TWI529908B - 半導體裝置 - Google Patents

半導體裝置 Download PDF

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Publication number
TWI529908B
TWI529908B TW104106919A TW104106919A TWI529908B TW I529908 B TWI529908 B TW I529908B TW 104106919 A TW104106919 A TW 104106919A TW 104106919 A TW104106919 A TW 104106919A TW I529908 B TWI529908 B TW I529908B
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TW
Taiwan
Prior art keywords
wiring substrate
conductive pad
conductive
wiring
conductive pads
Prior art date
Application number
TW104106919A
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English (en)
Chinese (zh)
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TW201523836A (zh
Inventor
石川智和
岡田三香子
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瑞薩電子股份有限公司
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Application filed by 瑞薩電子股份有限公司 filed Critical 瑞薩電子股份有限公司
Publication of TW201523836A publication Critical patent/TW201523836A/zh
Application granted granted Critical
Publication of TWI529908B publication Critical patent/TWI529908B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
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    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
TW104106919A 2007-09-12 2008-06-25 半導體裝置 TWI529908B (zh)

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US8766425B2 (en) 2014-07-01
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KR20090027573A (ko) 2009-03-17
KR101426568B1 (ko) 2014-08-05
US8698299B2 (en) 2014-04-15
US20140252357A1 (en) 2014-09-11
US20140070214A1 (en) 2014-03-13
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