TWI403398B - 工件保持機構 - Google Patents
工件保持機構 Download PDFInfo
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- TWI403398B TWI403398B TW096138838A TW96138838A TWI403398B TW I403398 B TWI403398 B TW I403398B TW 096138838 A TW096138838 A TW 096138838A TW 96138838 A TW96138838 A TW 96138838A TW I403398 B TWI403398 B TW I403398B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S294/00—Handling: hand and hoist-line implements
- Y10S294/907—Sensor controlled device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
本發明係關於一工件保持機構適用於設置以傳輸一工件的材料處理/傳輸設備,例如是晶圓,當水平保持該工件時。
在日本專利JP-A-2006-150538中,舉例而言,一習知工件保持機構係被揭露。在該份文件中被描述的該工件保持機構包括一對端制轉桿位在一基底(傳輸手)的一端,以及一對夾鉗制轉桿用於朝向該基底的該尖端推擠一位在該基底上的晶圓。該對夾鉗制轉桿係被例如是空氣汽缸、線圈彈簧等等驅動機構以一預定方向軸向旋轉。根據此保持機構,位在該基底上的該晶圓可被該夾鉗制轉桿朝向該基底的該尖端推擠,藉此,定位並保持該晶圓在該基底上,當其被傳輸時,避免晶圓向旁邊偏移。
然而,使習知工件保持機構係使用一空氣汽缸來移動該夾鉗制轉桿,故有一個問題是該材料處理/傳輸設備不可在真空環境下被使用。
更甚地,用以移動夾鉗制轉桿的驅動器係應用大量的不同部件,故產生一複雜的機構結構以及難以降低重量以及作為一整體工件保持機構之簡單化。
本發明係下述內容中詳細介紹。故本發明之一目的係提供一工件保持機構,其重量較輕且簡單,並可在真空中操作,可避免滑動或當傳輸該工件時,其他定位變動的問題,以在增加傳輸速度時有所貢獻。
本發明提供之工件保持機構係裝設在工件傳輸設備並使用於水平地保持一平坦工件。該機構包括一基底用於支持該工件,以及複數導引件,位在該基底處。每個導引件包括一軸、一接觸部以及一限制部,該軸係軸向地被該基底支持,當該工件被設置在該基底上時,該接觸部與該工件的一周圍的一下表面的一部分接觸並在該軸的周圍被向下推擠,當該接觸部係降下時,該限制部在該軸的周圍被抬起以朝向該工件的該周圍的一側表面的一部分。
根據上述設置,當一工件係設置在該基底上時,工件的周圍的一部分,也就是工件的下表面的一部份,係與該些導引件的該些接觸部接觸。在每個導引件中的該接觸部承受該工件的重量,使得該導引件在該軸附近旋轉或軸向轉動,自動地,此將該對應的導引件之限制部帶至一位置,避免該工件向旁邊偏移,藉此,使得該工件係準確地定位。根據本發明所提供之工件保持機構,該些導引件係設置以達成被該工件的重量引起之簡單移動,甚至可在真空中應用。此導引件之重量係很小且結構簡單。可靠地,根據本發明之工件保持機構避免傳輸中之工件橫向偏移,其係可達成傳輸速度上之改善。
更甚地,該基底可具有一階梯部,包括一安裝表面以及一直立牆對應該工件的該周圍,該接觸部以及該導引件的該限制部建構該階梯部的一部分。
根據上述設置,該工件係可靠地被保持在期望的位置,係被該基底之該階梯部以及該導引件之該接觸部以及該些限制部所完成。
較佳地,當該工件不在該基底上時,該接觸部可高於該階梯部的安裝表面。
藉由上述設置,每個導引件的基底可被可靠地與該工件接觸以被安置。
較佳地,當該在該基底上時,該限制部可比該階梯部的該直立牆更靠近該工件內的周圍的側表面的一部分。
藉由上述設置,甚至若因為被該基底的該階梯部之相對大概的定位而引起該工件初始係超出準確的位置的話,該工件可藉由該導引件的該限制部準確地被定位在期望的地方。
較佳地,該階梯部形成有複數溝槽用於支持該些導引件的該些軸,每個軸係係位在該導引件中的一偏離中央位置,用以伴隨該限制部降下而引起該導引件以一自然狀態傾斜。
藉由上述設置,該些導引件至該基底的連接係藉由將該每個導引件的軸放置在該溝槽內來達成,更甚地,該軸的偏離中央位置的設置係允許該些導引件以一自然狀態呈現一適合的傾斜位置。
較佳地,該基底以及至少一導引件可具有配合的接觸端,以藉由該接觸端用於該工件之電性偵測,此係根據該導引件的姿勢。
根據上述設置,無論工件有無位在該基底上,均可簡單地完成決定。
從本發明之下述實施例之敘述中,可更清楚描述本發明的其他特徵及優點。
本發明之實施例係詳細地敘述如下,並佐以圖示解釋。以下的實施例不會限制本發明的範圍。
第1圖至第3圖係顯示根據本發明之工件保持機構之一實施例。被詳述之工件保持機構A為一機構,用於水平地保持一平坦工件,例如是一晶圓W,如第1圖所示,包括一基底1以及複數導引件2。晶圓W在其周圍形成有一可分離圖案(定位平面),未顯示於第1圖中,舉例來說,該晶圓W具有約300±0.2公厘的直徑,775±25微米的厚度以及125克的重量。
基底1舉例係以鋁、陶或工程用塑膠製成,基底1具有底端10用以連接一未詳述之材料處理/傳輸設備之臂端,一晶圓支持板11用於置放該晶圓W。為了減輕重量,在板11之外的底端10的寬度小於晶圓W的直徑,板11具有部分被裁斷的端區域,也是為了減輕重量。
如第2及3圖所示,板11具有階梯部12用以水平地保持晶圓W並用於大體地定位該晶圓W,一開口13(未顯示於第3圖)用於允許一引腳之通過並與晶圓W的下表面接觸。在接觸狀態下,該引腳可通過該開口13而上下移動。階梯部12對應至晶圓W的周圍的位置中,每個階梯部12具有一安裝表面12A以配合該周圍的下表面,以及一直立牆12B相對該周圍的側表面,當晶圓W準確地設置在該基底1之一預定位置,直立牆12B形成以與晶圓W的側表面有一適當的間距,間距舉例約為0.5公厘。階梯部12形成有所需數量的罩凹處12C(本實施例舉例為4個)以及溝槽12D。每個導引件2係對應裝設在每個凹處12C,可在該凹處中軸向轉動。
該導引件2係少部分為高熱阻抗的,舉例以陶或工程塑膠形成。如第2圖所示,此些導引件2係成對的,故兩個導引件係為在晶圓W的直徑線上(為顯示於第2圖),一對導引件2以及其他對導引件2係以彼此線對稱的方式位在一水平面上。
如第2及3圖所示,導引件2包括一軸20軸向地設置在溝槽12D中,接觸部21係與晶圓W周圍的下表面之一部分接觸,以及一限制部22相對晶圓W側表面的一部份。軸20具有約1公厘的直徑,包括接觸部21以及限制部22的全長大約為5公厘,其中限制部22約2公厘,包括限制部22的總厚度約3公厘。
導引件2的接觸部21和限制部22分別建構安裝表面12A以及直立牆12B的一部份,導引件2的下表面的一端具有接觸端30,對應位在端30的地方,基底1的罩凹處12C具有接觸端40。根據導引件2的姿勢,兩接觸端30、40係彼此接觸或不接觸(如第3A-3C圖所示),此些接觸端30、40係用於電性偵測該晶圓W有沒有位在基底1上,舉例係連接至一包括一控制電路的工件偵測單元50。工件偵測單元50可裝設在材料處理/傳輸設備之主體中或者是在該設備外的一控制單元中。接觸端30、40以及工件偵測單元50必須用於至少一個導引件2。隨著變異,接觸端30、40以及工件偵測單元50可用於兩個導引件2,例如是左右兩個的或是前後兩個的導引件。所有的導引件2可具有分離的偵測系統,每個係包括兩個配合的接觸端以及連接至此些接觸端的工件偵測單元。
如第3A圖所示,軸20較靠近接觸部21的尖端,換句話說,不在導引件2的中心,當其係靜止在階梯部12的溝槽12D中時,故在一自然狀態下,該導引件2將會因為重量,偕同降下的限制部22,在軸20周圍傾斜。在此設置下,當沒有晶圓W設置在基底1上時,導引件2中的接觸部21尖端係高於安裝表面12A,另一方面,當晶圓W設置在基底1上時,如第3B圖所示,接觸部21的尖端被晶圓W周圍下表面向下推擠,使得導引件2在軸20附近逆時鐘旋轉(如第3B圖所示),然後相對該接觸部21尖端的限制部22便抬起直接與晶圓W周圍側表面接觸,或是以其之間的非常窄的間距朝向同樣的側表面(如第3C圖所示),若考慮晶圓W的直徑具有約±0.2公厘的尺寸誤差,間距舉例約為0.1公厘。如第3C圖所示之直立狀態,限制部22比基底1的直立牆12B更靠近晶圓W周圍側表面。依照此設置,晶圓W可比被直立牆12B定位而更準確的被限制部22定位。
第4圖係為一圖表顯示導引件2的尺寸,圖中之尺寸H和L代表從軸20至限制部22的垂直高度和水平距離,角度θ代表接觸部21從其傾斜狀態至水平狀態的移動角度,尺寸x和y代表限制部22在頂端移動時的水平距離和垂直距離,水平距離x較佳地不小於0.5厘米,係考慮到限制部22和直立牆12B的位置關係,而垂直距離y較佳地不大於1厘米,係考慮到晶圓W的厚度以及直立牆12B的高度。如圖所示,代表限制部22在頂端移動時的水平距離的尺寸x係滿足下列關係:x=Lcos θ+Hsin θ-L。同樣地,垂直距離的尺寸y係滿足下列關係:y=Lsin θ。舉例而言,當垂直高度為2厘米,水平長度L為2厘米,移動角度θ為25度,上述公式可算出x=0.66厘米,y=0.85厘米,此值滿足上述條件:x≧0.5厘米,y≦1厘米。此係表示甚至當導引件2非常小,適當的尺寸可以讓使用者輕易完成所需的移動作業。
工件保持機構A的操作如下所述:如第3A圖所示,在沒有晶圓W放置在基底1上的自然狀態中,導引件2係為傾斜的,接觸部21的尖端高於安裝表面12A,在此狀態下,導引件2的接觸端30係與基底1的接觸端40接觸,故工件偵測單元50偵測到電性導通並判斷沒有晶圓W放置在基底1上。
接下來,如第3B圖所示,當晶圓W放置在基底1上,晶圓W圓周的下表面的一部分與接觸部21的尖端接觸,該尖端係因為晶圓W的重量而被向下推擠。另一方面,限制部22係被向上抬起且比直立牆12B更靠近晶圓W側表面。對應地,甚至若晶圓W側表面起始係位在非常靠近或接觸直立牆12B,限制部22係被抬起且變成接觸晶圓W側表面,並朝向晶圓W的適當定位區域的中心推擠該晶圓W。
然後,當晶圓W完全位於基底1上,如第3C圖所示,晶圓W周圍的側表面便與接觸部21以及該安裝表面12A接觸,且導引件2係大體保持水平。在此狀態,導引件2中所有的限制部22係足夠靠近晶圓W的側表面,藉此,晶圓W便準確地定位在基底1上的所需位置。在此工站,導引件2的接觸端30係不與基底1的接觸端40接觸,故工件偵測單元50偵測到電路的未連接並判斷晶圓W係放置在基底1上。在工件偵測單元50偵測到晶圓W的置放狀態,材料處理/傳輸設備的主體臂係被驅動以操作該工件保持機構A(其係接合於臂的一端)在所需的方向(上、下、左、右、往前以及往後),在此操作間,被四個導引件2箝制住的晶圓W係相對於該基底1而維持不可移動的,對應地,甚至在高操作速度時,晶圓W係準確地被傳送至一預定的卸除位置。
上述工件保持機構A可在真空或高溫時完成操作,並偕同材料處理/傳輸設備。
用於避免晶圓W之位置偏移的導引件2係僅被晶圓W的重量而動作,此導引件2結構簡單且重量極小,可改善工件保持機構A的整體重量。
本發明並不侷限於上述實施例,舉例來說,如第5圖所示,接觸部21可具有圓端,故被承載的晶圓便預先接觸,此曲線形狀避免接觸部21損害晶圓的下表面,更甚地,基底的階梯部或是導引件的限制部可具有非直立牆,當向上行進時,係從被支撐的晶圓的中心往外傾斜。
本發明雖以較佳實施例揭露如上,然其並非用以限定本發明的範圍,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
1...基底
10...底端
11...晶圓支持板
12...階梯部
12A...安裝表面
12B...直立牆
12C...凹處
12D...溝槽
13...開口
2...導引件
20...軸
21...接觸部
22...限制部
30...接觸端
40...接觸端
50...工件偵測單元
第1圖係根據本發明之一工件保持機構的一概要圖。
第2圖係為第1圖中工件保持機構的一上視圖。
第3A-3C圖係沿第2圖中的剖面線III-III所示之剖面圖,用以解釋該工件偵測作業。
第4圖係一圖表以描述第1圖的工件保持機構的數個面向。
第5圖係根據本發明之工件保持機構之另一例的主要部分的剖面圖。
1...基底
10...底端
11...晶圓支持板
12...階梯部
13...開口
2...導引件
Claims (5)
- 一種工件保持機構,用以水平保持一用於工件傳輸設備的平坦工件,該機構包括:一基底,用於支持該工件;以及複數導引件,位在該基底處;其中每個導引件包括一軸、一接觸部以及一限制部,該軸係軸向地被該基底支持,當該工件被設置在該基底上時,該接觸部與該工件的一周圍的一下表面的一部分接觸並在該軸的周圍被向下推擠,當該接觸部係降下時,該限制部在該軸的周圍被抬起以朝向該工件的該周圍的一側表面的一部分;其中該基底具有一階梯部,包括一安裝表面以及一直立牆對應該工件的該周圍,該接觸部以及該導引件的該限制部建構該階梯部的一部分。
- 如申請專利範圍第1項所述之工件保持機構,其中當該工件不在該基底上時,該接觸部係高於該階梯部的該安裝表面。
- 如申請專利範圍第1或2項所述之工件保持機構,其中當該工件位在該基底上時,該限制部係比該階梯部的該直立牆更靠近該工件的該周圍的該側表面的一部分。
- 如申請專利範圍第1或2項所述之工件保持機構,其中該階梯部形成有複數溝槽用於支持該些導引件的該些軸,每個軸係係位在該導引件中的一偏離中央位置,用以伴隨該限制部降下而引起該導引件以一自然狀態傾斜。
- 如申請專利範圍第1或2項所述之工件保持機構,其中該基底以及至少一該導引件係末端接觸,而根據該些導引件中之至少一個的一姿勢用以電性偵測。
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JP3138554B2 (ja) * | 1992-12-11 | 2001-02-26 | 株式会社荏原製作所 | ウエハ支持装置 |
JPH1074816A (ja) * | 1996-08-29 | 1998-03-17 | Hitachi Techno Eng Co Ltd | ウェファ搬送装置 |
TW550725B (en) * | 2001-06-27 | 2003-09-01 | Applied Materials Inc | Locator pin integrated with sensor for detecting semiconductor substrate carrier |
Also Published As
Publication number | Publication date |
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JP2008108991A (ja) | 2008-05-08 |
US7748760B2 (en) | 2010-07-06 |
TW200827112A (en) | 2008-07-01 |
KR101404175B1 (ko) | 2014-06-05 |
KR101404177B1 (ko) | 2014-06-09 |
US20080099970A1 (en) | 2008-05-01 |
KR20140042838A (ko) | 2014-04-07 |
KR20080038042A (ko) | 2008-05-02 |
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