KR101426568B1 - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR101426568B1
KR101426568B1 KR1020080082975A KR20080082975A KR101426568B1 KR 101426568 B1 KR101426568 B1 KR 101426568B1 KR 1020080082975 A KR1020080082975 A KR 1020080082975A KR 20080082975 A KR20080082975 A KR 20080082975A KR 101426568 B1 KR101426568 B1 KR 101426568B1
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conductive pads
wiring
wiring board
chip
surface conductive
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Korean (ko)
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KR20090027573A (ko
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토시카즈 이시카와
미카코 오카다
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르네사스 일렉트로닉스 가부시키가이샤
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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US9330942B2 (en) 2016-05-03
US8766425B2 (en) 2014-07-01
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