合に被処理体の交換が間に合わず処理室が停止するような問題も,本発明に係るロードロック装置を2つ使用すれば実質的に4つのロードロックチャンバと同等になり容易に解決できる。 [0035] Furthermore, problems such as the processing chamber replacement of the object to be processed is not in time when the conventional load lock device in many cases and processing chamber of the short film processing of the processing time is stopped, according to the present invention can be substantially solved easily it becomes equivalent to four load lock chamber when the two use a load-lock device. 例えば,処理室が3つで,処理時間が約40秒程度の薄膜処理の場合,従来のロードロック装置に比べ生産性で約30%改善された。 For example, 3 Tsude processing chamber, processing time when the thin film processing of about 40 seconds, was improved by about 30% in productivity compared with the conventional load lock device.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】図1(A)及び(B)は,従来のロードロック装置を含む半導体製造装置を略示したものである。 [1] Figure 1 (A) and (B) is a diagram showing a semiconductor manufacturing apparatus comprising a conventional load lock device substantially.

【図2】図2は,本発明に係るロードロック装置の好適実施例の平面略示図である。 Figure 2 is a flat, substantially 示図 preferred embodiment of the load lock device according to the present invention.

【図3】図3(A)は図2のAA断面図を略示したものであり,図3(B)は図2のBB断面図を略示したものである。 [3] FIG. 3 (A) are those which substantially shows the AA cross-sectional view of FIG. 2, FIG. 3 (B) is obtained substantially shows a BB sectional view of FIG.

【図4】図4(A)〜(D)は,本発明に係るロードロック装置の拡大断面図である。 [4] FIG. 4 (A) ~ (D) is an enlarged sectional view of the load lock device according to the present invention.

【図5】図5は,本発明に係るロードロック装置の他の実施例の平面略示図である。 Figure 5 is a flat, substantially 示図 of another embodiment of a load lock device according to the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

20 ロードロック装置 22 処理室 23 ゲートバルブ 24 搬送機構 25 ロードロックチャンバ 30 フランジ手段 31 ウエハ保持手段 31a ウエハ保持手段上部 31b ウエハ保持手段下部 32 ドアバルブ 33 ドアバルブ 34 昇降手段 35 アーム機構 36 当接部 37 シール手段 38 半導体ウエハ 39 アーム機構 20 loadlock 22 processing chamber 23 gate valve 24 transport mechanism 25 load lock chamber 30 the flange means 31 wafer holding means 31a wafer holding means top 31b wafer holding means lower 32 door valve 33 door valve 34 lifting means 35 the arm mechanism 36 abutting portion 37 seals It means 38 semiconductor wafer 39 arm mechanism

Claims (7)

    (57)【特許請求の範囲】 (57) [the claims]
  1. 【請求項1】処理室へ被処理体を順次搬送する搬送機構と協働するべく該被処理体を積載して待機するロードロック装置であって、 チャンバ手段と、 複数の前記被処理体を装填するための保持手段であって、前記チャンバ内を上下に移動可能な保持手段と、 前記保持手段を上下移動するためのひとつの昇降手段 1. A to the processing chamber to a loadlock to wait by stacking the 該被 being processed to cooperate with transport mechanism for successively conveying the object to be processed, and chamber means, a plurality of said workpiece a holding means for loading one of the lifting means for the holding means movable, that said holding means moves up and down the chamber vertically
    と、前記保持手段の側面に設けられたひとつのフランジ手段であって、前記チャンバの内壁の一部と当接係合することで、前記チャンバの内部空間を隔絶された2つの部屋に分離するところのフランジ手段と、 前記フランジ手段の周縁部及び/またはチャンバ内壁と When, a one flange means provided on a side surface of said holding means, by partially abutting engagement of the inner wall of the chamber is separated into two rooms that are isolating the inner space of the chamber the flange means at a peripheral portion and / or the inner wall of the chamber of said flange means
    前記フランジ手段の当接部に設けられたシール手段と、から成る装置。 And sealing means provided on the abutting portion of the flange means, consists device.
  2. 【請求項2】請求項1に記載の装置であって、前記搬送機構は前記チャンバ手段の側面の略中央部に接続されている、 ところの装置。 2. A device according to claim 1, wherein the transport mechanism is connected to the substantially central portion of the side surface of said chamber means, at the device.
  3. 【請求項3】請求項2に記載の装置であって、前記フランジ手段は前記保持手段の側面の実質的に中央に結合されており、それが前記チャンバの前記内壁の一部と係合したとき前記保持手段の一部が前記搬送機構から完全に離隔され、前記保持手段の残りの部分が前記搬送機構にさらされる、 ところの装置。 3. A device according to claim 2, wherein the flange means is substantially coupled to the center of the side surface of the holding means, it is engaged with a portion of the inner wall of the chamber some of the holding means is completely spaced apart from the conveying mechanism when the remaining portion of the holding means is exposed to the transport mechanism, where the devices.
  4. 【請求項4】請求項1から3のいずれかに記載の装置であって、前記チャンバは、前記被処理体を前記保持手段へ搬入及び搬出するための少なくとも一つのドアバルブを有する、 ところの装置。 4. A device according to any of claims 1 to 3, wherein the chamber, said at least one door valve for loading and unloading the object to be processed to said holding means, at the device .
  5. 【請求項5】ロードロック装置の内部に積載待機された被処理体を順次所定の処理室へ搬入及び搬出する方法であって、 当該ロードロック装置が、 チャンバ手段と、 複数の前記被処理体を装填するための保持手段であって、前記チャンバ内を上下に移動可能な保持手段と、 前記保持手段を上下移動するためのひとつの昇降手段 5. The workpiece stacked waiting inside the loadlock a sequential loading and method for unloading to a predetermined processing chamber, the load lock device, a chamber unit, a plurality of said workpiece a holding means for loading, and holding means capable of moving the chamber vertically, one lifting means for vertically moving said holding means
    と、前記保持手段の側面に設けられたひとつのフランジ手段であって、前記チャンバの内壁の一部と当接係合することで、前記チャンバの内部空間を隔絶された2つの部屋に分離するところのフランジ手段と、 前記フランジ手段の周縁部及び/またはチャンバ内壁と When, a one flange means provided on a side surface of said holding means, by partially abutting engagement of the inner wall of the chamber is separated into two rooms that are isolating the inner space of the chamber the flange means at a peripheral portion and / or the inner wall of the chamber of said flange means
    前記フランジ手段の当接部に設けられたシール手段と、から成るところの方法であって前記フランジ手段を第1 Wherein a sealing means provided on the abutting portion of the flange means, said flange means a method where made of the first
    の位置で係合当接させた状態で、前記保持手段の第1部分へ前記被処理体を装填し、その間に処理済みの被処理体を前記処理室から搬出し前記保持手段の第2部分へ戻す工程と、 前記保持手段を移動させ、前記フランジ手段を第2の位置で係合当接させた状態で、前記保持手段の第1部分から前記被処理体を取り出して前記処理室へ搬送し、その間に前記保持手段の第2部分から前記処理済みの被処理体をチャンバ外部へ搬出する工程と、 前記フランジ手段を第2の位置で係合当接させた状態で、前記保持手段の第2部分へ前記被処理体を装填し、 In a state of being engaged contact in position, the second portion of the first said to partial loading of the workpiece, the holding means is unloaded from the processing chamber a treated object to be processed during the holding means a step of returning to, moving the holding means, conveying said flange means in a state of being engaged abutment at a second location, into the processing chamber is taken out the workpiece from the first portion of the holding means and, in a state unloading the processed workpiece to the outside of the chamber from the second portion, the said flange means were engaging contact with the second position of the holding means therebetween, said holding means wherein the second portion is loaded workpiece,
    その間に処理済みの被処理体を他の処理室から搬出し前記保持手段の第1部分へ戻す工程と、 前記保持手段を移動させ、再び前記フランジ手段を第1 A step of returning to the first part of the holding means unloads the processed workpiece from the other processing chamber therebetween, moving the holding means, said flange means again first
    の位置で係合当接させた状態で、前記保持手段の第2部分から前記被処理体を取り出して前記他の処理室へ搬送し、その間に前記保持手段の第1部分から前記処理済みの被処理体をチャンバ外部へ搬出する工程と、 上記工程を繰り返す工程と、 から成る方法。 In a state of being engaged abutment in a position, from said second portion of said holding means is taken out workpiece transported to the other processing chamber, from the first portion of said holding means said processed during It said method comprising the steps of: unloading the object to be processed into the chamber outside, a step of repeating the above steps.
  6. 【請求項6】請求項5に記載の方法であって、さらに、 6. The method of claim 5, further
    前記保持手段への被処理体の装填またはチャンバ外部への搬出中において、搬送機構から隔絶された方の部屋を大気圧に戻す工程と、 前記保持手段への被処理体の装填または搬出が終了した後、搬送機構から隔絶された方の部屋を真空排気する工程と、 を含むところの方法。 During unloading of the load or the chamber outside of the object to be processed to said holding means, a step of returning the room who is isolated from the conveying mechanism to the atmospheric pressure, the loading or unloading of the workpiece ends to the holding means after the method at which and a step of evacuating the room who is isolated from the conveying mechanism.
  7. 【請求項7】請求項6に記載の方法であって、搬送機構から隔絶された方の部屋を大気圧に戻す工程において、 7. A method according to claim 6, in the step of returning the room who is isolated from the conveying mechanism to the atmospheric pressure,
    前記フランジ手段と前記チャンバ内壁の一部との係合が保持される、 ところの方法。 The engagement of the part of the flange means and the inner wall of the chamber is maintained, at the method.
JP4101198A 1998-02-09 1998-02-09 Load lock apparatus and method for semiconductor processing Expired - Fee Related JP3286240B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4101198A JP3286240B2 (en) 1998-02-09 1998-02-09 Load lock apparatus and method for semiconductor processing

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP4101198A JP3286240B2 (en) 1998-02-09 1998-02-09 Load lock apparatus and method for semiconductor processing
TW88101651A TW410409B (en) 1998-02-09 1999-02-03 Device and method for load locking for semiconductor processing
KR19990004326A KR100373803B1 (en) 1998-02-09 1999-02-08 Device and Method for Load Locking for Semiconductor Processing
EP19990200381 EP0935279A3 (en) 1998-02-09 1999-02-09 Device and method for load locking for semiconductor processing
US09246921 US6053686A (en) 1998-02-09 1999-02-09 Device and method for load locking for semiconductor processing

Publications (2)

Publication Number Publication Date
JPH11233583A true JPH11233583A (en) 1999-08-27
JP3286240B2 true JP3286240B2 (en) 2002-05-27

Family

ID=12596465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4101198A Expired - Fee Related JP3286240B2 (en) 1998-02-09 1998-02-09 Load lock apparatus and method for semiconductor processing

Country Status (4)

Country Link
US (1) US6053686A (en)
EP (1) EP0935279A3 (en)
JP (1) JP3286240B2 (en)
KR (1) KR100373803B1 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0735573B1 (en) 1995-03-28 2004-09-08 BROOKS Automation GmbH Loading and unloading station for semiconductor treatment installations
US5961269A (en) * 1996-11-18 1999-10-05 Applied Materials, Inc. Three chamber load lock apparatus
US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
US20040221811A1 (en) * 2001-11-30 2004-11-11 Robert Mitchell Method and apparatus for processing wafers
US6318945B1 (en) * 1999-07-28 2001-11-20 Brooks Automation, Inc. Substrate processing apparatus with vertically stacked load lock and substrate transport robot
JP3273560B2 (en) * 1999-08-30 2002-04-08 日本エー・エス・エム株式会社 Multi-chamber load lock device of the seal mechanism
JP2001358191A (en) * 2000-06-09 2001-12-26 Asm Japan Kk Substrate support plate for semiconductor manufacturing apparatus
US20040096300A1 (en) * 2001-06-30 2004-05-20 Ilya Perlov Loadlock chamber
US7018504B1 (en) 2000-09-11 2006-03-28 Asm America, Inc. Loadlock with integrated pre-clean chamber
US7316966B2 (en) 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
JP2004523880A (en) * 2000-09-15 2004-08-05 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Processing unit for double-double slotted load lock
FR2817154B1 (en) 2000-11-27 2003-06-06 Ela Medical Sa Active medical device type of implantable cardioverter / defibrillator perfected discrimination of atrial fibrillation
US6609869B2 (en) * 2001-01-04 2003-08-26 Asm America Transfer chamber with integral loadlock and staging station
US6899507B2 (en) 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
US20050194096A1 (en) * 2003-08-29 2005-09-08 Crossing Automation, Inc. Method and apparatus for semiconductor processing
US7207766B2 (en) 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US8403613B2 (en) * 2003-11-10 2013-03-26 Brooks Automation, Inc. Bypass thermal adjuster for vacuum semiconductor processing
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
WO2005086207A1 (en) * 2004-03-02 2005-09-15 Asys Automatic Systems Gmbh & Co. Kg Transfer device in manipulation and/or processing centres
US7845891B2 (en) 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US7665951B2 (en) * 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
JP4635972B2 (en) * 2006-06-29 2011-02-23 株式会社ニコン Loadlock, a method and a wafer bonding system using it
KR100790789B1 (en) 2006-07-03 2008-01-02 코닉시스템 주식회사 Semiconductor manufacturing apparatus
US8440048B2 (en) * 2009-01-28 2013-05-14 Asm America, Inc. Load lock having secondary isolation chamber
DE102010048043A1 (en) 2010-10-15 2012-04-19 Ev Group Gmbh Apparatus and method for processing of wafers
JP2012134370A (en) * 2010-12-22 2012-07-12 Canon Anelva Corp Chamber, vacuum processing apparatus, substrate transfer method
JP6122256B2 (en) * 2011-08-12 2017-04-26 芝浦メカトロニクス株式会社 Processing system and a processing method
KR101311616B1 (en) * 2011-08-12 2013-09-26 시바우라 메카트로닉스 가부시끼가이샤 Processing system and processing method
JP2014093489A (en) * 2012-11-06 2014-05-19 Tokyo Electron Ltd Substrate processing device
JP6016584B2 (en) * 2012-11-08 2016-10-26 東京エレクトロン株式会社 Load locking device
US9355876B2 (en) 2013-03-15 2016-05-31 Applied Materials, Inc. Process load lock apparatus, lift assemblies, electronic device processing systems, and methods of processing substrates in load lock locations

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874525A (en) * 1973-06-29 1975-04-01 Ibm Method and apparatus for handling workpieces
US4400125A (en) * 1981-06-12 1983-08-23 Chevron Research Company Method of and apparatus for charging ground hydrocarbonaceous material to a pressurized gasification system
DE3789212D1 (en) * 1986-12-19 1994-04-07 Applied Materials Inc Integrated Management System containing multiple chamber.
US4892455A (en) * 1987-05-21 1990-01-09 Hine Derek L Wafer alignment and transport mechanism
JP3466607B2 (en) * 1989-09-13 2003-11-17 ソニー株式会社 Sputtering apparatus
JPH0570967A (en) * 1991-09-13 1993-03-23 Nec Corp Electroless plating bath
US5223001A (en) * 1991-11-21 1993-06-29 Tokyo Electron Kabushiki Kaisha Vacuum processing apparatus
JP2751975B2 (en) * 1991-12-20 1998-05-18 株式会社日立製作所 The load lock chamber of a semiconductor processing apparatus
US5793050A (en) * 1996-02-16 1998-08-11 Eaton Corporation Ion implantation system for implanting workpieces
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US5961269A (en) * 1996-11-18 1999-10-05 Applied Materials, Inc. Three chamber load lock apparatus

Also Published As

Publication number Publication date Type
EP0935279A2 (en) 1999-08-11 application
KR100373803B1 (en) 2003-02-26 grant
US6053686A (en) 2000-04-25 grant
JPH11233583A (en) 1999-08-27 application
EP0935279A3 (en) 2003-11-26 application

Similar Documents

Publication Publication Date Title
US5286296A (en) Multi-chamber wafer process equipment having plural, physically communicating transfer means
US5609459A (en) Door drive mechanisms for substrate carrier and load lock
US6450750B1 (en) Multiple loadlock system
US6641350B2 (en) Dual loading port semiconductor processing equipment
US6042623A (en) Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor
US6059507A (en) Substrate processing apparatus with small batch load lock
US6696367B1 (en) System for the improved handling of wafers within a process tool
US6899507B2 (en) Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
US5664925A (en) Batchloader for load lock
US6494670B2 (en) Three chamber load lock apparatus
US6382895B1 (en) Substrate processing apparatus
US5607276A (en) Batchloader for substrate carrier on load lock
US5613821A (en) Cluster tool batchloader of substrate carrier
US20030077150A1 (en) Substrate processing apparatus and a method for fabricating a semiconductor device by using same
US6234107B1 (en) Auxiliary vacuum chamber and vacuum processing unit using same
US5746008A (en) Electronic substrate processing system using portable closed containers
US6120229A (en) Substrate carrier as batchloader
US6802934B2 (en) Processing apparatus
JP2001135704A (en) Substrate treatment apparatus and transfer control method for substrate transfer tray
US5621982A (en) Electronic substrate processing system using portable closed containers and its equipments
US5795355A (en) Integrated micro-environment container loader apparatus having a semipermeable barrier
JPH07211761A (en) Transfer of material to be treated in treating device
JPS62216315A (en) Semiconductor processor
US5759334A (en) Plasma processing apparatus
JPH09223727A (en) Semiconductor treating apparatus, substrate changing mechanism and changing method thereof

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 6

Free format text: PAYMENT UNTIL: 20080308

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 7

Free format text: PAYMENT UNTIL: 20090308

LAPS Cancellation because of no payment of annual fees